阅读说明：本技术 处理腔导向装置、处理腔和用于将基体支架引导至处理位置处的方法 (Processing chamber guiding device, processing chamber and for by substrate holder guide to processing position at method ) 是由 S·瑞伯 K·席林格 B·瑞卡特 于 2018-03-19 设计创作，主要内容包括：本发明涉及一种处理腔导向装置,所述处理腔导向装置构造成用于沿导向方向直线引导能在所述处理腔导向装置中移动的基体支架,以利用所述基体支架向处理位置处的移动,使得处理腔导向装置和基体支架至少构成处理腔导向装置的局部的边界。本发明的特征在于,所述处理腔导向装置具有用于基体支架的滚动体支承结构和至少一个密封面,所述密封面平行于导向方向延伸并且构造和设置成使得,当设置在处理腔导向装置中的基体支架处于处理位置处时,密封面与基体支架隔开小于1mm的间距。本发明还涉及一种处理腔和一种用于将基体支架引导到处理位置处的方法。(The present invention relates to a kind of processing chamber guiding devices, the processing chamber guiding device is configured to for guiding the substrate holder that can be moved in the processing chamber guiding device along guide direction straight line, to utilize described matrix bracket to the movement at processing position, so that processing chamber guiding device and substrate holder at least constitute the boundary of the part of processing chamber guiding device.The present invention is characterized in that, the processing chamber guiding device has the rolling element bearing structure and at least one sealing surface for substrate holder, the sealing surface is parallel to guide direction and extends and be configured and located such that, when the substrate holder being arranged in processing chamber guiding device is at processing position, the spacing of sealing surface and substrate holder separated by less than 1mm.The invention further relates to a kind of processing chambers and a kind of method for substrate holder to be directed at processing position.)

1. processing chamber guiding device (1,1a, 1b, 1c) is configured to for that can lead in the processing chamber along the guidance of guide direction straight line The substrate holder moved into device, to utilize described matrix bracket to the movement at processing position, so that being led by processing chamber The part of processing chamber guiding device (1,1a, 1b, 1c) is at least constituted to device (1,1a, 1b, 1c) and substrate holder (2,2a) Boundary, which is characterized in that there is at least one sealing surface (4,4a), the sealing surface be parallel to the guide direction extend and It is configured and located such that, when the described matrix bracket (2,2a) being arranged in the processing chamber guiding device (1,1a, 1b, 1c) When at the processing position, the sealing surface (4,4a) and described matrix bracket (2,2a) are separated by less than the spacing of 1mm.

2. processing chamber guiding device (1,1a, 1b, 1c) according to claim 1, which is characterized in that the sealing surface (4, 4a) perpendicular to the guide direction and it is parallel to described matrix in the processing chamber guiding device (1,1a, 1b, 1c) is set The surface of bracket, the sealing surface (4,4a) have the width of at least 2mm, particularly at least 10mm, preferably at least 20mm.

3. the processing chamber guiding device according to any one of the claims (1,1a, 1b, 1c), which is characterized in that In addition to the primary sealing area (4,4a), the processing chamber guiding device (1,1a, 1b, 1c) also has at least one second sealing Face (4,4a), the secondary sealing area (4,4a) are parallel to the guide direction and extend and be configured and located such that, when setting It sets when the described matrix bracket (2,2a) in the processing chamber guiding device (1,1a, 1b, 1c) is at the processing position, Described matrix bracket (2,2a) is arranged between two sealing surfaces, and two sealing surfaces are along perpendicular to the guide direction Direction separate certain spacing, the spacing is to be less than 0.4mm, preferably smaller than 0.3mm, particularly less than the degree of 0.2mm More than the width of described matrix bracket.

4. the processing chamber guiding device according to any one of the claims (1,1a, 1b, 1c), feature exists In the processing chamber guiding device (1,1a, 1b, 1c) has the rolling element bearing structure for described matrix bracket (2,2a).

5. the processing chamber guiding device according to any one of the claims (1,1a, 1b, 1c), feature exists In the processing chamber guiding device (1,1a, 1b, 1c) has the slot for accommodating described matrix bracket, especially rectangular channel.

6. according to processing chamber guiding device described in claim 4 and 5 (1,1a, 1b, 1c), which is characterized in that the rolling Body supporting structure is arranged on the bottom surface of the slot.

7. the processing chamber guiding device according to any one of claim 5 to 6 (1,1a, 1b, 1c), feature exists In, an end face of the slot, two end faces of the preferably described slot be at least configured in partial region the sealing surface (4, 4a)。

8. having at least one according to any one of the claims for the processing chamber (P) for the silicon layer that is vapor-deposited Processing chamber guiding device (1,1a, 1b, 1c) and at least one substrate holder (2,2a), by described matrix bracket at the place It manages in chamber guiding device (1,1a, 1b, 1c) to the movement at processing position, at least boundary of the part of composition processing chamber (P), institute It states processing chamber guiding device (1,1a, 1b, 1c) and substrate holder is cooperatively configured so that, led when being arranged in the processing chamber When described matrix bracket (2,2a) in device (1,1a, 1b, 1c) is at the processing position, the sealing surface (4,4a) With described matrix bracket (2,2a) separated by less than the spacing of 1mm, wherein the side that the processing chamber (P) is preferably oppositely arranged at two There is end side to limit element, the end side limits element and connect with the processing chamber guiding device (1,1a, 1b, 1c) on face.

9. processing chamber (P) according to claim 8, which is characterized in that described matrix bracket (2,2a) has for rolling The guide frame of rolling element in body supporting structure, the guide frame have specifically for slot or described matrix bracket (2,2a) There is a rolling element bearing structure, the rolling element bearing structure setting is in described matrix bracket towards the processing chamber guiding device On the side of (1,1a, 1b, 1c).

10. the processing chamber according to any one of claim 8 to 9 (P), which is characterized in that described matrix bracket (2) tool Have sealing strip (6), the sealing strip (6) extends and is arranged so that along the guide direction, described close at processing position Strip of paper used for sealing (6) separated by less than 0.5mm, preferably smaller than 0.3mm, particularly is less than with the processing chamber guiding device (1,1a, 1b, 1c) The spacing of 0.2mm.

11. the processing chamber according to any one of claim 8 to 10 (P), which is characterized in that processing chamber (P) tool There is the processing chamber guiding device (1,1a, 1b, 1c) of the processing chamber guiding device (1,1a, 1b, 1c) as lower part, and attached There is the processing chamber guiding device (1,1a, 1b, 1c) at least one top, the processing chamber guiding device on the top and end with adding Lateral confinement determines element and connects and be arranged so that, at processing position, the sum of the lower part is arranged in described matrix bracket (2,2a) Between the processing chamber guiding device (1,1a, 1b, 1c) on top, the processing chamber guiding device (1,1a, 1b, 1c) on the top is special It is to be made of processing chamber guiding device as claimed in any of claims 1 to 6.

12. processing chamber (P) according to claim 11, which is characterized in that in addition to as the first substrate holder (2,2a) Described matrix bracket (2,2a), the processing chamber (P) also have at least one second substrate holder (2,2a), and in addition to conduct The lower part of first processing chamber guiding device pair and top processing chamber guiding device (1,1a, 1b, 1c), the processing chamber (P) also have as second processing chamber guiding device pair another lower part processing chamber guiding device (1,1a, 1b, 1c) and separately The processing chamber guiding device (1,1a, 1b, 1c) on one top, another lower part and top processing chamber guiding device construction Be arranged so that, at processing position, second substrate holder (2,2a) is arranged in the second processing chamber guiding device Pair lower part between the processing chamber guiding device (1,1a, 1b, 1c) on top, and pass through each described matrix bracket, each institute It states processing chamber guiding device and end side limits element and is configured to the processing chamber (P).

13. processing chamber (P) according to claim 12, which is characterized in that the processing chamber guiding device of each lower part Rolling element bearing structure and/or described matrix bracket (2,2a) for described matrix bracket (2,2a) are respectively provided with respectively in court Rolling element bearing structure is provided on the side of the processing chamber guiding device of each lower part.

14. processing chamber described in any one of 2 to 13 (P) according to claim 1, which is characterized in that each top Processing chamber guiding device be respectively provided with rolling element bearing structure and/or described matrix bracket (2,2a) respectively towards it is each it is described on Rolling element bearing structure is provided on the side of the processing chamber guiding device in portion.

15. processing chamber described in any one of 1 to 14 (P) according to claim 1, which is characterized in that each substrate holder (2) It is all respectively provided with sealing strip according to claim 10 (6) and these sealing strips is arranged so that, at processing position, Each sealing strip is located on the side of the mutual direction of substrate holder (2).

16. processing chamber described in any one of 1 to 15 (P) according to claim 1, which is characterized in that the processing chamber guiding There is device (1,1a, 1b, 1c) at least one to be used for the entrance (7a, 7b) of flush gas, and the entrance (7a, 7b) is arranged to make , at the processing position, it can be led between the processing chamber guiding device (1,1a, 1b, 1c) and described matrix bracket (2) Enter flush gas, preferably in the processing chamber guiding device (1,1a, 1b, 1c) and described matrix bracket (2) towards the processing Flush gas is imported between the end side of chamber guiding device.

17. there is the place according to any one of claim 7 to 15 for the device of the chemical deposition silicon layer on matrix It manages chamber (P).

18. for by substrate holder guide to processing position at method, which is characterized in that processing chamber guiding device (1,1a, 1b, 1c) in described matrix bracket (2,2a) are guided by rolling element bearing structure.

19. according to the method for claim 18, which is characterized in that preferably during the deposition process, in described matrix bracket and Flush gas is supplied between the processing chamber guiding device, preferably in substrate holder towards the end side of processing chamber guiding device and institute It states and supplies flush gas between processing chamber guiding device.

Technical field

The present invention relates to a kind of processing chamber guiding device, a kind of processing chamber and one kind for substrate holder to be directed to processing Method at position.

Background technique

When for example giving basal body coating layer for the deposited semiconductor layer on growth substrate, such substrate holder is used: Growth substrate is arranged on described matrix bracket.The substrate holder is brought into processing position followed by processing chamber guiding device Set place.

It is known that substrate holder setting lower part and top processing chamber guiding device, so as to make matrix Bracket moves in processing chamber guiding device in parallel, and processing chamber is constituted at processing position, and the processing chamber is logical in side Substrate holder is crossed to limit, and is limited up and down by processing chamber guiding device.Such as from WO 2013/004851 This device known to A1.

Summary of the invention

It is an object of the present invention to formerly known processing chamber guiding device be improved, so as to realize better processing Condition.

The purpose passes through processing chamber guiding device according to claim 1, processing according to claim 8 Chamber according to claim 17 for the device of chemical deposition layer on matrix and according to claim 18 is used for Substrate holder is guided to the method at processing position and is realized.Advantageous design scheme is provided in the dependent claims.

Preferably, the processing chamber guiding device is configured to for executing according to the method for the present invention, particularly executing institute State the advantageous form of implementation of method.Preferably, it is designed for according to the method for the present invention through processing according to the present invention Chamber guiding device is implemented, and is especially implemented by the preferred implementing form of the processing chamber guiding device.

Processing chamber guiding device according to the present invention is configured to lead for guiding along guide direction straight line in transport process chamber The moveable substrate holder into device.Thus using described matrix bracket to processing position at movement so that, place can be passed through Reason chamber guiding device and substrate holder at least constitute the boundary of the part of processing chamber guiding device.

To this example as known to 2013/004851 A1 of WO, there is the processing chamber guiding for being configured to track 3 Device, substrate holder 1 can be moved in the processing chamber guiding device (see Fig. 1 of WO2013/004851A1).Substrate holder 1 The local boundary of processing chamber is constituted with track 3.

Importantly, in the present invention, the processing chamber guiding device has at least one sealing surface, the sealing surface is flat Row extends and is configured and located such that in guide direction, when the substrate holder being arranged in processing chamber guiding device is in place When managing at position, sealing surface is spaced apart less than 1mm, preferably smaller than 0.5mm, particularly the spacing less than 0.2mm with substrate holder.

The present invention is based on such cognitions, that is, current processing chamber guiding device has the shortcomings that such: for example for simple sliding Guiding device, the particle into processing chamber guiding device will lead to dyskinesia or locking.Equally possible formation abrasive dust, this mill Bits, which can enter processing chamber, and abrasive dust herein may cause deposited layer quality reduces.It is small by being separated with substrate holder In the sealing surface of the spacing of 1mm, preferably smaller than 0.5mm, it can be ensured that have foot between substrate holder and processing chamber guiding device Enough sealings, so that only seldom process gas can pass through between substrate holder and sealing surface.

Therefore, sealing surface is used in processing chamber guiding device and is located at the base handled at position in processing chamber guiding device Near-hermetic is at least realized between body support frame.In order to improve sealing effect, it is advantageous to which the sealing surface has at least 2mm, spy It is not the width of at least 10mm, preferably at least 20mm, and the sealing surface perpendicular to guide direction and is parallel to setting The surface of substrate holder in processing chamber guiding device.

In order to avoid being in contact between the substrate holder and sealing surface guided in processing chamber guiding device, the processing Chamber guiding device is advantageously configured so that at processing position, sealing surface and substrate holder are towards between the surface of sealing surface Spacing at least 0.02mm, particularly at least 0.05mm, preferably at least 0.1mm.

Preferably, sealing surface and substrate holder are utilized towards the spacing between the surface of sealing surface can be set in processing chamber Director element on guiding device and/or on substrate holder is realized.The director element can be configured to guide rail, guide roller And/or guiding ditch, especially it is structured to slot.

Advantageously, sealing surface extends enough length along guide direction, to form processing chamber, especially along guide direction At least processing chamber is formed on the width of substrate holder.Preferably, sealing surface at least extends 0.5m or more, it is further preferred that At least extend 1m or more.

Particularly advantageously, sealing surface extends in the whole length of processing chamber guiding device along guide direction.

Advantageously, in addition to the primary sealing area, the processing chamber guiding device has at least one secondary sealing area, institute It states secondary sealing area and is parallel to guide direction and extend and be configured and located such that, when being arranged in processing chamber guiding device Substrate holder be in processing position at when, substrate holder be arranged between the two sealing surfaces and the two sealing surfaces perpendicular to Guide direction separates certain spacing, and the spacing is to be less than 1mm, preferably smaller than 0.4mm, particularly less than the degree of 0.2mm More than the thickness of substrate holder.Which thereby enhance sealing effect.

Advantageously, the processing chamber guiding device advantageously has the rolling element bearing structure for substrate holder.Especially It is the temperature difference due to occurring during processing, shape change may occur for substrate holder and/or processing chamber guiding device, this Kind shape change will lead to substrate holder and block or cause in processing chamber guiding device and matrix in processing chamber guiding device The insufficient situation of the sealing occurred between bracket.The rolling element bearing structure avoids these disadvantages, and mode is, even if Space or on the time there are when temperature gradient, using the rolling element bearing structure, described matrix bracket is along guide direction With good movement.

Optionally, the rolling element bearing structure can be set on substrate holder.It is same it is within the scope of the invention that, Processing chamber guiding device and substrate holder all have rolling element bearing structure.

Advantageously, equipped with the director element with the rolling element bearing structure mating reaction, the director element prevents from sending out The raw lateral movement perpendicular to guide direction.The director element can be configured to as previously described guide rail, guide roller and/or It is oriented to ditch, is especially structured to slot.The director element is preferably provided on element corresponding with rolling element bearing structure: when When on director element, the director element is preferably provided on substrate holder, particularly is arranged rolling element bearing structure setting In substrate holder towards on the side of rolling element bearing structure at processing position.When rolling element bearing structure setting is in matrix branch When on frame, the director element is preferably provided on processing chamber guiding device, is in particular arranged at processing chamber guiding device and is being located It manages at position towards on the side of rolling element bearing structure.

The processing chamber guiding device advantageously has the slot for accommodating substrate holder.Sealing surface can be to have as a result, The mode of benefit is formed in the side wall of the slot or on side wall.The slot is advantageously configured to rectangular channel.Within the scope of the present invention , the slot is with rounded edge region.Thus, here it is particularly advantageous that one of side of the slot, preferably described Two sides of slot are configured to seal at least in partial region, advantageously in the whole length of the slot along guide direction Face.

Rolling element bearing structure is advantageously disposed on the bottom surface of the slot.Optionally, the bottom surface of the slot is configured to use In the rolling surface of the rolling element bearing structure of substrate holder.

Furthermore the present invention relates to a kind of processing chamber for the silicon layer that is vapor-deposited, the processing chamber has at least one basis Processing chamber guiding device of the invention, particularly the advantageous form of implementation of processing chamber guiding device, and have at least one A substrate holder.It is at least partially made up of in processing chamber guiding device to the movement at processing position described matrix bracket The boundary of processing chamber.There is processing chamber end side to limit element preferably on two opposite sides, and the end side limits element It is connect with processing chamber guiding device.

The end side limits element and is preferably located such that, at processing position, leads on the side that two are oppositely arranged It crosses the end side and limits restriction of the element realization in end side to processing chamber, however, in side upwardly through described matrix bracket and place Manage restriction of the chamber guiding device realization to processing chamber.

Preferably, described matrix bracket has the guide frame for the rolling element in rolling element bearing structure.Especially have Benefit, described matrix bracket have slot, it is therefore preferable to which rectangular channel, the slot are used to guide the rolling of processing chamber guiding device Body.Thus it is ensured when substrate holder moves in processing chamber guiding device and substrate holder is reliably guided.Particularly, lead to That crosses substrate holder avoids or at least limits the lateral movement perpendicular to guide direction to the guiding of rolling element.

In another advantageous design scheme, described matrix bracket has rolling element bearing structure, the rolling element branch Bearing structure is set to described matrix bracket towards on the side of processing chamber guiding device, to realize substrate holder along processing chamber The movement of low friction in the guide direction of guiding device.

In an advantageous embodiment, described matrix bracket has sealing strip, and the sealing strip prolongs along guide direction Stretch and be arranged so that, at processing position sealing strip and processing chamber guiding device separated by less than 0.3mm, preferably smaller than 0.2mm, particularly spacing less than 0.1mm.Hereby it is achieved that additional sealing between substrate holder and processing chamber guiding device And which thereby enhance the sealing effect between substrate holder and processing chamber guiding device.In addition, the sealing strip is used in particular for Prevent particle from entering in guide groove or spraying from guide groove.

The processing chamber guiding device is advantageously arranged to the processing chamber guiding device positioned at processing chamber lower part, and furthermore The processing chamber additionally has the processing chamber guiding device at least one top, the processing chamber guiding device on the top and end Lateral confinement determines element and connects and be arranged so that, at processing position, lower part and top place is arranged in described matrix bracket It manages between chamber guiding device.Similarly, the processing chamber guiding device on the top is configured to processing chamber guiding according to the present invention Device is especially structured to an advantageous embodiment mode of processing chamber guiding device according to the present invention.Locating as a result, It manages at position, it is all close to realize by processing chamber guiding device according to the present invention on the top edge of substrate holder and lower edge Seal effect.By in front and/or subsequent substrate holder and/or passing through along guide direction setting on leading edge and back edge End side limits element to realize the restriction to processing chamber.

In an advantageous embodiment, pass through a base on the side that the processing chamber is oppositely arranged at two respectively Body support frame limits:

The advantageously described processing chamber has the mentioned-above substrate holder as the first substrate holder, and additionally has There is at least one second substrate holder.In addition, in addition to the lower part as the first processing chamber guiding device pair and top processing Chamber guiding device, the processing chamber also have the processing of at least one other lower part as second processing chamber guiding device pair The processing chamber guiding device of chamber guiding device and other top.Similarly, the processing chamber of second processing chamber guiding device pair is led It is configured to processing chamber guiding device according to the present invention to device, is especially structured to processing chamber guiding device according to the present invention An advantageous embodiment.

Particularly advantageously, multiple processing chambers are arranged side by side.For this purpose, being arranged side by side in parallel with each other using at least three Substrate holder, intermediate substrate holder will process, particularly to carry out the matrix of coating in two sides carrying.Therefore, at first Reason chamber is constituted between the left side and the substrate holder of centre, and second processing chamber is in the intermediate structure between the substrate holder on the right At.Correspondingly, these substrate holders are guided by three lower parts and three tops processing chamber guiding device.

Processing chamber guiding device advantageously has at least one entrance for flush gas.The entrance is arranged to, In Processing can supply flush gas between processing chamber guiding device and substrate holder at position.Thus it has the advantage that, that is, Especially in rolling element bearing structure, can occur to avoid in the region between processing chamber guiding device and substrate holder Undesirable deposit.It is therefore preferred that during processing, especially during the deposition process, temporarily, at least gas is washed away in supply Body preferably constantly supplies flush gas.

Here, within the scope of the invention, the flush gas that there is over-voltage relative to the pressure in processing chamber is supplied, So that at least marginally flush gas is able to enter processing chamber.It is avoided in a particularly efficient manner from processing chamber as a result, Gas and particle enter the region between processing chamber guiding device and substrate holder, are especially that of avoiding the gas from processing chamber Rolling element bearing structure is reached with particle.Alternatively, or in addition advantageously, being provided with flush gas guiding device, so as to Enough while supply and export flush gas, are not intended to remove from the space between processing chamber guiding device and substrate holder Gas or particle.At processing position, the lower part and top of second processing chamber guiding device pair is arranged in the second substrate holder Processing chamber guiding device between, and from there through described matrix bracket, processing chamber guiding device and end side limit element structure At processing chamber.Here, it is within the scope of the invention that, processing chamber extends certain length along guide direction, which is greater than base Width of the body support frame along guide direction.

In this case, as previously described, in current composition scheme, pass through on the side that two are oppositely arranged It is arranged successively the boundary that multiple substrate holders realize side.

Advantageously, the processing chamber guiding device of each lower part is respectively provided with the rolling element bearing structure for substrate holder, Thus, it is possible to the movement of substrate holder is realized with the resistance of very little.

Particularly advantageously, the processing chamber guiding device on each top is respectively provided with rolling element bearing structure, to avoid Frictional force is generated in the guiding device on top or non-uniform shifting occurs due to the static friction and sliding friction that generate each other It is dynamic.

As previously described, each substrate holder is advantageously respectively provided with sealing strip, and the sealing strip is arranged so that, The sealing strip is on the side of the mutual direction of substrate holder at processing position.It is achieved in particularly effective sealing.

Advantageously, in order to realize the movement of low friction, all substrates bracket of processing chamber is all led all towards processing chamber There is rolling element bearing structure on the side of device.

In addition, the present invention relates to a kind of device for the chemical deposition layer on matrix, particularly growth substrate, the dress Setting has processing chamber according to the present invention as elucidated before.This device has the advantages that noted earlier.

The present invention is advantageous especially for such processing, in such a process, the chemical deposition on growth substrate Semiconductor layer and/or barrier layer.The present invention is especially in the processing for then taking the layer deposited from growth substrate again off In be advantageous, so as to produce independent layer, particularly semiconductor layer by means of the present invention.The layer deposited for example may be used Be silicon layer, comprising the layer of silicon, such as silicon nitride layer or silicon carbide layer, or such as the Group III-V semiconductor layer of gallium arsenide layer,.

The present invention is advantageously utilised in the manufacture of semiconductor layer, particularly silicon layer, and the semiconductor layer is partly led for producing The large-scale semiconductor device of body device, particularly such as solar battery.Similarly, the present invention can be in production semiconductor device Part, particularly the semiconductor substrate as present in the manufacture of the large-scale semiconductor device of solar battery, for example for manufacturing The silicon wafer of solar battery carries out coating.In such a process, it is often desirable that, with barrier layer or other semiconductor layer Coating is carried out to semiconductor substrate.

Detailed description of the invention

Illustrate other preferred features and embodiment below with reference to embodiment and attached drawing.Wherein:

Fig. 1 shows the first embodiment of the processing chamber guiding device with a sealing surface；

Fig. 2 shows the top views viewed from above of the processing chamber guiding device according to Fig. 1；

Fig. 3 shows tool, and there are two the second embodiments of the processing chamber guiding device of sealing surface；

Fig. 4 shows tool, and there are four the 3rd embodiments of the processing chamber guiding device of sealing surface；

Fig. 5 shows the embodiment of the processing chamber with a total of four processing chamber guiding device for vapor deposition.

Specific embodiment

All attached drawings are all schematic diagram, are indicated not in scale.Identical appended drawing reference mark is identical in Fig. 1 to 5 or makees With identical element.

The first embodiment of processing chamber guiding device 1 is shown in FIG. 1.Processing chamber guiding device 1 is configured to for straight line Guide the substrate holder 2 that can be moved in processing chamber guiding device.It leads on the energy edge in processing chamber guiding device of described matrix bracket 2 It is mobile to direction.In Fig. 1, the guide direction is perpendicular to drawing and is directed toward drawing.Processing chamber guiding device has rolling element Supporting structure, the rolling element bearing structure are made of multiple rolling elements being rotatably supported in processing chamber guiding device.In In Fig. 1, it can be seen that a rolling element 3.In use, substrate holder is supported on rolling element 3 and thus, it is possible to along guiding Direction is mobile.

Processing chamber guiding device 1 also has the protrusion with sealing surface 4.The sealing surface 4 is parallel to guide direction extension And it is configured and located such that, at processing position as is shown in fig. 1, for the base being arranged in processing chamber guiding device The spacing that body support frame 2, sealing surface and substrate holder are 0.2mm separated by less than 1mm, in the current situation.Therefore the also edge of sealing surface 2 Side of the substrate holder 2 in Fig. 1 positioned at the right is parallel to extend.As previously described, in the side of substrate holder 2 and sealing The spacing of 0.2mm is formed between face 4.Sealing surface extends on the width A of 20mm perpendicular to guide direction.

Processing chamber guiding device depends on the device using the processing chamber guiding device along the length of guide direction, especially It is determined by the desired length of the processing chamber of processing chamber guiding device composition.In the current situation, processing chamber guiding device Length is 5m.Sealing surface 4 extends in the whole length of processing chamber guiding device along guide direction and therefore equally has 5m Length.Therefore, processing chamber is come in side upwardly through multiple substrate holders being arranged in processing chamber guiding device before and after successive It limits.

Substrate holder 2 has multiple retainers for growth substrate (being silicon wafer in the current situation), the retainer It is set on the side being oppositely arranged at processing position with sealing surface 4 according to first embodiment and therefore as shown in Figure 1 On the processing side of left sides.A growth substrate 5 is exemplarily illustrated in figure.

During use, processing chamber, the processing chamber and the other component being not shown in Fig. 1 are constituted at processing position Constitute encirclement structure spatially.Led by substrate holder 2 and by processing chamber to this encirclement structure division spatially It is formed to device 1.

Processing common for one kind of this device is on growth substrate 5, particularly to be formed as with porous surface Silicon wafer growth substrate on carry out deposited semiconductor layer, especially progress epitaxial deposition.Here it should be avoided in processing chamber (matrix The left side of bracket 2) and perimeter (right side of substrate holder 2) between gas exchanges occur.

On the one hand it is ensured by the sealing surface 4 and is connect between sealing surface 4 and substrate holder 2 there is no direct machinery On the other hand touching can realize the movement of substrate holder 2 from there through rolling element bearing structure with very small resistance.Sealing surface 4 and substrate holder 2 towards the close clearance between the right side of sealing surface 4 still constitute apparent flow resistance, to avoid Air-flow is by this gap, or at least significantly reduces the air-flow by this gap.

The top view viewed from above according to the processing chamber guiding device in Fig. 1 is shown in FIG. 2.Here it can be seen that Along guide direction F, multiple rolling elements 3 are successively set.All rolling elements of rolling element bearing structure are rotatably supported in processing In chamber guiding device.For the sake of apparent, three rolling elements are only shown.Actually a processing chamber guiding device obviously may be used It is provided with 200 rolling elements in total with greater amount of rolling element, such as in the 5m length that herein is related to.

The second embodiment of processing chamber guiding device according to the present invention is shown in FIG. 3, the embodiment is in basic structure On be identical with the first embodiment.In order to avoid repetition, only illustrate the main distinction below:

Also there is secondary sealing area 4a according to the processing chamber guiding device of Fig. 3, secondary sealing area 4a is additional to as The sealing surface 4 of one sealing surface.The secondary sealing area 4a is equally parallel to guide direction and extends and be constructed and arranged to So that, for the substrate holder 2 at processing chamber guiding device is arranged in, described matrix bracket is arranged two at processing position Between a sealing surface 4 and 4a.Sealing surface 4 and 4a have a spacing B perpendicular to guide direction, and the spacing B is to be less than 0.4mm, excellent The choosing substantially degree of 0.2mm is more than the width of substrate holder.Therefore, for the substrate holder 2 being centrally located, each side with There are the gaps of 0.1mm between two sealing surfaces 4 and 4a.

Secondary sealing area 4a is parallel to sealing surface 4 and is of the same size.

Therefore, processing chamber guiding device according to Fig.3, has the advantage that, that is, on the left of substrate holder 2 There are higher flow resistances for the air-flow or the air-flow contrary with it for flowing to 2 right side of substrate holder, this is because On the one hand the two sides of substrate holder pass through sealing surface 4 and on the other hand form flow resistance by sealing surface 4a.

In addition, the advantage that this embodiment additionally provides, that is, sealing surface 4 and sealing surface 4a are used as and are used for matrix branch The guide frame of frame 2, to prevent to be displaced sideways, i.e. horizontal movement in Fig. 3:

In Fig. 1, shown substrate holder 2 has slot in lower end side, and rolling element 3 is embedded in the slot.Thus it keeps away Exempt from that lateral movement (movement horizontal in Fig. 1 and therefore perpendicular to guide direction) occurs, this is because substrate holder 2 In the side wall of slot avoid or at least limit lateral movement and with the contact of the side wall of rolling element 3.

In the embodiment according to Fig. 3, this slot of substrate holder is not indispensable, because passing through 4 He of sealing surface 4a limits lateral movement of the substrate holder to right and left.In an optional advantageous embodiment, according to the processing of Fig. 3 Chamber guiding device still has the substrate holder 2 of slot according to figure 1, to avoid substrate holder and sealing surface 4 and 4a from sending out Raw contact, thus when substrate holder is mobile, resistance not will increase.

Also have furthermore according to the processing chamber guiding device 1 of Fig. 3 there are two the entrance 7a and 7b for flush gas, it is described enter Mouth can be connected with corresponding flush gas supply line.Under operation, flush gas is supplied everywhere by entrance 7a, 7b It manages in the intermediate space 8a and 8b between chamber guiding device 1 and substrate holder 2, so as to exist in the intermediate space 8a and 8b Over-voltage relative to the pressure being present in processing chamber and atmosphere.It is thus achieved that flush gas is basic on sealing surface 4 and 4a Into atmosphere or enter processing chamber.Thus foreign particles are avoided in a particularly efficient manner or undesirable gas enters centre Space 8a and 8b and being especially that of avoiding has an impact the function of rolling element bearing structure.It alternatively, or in addition, can be with In the beginning of processing chamber guiding device and/or end, preferably the entrance for flush gas both had been equipped at beginning or in end.

The 3rd embodiment of processing chamber guiding device is shown in FIG. 4.Here structure is substantially identical as the structure of Fig. 3 And in order to avoid repeating only to illustrate the main distinction below:

There is the slot for accommodating substrate holder 2 according to the processing chamber guiding device of Fig. 4.The slot is configured to rectangular channel, Setting has the rolling element bearing structure of rolling element 3 on the bottom surface of the slot.Processing chamber guiding device is configured to and matrix branch Frame 2 match so that, the bottom surface 4b and 4c of spacing and slot between the side 4 of slot and 4a is corresponding with substrate holder the bottom of towards Spacing < 0.2mm between the side in face, is 0.1mm in the current situation.Pass through four sealing surfaces 4,4a, 4b and 4c shape as a result, At flow resistance, the flow resistance is avoided that appearance from 2 left side of substrate holder to 2 right side of substrate holder or contrary gas Stream, or can at least significantly reduce this air-flow.

Additionally, sealing strip 6 is had according to the growth substrate of Fig. 42.The sealing strip 6 while the guarantor as growth substrate 5 Hold item.Sealing strip 6 extends and is arranged so that along guide direction (towards in drawing), at shown processing position, sealing strip The spacing for being about 0.2mm separated by less than 0.5mm, in the current situation between processing chamber guiding device.It additionally realizes as a result, It increases into slot or the flow resistance of gas stream that is flowed out from slot.

Every two processing chamber guiding device is advantageously integrally formed.With reference to the embodiment and root of processing chamber according to the present invention This is described in detail according to the diagram of Fig. 5:

One embodiment of processing chamber according to the present invention is shown in FIG. 5.As the first processing chamber guiding device pair The processing chamber has the processing chamber guiding device 1 of lower part and the processing chamber guiding device 1a on top.In addition, the processing chamber tool Have as the processing chamber guiding device 1b of another lower part of second processing chamber guiding device pair and another processing chamber guiding dress Set 1c.The processing chamber guiding device 1 and 1b of lower part are integrally formed.Processing chamber the guiding device 1a and 1c on top are also integrally formed. The processing chamber additionally has there are two substrate holder 2 and 2a, and each described matrix bracket is respectively provided with for growth substrate 5 Keep structure.

Processing chamber guiding device 1,1a, 1b and 1c are formed according to the processing chamber guiding device of such as Fig. 4 and are therefore had respectively There is the slot for accommodating substrate holder.At processing position shown in fig. 5, substrate holder is arranged so that, each growth substrate Opposite to each other.Therefore processing chamber a P, the processing chamber P are constituted, setting (or is passed through by substrate holder 2 and 2a in side Growth substrate 5 on substrate holder) it limits.The processing chamber passes through processing chamber guiding device 1,1a, 1b up and down It is limited with 1c.In end side, the processing chamber is respectively provided with end side and limits element, and the end side limits element and processing chamber is oriented to Connect to device Fluid Sealing.The extension that end side limits element is shown in dotted line in Fig. 5.Therefore, end side limits element It is configured so that, avoids air-flow that the throughput flowed out from processing chamber, but matrix are flowed out or at least reduced from processing chamber P in end side Bracket 2 and 2a can be limited along guide direction from end side to be moved through beside element.End side limits element setting and is oriented in processing chamber On the beginning and end of device, the processing chamber guiding device is respectively provided with the length of 5m.End side arranged in parallel limits The spacing of element therefore also about 5mm.

It is different from mentioned-above embodiment, in the embodiment according to Fig. 5, rolling element is set on substrate holder respectively 3, and the rolling element rolls in slot, and the slot is formed in processing chamber guiding device.Therefore, in this embodiment, Rolling element bearing structure setting is on substrate holder.

Therefore, processing chamber P is thus constituted, length and its width of the processing chamber along guide direction with about 5mm are substantially It is equivalent to the spacing on the surface of substrate holder 2 and the mutual direction of 2a, which is about 10cm in the current situation.The height of processing chamber Degree be equivalent to the processing chamber guiding device of lower part to top processing chamber guiding device spacing, be about in the current situation 40cm。

In another embodiment, another growth substrate bracket, the growth are extended to processing chamber as shown in Figure 5 The side of growth substrate bracket 2 is arranged on right side in matrix scaffold.It also is provided with distinguishing accordingly between third growth substrate The processing chamber guiding device of upper and lower part with the slot for rolling element.Thus in addition to the processing chamber P being shown in FIG. 5, Second processing chamber is constituted also between growth substrate bracket 2 and third growth substrate bracket.Correspondingly, in this embodiment, The left and right side of growth substrate bracket 2 all has the matrix to be processed.Correspondingly, third substrate holder is only being arranged to second The left side of processing chamber has the matrix to be processed.