阅读说明：本技术 膜下缺陷检测方法及膜下缺陷检测设备 (Under-film defect detection method and under-film defect detection equipment ) 是由 洪日 周振华 赵云飞 刘瑶 于 2017-12-15 设计创作，主要内容包括：一种膜下缺陷检测方法及膜下缺陷检测设备(100),膜下缺陷检测方法包括步骤：通过光学显微镜(10)对被检测物(Y)进行检测,确定被检测物(Y)的缺陷的第一坐标信息(S10)；根据光学显微镜(10)与扫描装置(20)及切割装置(30)的位置关系和第一坐标信息,确定被检测物(Y)的缺陷与扫描装置(20)的第二坐标信息,及确定被检测物(Y)的缺陷与切割装置(30)的第三坐标信息(S20)；及根据第三坐标信息,控制切割装置(30)对被检测物(Y)进行切割,及根据第二坐标信息,控制扫描装置(20)对切割后的被检测物(Y)的缺陷进行扫描(S30)。(under-film defect detection method and under-film defect detection equipment (100), the under-film defect detection method comprises the steps of detecting an object to be detected (Y) through an optical microscope (10) to determine th coordinate information (S10) of the defect of the object to be detected (Y), determining second coordinate information of the defect of the object to be detected (Y) and a scanning device (20) and third coordinate information (S20) of the defect of the object to be detected (Y) and a cutting device (30) according to the position relation of the optical microscope (10) and the scanning device (20) and the th coordinate information, controlling the cutting device (30) to cut the object to be detected (Y) according to the third coordinate information, and controlling the scanning device (20) to scan the defect of the cut object to be detected (Y) according to the second coordinate information (S30).)

method for detecting defects under film, which is characterized by comprising the following steps:

detecting an object to be detected through an optical microscope, and determining th coordinate information of the defect of the object to be detected;

determining the position relation between the optical microscope and the scanning device and the cutting device, determining the second coordinate information of the defect of the detected object and the scanning device, determining the third coordinate information of the defect of the detected object and the cutting device according to the th coordinate information and determining the position relation between the optical microscope and the scanning device and the cutting device

And controlling the cutting device to cut the detected object according to the third coordinate information, and controlling the scanning device to scan the defects of the cut detected object according to the second coordinate information.

The method for detecting defects under film according to claim 1, wherein the scanning device comprises a scanning probe, and the step of determining the defects of the object to be detected and the second coordinate information of the scanning device according to the positional relationship between the optical microscope and the scanning device and the cutting device and the -th coordinate information comprises:

calculating the relative positions of the focal point of the optical microscope and the focal point of the scanning probe; and

and converting the th coordinate information according to the relative position to obtain the second coordinate information.

The method for detecting defects under film according to claim 1 or 2, wherein the cutting device comprises a cutting probe, and the step of determining the defects of the object to be detected and the third coordinate information of the cutting device according to the positional relationship between the optical microscope and the scanning device and the cutting device and the -th coordinate information comprises:

calculating the relative positions of the focal point of the optical microscope and the focal point of the cutting probe; and

and converting the th coordinate information according to the relative position to obtain the third coordinate information.

The method for detecting defects under film according to claim 1, wherein the scanning device comprises a scanning probe, the cutting device comprises a cutting probe, and the step of controlling the cutting device to cut the object to be detected according to the third coordinate information and the step of controlling the scanning device to scan the defects of the object to be detected after cutting according to the second coordinate information comprises:

moving the detected object to a focus of the scanning probe according to the second coordinate information;

rotating the detected object to the vertical direction of the ion beam of the cutting probe according to the third coordinate information, and controlling the cutting probe to cut the section of the defect of the detected object; and

and controlling the scanning probe to scan the defects of the detected object after the section is cut according to the second coordinate information.

The method for detecting defects under a film according to claim 4, wherein the step of rotating the inspected object to the vertical direction of the ion beam of the cutting probe according to the third coordinate information and controlling the cutting probe to cut the section of the defect of the inspected object comprises the steps of:

and when the cutting probe is controlled to cut the section of the detected object according to the third coordinate information, moving the detected object along the vertical direction of the ion beam vertical to the cutting probe and adjusting the intensity of the ion beam of the cutting probe, wherein the section is provided with a surface parallel to the vertical direction of the ion beam of the cutting probe, the surface is provided with the defect, and the surface faces the scanning probe.

The method for detecting defects under film according to claim 1, wherein the scanning device comprises a scanning probe and a detector, and the step of controlling the scanning device to scan the defects of the detected object after cutting according to the second coordinate information comprises:

emitting an electron beam by the scanning probe to scan a section formed when the cutting probe cuts;

receiving a secondary electron signal generated by the section through the detector to acquire image information of the section, and determining the position of the film layer of the defect according to the image information; and

and acquiring X-rays generated by the defects through the detector, and analyzing the composition of the defects according to the X-rays.

The method for detecting defects under a film according to claim 1, wherein the object to be detected is a display screen, and the step of detecting the object to be detected by an optical microscope comprises the steps of:

and switching on a power supply to the detected object, lighting the detected object, and detecting the detected object through the optical microscope.

types of under-film defect detection equipment is characterized by comprising an optical microscope, a scanning device and a cutting device, and further comprising:

a memory storing at least programs;

a processor for executing the at least program to implement the steps of:

detecting an object to be detected through the optical microscope, and determining th coordinate information of the defect of the object to be detected;

determining the second coordinate information of the defect of the detected object and the scanning device and the third coordinate information of the defect of the detected object and the cutting device according to the position relation of the optical microscope, the scanning device and the cutting device and the th coordinate information

And controlling the cutting device to cut the detected object according to the third coordinate information, and controlling the scanning device to scan the defects of the cut detected object according to the second coordinate information.

The under-film defect inspection apparatus of claim 8, wherein the scanning device comprises a scanning probe, and the processor is configured to execute at least program to implement the steps of:

calculating the relative positions of the focal point of the optical microscope and the focal point of the scanning probe; and

and converting the th coordinate information according to the relative position to obtain the second coordinate information.

The under film defect inspection apparatus of claim 8 or 9, wherein the cutting device comprises a cutting probe, the processor being configured to execute at least program to perform the steps of:

calculating the relative positions of the focal point of the optical microscope and the focal point of the cutting probe; and

and converting the th coordinate information according to the relative position to obtain the third coordinate information.

The under-film defect inspection apparatus of claim 8, wherein the scanning device comprises a scanning probe, the cutting device comprises a cutting probe, and the processor is configured to execute at least program to implement the steps of:

moving the detected object to a focus of the scanning probe according to the second coordinate information;

rotating the detected object to the vertical direction of the ion beam of the cutting probe according to the third coordinate information, and controlling the cutting probe to cut the section of the defect of the detected object; and

and controlling the scanning probe to scan the defects of the detected object after the section is cut according to the second coordinate information.

The under film defect inspection apparatus of claim 11, wherein the processor is configured to execute at least program to implement the steps of:

and when the cutting probe is controlled to cut the section of the detected object according to the third coordinate information, moving the detected object along the vertical direction of the ion beam vertical to the cutting probe and adjusting the intensity of the ion beam of the cutting probe, wherein the section is provided with a surface parallel to the vertical direction of the ion beam of the cutting probe, the surface is provided with the defect, and the surface faces the scanning probe.

The under-film defect inspection apparatus of claim 8, wherein the scanning device comprises a scanning probe and a detector, and the processor is configured to execute at least program to implement the steps of:

emitting an electron beam by the scanning probe to scan a section formed when the cutting probe cuts;

receiving a secondary electron signal generated by the section through the detector to acquire image information of the section, and determining the position of the film layer of the defect according to the image information; and

and acquiring X-rays generated by the defects through the detector, and analyzing the composition of the defects according to the X-rays.

The under-film defect inspection apparatus of claim 8, wherein the inspected object is a display screen, and the processor is configured to execute at least program to implement the following steps:

and switching on a power supply to the detected object, lighting the detected object, and detecting the detected object through the optical microscope.