阅读说明：本技术 用于涂覆多孔基底的表面的设备和方法 (Apparatus and method for coating a surface of a porous substrate ) 是由 朴相俊 金钟硕 李恩政 金圣洙 李在仁 赵安部 于 2018-06-22 设计创作，主要内容包括：本发明涉及用于涂覆多孔基底的表面的设备和方法,根据本发明的一个方面,提供了用于涂覆具有第一表面和与第一表面相对的第二表面的多孔基底的表面的设备,所述设备包括：用于将源气体供应至多孔基底的第一表面的第一供应部；用于在多孔基底内部产生从多孔基底的第一表面朝向第二表面的方向上的流动流的第一泵送部；用于将源气体供应至多孔基底的第二表面的第二供应部；用于在多孔基底内部产生从多孔基底的第二表面朝向第一表面的方向上的流动流的第二泵送部；和用于输送基底的基底载体。(According to one aspect of the present invention, there is provided an apparatus for coating a surface of a porous substrate having a first surface and a second surface opposite the first surface, the apparatus comprising: a first supply part for supplying a source gas to a first surface of the porous substrate; a first pumping section for generating a flow stream inside the porous substrate in a direction from the first surface toward the second surface of the porous substrate; a second supply part for supplying a source gas to the second surface of the porous substrate; a second pumping section for generating a flow stream inside the porous substrate in a direction from the second surface toward the first surface of the porous substrate; and a substrate carrier for transporting the substrate.)

1. An apparatus for coating a surface of a porous substrate having a first surface and a second surface opposite the first surface, the apparatus comprising:

a first supply portion for supplying a source gas to the first surface of the porous substrate;

a first pumping section for generating a flow stream inside the porous substrate in a direction from the first surface toward the second surface of the porous substrate;

a second supply portion for supplying the source gas to the second surface of the porous substrate;

a second pumping section for generating a flow stream inside the porous substrate in a direction from the second surface toward the first surface of the porous substrate; and

a substrate carrier for transporting the substrate.

2. The apparatus for coating a porous substrate according to claim 1,

wherein the first supply portion and the first pumping portion are disposed to face each other based on the substrate.

3. The apparatus for coating a porous substrate according to claim 1,

wherein the second supply portion and the second pumping portion are disposed to face each other based on the substrate.

4. The apparatus for coating a porous substrate according to claim 1,

wherein the first supply portion and the second pumping portion are disposed in order in a conveyance direction of the substrate so as to face a first surface side of the substrate.

5. The apparatus for coating a porous substrate according to claim 1,

wherein the first pumping part and the second supplying part are disposed in order in a conveying direction of the substrate to face a second surface side of the substrate.

6. The apparatus for coating a porous substrate according to claim 1,

wherein the first supply portion and the second supply portion are arranged in order in a conveying direction of the substrate, an

The first pumping part and the second pumping part are sequentially arranged along a conveying direction of the substrate.

7. The apparatus for coating a porous substrate according to claim 1,

wherein the first pumping section and the second pumping section form the flow stream having the same pressure.

8. The apparatus for coating a porous substrate according to claim 1,

wherein the first pumping section and the second pumping section form the flow stream having different pressures.

9. The apparatus for coating a porous substrate according to claim 1,

wherein the first supply part includes a pretreatment gas injection port, a source gas injection port, and a purge gas injection port.

10. The apparatus for coating a porous substrate according to claim 9,

wherein a plasma or organic vapor is supplied through the pretreatment gas injection port.

11. The apparatus for coating a porous substrate according to claim 1,

wherein the substrate carrier has one or more openings in at least some regions for passing the flow stream.

12. The apparatus for coating a porous substrate according to claim 1,

wherein the substrate carrier is arranged to transport a continuous substrate.

13. The apparatus for coating a porous substrate according to claim 1,

wherein the substrate support is configured to transport a discontinuous substrate.

14. The apparatus for coating a porous substrate according to claim 13,

further comprising a substrate inverting portion for inverting the first surface and the second surface of the substrate passing through the first supply portion.

15. The apparatus for coating a porous substrate according to claim 14,

wherein the first supply part and the second supply part are sequentially disposed on an upper portion or a lower portion of the substrate in a conveyance direction of the substrate, an

The first pumping part and the second pumping part are sequentially disposed on the other of the upper part or the lower part of the substrate in a conveying direction of the substrate.

16. A method for coating a surface of a porous substrate by generating a flow stream inside pores in the substrate having a first surface and a second surface opposite the first surface, the method comprising the steps of:

transporting the porous substrate;

supplying and diffusing a source gas in a direction from the first surface toward the second surface of the porous substrate, and removing reactive byproducts and the remaining source after reaction; and

the source gas is supplied and diffused in a direction from the second surface toward the first surface of the porous substrate, and reactive byproducts and the remaining source are removed after the reaction.

Technical Field

The present invention relates to an apparatus and a method for coating the surface of a porous substrate.

This application claims benefit based on priority of korean patent application No. 10-2017-0088402, filed on 12.7.7.2017, the disclosure of which is incorporated herein by reference in its entirety.

Background

As a method of forming a film on a substrate, there is, for example, an atomic layer deposition method.

Atomic Layer Deposition (ALD) is a technique for forming a film on a substrate based on sequential use of chemicals, usually in the gas phase, and is applied to various fields.

Fig. 1 is a schematic view showing a general atomic layer deposition apparatus 1, and particularly shows a spatial division type atomic layer deposition apparatus 1.

The atomic layer deposition apparatus 1 comprises a gas distribution plate 10 having a plurality of supply ports 11, 12, 13 and a transport device for transporting a substrate 20. The gas distribution plate 10 has a precursor gas supply port 11 for supplying one or more precursor gases (precursor a, precursor B) (also referred to as "source gases") onto the substrate 20, a precursor gas supply port 12, and a purge gas supply port 13 for supplying a purge gas.

In addition, the atomic layer deposition method is advantageous for surface coating of pores in a porous substrate due to its high coatability. However, when the porous substrate becomes thick, the source gas is supplied into the pores and diffused, and the purging and removal of the reactive by-products are not smooth, and thus uniform coating becomes difficult.

Specifically, depending on the pore size, aspect ratio, or surface characteristics of the porous substrate, the supply or diffusion of gas into the pores may be not smooth, and thus unevenness in deposition thickness and composition may occur in the depth direction (thickness direction) of the porous substrate.

Disclosure of Invention

Technical problem

The problem to be solved by the present invention is to provide an apparatus and a method for coating a surface of a porous substrate that can uniformly coat the surface of the porous substrate.

Technical scheme

In order to solve the above-mentioned problems, according to one aspect of the present invention, there is provided an apparatus for coating a surface of a porous substrate having a first surface and a second surface opposite to the first surface, the apparatus comprising: a first supply part for supplying a source gas to a first surface of the porous substrate; a first pumping section for generating a flow stream inside the porous substrate in a direction from the first surface towards the second surface of the porous substrate; a second supply part for supplying a source gas to the second surface of the porous substrate; a second pumping section for generating a flow stream inside the porous substrate in a direction from the second surface toward the first surface of the porous substrate; and a substrate carrier for transporting the substrate.

Further, the first supply portion and the first pumping portion may be disposed to face each other based on the substrate.

Further, the second supply portion and the second pumping portion may be disposed to face each other based on the substrate.

Further, the first supply portion and the second pumping portion may be disposed in order in the conveyance direction of the substrate to face the first surface side of the substrate.

Further, the first pumping part and the second supplying part may be sequentially disposed to face the second surface side of the substrate in the conveying direction of the substrate.

Further, the first supply part and the second supply part may be sequentially arranged in a conveyance direction of the substrate, and the first pumping part and the second pumping part may be sequentially arranged in the conveyance direction of the substrate.

Further, the first pumping section and the second pumping section may be arranged to form flow streams having the same pressure.

Further, the first pumping section and the second pumping section may be arranged to form flow streams having different pressures.

Furthermore, the substrate carrier may have one or more openings for passing the flow stream through in at least some regions.

Further, the substrate carrier may be configured to continuously convey the substrate while passing through the first supply and the second supply.

Alternatively, the substrate carrier may be configured to discontinuously transport the substrate while passing through the first supply and the second supply.

Further, the apparatus may further include a substrate inverting part for inverting the first surface and the second surface of the substrate passing through the first supplying part.

At this time, the first supply part and the second supply part may be sequentially disposed on an upper portion or a lower portion of the substrate in a conveyance direction of the substrate, and the first pumping part and the second pumping part may be sequentially disposed on the other of the upper portion or the lower portion of the substrate in the conveyance direction of the substrate.

Further, according to yet another aspect of the present invention, there is provided a method for coating a surface of a porous substrate by generating a flow stream inside pores in the porous substrate having a first surface and a second surface opposite to the first surface, the method comprising the steps of: transporting a porous substrate; supplying and diffusing a source gas in a direction from a first surface toward a second surface of the porous substrate, and removing reactive byproducts and the remaining source after the reaction; and supplying and diffusing a source gas in a direction from the second surface toward the first surface of the porous substrate, and removing the reactive byproducts and the remaining source after the reaction.

Advantageous effects

As described above, the apparatus and method for coating the surface of a porous substrate related to at least one embodiment of the present invention have the following effects.

By sequentially passing the direction in which the source gas is supplied and the flow stream direction formed inside the porous substrate through different spaces in the conveyance direction of the porous substrate, the supply and diffusion of the source gas are smoothly performed on both surfaces of the porous substrate, so that the unevenness of the deposition thickness and composition can be improved.

In addition, the degree of deposition on both surfaces (front surface, back surface) of the porous substrate can be optionally controlled.

Drawings

Fig. 1 is a schematic view showing a general atomic layer deposition apparatus.

Fig. 2 is a schematic view showing a surface coating apparatus of a porous substrate related to a first embodiment of the present invention.

Fig. 3 is a schematic view showing a surface coating apparatus of a porous substrate related to a second embodiment of the present invention.

Fig. 4 is an enlarged view of a portion a in fig. 3.

Fig. 5 is an enlarged view of a portion B in fig. 3.

Detailed Description

Hereinafter, an apparatus and a method for coating a surface of a porous substrate according to one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In addition, the same or similar reference numerals are given to the same or corresponding parts regardless of the reference numerals, redundant description will be omitted, and the size and shape of each constituent member shown may be enlarged or reduced for convenience of description.

In this document, the surface coating apparatus of the porous substrate (hereinafter, also referred to as "coating apparatus") may be an atomic layer deposition apparatus, but is not limited thereto, and it may also be applied to various deposition methods in which coating is performed by forming a flow stream, such as chemical vapor deposition, molecular layer deposition, or deposition by a combination thereof.

Fig. 2 is a schematic view showing a surface coating apparatus 100 of a porous substrate related to a first embodiment of the present invention.

The coating apparatus 100 is an apparatus for coating a surface of a porous substrate having a first surface and a second surface opposite to the first surface, the apparatus comprising: a source gas supply part 110 for supplying a source gas to the first surface of the porous substrate 20, and a source gas pumping part 130 for generating a flow stream inside the porous substrate (holes, 121) in a direction from the first surface toward the second surface of the porous substrate 120.

Accordingly, the source gases are injected toward the first surface side of porous substrate 120 while generating a flow flowing from the first surface side to the second surface side in the pores of porous substrate 120 by source gas pumping part 130, so that the injection and diffusion of the source gases into the interior of porous substrate 120 are smooth.

Fig. 3 is a schematic view illustrating a surface coating apparatus 200 of a porous substrate related to a second embodiment of the present invention, fig. 4 is an enlarged view of a portion a of fig. 3, and fig. 5 is an enlarged view of a portion B of fig. 3.

The coating apparatus 200 relating to the second embodiment is an apparatus for coating a surface of a porous substrate having a first surface (e.g., a front surface) and a second surface (e.g., a rear surface) opposite to the first surface.

The coating apparatus 200 includes a first supply part 211 for supplying a source gas to the first surface of the porous substrate 200 and a first pumping part 231 for generating a flow stream inside the porous substrate 220 in a direction from the first surface toward the second surface of the porous substrate 220.

The coating apparatus 200 further includes a second supply part 212 for supplying the source gas to the second surface of the porous substrate 220 and a second pumping part 232 for generating a flow stream inside the porous substrate 220 in a direction from the second surface toward the first surface of the porous substrate 220.

The coating apparatus 200 further includes a substrate carrier (not shown) for transporting the substrate 220. In this case, the substrate carrier has one or more openings in at least some regions for the flow stream to pass through. For example, the substrate carrier may also be configured in the form of a mesh or grid having a predetermined opening ratio. Alternatively, the substrate carrier may be configured in a roll-to-roll manner to include a plurality of guide rollers. In such a structure, in order to form the opening for passing the flow stream, the roll-to-roll apparatus may also be configured to support both side edges of the substrate in the width direction.

On the other hand, based on fig. 3, a region where the first and second pumping parts 231 and 212 are provided may be referred to as an upper portion of the substrate 220, and a region where the first and second pumping parts 211 and 232 are provided may be referred to as a lower portion of the substrate 220.

The first and second supply parts 211 and 212 are provided to inject source gases onto the substrate, and the first and second supply parts 211 and 212 include one or more source gas (source a, source B) injection ports and a purge gas injection port.

Specifically, each supply portion (211, 212) may include a pretreatment gas injection port, a source gas injection port, and a purge gas injection port. For example, in the supply section, a pretreatment gas injection port, a first precursor (source a) injection port, a purge gas injection port, a second precursor (source B) injection port, and a purge gas injection port may be arranged. In addition, the pretreatment gas injection port may have a plurality of different gas injection ports. In addition, plasma or organic vapor may be supplied through the pretreatment gas injection port.

In addition, the first supply part 211 and the first pumping part 231 may be disposed to face each other based on the substrate 220. For example, when the source gas is injected to the first surface side of the substrate through the first supply part 211, the first pumping part 231 generates a flow stream flowing from the first surface to the second surface in the pores 221 inside the porous substrate, so that the coating can be achieved inside the pores.

Further, the second supply part 212 and the second pumping part 232 may be disposed to face each other based on the substrate. For example, when the source gas is injected to the second surface side of the substrate 220 through the second supply part 212, the second pumping part 232 generates a flow stream flowing from the second surface to the first surface in the pores 221 inside the porous substrate, so that the coating can be achieved inside the pores.

Further, the first supply part 211 and the second pumping part 232 may be sequentially disposed to face a first surface side of the substrate (e.g., a lower portion of the substrate) in the conveying direction of the substrate 220, and the first pumping part 231 and the second supply part 212 may be sequentially disposed to face a second surface side of the substrate (e.g., an upper portion of the substrate) in the conveying direction of the substrate 220.

In addition, the first supply part 211 and the second supply part 212 may be sequentially arranged in a conveyance direction of the substrate, for example, the first supply part 211 may be disposed on a lower portion of the substrate, the second supply part 212 may be disposed on an upper portion of the substrate, and vice versa. Further, the first pumping part 231 and the second pumping part 232 may be sequentially arranged in the conveying direction of the substrate, for example, the first pumping part 231 may be disposed on an upper portion of the substrate, the second pumping part 232 may be disposed on a lower portion of the substrate, and vice versa.

Referring to fig. 3 to 5, the supply and diffusion of the source gas are smoothly performed on both surfaces (first and second surfaces) of the porous substrate 200 by sequentially passing the direction in which the source gas is supplied and the flow stream direction (see arrows in fig. 4 and 5) formed inside the porous substrate through different spaces in the transport direction of the porous substrate 220.

On the other hand, the first and second pumping parts 231 and 232 may be provided to form flow streams having the same pressure. Alternatively, the first and second pumping parts 231 and 232 may be provided to form flow streams having different pressures. Thus, the degree of deposition of the porous substrate 220 on both surfaces (front surface, back surface) can be optionally controlled.

The substrate carrier may also be arranged to transport a continuous substrate. The continuous substrate may be a web.

Although, up to now, an example in which the supply portion and the pumping portion are arranged such that the directions of the flow streams applied to the porous substrate 220 are crossed during the travel of the porous substrate 220 has been described, the present invention is not limited in such a manner.

The substrate carrier may also be configured to transport discrete substrates. The discrete substrate may be a wafer or glass. At this time, the coating apparatus 200 may further include a substrate inverting part (not shown) for inverting the first and second surfaces of the substrate passing through the first supply part 211.

At this time, the first supply part 211 and the second supply part 212 may be sequentially disposed on an upper portion or a lower portion of the substrate in a conveyance direction of the substrate. For example, the first supply part 211 and the second supply part 212 may be simultaneously disposed on an upper portion or a lower portion of the substrate.

Similarly, the first and second pumping parts 231 and 232 may be sequentially disposed on the other of the upper or lower portion of the substrate 20 in the conveying direction thereof.

For example, the first and second pumping parts 231 and 232 may be simultaneously disposed on the upper or lower portion of the substrate 220. Of course, when the first and second supply parts 211 and 212 are disposed on the upper portion of the substrate 220, the first and second pumping parts 231 and 232 may be disposed on the lower portion of the substrate 220.

In addition, the first supply part 211 and the first pumping part 231 may be disposed to face each other based on the substrate 220, and the second supply part 212 and the second pumping part 232 may be disposed to face each other based on the substrate 220.

The coating method using the coating apparatus 200 having the above-described structure is as follows.

The coating method is a method for coating a surface of a porous substrate by generating a flow stream inside pores in the porous substrate having a first surface and a second surface opposite to the first surface, the method comprising the steps of: transporting a porous substrate; supplying and diffusing a source gas in a direction from a first surface toward a second surface of the porous substrate, and removing reactive byproducts and the remaining source after the reaction; and supplying and diffusing a source gas in a direction from the second surface toward the first surface of the porous substrate, and removing the reactive byproducts and the remaining source after the reaction.

For example, a surface coating method of a porous substrate is a method for coating a surface of a porous substrate having a first surface and a second surface opposite to the first surface, the method comprising the steps of: transporting a porous substrate; supplying a source gas to a first surface of a porous substrate and diffusing it; and generating a flow stream inside the porous substrate in a direction from the first surface toward the second surface of the porous substrate.

Furthermore, the method comprises the steps of: supplying a source gas to the second surface of the porous substrate and diffusing it; and generating a flow stream inside the porous substrate in a direction from the second surface toward the first surface of the porous substrate.

The preferred embodiments of the present invention as set forth above are disclosed for illustrative purposes, wherein various modifications, adaptations, and additions may be made by those skilled in the art within the spirit and scope of the invention, and such modifications, adaptations, and additions are intended to be considered within the scope of the appended claims.

INDUSTRIAL APPLICABILITY

According to the surface coating apparatus and method of a porous substrate related to at least one embodiment of the present invention, the supply and diffusion of source gases are smoothly performed on both surfaces of the porous substrate, so that the unevenness of the deposition thickness and composition can be improved.