阅读说明：本技术 电容薄膜及其双面金属堆栈工艺 (Capacitor film and double-sided metal stacking process thereof ) 是由 徐康程 钟复兴 江龙荣 夏正春 于 2019-09-02 设计创作，主要内容包括：本发明公开了电容薄膜及其双面金属堆栈工艺,电容薄膜双面金属堆栈工艺包括步骤S1：放卷辊将卷起的薄膜进行放卷,步骤S2：放卷后的薄膜通过辊筒传输到第一冷却辊进行附着铝层,步骤S3：第一冷却辊通过辊筒将薄膜传输到第二冷却辊进行附着铝层,步骤S4：第二冷却辊通过若干辊筒将薄膜传输到第三冷却辊进行附着铝层,步骤S5：第三冷却辊通过辊筒将薄膜传输到第四冷却辊进行附着铝层,步骤S6：第四冷却辊通过辊筒将薄膜传输到收卷辊进行收卷。本发明公开的电容薄膜及其双面金属堆栈工艺,其在真空状态下通过一面双排的方式加大铝层附着厚度。(The invention discloses a capacitor film and a double-sided metal stacking process thereof, wherein the double-sided metal stacking process of the capacitor film comprises the following steps of S1: unwinding the wound film by the unwinding roller, and performing step S2: the unreeled film is transmitted to a first cooling roller through a roller to be adhered with an aluminum layer, and the step S3 is as follows: the first cooling roller transmits the film to the second cooling roller through the roller to attach the aluminum layer, and the step S4: the second cooling roller transmits the film to a third cooling roller through a plurality of rollers to attach the aluminum layer, and the step S5: the third cooling roller transmits the film to the fourth cooling roller through the roller to attach the aluminum layer, and the step S6: and the fourth cooling roller transmits the film to the winding roller through the roller to be wound. The invention discloses a capacitor film and a double-sided metal stacking process thereof, which increase the adhesion thickness of an aluminum layer in a one-sided double-row mode in a vacuum state.)

1. A double-sided metal stacking process for a capacitor film is characterized by comprising the following steps:

step S1: the unwinding roller unwinds the wound film;

step S2: the unreeled film is conveyed to a first cooling roller through a roller to be adhered with an aluminum layer;

step S3: the first cooling roller transmits the film to the second cooling roller through the roller to attach an aluminum layer;

step S4: the second cooling roller transmits the film to a third cooling roller through a plurality of rollers to carry out reverse side aluminum layer adhesion;

step S5: the third cooling roller transmits the film to the fourth cooling roller through the roller to be adhered with an aluminum layer;

step S6: and the fourth cooling roller transmits the film to the winding roller through the roller to be wound.

2. The double-sided metal stacking process of the capacitor film according to claim 1, wherein an aluminum wire evaporating device is respectively arranged below the first cooling roller and the second cooling roller, the aluminum wire evaporating device is used for evaporating aluminum wires, and the evaporated aluminum wires are cooled and attached to the film surface when the film is conveyed to the first cooling roller and the second cooling roller.

3. The double-sided metal stacking process of the capacitor film according to claim 1, wherein an aluminum wire evaporating device is respectively arranged below the third cooling roller and the fourth cooling roller and used for evaporating aluminum wires, and the evaporated aluminum wires are cooled and attached to the other film surface of the film when the film is conveyed to the third cooling roller and the fourth cooling roller.

4. The double-sided metal stack process of claim 1, wherein step S4 is implemented as the following steps:

step S4.1: the film surface of the film is tightly attached to the second cooling roller, so that the film surface far away from the second cooling roller is attached with an aluminum layer;

step S4.2: the second cooling roller transmits the back surface of the film to a third cooling roller according to the position distribution of the rollers, and the film surface of the film with the aluminum layer is tightly attached to the third cooling roller;

step S4.3: the film is far away from the film surface of the third cooling roller, which is not adhered with the aluminum layer, and is adhered with the aluminum layer.

5. The double-sided metal stacking process for capacitor films as claimed in claim 1, wherein the double-sided metal stacking process for capacitor films is performed by attaching aluminum layer in a vacuum chamber.

6. The process of claim 1, wherein the first chill roll, the second chill roll, the third chill roll and the fourth chill roll are sequentially transported on the chill rolls, the first chill roll and the second chill roll are used for attaching the aluminum layer to the same surface of the film, and the third chill roll and the fourth chill roll are used for attaching the aluminum layer to the other surface of the film.

7. A capacitor film produced by the double-sided metal stack process of claim 1.

Technical Field

The invention belongs to a capacitor stacking process, and particularly relates to a capacitor film double-sided metal stacking process and a capacitor film.

Background

Electronic components are the foundation of the information industry, and capacitors are the most widely used electronic components among many, and the yield accounts for more than 50% of the total yield of electronic components. The yield of ceramic capacitors, electrolytic capacitors and organic thin film capacitors, which are three major products, accounts for more than 90% of the total capacitor yield. The organic thin film capacitors including the lead micro-capacitor, the leadless chip capacitor, the integrated capacitor, and the nano-capacitor occupy the half-wall river mountain. The film capacitor can be divided into a winding type, a laminated type and an inner string type according to the structure, and can be divided into a metal film (aluminum film, aluminum zinc film), a metal foil and a film foil composite structure according to the electrode.

At present, the existing capacitor thin film manufacturing materials in the market comprise ITO (indium tin oxide) and silver paste, but the following problems exist:

1. the double-sided metal stack has uneven thickness and low qualified rate;

2. the process is complex and the efficiency is low;

3. the metal thickness does not reach the standard;

4. manual screen printing or etching is costly.

Disclosure of Invention

The invention mainly aims to provide a capacitor film and a double-sided metal stacking process thereof, which increase the adhesion thickness of aluminum layers in a one-sided double-row mode in a vacuum state.

The main object of the present invention is to provide a capacitor film and a double-sided metal stacking process thereof, which uses roll-to-roll continuous mechanized metal stacking.

The invention mainly aims to provide a capacitor film and a double-sided metal stacking process thereof, wherein a film material is attached to the front side of the capacitor film in a one-time way back and forth in a state that a vacuum cabin body is not taken out.

In order to achieve the above object, the present invention provides a double-sided metal stacking process for capacitor thin films, which comprises the following steps:

step S1: the unwinding roller unwinds the wound film;

step S2: the unreeled film is conveyed to a first cooling roller through a roller to be adhered with an aluminum layer;

step S3: the first cooling roller transmits the film to the second cooling roller through the roller to attach an aluminum layer;

step S4: the second cooling roller transmits the film to a third cooling roller through a plurality of rollers to carry out reverse side aluminum layer adhesion;

step S5: the third cooling roller transmits the film to the fourth cooling roller through the roller to be adhered with an aluminum layer;

step S6: and the fourth cooling roller transmits the film to the winding roller through the roller to be wound.

As a further preferable technical means of the above technical means, aluminum wire evaporation devices are respectively provided below the first cooling roller and the second cooling roller, the aluminum wire evaporation devices are used for evaporating aluminum wires, and the evaporated aluminum wires are cooled and adhered to the film surface when the film is conveyed to the first cooling roller and the second cooling roller.

As a further preferable technical means of the above technical means, an aluminum wire evaporating device is respectively provided below the third cooling roller and the fourth cooling roller, the aluminum wire evaporating device is used for evaporating aluminum wires, and the evaporated aluminum wires are cooled and attached to the other film surface of the film when the film is conveyed to the third cooling roller and the fourth cooling roller.

As a further preferable embodiment of the above technical means, step S4 is specifically implemented as the following steps:

step S4.1: the film surface of the film is tightly attached to the second cooling roller, so that the film surface far away from the second cooling roller is attached with an aluminum layer;

step S4.2: the second cooling roller transmits the back surface of the film to a third cooling roller according to the position distribution of the rollers, and the film surface of the film with the aluminum layer is tightly attached to the third cooling roller;

step S4.3: the film is far away from the film surface of the third cooling roller, which is not adhered with the aluminum layer, and is adhered with the aluminum layer.

As a further preferable technical solution of the above technical solution, the double-sided metal stack process of the capacitor thin film attaches the aluminum layer in a state of a vacuum chamber.

In a more preferred embodiment of the above aspect, the film is transported on the cooling rolls in the order of a first cooling roll, a second cooling roll, a third cooling roll, and a fourth cooling roll, the first cooling roll and the second cooling roll adhere the aluminum layer to the same film surface of the film, and the third cooling roll and the fourth cooling roll adhere the aluminum layer to the other same film surface of the film.

The invention also provides a capacitor film which is manufactured by the capacitor film double-sided metal stacking process.

Drawings

FIG. 1 is a schematic structural diagram of a capacitor film and a double-sided metal stacking process thereof according to the present invention.

The reference numerals include: 100. a film; 101. unwinding rollers; 102. a wind-up roll; 103. a first cooling roll; 104. a second cooling roll; 105. a third cooling roll; 106. a fourth cooling roll; 107. an aluminum wire evaporation device.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

Referring to fig. 1 of the drawings, fig. 1 is a schematic structural diagram of a capacitor thin film and a double-sided metal stacking process thereof according to the present invention.

In the preferred embodiment of the present invention, those skilled in the art should note that the cooling roll, the aluminum wire evaporating device, etc. according to the present invention can be regarded as the prior art.

Preferred embodiments.

The invention discloses a double-sided metal stacking process for a capacitor film, which comprises the following steps:

step S1: the unwinding roller 101 unwinds the wound film 100;

step S2: the unreeled film 100 is conveyed to a first cooling roller 103 through a roller to be adhered with an aluminum layer;

step S3: the first cooling roller 103 transfers the film 100 to the second cooling roller 104 through a roller for attaching an aluminum layer;

step S4: the second cooling roller 104 conveys the film 100 to a third cooling roller 105 through a plurality of rollers to carry out reverse side aluminum layer adhesion;

step S5: the third cooling roller 105 transmits the film 100 to the fourth cooling roller 106 through a roller to attach an aluminum layer;

step S6: the fourth chill roll 106 transfers the film 100 through a roll to take-up roll 102 for take-up.

It is worth mentioning that an aluminum wire evaporating device 107 is respectively arranged below the first cooling roller 103 and the second cooling roller 104, the aluminum wire evaporating device 107 is used for evaporating aluminum wires, and the evaporated aluminum wires are attached to the film surface of the film 100 after being cooled when the film 100 is conveyed to the first cooling roller 103 and the second cooling roller 104.

Specifically, an aluminum wire evaporating device 107 is respectively arranged below the third cooling roller 105 and the fourth cooling roller 106, the aluminum wire evaporating device 107 is used for evaporating aluminum wires, and the evaporated aluminum wires are cooled and attached to the other film surface of the film 100 when the film 100 is conveyed to the third cooling roller 105 and the fourth cooling roller 106.

More specifically, step S4 is specifically implemented as the following steps:

step S4.1: the film surface of the film 100 is in close contact with the second cooling roller 104, and the film surface of the film 100 away from the second cooling roller 104 is subjected to aluminum layer adhesion;

step S4.2: the second cooling roller 104 transmits the reverse side of the film 100 to the third cooling roller 105 according to the position distribution of the rollers, and the film surface of the film 100 with the aluminum layer is tightly attached to the third cooling roller 105;

step S4.3: the film 100 is separated from the film surface of the third cooling roller 105 to which the aluminum layer is not attached, and the aluminum layer is attached.

Further, the double-sided metal stacking process of the capacitor film is used for attaching the aluminum layer in the state of a vacuum cabin.

Further, the film 100 is conveyed on the cooling rollers in the order of a first cooling roller 103, a second cooling roller 104, a third cooling roller 105, and a fourth cooling roller 106, the first cooling roller 103 and the second cooling roller 104 adhering an aluminum layer to the same film surface of the film 100, and the third cooling roller 105 and the fourth cooling roller 106 adhering an aluminum layer to the other same film surface of the film 100.

Preferably, the winding roller 102 and the unwinding roller 101 are used for stacking through a roll-to-roll continuous mechanized technology, so that the production efficiency is greatly improved.

It should be noted that the metal involved in the double-sided metal stacking process of the capacitor thin film of the present invention includes one or more of aluminum, copper, and the like, and is not only aluminum.

The invention also discloses a capacitor film which is manufactured by the capacitor film double-sided metal stacking process.

It should be noted that the technical features of the cooling roll, the aluminum wire evaporator, etc. related to the present patent application should be regarded as the prior art, and the specific structure, the operation principle, the control mode and the spatial arrangement mode of the technical features may be selected conventionally in the field, and should not be regarded as the point of the present patent, and the present patent is not further specifically described in detail.

It will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.