Electronic component and mounting frame for mounting the same
阅读说明:本技术 电子组件及用于安装该电子组件的安装框架 (Electronic component and mounting frame for mounting the same ) 是由 赵范俊 于 2018-12-24 设计创作,主要内容包括:本发明提供了一种电子组件及用于安装该电子组件的安装框架。所述电子组件包括:电容器阵列,包括在第一方向上顺序地布置的多个电容器;以及一对金属框架,分别设置在所述电容器阵列的相对的侧表面上,并且分别连接到所述多个电容器的第一外电极和第二外电极,其中,所述金属框架中的每个包括:支撑部,结合到所述第一外电极和所述第二外电极的头部;以及安装部,从所述支撑部的下端沿垂直于所述第一方向的第二方向延伸,并且一个或更多个切割部形成在所述支撑部的下侧的部分和所述安装部中。(The invention provides an electronic component and a mounting frame for mounting the electronic component. The electronic component includes: a capacitor array including a plurality of capacitors sequentially arranged in a first direction; and a pair of metal frames respectively disposed on opposite side surfaces of the capacitor array and respectively connected to first and second external electrodes of the plurality of capacitors, wherein each of the metal frames includes: a support coupled to the heads of the first and second external electrodes; and a mounting part extending from a lower end of the supporting part in a second direction perpendicular to the first direction, and one or more cutting parts formed in a portion of a lower side of the supporting part and the mounting part.)
1. An electronic assembly, comprising:
a capacitor array including a plurality of capacitors sequentially arranged in a first direction; and
a pair of metal frames respectively disposed on opposite side surfaces of the capacitor array and respectively connected to first and second external electrodes of the plurality of capacitors,
wherein each of the pair of metal frames includes:
a support coupled to corresponding heads of the first and second external electrodes; and
a mounting part extending from a lower end of the supporting part in a second direction perpendicular to the first direction, and
one or more cutting portions are formed in portions of lower sides of the mounting portion and the supporting portion.
2. The electronic component according to claim 1, wherein the cut portion is formed on each boundary line of the plurality of capacitors adjacent to each other in the first direction.
3. The electronic assembly of claim 1, wherein the cut-out has an L-shape.
4. The electronic component according to claim 1, wherein 0.01 ≦ d1/t ≦ 0.5 and 0.01 ≦ d2/b ≦ 0.5, wherein a length of the cut portion in a thickness direction is d1, a length of the support portion in the thickness direction is t, a length of the cut portion in the first direction is d2, and a length of each of the plurality of capacitors in the first direction is b,
wherein the thickness direction is perpendicular to the first direction and the second direction.
5. The electronic component of claim 1, further comprising an encapsulation that encapsulates the capacitor array,
wherein the mounting portion is exposed to an outside of the enclosing portion.
6. The electronic assembly of claim 1, wherein a conductive adhesive portion is disposed between the head portions of the first and second outer electrodes and the support portion.
7. The electronic assembly of claim 1, wherein the capacitor comprises: a main body; and the first and second external electrodes formed on opposite end surfaces of the body in the second direction, and
the main body includes: a dielectric layer; and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween.
8. The electronic assembly of claim 7, wherein the first outer electrode comprises:
a first head formed on one of the opposite end surfaces of the body in the second direction; and
a first strap portion extending from the first head portion to portions of an upper surface and a lower surface of the main body and portions of opposite side surfaces of the main body,
the second external electrode includes:
a second head formed on the other of the opposite end surfaces of the body in the second direction; and
a second band extending from the second head to portions of the upper and lower surfaces of the body and portions of the opposite side surfaces of the body.
9. The electronic assembly of claim 1, wherein the capacitor array is stacked in at least two layers.
10. The electronic assembly of claim 9, wherein the support portion extends to heads of the plurality of capacitors of the capacitor array at an upper side.
11. The electronic assembly of claim 9, further comprising an encapsulation that encapsulates the capacitor array,
wherein the mounting portion is exposed to an outside of the enclosing portion.
12. A mounting frame for mounting electronic components, the mounting frame comprising:
a first metal frame comprising: a first support part located in a first plane; and a first mounting portion extending from an edge of the first support portion in a second plane perpendicular to the first support portion, the first support portion and the first mounting portion including first cut portions periodically provided extending along portions of the first support portion and the first mounting portion;
a second metal frame comprising: a second support portion located in a third plane parallel to the first plane; and a second mounting part extending from an edge of the second supporting part toward the first mounting part in the second plane, the second supporting part and the second mounting part including periodically arranged second cutting parts extending along portions of the second supporting part and the second mounting part,
wherein the first metal frame and the second metal frame are separated in a first direction extending from the first plane to the third plane to accommodate an array of a plurality of capacitors to be disposed such that a first outer electrode of each of the plurality of capacitors is in direct contact with the first support portion and a second outer electrode of each of the plurality of capacitors is in direct contact with the second support portion.
13. The mounting frame of claim 12, wherein 0.01 ≦ d1/t ≦ 0.5 and 0.01 ≦ d2/b ≦ 0.5, wherein d1 is a length of the cut portion in a second direction perpendicular to the second plane, t is a length of the support portion in the second direction, d2 is a length of the cut portion in a third direction perpendicular to the first direction and the second direction, and b is a length of each of the plurality of capacitors in the third direction.
14. The mounting frame of claim 12, wherein the first and second supports extend in a second direction perpendicular to the second plane to accommodate a stack of at least two capacitor arrays stacked in the second direction.
15. The mounting frame of claim 14, wherein the first and second cuts extend in the second direction in the corresponding support to reach a portion of the capacitor array away from the second plane.
16. The mounting frame of claim 12, wherein a portion of the plurality of capacitors are separated from the first and second mounting portions in a second direction perpendicular to the second plane when the mounting frame is disposed.
Technical Field
The present disclosure relates to an electronic component and a mounting frame for mounting the electronic component.
Background
Multilayer capacitors are commonly used in various electronic devices because they can be realized in small size and high capacity.
In recent years, due to the rapid increase in popularity of environmentally friendly automobiles and electric vehicles, power drive systems in automobiles have increased, and thus, the demand for multilayer capacitors required for automobiles has also increased.
Since high levels of thermal, electrical and mechanical reliability are required when used as automotive parts, the level of performance required for multilayer capacitors is also increasing.
In particular, there is an increasing demand for modular electronic devices: high resistance to vibration and deformation while allowing high capacitance to be achieved by stacking a plurality of multilayer capacitors in a limited space.
Disclosure of Invention
An aspect of the present disclosure may provide an electronic component capable of achieving high capacitance and improving thermal reliability, mechanical reliability, and resistance to warp deformation.
According to one aspect of the present disclosure, an electronic assembly may include: a capacitor array including a plurality of capacitors sequentially arranged in a first direction; and a pair of metal frames respectively disposed on opposite side surfaces of the capacitor array and respectively connected to first and second external electrodes of the plurality of capacitors, wherein each of the metal frames includes: a support coupled to the heads of the first and second external electrodes; and a mounting part extending from a lower end of the supporting part in a second direction perpendicular to the first direction, and one or more cutting parts formed in a portion of a lower side of the supporting part and the mounting part.
The cutting portion may be formed on each boundary line of the plurality of capacitors adjacent to each other in the first direction.
The cutting part may connect the portion of the lower side of the supporting part and the mounting part to each other to have an L shape.
When the length of the cutting part in the thickness direction is d1, the length of the supporting part in the thickness direction is t, the length of the cutting part in the first direction is d2, and the length of each of the plurality of capacitors in the first direction is b, 0.01 ≦ d1/t ≦ 0.5 and 0.01 ≦ d2/b ≦ 0.5 may be satisfied.
The electronic assembly may further include an encapsulation part encapsulating the capacitor array, wherein the mounting part may be exposed to an outside of the encapsulation part.
A conductive adhesive part may be disposed between the head part of the first external electrode and the head part of the second external electrode and the support part.
The capacitor may include: a main body; and the first and second external electrodes formed on opposite end surfaces of the body in the second direction, and the body may include: a dielectric layer; and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween.
The first outer electrode may include: a first head formed on one of the opposite end surfaces of the body in the second direction; and a first strap portion extending from the first head portion to portions of the upper and lower surfaces of the main body and portions of the opposite side surfaces of the main body. The second external electrode may include: a second head formed on the other of the opposite end surfaces of the body in the second direction; and a second band extending from the second head to portions of the upper and lower surfaces of the body and portions of the opposite side surfaces of the body.
The capacitor array may be stacked in at least two layers.
The support portion may extend to heads of the plurality of capacitors of the capacitor array located at an upper side.
The electronic assembly may further include an encapsulation part encapsulating the capacitor array, wherein the mounting part may be exposed to an outside of the encapsulation part.
According to another aspect of the present disclosure, there is provided a mounting frame for mounting electronic components, which may include: a first metal frame comprising: a first support part located in a first plane; and a first mounting portion extending from an edge of the first support portion in a second plane perpendicular to the first support portion, the first support portion and the first mounting portion including first cut portions periodically provided extending along portions of the first support portion and the first mounting portion; a second metal frame comprising: a second support portion located in a third plane parallel to the first plane; and a second mounting part extending from an edge of the second support part toward the first mounting part in the second plane, the second support part and the second mounting part including second cut parts periodically disposed extending along portions of the second support part and the second mounting part, wherein the first metal frame is separated from the second metal frame in a first direction extending from the first plane to the third plane to accommodate an array of a plurality of capacitors to be disposed such that the first outer electrode of each of the plurality of capacitors is in direct contact with the first support part and the second outer electrode of each of the plurality of capacitors is in direct contact with the second support part.
Drawings
The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a perspective view schematically showing a multilayer capacitor applied to an exemplary embodiment in the present disclosure;
fig. 2A and 2B are plan views illustrating first and second internal electrodes applied to the multilayer capacitor of fig. 1;
FIG. 3 is a sectional view taken along line I-I' of FIG. 1;
fig. 4 is a perspective view showing a schematic structure of an electronic component according to an exemplary embodiment in the present disclosure;
FIG. 5 is an exploded perspective view of the electronic assembly of FIG. 4;
fig. 6 is a perspective view showing an enclosure formed on the electronic component of fig. 4;
fig. 7 is a perspective view showing a schematic structure of an electronic component according to another exemplary embodiment in the present disclosure;
FIG. 8 is an exploded perspective view of the electronic assembly of FIG. 7; and
fig. 9 is a perspective view illustrating an encapsulation part formed on the electronic component of fig. 7.
Detailed Description
Exemplary embodiments of the present disclosure will now be described in detail below with reference to the accompanying drawings. In the drawings, the shape, size, and the like of components may be exaggerated or reduced for clarity.
This disclosure may, however, be embodied in many different forms and should not be construed as limited to the particular embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The term "exemplary embodiment" as used herein does not refer to the same exemplary embodiment, but is provided to emphasize a particular feature or characteristic that is different from a feature or characteristic of another exemplary embodiment. However, the exemplary embodiments provided herein are considered to be capable of being implemented in whole or in part by combining with each other. For example, unless an opposite or contradictory description is provided therein, an element described in a specific exemplary embodiment, even if it is not described in another exemplary embodiment, may be understood as a description relating to another exemplary embodiment.
In the specification, the meaning of "connected" of a component to another component includes an indirect connection through a third component and a direct connection between two components. Further, "electrically connected" is meant to include the concept of physically connected and physically disconnected. It will be understood that when an element is referred to by "first" and "second," the element is not so limited. They may be used only for the purpose of distinguishing elements from other elements and may not limit the order or importance of the elements. In some instances, a first element may be termed a second element without departing from the scope of the claims set forth herein. Similarly, a second element may also be referred to as a first element.
Here, upper, lower, upper surface, lower surface, and the like are defined in the drawings. Further, the vertical direction is directed to the upward direction and the downward direction, and the horizontal direction is directed to a direction perpendicular to the above-described upward direction and downward direction. In this case, a vertical section refers to a case taken along a plane in the vertical direction, and an example thereof may be a sectional view shown in the drawings. Further, a horizontal section refers to a case taken along a plane in the horizontal direction, and an example thereof may be a plan view shown in the drawings.
The terminology used herein is for the purpose of describing example embodiments only and is not intended to be limiting of the disclosure. In this case, the singular form includes the plural form unless the context indicates otherwise.
For clarity in describing exemplary embodiments in the present disclosure, directions will be defined. X, Y and Z in the drawings respectively refer to a length direction, a width direction, and a thickness direction of the multilayer capacitor.
Further, X, Y and Z refer to the width direction, length direction, and thickness direction of the capacitor array, respectively.
Here, the Y direction refers to a stacking direction in which dielectric layers are stacked in the present exemplary embodiment.
Fig. 1 is a perspective view schematically illustrating a multilayer capacitor applied to an exemplary embodiment in the present disclosure, fig. 2A and 2B are plan views illustrating first and second internal electrodes applied to the multilayer capacitor of fig. 1, and fig. 3 is a sectional view taken along line I-I' of fig. 1.
First, the structure of a multilayer capacitor applied to an electronic component according to the present exemplary embodiment will be described with reference to fig. 1 to 3.
Referring to fig. 1 to 3, the
The
In addition, the
Further, the
The shape of the
The
Barium titanate (BaTiO)3) Examples of the base ceramic powder may include Ca, Zr, etc. partially dissolved in BaTiO3Of (Ba)1- xCax)TiO3、Ba(Ti1-yCay)O3、(Ba1-xCax)(Ti1-yZry)O3、Ba(Ti1-yZry)O3And the like, but are not limited thereto.
Further, the
The ceramic additives may include, for example, transition metal oxides or carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.
The first and second
The first and second
Meanwhile, the present disclosure shows and describes a structure in which the internal electrodes are stacked in the Y direction of the
One end portion of each of the first and second
Ends of the first and second
According to the configuration as described above, when a predetermined voltage is applied to the first and second
The capacitance of the
In addition, the material forming the first and second
The method of printing the conductive paste may be a screen printing method, a gravure printing method, etc., but is not limited thereto.
Voltages having different polarities may be supplied to the first and second
The first
The
The
The second
The
The
Meanwhile, the first and second
The plating layer may include first and second nickel (Ni) plating layers and first and second tin (Sn) plating layers covering the first and second Ni plating layers, respectively.
Fig. 4 is a perspective view illustrating a schematic structure of an electronic assembly according to an exemplary embodiment in the present disclosure, and fig. 5 is an exploded perspective view of the electronic assembly of fig. 4.
Referring to fig. 4 and 5, the
The
Such a
The
Further, the length of the first supporting
The conductive adhesive part 160 may be disposed between each of the first
According to the present exemplary embodiment, the conductive adhesive part 160 may be disposed on the corresponding
Such a conductive adhesive part 160 may be formed using a high temperature solder, a conductive adhesive material, or the like, but is not limited thereto.
The first mounting
The first mounting
In addition, the
One or more
Since the
Further, the
According to the present exemplary embodiment, since the number of the
With such a
In addition, the
That is, the
The
Such a
The
Further, the length of the second supporting
The conductive adhesive parts 160 may be each disposed between the second
According to the present exemplary embodiment, the conductive adhesive part 160 may be disposed on the corresponding
Such a conductive adhesive part 160 may be formed using a high temperature solder, a conductive adhesive material, or the like, but is not limited thereto.
The second mounting
The second mounting
In addition, the
One or more second cutting portions 153 may be formed in a portion of the lower side of the second supporting
Since the second cutting part 153 is formed only in the lower portion of the second supporting
Further, the second cutting portions 153 may be formed on the respective boundary lines of the
According to the present exemplary embodiment, since the number of the
With such a second cutting portion 153, the
In addition, the second cutting portion 153 may connect a portion of the lower side of the second supporting
That is, the second cutting portion 153 according to the present exemplary embodiment may be formed in an L shape.
The multilayer capacitor according to the prior art has the following structure: when mounted on the substrate, the capacitor body and the substrate are in direct contact with each other through solder. Here, since thermal or mechanical deformation generated in the substrate is directly transferred to the multilayer capacitor, it is difficult to secure a high level of reliability.
In the electronic component according to the present exemplary embodiment, since the plurality of
Meanwhile, in order to reduce the transfer of warp deformation stress from the substrate by bonding the metal frame to the multilayer capacitor, it is effective to bond the support portion of the metal frame to the opposite end surface of the multilayer capacitor in the X direction having the longest length in the multilayer capacitor.
However, in the case where a plurality of multilayer capacitors are sequentially arranged in one direction to be electrically connected in parallel to constitute a capacitor array, and then a metal frame is bonded to the capacitor array, the support portion of the metal frame may be bonded to opposite end surfaces of the capacitor array in an X direction having a relatively small length, rather than to an opposite end surface of the capacitor array in a longest Y direction in the entire capacitor array.
Therefore, the metal frame is difficult to absorb deformation with respect to the Y direction which is most affected by the warpage of the substrate, and defects such as deterioration of the bonding surface and cracks may easily occur.
In the electronic assembly according to the present exemplary embodiment, the first metal frame may have one or more first cut portions in a portion of the lower side of the first support part and the first mounting part, and the second metal frame may have one or more second cut portions in a portion of the lower side of the second support part and the second mounting part.
Therefore, the electronic component may have a structure in which the first supporting portion and the first mounting portion and the second supporting portion and the second mounting portion are divided into a plurality of portions by the first cutting portion and the second cutting portion, respectively, and may be deformed when warped. Therefore, deformation with respect to the Y direction caused by warpage of the substrate is effectively absorbed and reduced, so that defects such as deterioration of the bonding surface and cracks described above can be prevented.
Meanwhile, when the sizes of the first and second cutting parts are excessively increased in the first and second supporting parts, the areas of the first and second supporting parts may be reduced by the sizes of the first and second cutting parts, respectively. As a result, the fixing strength may be reduced.
Table 1 below shows the results of the warp deformation test according to the size of the cut portion formed in the supporting portion.
The multilayer capacitor used in each sample was manufactured to have a length of 3.2mm in the X direction, a length of 2.5mm in the Y direction, and an electrical characteristic of 10 μ F.
Further, in the capacitor array used in the test, the multilayer capacitors were arranged in a one-layer five-column structure, and the sizes of the cut portions formed in the supporting portions were variously changed. After performing 100 times of temperature cycles of-55 ℃ to 125 ℃, the capacitor array was mounted on the PCB and 10mm warpage was repeated to observe the separation pattern of the bonding portion of the metal frame. The results are shown in table 1.
Here, as shown in fig. 4, d1 denotes the length of the cut portion in the Z direction, t denotes the length of the support portion in the Z direction, d2 denotes the length of the cut portion in the Y direction, and b denotes the length of the multilayer capacitor in the Y direction.
[ Table 1]
In the case where the cut portion is formed in the metal frame, an effect of suppressing the warp deformation can be obtained even if the size of the cut portion is small.
However, as shown in table 1, in the case where the size of the cut portion is excessively large, it can be seen that the area of the metal frame is reduced, so that the metal frame is broken or detached from the capacitor array during warp deformation.
With table 1, the size of the cut portion for preventing the deterioration of the bonding surface formed in the supporting portion of the metal frame satisfies: d1/t is more than or equal to 0.01 and less than or equal to 0.5, and d2/b is more than or equal to 0.01 and less than or equal to 0.5.
Fig. 6 is a perspective view illustrating an encapsulation part formed on the electronic component of fig. 4.
Referring to fig. 6, the electronic component according to the present exemplary embodiment may further include an
The
That is, the lower surfaces of the first and second mounting
Such an
Fig. 7 is a perspective view illustrating a schematic structure of an electronic assembly according to another exemplary embodiment in the present disclosure, and fig. 8 is an exploded perspective view of the electronic assembly of fig. 7.
Referring to fig. 7 and 8, in the electronic component 200' according to the present exemplary embodiment, at least two
A lower portion of the
Further, the lower portion of the
In addition, the first support part 141 'of the first metal frame 140' may have a
The
The conductive adhesive part 160' may be disposed on the
In addition, the second supporting portion 151 'of the second metal frame 150' may have a second extending
The
Similar to the
Fig. 9 is a perspective view illustrating an encapsulation part formed on the electronic component of fig. 7.
Referring to fig. 9, the electronic assembly according to the present exemplary embodiment may further include an encapsulation part 170' encapsulating the
The encapsulation part 170' may be formed using an insulating resin such as an epoxy resin, and may encapsulate all remaining portions of the electronic component except for the first mounting
That is, the lower surfaces of the first and second mounting
Such an encapsulation part 170' may serve to improve a bonding state between the two
In addition, the first cut portion and the second cut portion may extend in the Z direction in the corresponding support portions to reach portions of the
As set forth above, according to the exemplary embodiments in the present disclosure, a high-capacity electronic component can be provided, and the thermal reliability, mechanical reliability, and resistance to warp deformation of the electronic component can be improved.
While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the invention as defined by the appended claims.
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