阅读说明：本技术 一种刀具的加工方法 (Machining method of cutter ) 是由 董向阳 于 2018-06-26 设计创作，主要内容包括：本发明涉及一种刀具的加工方法。包括以下步骤：步骤一：在硬质合金基体端部切削出两个相互垂直的切削面,与硬质合金基体底部平行的切削面和硬质合金基体构成焊接平台,另一个切削面为焊接面,憨厚在焊接平台上开设处排屑槽,并在排屑槽靠近焊接面的一侧预留出定位面,最后再硬质合金基体端部突出部分远离焊接面的一侧开设出形状为内凹弧面的避空面；第二步,将金刚石焊接在硬质合金基体端部形成金刚石刀具；第三步,采用激光切削法加工刀具,使之具备第一后刀面、第二后刀面和刀具刃口。本发明的工艺方法简单,加工精度高,在金刚石表面涂覆涂层,可有效防止激光的透射和反射,提高刀具的加工效率和质量。(The invention relates to a machining method of a cutter. The method comprises the following steps: the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface; secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter; and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge. The process method of the invention is simple, the processing precision is high, and the coating is coated on the surface of the diamond, thereby effectively preventing the transmission and reflection of laser and improving the processing efficiency and quality of the cutter.)

1. The machining method of the cutter is characterized by comprising the following steps of:

the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;

secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;

and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.

2. A method of machining a tool as claimed in claim 1, wherein the diamond tool surface is cleaned with steam prior to machining.

3. A method of machining a tool as claimed in claim 1, wherein the diamond surface is coated with a coating.

Technical Field

The invention relates to a machining method of a cutter.

Background

Diamond is a crystal of a single carbon atom, and has the highest hardness, rigidity, refractive index and thermal conductivity in nature. Can meet most requirements of precision and ultra-precision cutting on cutter materials, and is an ideal precision cutting cutter material. When the diamond cutter is manufactured by adopting the traditional mechanical grinding method, because the grinding linear velocity is high, the local pressure is large, the impact on the surface and the cutting edge of the cutter is severe, the surface of the cutter can generate tiny furrows and thicker processing deterioration layers inevitably, and the saw teeth of the cutting edge are larger, thereby limiting the further improvement of the quality of the cutter.

Disclosure of Invention

Aiming at the defects, the invention aims to provide a machining method of a cutter, which has the advantages of simple process method, high machining precision and good quality.

Therefore, the technical scheme adopted by the invention is as follows:

the method comprises the following steps:

the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;

secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;

and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.

As a further improvement of the technical scheme, before the processing, the surface of the diamond cutter is cleaned by steam.

As a further improvement of the technical scheme, the surface of the diamond is coated with a coating.

The invention has the advantages that:

the process method of the invention is simple, the processing precision is high, and the coating is coated on the surface of the diamond, thereby effectively preventing the transmission and reflection of laser and improving the processing efficiency and quality of the cutter.

Detailed Description

A machining method of a cutter comprises the following steps:

the method comprises the following steps: cutting two mutually perpendicular cutting surfaces at the end part of the hard alloy substrate, wherein the cutting surface parallel to the bottom of the hard alloy substrate and the hard alloy substrate form a welding platform, the other cutting surface is a welding surface, a chip groove is formed on the welding platform, a positioning surface is reserved on one side of the chip groove close to the welding surface, and finally a clearance surface in the shape of an inwards concave arc surface is formed on one side of the protruding part of the end part of the hard alloy substrate, which is far away from the welding surface;

secondly, welding the diamond on the end part of the hard alloy substrate to form a diamond cutter;

and thirdly, machining the cutter by adopting a laser cutting method to enable the cutter to be provided with a first rear cutter face, a second rear cutter face and a cutter cutting edge.

As a further improvement of the technical scheme, before the processing, the surface of the diamond cutter is cleaned by steam.

As a further improvement of the technical scheme, the surface of the diamond is coated with a coating.