阅读说明：本技术 局部区域表面处理装置及其表面处理方法 (Local area surface treatment device and surface treatment method thereof ) 是由 周爱和 于 2019-12-06 设计创作，主要内容包括：本发明公开了一种局部区域表面处理装置及其表面处理方法,局部区域表面处理装置包括：电镀槽,内限定有容纳腔,电镀槽的两个侧部分别设有安装孔以穿过待处理样品；至少一组电镀模具,每组电镀模具分别包括：两个电镀模具本体,沿水平方向间隔开分布且形成为通道,待处理样品的两个待处理面分别与两个电镀模具本体相对设置,每个电镀模具本体内限定有腔室,每个电镀模具本体设有与腔室连通的进液通孔,每个电镀模具本体与另一电镀模具本体相对设置的一端设有出液通孔,出液通孔沿上下方向的高度大于进液通孔的高度,电镀液能够依次穿过进液通孔、出液通孔与待处理面接触。该局部区域表面处理装置能够实现双面处理,提高产品质量。(The invention discloses a local area surface treatment device and a surface treatment method thereof, wherein the local area surface treatment device comprises: the electroplating bath is internally limited with an accommodating cavity, and two side parts of the electroplating bath are respectively provided with a mounting hole for penetrating through a sample to be processed; at least a set of electroplating die, every group electroplating die includes respectively: two electroplating mold bodies, along the spaced apart distribution of horizontal direction and form into the passageway, two pending faces of pending sample set up with two electroplating mold bodies respectively relatively, every electroplating mold body is internal to be injectd there is the cavity, every electroplating mold body is equipped with the feed liquor through-hole with the cavity intercommunication, every electroplating mold body is equipped with out the liquid through-hole with the relative one end that sets up of another electroplating mold body, it highly is greater than the height of feed liquor through-hole along the upper and lower direction to go out the liquid through-hole, the plating solution can pass the feed liquor through-hole in proper order, go out the liquid through-hole and wait. The local area surface treatment device can realize double-sided treatment and improve the product quality.)

1. A localized area surface treatment device, comprising:

the device comprises an electroplating bath, a containing cavity is limited in the electroplating bath, two opposite side parts of the electroplating bath are respectively provided with a mounting hole for penetrating a sample to be processed, and the mounting holes are communicated with the containing cavity;

at least a set of electroplating die, electroplating die locates hold the chamber, every group electroplating die includes respectively:

two electroplating mould bodies which are distributed oppositely at intervals along the horizontal direction, a channel is formed between the two electroplating mould bodies, extension lines at two ends of the channel are communicated with the mounting hole to penetrate through the sample to be processed, two surfaces to be processed of the sample to be processed are respectively arranged opposite to the two electroplating mould bodies, a cavity is defined in each electroplating mould body, each electroplating mould body is provided with a liquid inlet through hole communicated with the cavity, one end of each electroplating mould body, which is arranged opposite to the other electroplating mould body, is provided with a liquid outlet through hole respectively communicated with the cavity and the channel, the height of the liquid outlet through hole in the vertical direction is larger than that of the liquid inlet through hole, and electroplating liquid can sequentially pass through the liquid inlet through hole and the liquid outlet through hole to be contacted with the surface to be treated.

2. The local area surface treatment device according to claim 1, wherein a distance between the plating die body and the corresponding surface to be treated is adjustable.

3. The local area surface treatment device according to claim 1, wherein two electroplating mold bodies are symmetrically distributed on two sides of the sample to be treated.

4. The local area surface treatment device according to claim 1, wherein two surfaces to be treated of the sample to be treated are spaced apart from the corresponding electroplating mold body.

5. The partial area surface treatment apparatus according to claim 1, wherein the plating die body is formed as a hollow cube, the plating die body including:

the bottom plate is provided with a liquid inlet through hole which is communicated along the thickness direction of the bottom plate;

the side plate is positioned above the bottom plate and connected with the bottom plate, and is provided with a liquid outlet through hole which is communicated along the thickness direction of the side plate.

6. The local area surface treatment device according to claim 5, wherein a plurality of rows of said liquid outlet through holes are distributed at intervals along the length direction of said side plate, a plurality of said liquid outlet through holes in each row of said liquid outlet through holes are distributed at intervals along the width direction of said side plate, a plurality of said liquid inlet through holes are provided, and a plurality of said liquid inlet through holes are distributed at intervals uniformly along the length direction of said bottom plate.

7. The local area surface treatment device according to claim 1, wherein a radial dimension of the liquid inlet through hole is larger than a radial dimension of the liquid outlet through hole.

8. The local area surface treatment device according to any one of claims 1 to 7, wherein an end of the two plating mold bodies disposed opposite to each other is an anode plate.

9. The local area surface treatment device of claim 8, wherein the anode plate is a metallic titanium anode plate.

10. A local area surface treatment method of a local area surface treatment apparatus according to any one of claims 1 to 9, characterized in that the method comprises the steps of:

passing the sample to be processed through one electroplating bath or a plurality of electroplating baths in sequence;

and carrying out double-sided treatment on the sample to be treated through two electroplating mold bodies which are arranged in each electroplating bath and are positioned on two sides of the sample to be treated and distributed at intervals.

Technical Field

The invention belongs to the technical field of surface treatment, and particularly relates to a local area surface treatment device and a local area surface treatment method.

Background

The noble metal surface treatment technology has been rapidly developed since being popularized and applied in the electronic industry. Particularly, gold plating surface treatment technology and process are widely applied to precision electronic industries such as smart phones, computers, cameras, automobiles, aerospace and the like, and general civil electronic products such as televisions, refrigerators and the like, and in addition, to the processing field of ornaments and the like.

In order to fully utilize the limited precious metal resources such as gold in nature, when the precious metal surface treatment is carried out on electronic products with various continuous metal terminals, the precious metal only needs to be separated out on the effective functional area of the products. This requires that the noble metal plating technique must satisfy: noble metals can be precipitated only in a local area of the electronic product. Based on the requirements of this particular noble metal plating technique, the research on noble metal plating techniques, particularly gold plating techniques, has been unprecedentedly developed in the recent history of the surface treatment of metals, and a large number of partial plating techniques are emerging, which are also commonly referred to as local area surface treatment techniques.

The precious metal local area electroplating technology includes immersion plating using surface treatment solution depth control, brush plating using local area control, and especially in recent years, precious metal electroplating technology using various molds to perform local area surface treatment according to the shape and characteristics of an electroplated product has been developed and applied more widely, and various precious metal local area electroplating devices and electroplating methods have been gradually formed.

In patent document 1 (japanese patent No. 5884142), a partial surface treatment method and a partial surface treatment apparatus are described. The jig for flowing out the noble metal surface treatment solution and the jig for recovering the noble metal surface treatment solution are oppositely arranged on two sides of the continuous metal terminal to carry out single-side surface treatment on the product. The continuous metal terminal between the two jigs is operated at a constant speed in a direction parallel to and in the narrow slit of the jig, and the precious metal surface treatment solution flowing out from the narrow slit is subjected to surface treatment on a partial region of the cut surface of the metal terminal while passing through the gap between the continuous metal terminals (as shown in fig. 1).

The noble metal surface treatment solution passing through the gap between the product terminals can be sucked and recovered by the narrow slits of the recovery noble metal solution, so that the contact between the surface treatment solution and the reverse side of the continuous metal terminal product is reduced as much as possible. Therefore, a surface treatment method for a local area is established in which a surface treatment is performed only in a local area where plating is required and a surface treatment is not performed in an area where a surface treatment is not required. In addition, the narrow slits of the recovery jig can better absorb the precious metal surface treatment solution, so that even if the flow rate of the precious metal surface treatment solution flowing out of the narrow slits of the recovery jig is high, the quantity of the precious metal surface treatment solution flowing out of the narrow slits of the local surface treatment jig can be appropriate, and the precious metal electrolytically precipitated in the non-surface treatment area can be controlled to be in the minimum range. Therefore, the surface treatment equipment can realize the purpose of performing surface treatment only in a required local area between the narrow slits of the jig by the continuous metal terminals running at a certain speed.

Although the local area electroplating device described in patent document 1 has good applicability to precious metal continuous local area electroplating of small continuous terminals, the structure of the device can only electroplate one side of a product, and electroplating on the other side of the product needs to be additionally provided with another corresponding group of devices to meet the requirement; in addition, when the continuous terminal needs to be plated with a thick noble metal film, a plurality of groups of local area plating equipment are added. Therefore, the electroplating equipment can not carry out double-sided electroplating simultaneously, and the defects that the length of the electroplating equipment needs to be increased for products with thick noble metal films and the like need to be solved.

In the plating apparatus described in patent document 2 (japanese patent No. 4441254), a noble metal plating solution discharged from a narrow slit of a disk-shaped rotating body is brought into contact with a partial area of a product to be plated, the product is moved in a running direction, and the disk-shaped rotating body is continuously rotated to continuously plate a continuous metal terminal product.

The plating apparatus described in patent document 2 can perform high-speed precious metal local area plating on a continuous metal terminal, and since both the disk-shaped rotating body and the continuous metal terminal are made of materials with high hardness, they cannot be sufficiently tightly bonded when they are in contact with each other; so that there will be a slight gap where there is no tight joint. When the noble metal solution is discharged from the plating slit, the noble metal solution leaks through the minute gap between the disk-shaped rotating body and the continuous metal terminal, in addition to the local area to be plated, and an excess noble metal is plated on the area where the plating solution leaks, that is, the area other than the predetermined local area to be plated. In addition, the noble metal plating solution is sprayed from the narrow slit, and after passing through the slit between the continuous terminals, an unnecessary noble metal is plated to an unnecessary region on the reverse side of the product by contacting the unnecessary noble metal plating solution. In order to save precious metal resources, a precious metal recovery process is required to be added for unnecessary precious metal plating caused by leakage, so that a lot of manpower and material resources are required, and the cost of plating production is increased.

Patent document 3(CN 204138798U) discloses an apparatus for selectively plating a mold in a bar shape. In order to solve the problem of unnecessary precious metal plating due to the leakage of precious metal solution in the local area plating apparatus of patent document 2, a silicone mold is embedded in a portion of the disc-shaped rotating body contacting the continuous metal terminal, so that the continuous metal terminal is in direct contact with the silicone mold embedded in the disc-shaped rotating body.

In the local area surface treatment apparatuses of patent documents 2 and 3, the effective surface treatment length of the disk-shaped rotating body is only one third of the circumference available. Therefore, the effective utilization rate of the continuous metal terminal product with thicker precious metal precipitation film is greatly limited. Patent document 4(CN 104894622a) has proposed a selective surface treatment mold, i.e., a linear type partial area surface treatment apparatus, for this problem. The noble metal solution level sprayed out from the narrow gap of the die is towards the local area of the continuous metal terminal needing surface treatment, the narrow gap of the die can be adjusted according to the size of the surface treatment area of the continuous metal terminal, and the length of the narrow gap of the die can also be adjusted according to the thickness of the noble metal film of the continuous metal terminal, so that the local area surface treatment equipment formed by combining the dies has the characteristics of convenience in operation and high noble metal surface treatment and precipitation efficiency.

The various local area plating apparatuses described in patent documents 1 to 4 provide surface treatment methods for continuous metal terminals with various complicated requirements for local area surface treatment of noble metals. However, since all the local area plating apparatuses surface-treat one side, a single mold cannot simultaneously surface-treat both sides of the continuous metal terminals. And the surface treatment cannot be oppositely disposed at both sides of the continuous metal terminal. Therefore, when the continuous metal terminal products which have high requirements on film thickness and need double-sided electroplating are subjected to surface treatment, a plurality of groups of local area surface treatment equipment need to be added, so that the total length of the surface treatment equipment is lengthened, the corresponding workshop of the surface treatment workshop is also lengthened, and the initial investment of surface treatment production is increased. In addition, the metal precipitation principle of all local area surface treatment equipment is that a precious metal solution is sprayed to the surface of a continuous metal terminal through a narrow slit to obtain a surface treatment product, the spraying strength and the direction uniformity of the precious metal solution directly influence the electroplating uniformity of precious metal surface treatment, the performance and the quality of precipitated metal, and in the long-time continuous surface treatment production process, the difficulty is great in continuously keeping the spraying strength and the direction uniformity of the precious metal solution unchanged.

The existing precious metal local area electroplating equipment has the following defects: 1) the defect that the existing precious metal electroplating equipment can only carry out local area electroplating on one surface is improved; 2) when the existing precious metal local area electroplating equipment is used for electroplating, the continuous stability and uniformity of precious metal solution to product electroplating are insufficient; 3) when the existing local area electroplating equipment is used for electroplating by using a noble metal solution, the electroplating efficiency of noble metal is lower, the electroplating production efficiency is influenced, and the electroplating production cost is overhigh.

The local area electroplating equipment for surface treatment of continuous metal terminal products which are required to be electroplated on two sides needs to solve the following technical problems by aiming at the defects and shortcomings of the existing local area electroplating equipment and having high requirement on the surface treatment film thickness: 1) the double surfaces of the continuous metal terminals are subjected to local surface treatment simultaneously; 2) the continuous stability and uniformity of the noble metal solution on the surface treatment of the product can be ensured; 3) to achieve high efficiency of a surface treatment apparatus for a local area and to provide a surface treatment product of high quality and high grade, to shorten the total length of the apparatus, and to reduce initial investment in production facilities and factories.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art.

Therefore, the invention provides a local area surface treatment device which can simultaneously carry out local surface treatment on two sides of a sample to be treated and improve the quality of a product.

The invention also provides a local area surface treatment method, which can effectively improve the local surface treatment efficiency and reduce the production cost.

The local area surface treatment device according to the embodiment of the first aspect of the invention comprises: the device comprises an electroplating bath, a containing cavity is limited in the electroplating bath, two opposite side parts of the electroplating bath are respectively provided with a mounting hole for penetrating a sample to be processed, and the mounting holes are communicated with the containing cavity; at least a set of electroplating die, electroplating die locates hold the chamber, every group electroplating die includes respectively: two electroplating mould bodies which are oppositely distributed at intervals along the horizontal direction, a channel is formed between the two electroplating mould bodies, extension lines at both ends of the passage communicate with the mounting hole to pass through the sample to be processed, two surfaces to be processed of the sample to be processed are respectively arranged opposite to the two electroplating mould bodies, a cavity is defined in each electroplating mould body, each electroplating mould body is provided with a liquid inlet through hole communicated with the cavity, one end of each electroplating mould body, which is arranged opposite to the other electroplating mould body, is provided with a liquid outlet through hole respectively communicated with the cavity and the channel, the height of the liquid outlet through hole in the up-down direction is larger than that of the liquid inlet through hole, and electroplating liquid can sequentially pass through the liquid inlet through hole, the electroplating liquid flowing out of the liquid outlet through hole and the surface to be treated are in contact.

According to the local area surface treatment device provided by the embodiment of the invention, at least one group of electroplating molds is arranged in the accommodating cavity, each group of electroplating molds respectively comprises two electroplating mold bodies, the two electroplating mold bodies are distributed at intervals and are provided with the channels, a sample to be treated passes through the channels, the two surfaces of the sample to be treated can be treated by matching the two electroplating mold bodies, and during treatment, electrolyte sequentially passes through the liquid inlet through hole and is contacted with the surface to be treated through electroplating liquid flowing out from the liquid outlet through hole, so that the uniformity and the stability of the electroplating liquid are improved.

According to one embodiment of the invention, the distance between the electroplating mould body and the corresponding surface to be treated is adjustable.

According to one embodiment of the invention, two electroplating mold bodies are symmetrically distributed on two sides of the sample to be processed.

According to one embodiment of the invention, two surfaces to be processed of the sample to be processed are respectively distributed at intervals with the corresponding electroplating mould body.

According to an embodiment of the present invention, the plating die body is formed as a hollow cube, the plating die body including: the bottom plate is provided with a liquid inlet through hole which is communicated along the thickness direction of the bottom plate; the side plate is positioned above the bottom plate and connected with the bottom plate, and is provided with a liquid outlet through hole which is communicated along the thickness direction of the side plate.

According to an embodiment of the invention, a plurality of rows of the liquid outlet through holes are distributed at intervals along the length direction of the side plate, a plurality of the liquid outlet through holes in each row of the liquid outlet through holes are distributed at intervals along the width direction of the side plate, a plurality of the liquid inlet through holes are distributed at intervals along the length direction of the bottom plate.

According to one embodiment of the invention, the radial dimension of the liquid inlet through hole is larger than the radial dimension of the liquid outlet through hole.

According to one embodiment of the invention, the end of the two electroplating mould bodies which are oppositely arranged is an anode plate.

According to one embodiment of the invention, the anode plate is a metallic titanium anode plate.

According to a local area surface treatment method of an embodiment of a second aspect of the present invention, the local area surface treatment device according to any one of the above, the method includes the steps of: passing the sample to be processed through one electroplating bath or a plurality of electroplating baths in sequence; and carrying out double-sided treatment on the sample to be treated through two electroplating mold bodies which are arranged in each electroplating bath and are positioned on two sides of the sample to be treated and distributed at intervals.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic view of the structure of a metal terminal of patent document 1;

FIG. 2 is a schematic perspective view of a local area surface treatment apparatus according to an embodiment of the present invention;

FIG. 3 is a perspective view of a localized area surface treatment apparatus according to an embodiment of the present invention;

FIG. 4 is a schematic perspective view of a plating die body of a partial area surface treatment apparatus according to an embodiment of the present invention;

FIG. 5 is a perspective view of a plating die body of a partial area surface treatment apparatus according to an embodiment of the invention;

FIG. 6 is a structural schematic view of a side plate of the plating die body of the partial area surface treatment apparatus according to the embodiment of the invention;

FIG. 7 is a schematic illustration of sample processing according to example 1 of the present invention;

FIG. 8 is a schematic illustration of sample processing according to example 2 of the present invention;

FIG. 9 is a schematic illustration of sample processing according to example 3 of the present invention;

FIG. 10 is a schematic illustration of sample processing according to example 4 of the present invention;

FIG. 11 is a schematic sample processing according to example 5 of the present invention.

Reference numerals:

a local area surface treatment device 100;

an electroplating bath 10; a housing chamber 11; a mounting hole 12;

an electroplating mold 20;

an electroplating mold body 30; a channel 31; a chamber 32; a liquid inlet through hole 33; a liquid outlet through hole 34; a bottom plate 35; side plates 36;

the sample to be treated 200.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of illustrating the present invention and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements can be directly connected with each other or indirectly connected with each other through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The local area surface treatment apparatus 100 according to an embodiment of the present invention is described in detail below with reference to the drawings.

As shown in fig. 2 to 11, the local area surface treatment apparatus 100 according to the embodiment of the present invention includes: the electroplating bath 10 and at least one group of electroplating molds 20, wherein each group of electroplating molds 20 respectively comprises two electroplating mold bodies 30.

Specifically, a containing cavity 11 is defined in the electroplating bath 10, two opposite side portions of the electroplating bath 10 are respectively provided with a mounting hole 12 to pass through a sample 200 to be processed, the mounting holes 12 are communicated with the containing cavity 11, the electroplating molds 20 are arranged in the containing cavity 11, the two electroplating mold bodies 30 are distributed oppositely at intervals along the horizontal direction, a channel 31 is formed between the two electroplating mold bodies 30, extension lines at two ends of the channel 31 are communicated with the mounting holes 12 to pass through the sample 200 to be processed, two surfaces to be processed of the sample 200 to be processed are respectively arranged opposite to the two electroplating mold bodies 30, a cavity 32 is defined in each electroplating mold body 30, each electroplating mold body 30 is provided with a liquid inlet through hole 33 communicated with the cavity 32, one end of each electroplating mold body 30, which is arranged opposite to the other electroplating mold body 30, is provided with a liquid outlet through hole 34 respectively communicated with the cavity 32 and the channel 31, the height of the liquid outlet through hole 34 in the vertical direction is greater than that of the liquid inlet through hole 33, and the electroplating liquid can sequentially pass through the liquid inlet through hole 33 and the liquid outlet through hole 34 to be contacted with a surface to be treated.

In other words, the local area surface treatment apparatus 100 according to the embodiment of the present invention mainly includes the plating tank 10 and at least one set of plating molds 20, each set of plating molds 20 mainly includes two plating mold bodies 30, a receiving cavity is defined in the plating tank 10, at least one set of plating molds 20 may be disposed in the receiving cavity, each set of plating molds 20 may include two plating mold bodies 30, the two plating mold bodies 30 are spaced apart in the horizontal direction, and a passage 31 may be formed between the two plating mold bodies 30. In order to introduce the sample 200 to be processed into the channel 31, the two opposite sides of the electroplating bath 10 are respectively provided with the mounting holes 12, and two ends of the axial extension line of the channel 31 can be respectively communicated with the two mounting holes 12, that is, when the sample 200 to be processed is processed, one end of the sample 200 to be processed passes through one mounting hole 12 and extends into the channel 31, and the two surfaces to be processed, which are arranged on the back of the sample 200 to be processed, of the two electroplating mold bodies 30 are respectively processed, so that the double-surface local area processing is realized. A cavity 32 is defined in each electroplating mold body 30, each electroplating mold body 30 can be provided with a liquid inlet through hole 33, and the electroplating liquid can be conveyed into the cavity 32 through the liquid inlet through hole 33, specifically, the precious metal solution can be conveyed to the liquid inlet through hole 33 from a precious metal solution mother tank of the electroplating device through a pump. One end of each electroplating mold body 30, which is opposite to the other electroplating mold body 30, is provided with a liquid outlet through hole 34 which is respectively communicated with the cavity 32 and the channel 31, electroplating liquid in the cavity 32 can pass through the liquid outlet through hole 34 to be contacted with a surface to be treated, the flow rate of the electroplating liquid can be adjusted, and the height of the liquid level of the solution can be adjusted and tends to be stable, uniform and stable due to the uniform flow rate, so that the precious metal electroplating of the continuous metal terminal can be carried out under the condition that the liquid level of the electroplating solution is stable, uniform and stable, and the precious metal electroplating separated out from the continuous metal terminal has good stability and uniformity. Wherein the volume of the chamber 32 may be set according to the volume of the noble metal plating solution contained therein. Because the height of the liquid outlet through hole 34 along the vertical direction is greater than that of the liquid inlet through hole 33, the stability and uniformity of the electroplating solution can be further improved, and the product quality is improved.

It should be noted that the sample 200 to be processed may be a continuous metal terminal, and the material of the continuous metal terminal may be copper, copper alloy, stainless steel, or the like. For example, after the continuous metal terminal is subjected to pre-treatment of degreasing and pickling in a continuous plating line, the continuous metal terminal is subjected to overall plating in a nickel solution treatment tank to form a nickel layer, and then, a surface treatment is performed on a specified partial region of the continuous metal terminal using the partial region surface treatment apparatus 100 of the embodiment of the present invention using a noble metal plating solution to form a noble metal plating film layer and a noble metal protecting agent, so that a partial region continuous metal terminal plated product can be obtained.

The partial-area surface treatment apparatus 100 of a noble-metal plated product according to an embodiment of the present invention can be applied to the partial-area noble-metal plating of a plurality of kinds of continuous metal terminals with a wide variety of noble-metal solutions. The noble metal plating can be gold plating, silver plating or palladium plating; alloy plating of noble metals is also possible, for example: gold and silver plating, cobalt and nickel plating, gold and tin plating, palladium and nickel plating, rhodium and ruthenium plating, and the like.

In addition, as the continuous metal terminal is applied to the electronic industry, other kinds of precious metal plating and alloy plating are researched and developed, and when they are applied to plating production, as long as the continuous metal terminal product belongs to the partial area plating, the partial area surface processing apparatus 100 and the processing method of the embodiment of the invention can be used for plating production.

In addition to noble metals, any conventional plating of continuous metal terminals may be used to perform the plating production when localized area plating is required. For example, there are many of the various partial area tin plating products that are currently widely used in continuous metal terminals that can be produced by electroplating using the partial area surface treatment apparatus 100 and the treatment method according to the embodiment of the present invention.

That is, the partial-area surface treatment apparatus 100 and the treatment method according to the embodiment of the present invention can be applied to any plating solution, and when the continuous metal terminal structure is applied to the partial-area surface treatment apparatus 100 according to the embodiment of the present invention, they can be applied to actual plating production.

Therefore, the local area surface treatment device 100 according to the embodiment of the present invention combines the electroplating bath 10 with at least one set of electroplating molds 20, and each set of electroplating molds 20 combines two electroplating mold bodies 30, so that not only can the double-sided local area treatment of the sample 200 to be treated be realized, but also the treatment efficiency can be improved, and the production cost can be reduced.

In some embodiments of the present invention, the distance between the plating die body 30 and the corresponding surface to be processed can be adjusted as needed, so that the efficiency of the noble metal precipitation rate and the quality of the plated product can be adjusted, and thus, the noble metal plating efficiency and the plating quality can be optimally combined by adjusting the optimal distance therebetween according to the difference of the noble metal solutions, so that the obtained noble metal plated product has high grade and high quality, and the optimal noble metal plated product can be provided.

According to an embodiment of the present invention, the two electroplating mold bodies 30 are symmetrically distributed on two sides of the sample 200 to be processed, and can simultaneously process two surfaces to be processed, which are disposed opposite to each other, of the sample 200 to be processed, so that consistency of processing structures of the two surfaces to be processed when the sample 200 to be processed is processed in a double-sided local area can be further improved, an occupied space can be reduced, and a space occupied by the apparatus can be reduced. Compared with the prior local area electroplating equipment, the method for simultaneously electroplating the noble metal on the two sides of the continuous metal terminal does not have the electroplating problem caused by the leakage of the noble metal solution on the reverse side when the noble metal is electroplated on one side, so the electroplated product obtained by the local area double-side simultaneous electroplating method has excellent high-grade and high-quality electroplating performance. In addition, because the local area electroplating mold can be used for electroplating the double-sided local areas of the continuous metal terminals at the same time, compared with the traditional local area electroplating equipment, the local area electroplating mold has the characteristics of saving electroplating time, being simple and easy to operate, increasing the electroplating production efficiency and reducing the electroplating production cost.

In some embodiments of the present invention, two surfaces to be processed of the sample to be processed 200 are spaced apart from the corresponding electroplating mold body 30, that is, the electroplating mold body 30 is not in direct contact with the surfaces to be processed, and the surfaces to be processed of the product are in direct contact with the mold, so that the mold is worn, the electroplating precision is affected, and the product yield is reduced.

According to an embodiment of the present invention, the electroplating mold body 30 is formed into a hollow cube, the electroplating mold body 30 includes a bottom plate 35 and two side plates 36, the two side plates 36 and the bottom plate 35 can cooperate to define a chamber 32, the bottom plate 35 is provided with a liquid inlet through hole 33 penetrating along a thickness direction of the bottom plate, an electroplating solution can enter the chamber 32 through the liquid inlet through hole 33, the side plates 36 are located above the bottom plate 35 and connected with the bottom plate 35, the side plates 36 are provided with liquid outlet through holes 34 penetrating along the thickness direction of the side plates, and the electroplating solution in the chamber 32 can flow out from the liquid outlet through holes 34.

Alternatively, the side panel 36 is formed as a rectilinear side panel.

As shown in fig. 4 to 6, alternatively, the multiple liquid outlet through holes 34 are distributed at intervals along the length direction of the side plate 36, the multiple liquid outlet through holes 34 in each liquid outlet through hole 34 are distributed at intervals along the width direction of the side plate 36, the number of liquid inlet through holes 33 is multiple, and the multiple liquid inlet through holes 33 are distributed at intervals and uniformly along the length direction of the bottom plate 35, so that the liquid outlet uniformity and stability can be further improved. Wherein each of the discharge liquid passing holes 34 is extendable in the up-down direction, and the height thereof can be set and adjusted according to the height of the area to be processed of the sample to be processed 200. The number of the liquid inlet through holes 33 can be two, so that the manufacturing cost can be reduced, and the flowing uniformity of the electroplating solution can be improved by simultaneously entering the cavity 32 through the two liquid inlet through holes 33.

According to an embodiment of the invention, the radial size of the liquid inlet through hole 33 is larger than that of the liquid outlet through hole 34, so that the liquid inlet efficiency and the liquid outlet uniformity and stability are further improved. The radial dimension of the liquid outlet through holes 34 can be adjusted according to the size of the plating area of the local area of the continuous metal terminal.

In some embodiments of the present invention, the local area surface treatment apparatus 100 further comprises a pump, and the stability of the plating solution level can be adjusted by adjusting a frequency converter of the pump.

According to one embodiment of the present invention, the end of the two plating die bodies 30 opposite to each other is an anode plate, that is, at least a portion of the side plate 36 is formed as an anode plate.

Alternatively, the anode plate is a metallic titanium anode plate, the metallic titanium is generally insoluble in the electroplating solution, and the metal in the electroplating solution is not easy to be replaced and precipitated on the surface of the titanium metal, so that the metallic titanium anode plate is widely used as an anode in various electroplating. Also useful as anodes are the electroplating of noble metals on the titanium surface such as: platinum, gold, etc., but are expensive.

According to the local area surface treatment method of the embodiment of the invention, the local area surface treatment device 100 according to any one of the above embodiments comprises the following steps:

the sample 200 to be processed is passed through one plating bath 10 or sequentially passed through a plurality of plating baths 10.

The sample 200 to be processed is subjected to the double-sided local area processing by two plating mold bodies 30 which are arranged in each plating tank 10 and are located at both sides of the sample 200 to be processed and are spaced apart from each other.

That is, the two electroplating mold bodies 30 located at both sides of the sample to be processed are used for performing the double-sided local area processing on the sample to be processed 200, and when a plurality of different electroplated layers are processed on a product to be processed, the product to be processed only needs to pass through the plurality of electroplating baths 10 in sequence, and different types of electroplating solutions can be loaded in the plurality of electroplating baths 10. According to the requirement of the electroplated product on the noble metal film thickness and the requirement of the electroplating production line speed, the electroplating production requirement can be met by adopting a mode that one electroplating bath 10 or a plurality of electroplating baths 10 are connected in series.

Therefore, according to the local area surface treatment device 100 and the local area surface treatment method of the embodiment of the invention, the double-sided local area treatment can be performed on the sample 200 to be treated, the precious metal can be precipitated on the two sides of the continuous metal terminal to obtain the electroplating product, and the device and the method have the advantages of high electroplating production efficiency, reduction of the overall investment cost of electroplating production, reduction of the electroplating production cost and the like.

The local area surface treatment apparatus 100 and the local area surface treatment method according to the embodiment of the present invention will be specifically described below with reference to specific embodiments.