阅读说明：本技术 一种电镀腔体以及制作方法 (Electroplating cavity and manufacturing method ) 是由 杨华 刘锦森 刘福波 朴起政 郑秀谦 龚圆杰 于 2019-11-11 设计创作，主要内容包括：本发明涉及一种电镀腔体,包括腔体坯件、镀覆于腔体坯件上的电镀层,电镀层中各组分按重量百分比包括：铜70％～90％；镍10％～20％；铬0.5％～5％；还涉及一种电镀腔体的制作方法,包括以下步骤：镀前处理、镀镍打底、镀亮铜打底、镀酸铜打底、镀光亮镍、镍封、镀铬、脱水、烘烤、包装,本发明提供了一种高温烘烤不变色,而且增强了耐腐蚀、耐摩擦、光泽度、热反射性能的电镀腔体及其制作方法。(The invention relates to an electroplating cavity, which comprises a cavity blank and an electroplating layer plated on the cavity blank, wherein the electroplating layer comprises the following components in percentage by weight: 70% -90% of copper; 10 to 20 percent of nickel; 0.5 to 5 percent of chromium; also relates to a manufacturing method of the electroplating cavity, which comprises the following steps: the invention provides an electroplating cavity which does not change color when baked at high temperature and enhances corrosion resistance, friction resistance, glossiness and heat reflection performance, and a manufacturing method thereof.)

1. An electroplating cavity comprises a cavity blank and an electroplating layer plated on the cavity blank, wherein the cavity blank comprises a front plate, a rear plate, a U plate and a bottom plate; the electroplated layer comprises the following components in percentage by weight: 70% -90% of copper; 10 to 20 percent of nickel; 0.5 to 5 percent of chromium.

2. The electroplating chamber of claim 1, wherein: the thickness of the electroplated layer is 12-15 μm.

3. A manufacturing method of an electroplating cavity is characterized in that: the method comprises the following steps:

the method comprises the following steps: pre-plating treatment:

the pre-plating treatment is acted on the surface of the cavity blank and is used for removing a grease layer, a wax layer and a rust film on the surface of the cavity blank;

step two: and (3) nickel plating and priming:

plating at least one nickel plating layer on the cavity blank processed in the first step for filling and leveling the material gap of the cavity blank;

step three: plating bright copper and bottoming:

plating at least one bright copper plating layer on the cavity blank processed in the second step, wherein the bright copper plating layer is used for increasing the surface bonding degree, the adhesive force, the corrosion resistance, the friction resistance and the glossiness of the electroplated layer;

step four: acid copper plating and priming:

plating at least one acid copper plating layer on the cavity blank processed in the third step, wherein the acid copper plating layer is used for increasing the surface brightness, the corrosion resistance, the adhesive force, the corrosion resistance, the friction resistance and the glossiness of the electroplating layer;

step five: plating bright nickel:

plating at least one layer of bright nickel plating layer on the cavity blank processed in the fourth step, wherein the bright nickel plating layer is a composite plating layer for realizing particles and bright nickel and is used for enabling a subsequent chromium plating layer to have micropores or microcracks;

step six: nickel sealing:

plating at least one nickel sealing layer on the cavity blank treated in the fifth step, and filling up gaps of an electroplated layer to enhance the corrosion resistance;

step seven: and (3) chromium plating:

plating at least one chromium coating on the cavity blank treated in the sixth step, wherein the chromium coating is passivated to generate a passivation film with compact structure on the surface of an electroplated layer so as to improve the corrosion resistance of the electroplated layer;

step eight: dehydrating and baking:

the device is used for drying the cavity blank, and the stability of an electroplated layer is enhanced;

step nine: and (6) packaging.

4. The method of claim 3, wherein the step of forming the plating chamber comprises: the pre-plating treatment comprises thermal degreasing, ultrasonic dewaxing, electrolytic degreasing, acid electrolysis and hydrochloric acid neutralization treatment which are sequentially carried out, wherein the acid electrolysis treatment is to soak a cavity blank in a solution with the concentration of sulfuric acid of 60g/L, the solution temperature is normal temperature, and the time is 1.5-2.0 minutes; and the hydrochloric acid neutralization treatment is to soak the cavity blank in a solution with the industrial hydrochloric acid concentration of 50-100 ml/L, wherein the solution temperature is normal temperature, and the time is 1-1.5 minutes.

5. The method of claim 3, wherein the step of forming the plating chamber comprises: the nickel plating priming comprises nickel impact treatment, wherein the nickel impact treatment is to soak a cavity blank in a solution with nickel chloride concentration of 70-90 g/L and hydrochloric acid concentration of 80-100 ml/L, the temperature of the solution is normal temperature, and the time is 60-120 seconds.

6. The method of claim 3, wherein the step of forming the plating chamber comprises: the bright copper plating bottoming comprises alkaline copper plating and sulfuric acid neutralization treatment which are sequentially carried out, wherein the alkaline copper plating treatment is to soak a cavity blank in a solution with the concentration of free sodium cyanide of 5-10g/L and the depth of cuprous cyanide of 25-35 g/L, the temperature of the solution is 40-55 ℃, and the time is 2-2.5 minutes.

7. The method of claim 3, wherein the step of forming the plating chamber comprises: the acid copper plating priming comprises acid copper plating and sulfuric acid neutralization treatment which are sequentially carried out, wherein the acid copper plating treatment is to soak a cavity blank in a solution with the copper sulfate concentration of 175-190 g/L, the sulfuric acid concentration of 55-75 g/L and the chloride ion concentration of 60-90 PPm, the temperature of the solution is 18-28 ℃, and the time is 1000-1200 seconds.

8. The method of claim 3, wherein the step of forming the plating chamber comprises: and in the step five, the bright nickel plating is to soak the cavity blank in a solution with the nickel sulfate concentration of 160-190 g/L, the nickel chloride concentration of 45-50 g/L and the boric acid concentration of 38-45 g/L, wherein the temperature of the solution is 50-60 ℃, and the time is 3.5-15 minutes.

9. The method of claim 3, wherein the step of forming the plating chamber comprises: and in the step six, the nickel seal is to soak the cavity blank in a solution with the nickel sulfate concentration of 80-100g/L, the nickel chloride concentration of 25-35 g/L and the boric acid concentration of 25-35 g/L, wherein the solution temperature is 40-55 ℃ and the time is 0.5-3 minutes.

10. The method of claim 3, wherein the step of forming the plating chamber comprises: the chromium plating comprises chromium activation and chromium polishing treatment which are sequentially carried out, wherein the chromium activation treatment is to soak the cavity blank in a solution with the concentration of chromic anhydride of 5-8 g/L and the concentration of sulfuric acid of 0.3ml/L, the temperature of the solution is normal temperature, and the time is 2-5 seconds; the photo-chromic treatment is to soak the cavity blank in a solution with chromic anhydride concentration of 190-230 g/L and sulfuric acid concentration of 0.3-0.8 g/L, wherein the temperature of the solution is 18-25 ℃, and the time is 2-3 minutes.

Technical Field

The invention belongs to the technical field of ovens, and particularly relates to an electroplating cavity and a manufacturing method thereof.

Background

The electric oven heats by a heating tube to raise the temperature of the oven cavity, thereby achieving the purpose of heating food. In the cooking process, the cavity is in a high-temperature barbecue state for a long time. The existing cavity is usually formed by processing a common galvanized plate or a stainless steel plate, and the common galvanized plate or the stainless steel plate is easily oxidized and discolored by heat under a high-temperature state, so that the cleaning is difficult, the heat reflection effect is poor, and the use experience is influenced.

Therefore, based on the problems, the electroplating cavity which does not change color when being baked at high temperature and enhances the corrosion resistance, the friction resistance, the glossiness and the heat reflection performance and the manufacturing method thereof are provided, and the electroplating cavity has important practical significance.

Disclosure of Invention

In order to solve the problems in the prior art, the invention provides the electroplating cavity which does not change color when being baked at high temperature and enhances the corrosion resistance, the friction resistance, the glossiness and the heat reflection performance, and the manufacturing method thereof.

The technical scheme adopted by the invention for solving the problem is as follows:

an electroplating cavity comprises a cavity blank and an electroplating layer plated on the cavity blank, wherein the cavity blank comprises a front plate, a rear plate, a U plate and a bottom plate, and the electroplating layer comprises the following components in percentage by weight: 70% -90% of copper; 10 to 20 percent of nickel; 0.5 to 5 percent of chromium.

Preferably, the thickness of the plating layer is 12 to 15 μm.

A second object of the present invention is to: the manufacturing method of the electroplating cavity comprises the following steps:

the method comprises the following steps: pre-plating treatment:

the pre-plating treatment is acted on the surface of the cavity blank and is used for removing a grease layer, a wax layer and a rust film on the surface of the cavity blank;

step two: and (3) nickel plating and priming:

plating at least one nickel plating layer on the cavity blank processed in the first step, wherein the nickel plating layer is used as a first transition layer of an electroplated layer and is used for filling and leveling a material gap of the cavity blank;

step three: plating bright copper and bottoming:

plating at least one bright copper plating layer on the cavity blank treated in the second step, wherein the bright copper plating layer is used as a second transition layer of the electroplated layer and is used for increasing the surface bonding degree, the adhesive force, the corrosion resistance, the friction resistance and the glossiness of the electroplated layer;

step four: acid copper plating and priming:

plating at least one acid copper plating layer on the cavity blank treated in the third step, wherein the acid copper plating layer is used as a third transition layer of an electroplated layer and is used for increasing the surface brightness, the corrosion resistance, the adhesion, the corrosion resistance, the friction resistance and the glossiness of the electroplated layer;

step five: plating bright nickel:

plating at least one layer of bright nickel plating layer on the cavity blank treated in the fourth step, wherein the bright nickel plating layer is used as a fourth transition layer of the electroplated layer, is a composite plating layer for realizing particles and bright nickel and is used for enabling a subsequent chromium plating layer to have micropores or microcracks;

step six: nickel sealing:

plating at least one nickel seal layer on the cavity blank treated in the fifth step, wherein the nickel seal layer is used as a fifth transition layer of the electroplated layer and is used for filling gaps of the electroplated layer and enhancing the corrosion resistance;

step seven: and (3) chromium plating:

plating at least one chromium plating layer on the cavity blank processed in the sixth step, wherein the chromium plating layer is used as the outermost layer of the electroplated layer, and is used for generating a passivation film with compact tissue on the surface of the electroplated layer through passivation treatment so as to improve the corrosion resistance of the electroplated layer;

step eight: dehydrating and baking:

the device is used for drying the cavity and enhancing the stability of an electroplated layer;

step nine: and (6) packaging.

Preferably, the pre-plating treatment comprises thermal degreasing, ultrasonic wave dewaxing, electrolytic degreasing, acid electrolysis and hydrochloric acid neutralization treatment which are sequentially carried out.

Preferably, the acid electrolysis treatment is to soak the cavity blank in a solution with the sulfuric acid concentration of 60g/L, wherein the solution temperature is normal temperature, and the time is 1.5-2.0 minutes; and the hydrochloric acid neutralization treatment is to soak the cavity blank in a solution with the industrial hydrochloric acid concentration of 50-100 ml/L, wherein the solution temperature is normal temperature, and the time is 1-1.5 minutes.

Preferably, the nickel plating primer comprises an impact nickel treatment.

Preferably, the nickel impact treatment is to soak the cavity blank in a solution with nickel chloride concentration of 70-90 g/L and hydrochloric acid concentration of 80-100 ml/L, wherein the solution temperature is normal temperature and the time is 60-120 seconds.

Preferably, the bright copper plating priming comprises alkaline copper plating and sulfuric acid neutralization treatment which are sequentially carried out.

Preferably, the alkaline copper plating treatment is to soak the cavity blank in a solution with the concentration of free sodium cyanide of 5-10g/L and the depth of cuprous cyanide of 25-35 g/L, wherein the temperature of the solution is 40-55 ℃, and the time is 2-2.5 minutes; the sulfuric acid neutralization treatment is to soak the cavity blank in a solution with the industrial sulfuric acid concentration of 75-120 g/L, wherein the solution temperature is normal temperature, and the time is 3-10 seconds.

Preferably, the acid copper plating priming comprises acid copper plating and sulfuric acid neutralization treatment which are sequentially carried out.

Preferably, the acid copper plating treatment is to soak the cavity blank in a solution with the copper sulfate concentration of 175-190 g/L, the sulfuric acid concentration of 55-75 g/L and the chloride ion concentration of 60-90 PPm, wherein the solution temperature is 18-28 ℃ and the time is 1000-1200 seconds; the sulfuric acid neutralization treatment is to soak the cavity blank in a solution with the industrial sulfuric acid concentration of 75-120 g/L and the membrane hydrochloric acid concentration of 5g/L, wherein the solution temperature is normal temperature, and the time is 3-10 seconds.

Preferably, in the step five, the bright nickel plating is to soak the cavity blank in a solution with the nickel sulfate concentration of 160-190 g/L, the nickel chloride concentration of 45-50 g/L and the boric acid concentration of 38-45 g/L, wherein the solution temperature is 50-60 ℃ and the time is 3.5-15 minutes.

Preferably, the nickel seal in the sixth step is to soak the cavity blank in a solution with a nickel sulfate concentration of 80-100g/L, a nickel chloride concentration of 25-35 g/L and a boric acid concentration of 25-35 g/L, wherein the solution temperature is 40-55 ℃ and the time is 0.5-3 minutes.

Preferably, the chromium plating comprises chromium activation and photochromism treatment which are sequentially carried out.

Preferably, the chromium activation treatment is to soak the cavity blank in a solution with a chromic anhydride concentration of 5-8 g/L and a sulfuric acid concentration of 0.3ml/L, wherein the solution temperature is normal temperature and the time is 2-5 seconds; the photo-chromic treatment is to soak the cavity blank in a solution with chromic anhydride concentration of 190-230 g/L and sulfuric acid concentration of 0.3-0.8 g/L, wherein the temperature of the solution is 18-25 ℃, and the time is 2-3 minutes.

Preferably, the dehydration and baking comprise ultrasonic dehydration and baking which are sequentially carried out; the ultrasonic dehydration is to soak the cavity blank in a dehydrating agent solution with the temperature of 2-5 g/L, wherein the temperature of the solution is 45-60 ℃, and the time is 1-1.5 minutes.

The invention has the advantages and positive effects that:

1. in the invention, the cavity blank is plated with an electroplated layer, and the electroplated layer comprises the following components in percentage by weight: 70% -90% of copper; 10 to 20 percent of nickel; 0.5 to 5 percent of chromium, thereby greatly improving the corrosion resistance, the friction resistance and the glossiness of the cavity blank which can be plated with the electroplated layer.

2. According to the invention, through electroplating treatment on the cavity blank, the cavity blank has the advantages of no surface discoloration, high surface hardness, good friction resistance and good surface heat reflection performance in high-temperature baking, and is convenient to clean, attractive, practical, high-temperature resistant and the like.

Drawings

The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and examples, but it should be understood that these drawings are designed for illustrative purposes only and thus do not limit the scope of the present invention. Furthermore, unless otherwise indicated, the drawings are intended to be illustrative of the structural configurations described herein and are not necessarily drawn to scale.

Fig. 1 is a schematic diagram of an exploded structure of a cavity blank in the present invention.

In the figure: 1. the front plate, 2, the back plate, 3, the U board, 4, the bottom plate.

Detailed Description

First, it should be noted that the specific structures, features, advantages, etc. of the present invention will be specifically described below by way of example, but all the descriptions are for illustrative purposes only and should not be construed as limiting the present invention in any way. Furthermore, any single feature described or implicit in any embodiment or any single feature shown or implicit in any drawing may still be combined or subtracted between any of the features (or equivalents thereof) to obtain still further embodiments of the invention that may not be directly mentioned herein. In addition, for the sake of simplicity, the same or similar features may be indicated in only one place in the same drawing.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations. The present invention will be specifically described with reference to fig. 1.