阅读说明：本技术 电池极耳表面处理方法 (Surface treatment method for battery tab ) 是由 唐永炳 蒋春磊 孟醒 石磊 于 2018-06-20 设计创作，主要内容包括：本发明提供了一种电池极耳表面处理方法,涉及电池技术领域,该电池极耳表面处理方法,将极耳清洗后进行等离子体刻蚀去除极耳表面的钝化层后,完成对极耳的表面处理,利用该处理方法能够缓解现有技术的处理方法工艺复杂、污染环境以及成本高的技术问题,达到了简化工艺,避免污染,降低成本和提高焊锡与极耳的结合强度的目的。(The invention provides a battery tab surface treatment method, which relates to the technical field of batteries and is characterized in that after a tab is cleaned, plasma etching is carried out to remove a passivation layer on the surface of the tab, and then the surface treatment of the tab is completed.)

1. A surface treatment method for a battery tab is characterized in that after the tab is cleaned, plasma etching is carried out to remove a passivation layer on the surface of the tab, and then the surface treatment of the tab is completed.

2. The battery tab surface treatment method according to claim 1, wherein the cleaning comprises ultrasonic cleaning.

3. The surface treatment method for the battery tab according to claim 2, wherein the tab is subjected to ultrasonic cleaning and deionized water cleaning to complete the cleaning process.

4. The battery tab surface treatment method according to claim 3, wherein the washing comprises the steps of:

firstly, placing the tab into a ketone for ultrasonic cleaning for 15-20 min, then washing the tab with deionized water, then placing the tab into an alcohol solution for ultrasonic cleaning for 15-20 min, then taking out the tab, washing the tab with deionized water again, and then placing the tab into deionized water for ultrasonic cleaning for 7-12 min to complete the cleaning process;

preferably, the tab is firstly placed in acetone for ultrasonic cleaning for 15-20 min, then is washed by deionized water, is placed in an ethanol solution for ultrasonic cleaning for 15-20 min, then is taken out and is washed by the deionized water again, and then is placed in the deionized water for ultrasonic cleaning for 7-12 min, so that the cleaning process is completed.

5. The surface treatment method for the battery tab according to any one of claims 1 to 4, wherein the process conditions of the plasma etching are as follows: the degree of vacuum is (2.8-3.5) x 10^－3Pa, the ion source voltage is 50-100V, the mixed gas of inert gas and etching gas is introduced, the pressure is 10-25 Pa, the substrate bias is-400-800V, and the treatment time is 20-40 min.

6. The surface treatment method for the battery tab according to claim 5, wherein the plasma etching process conditions are as follows: the degree of vacuum is (3.0-3.3) × 10^－3Pa, ion source voltage of 60-90V, introducing mixed gas of inert gas and etching gas, pressure of 15-20 Pa, substrate bias voltage of-500-700V, and treatment time of 30-40 min.

7. The surface treatment method for a battery tab according to claim 5, wherein the inert gas comprises argon, helium, neon or xenon.

8. The battery tab surface treatment method as claimed in claim 5, wherein the etching gas comprises O₂、CF₄、H₂Or N₂Any one or a combination of several of them.

9. The battery tab surface treatment method according to claim 5, wherein the volume ratio of the inert gas to the etching gas is 5: 1-3: 2.

10. the surface treatment method for the battery tab according to any one of claims 1 to 4, wherein the tab is made of aluminum, nickel or copper nickel plating.

Technical Field

The invention relates to the technical field of batteries, in particular to a battery tab surface treatment method.

Background

With the increasing development of modern science and technology, energy and environmental issues become the focus of attention, and the new energy industry is developed, so that the requirements of products such as mobile phones, notebook computers, electric vehicles, electric tools and the like on batteries are higher and higher, and the lithium ion battery is paid attention as a rechargeable battery with a plurality of excellent performances such as high voltage platform, long cycle life, high specific energy, small self-discharge and the like.

In the structure of the lithium battery, a tab is a metal conductor that leads positive and negative electrodes from a battery core, generally, the positive electrode is made of aluminum material, the negative electrode is made of nickel or copper nickel-plated material and is a contact point for charging and discharging the lithium battery, and in the structure of the lithium battery, one end of the tab is connected with an external circuit, and the other end of the tab is connected with the inside of the battery. However, the tab material is exposed in the air for a long time and is easy to form a passivation layer on the surface, so that the phenomena of poor conductivity at a node, increased battery capacity loss, heating and the like are caused, the subsequent tin soldering process is also influenced, the surface passivation layer can reduce the welding quality of the tab, the charging and discharging performance of the battery is further influenced, and certain potential safety hazards are caused. Therefore, in order to obtain a tab with good weldability and high quality of welding spots, poor welding such as cold welding needs to be avoided during welding, and the passivation layer on the surface of the tab material needs to be removed.

At present, the common methods for solving the problem of surface passivation of the tab mainly comprise a chemical method or a plating method. The chemical method is to remove the passivation layer on the surface of the tab by using acid-base solution, so that the surface of the tab has good tin soldering wettability, and the quality of the product can be effectively controlled. The plating method is to prepare plating layers on the surfaces of the tabs so as to improve the tin weldability and the corrosion resistance of the tabs. Wherein, the chemical method treatment process is complex and is easy to cause environmental pollution; the plating method for preparing the multilayer structure improves the soldering performance and corrosion resistance of the tab material, but the plating structure has complex process, unstable quality and high cost, and in addition, the chemical method and the electroplating method do not accord with the current environmental protection concept.

Disclosure of Invention

The invention aims to provide a battery tab surface treatment method to relieve the technical problems of complex process, environmental pollution and high cost of the treatment method in the prior art.

In order to achieve the above purpose of the present invention, the following technical solutions are adopted:

a surface treatment method for a battery tab is characterized in that after the tab is cleaned, plasma etching is carried out to remove a passivation layer on the surface of the tab, and then the surface treatment of the tab is completed.

Further, the cleaning comprises ultrasonic cleaning.

Furthermore, the tab is sequentially subjected to ultrasonic cleaning and deionized water cleaning to complete the cleaning process.

Further, the cleaning comprises the following steps:

firstly, placing the tab into a ketone for ultrasonic cleaning for 15-20 min, then washing the tab with deionized water, then placing the tab into an alcohol solution for ultrasonic cleaning for 15-20 min, then taking out the tab, washing the tab with deionized water again, and then placing the tab into deionized water for ultrasonic cleaning for 7-12 min to complete the cleaning process;

preferably, the tab is firstly placed in acetone for ultrasonic cleaning for 15-20 min, then is washed by deionized water, is placed in an ethanol solution for ultrasonic cleaning for 15-20 min, then is taken out and is washed by the deionized water again, and then is placed in the deionized water for ultrasonic cleaning for 7-12 min, so that the cleaning process is completed.

Further, the process conditions of the plasma etching are as follows: the degree of vacuum is (2.8-3.5) x 10^－3Pa, the ion source voltage is 50-100V, the mixed gas of inert gas and etching gas is introduced, the pressure is 10-25 Pa, the substrate bias is-400-800V, and the treatment time is 20-40 min.

Further, the process conditions of the plasma etching are as follows: the degree of vacuum is (3.0-3.3) × 10^－3Pa, ion source voltage of 60-90V, introducing mixed gas of inert gas and etching gas, pressure of 15-20 Pa, substrate bias voltage of-500-700V, and treatment time of 30-40 min.

Further, the inert gas includes argon, helium, neon or xenon.

Further, the etching gas comprises O₂、CF₄、H₂Or N₂Any one or a combination of several of them.

Further, the volume ratio of the inert gas to the etching gas is 5: 1-3: 2.

furthermore, the material of the tab is aluminum, nickel or copper nickel plating.

Compared with the prior art, the invention has the following beneficial effects:

the invention provides a surface treatment method of a battery tab, which is to clean the tab and then carry out plasma etching to remove a passivation layer on the surface of the tab. Compared with the traditional chemical treatment process, the method does not need to use acid-base solution to corrode the tab material, so that the method is more environment-friendly. Compared with a complex plating method, the treatment method has the advantages of simpler process and better quality stability after the surface treatment of the tab.

By adopting the treatment method provided by the invention, the surface of the material is etched by plasma, the passivation layer on the surface of the material is removed, a rough surface structure can be obtained, the wettability of soldering tin is further facilitated, and the bonding strength of the soldering tin and the electrode lug is further improved. Therefore, the processing method is simpler and more efficient.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic view of the surface topography of a tab before treatment;

fig. 2 is a schematic diagram of the surface morphology structure of the treated tab.

Icon: 10-tab substrate; 11-passivation layer.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to examples, but it will be understood by those skilled in the art that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

The invention provides a surface treatment method of a battery tab, which is characterized in that after the tab is cleaned, plasma etching is carried out to remove a passivation layer on the surface of the tab, and then the surface treatment of the tab is completed.

The invention provides a surface treatment method of a battery tab, which is to clean the tab and then carry out plasma etching to remove a passivation layer on the surface of the tab. Compared with the traditional chemical treatment process, the method does not need to use acid-base solution to corrode the tab material, so that the method is more environment-friendly. Compared with a complex plating method, the treatment method has the advantages of simpler process and better quality stability after the surface treatment of the tab.

By adopting the treatment method provided by the invention, the surface of the material is etched by plasma, the passivation layer on the surface of the material is removed, a rough surface structure can be obtained, the specific surface area of the surface of the tab is improved, the wettability of soldering tin is further facilitated, and the bonding strength of the soldering tin and the tab is further improved. Therefore, the processing method is simpler and more efficient.

The processing method provided by the invention can be used for processing the tabs with different materials, for example, the material of the tabs can be aluminum, nickel or copper nickel plating, wherein the copper nickel plating refers to nickel plating on a copper base material.

In some embodiments of the invention, the cleaning comprises ultrasonic cleaning. For example, the tab is sequentially subjected to ultrasonic cleaning and deionized water cleaning to complete the cleaning process. The electrode lug is pretreated by ultrasonic cleaning and deionized water cleaning, so that impurities on the surface of the electrode lug can be effectively removed, the plasma etching effect in the later period is improved, the pollution can be reduced, and the requirement of environmental protection is met.

In some embodiments of the invention, the cleaning comprises the steps of:

the method comprises the steps of firstly putting a tab into acetone for ultrasonic cleaning for 15-20 min, then washing the tab with deionized water, putting the tab into an ethanol solution for ultrasonic cleaning for 15-20 min, then taking out the tab for washing with deionized water again, and then putting the tab into deionized water for ultrasonic cleaning for 7-12 min to finish the cleaning process.

In the above embodiment, acetone, ethanol solution and deionized water are adopted in the ultrasonic cleaning process, no acid-base solution is used in the whole cleaning process, the whole cleaning process belongs to physical cleaning, no chemical corrosion occurs, no pollution or harm is caused to the environment and operators, and the acetone and the ethanol used in the ultrasonic cleaning process are convenient to recycle and have lower cost.

In the present inventionIn some embodiments of the invention, the process conditions of the plasma etching are: the degree of vacuum is (2.8-3.5) x 10^－3Pa, the ion source voltage is 50-100V, the mixed gas of inert gas and etching gas is introduced, the pressure is 10-25 Pa, the substrate bias is-400-800V, and the treatment time is 20-40 min. The process conditions of the plasma etching can be further set as follows: the degree of vacuum is (3.0-3.3) × 10^－3Pa, ion source voltage of 60-90V, introducing mixed gas of inert gas and etching gas, pressure of 15-20 Pa, substrate bias voltage of-500-700V, and treatment time of 30-40 min. Wherein the inert gas can be argon, helium, neon or xenon, and the etching gas comprises O₂、CF₄、H₂Or N₂Any one or a combination of several of them; the volume ratio of the inert gas to the etching gas is 5: 1-3: 2.

the electrode lugs made of different materials can be subjected to plasma cleaning by introducing etching gases of different types and weight ratios, and the density, bombardment speed and the like of the plasma can be adjusted by controlling the process conditions of the plasma etching, so that the plasma etching rate is improved, and the electrode lugs are etched to different degrees.

In the above embodiment, the volume ratio of the inert gas to the etching gas may be, for example, 5: 1,3: 1,2: 1,3: 2 or 5: 2.

the present invention will be described in further detail with reference to examples and comparative examples.