阅读说明：本技术 一种用于脱除工件表面镀层的褪镀液及褪镀方法 (deplating liquid and deplating method for removing coating on surface of workpiece ) 是由 周群飞 乐新波 于 2018-06-29 设计创作，主要内容包括：本发明提供了一种用于脱除工件表面镀层的褪镀液,包括褪镀液A和褪镀液B；所述褪镀液A包括：强氧化剂3wt％～9wt％；碱性物质15wt％～30wt％；水60wt％～85wt％；所述褪镀液A中各组份用量之和为100％；所述褪镀液B包括：全氟聚醚基表面活性剂11wt％～22wt％；金属螯合剂0.6wt％～8wt％；无机酸10wt％～15wt％；水20wt％～70wt％；所述褪镀液B中各组份用量之和为100％。在褪镀中,先将待褪镀产品在褪镀液A中浸泡,得到初步褪镀的产品,再在褪镀液B中浸泡,得到褪镀产品。所述褪镀液可以完全脱除金属工件表面的金属镀层,并且不会损伤金属工件。(The invention provides a deplating solution for removing a coating on the surface of a workpiece, which comprises a deplating solution A and a deplating solution B; the deplating liquid A comprises: 3-9 wt% of strong oxidant; 15 wt% -30 wt% of alkaline substance; 60-85 wt% of water; the sum of the use amounts of all the components in the deplating liquid A is 100 percent; the deplating liquid B comprises: 11-22 wt% of perfluoropolyether surfactant; 0.6-8 wt% of metal chelating agent; 10-15 wt% of inorganic acid; 20-70 wt% of water; the sum of the use amounts of all the components in the deplating liquid B is 100 percent. In the deplating process, a product to be deplated is soaked in a deplating solution A to obtain a product subjected to primary deplating, and then is soaked in a deplating solution B to obtain a deplated product. The deplating liquid can completely remove the metal coating on the surface of the metal workpiece and does not damage the metal workpiece.)

1. a deplating liquid for removing a coating on the surface of a workpiece comprises a deplating liquid A and a deplating liquid B;

The deplating liquid A comprises:

3-9 wt% of strong oxidant;

15 wt% -30 wt% of alkaline substance;

60-85 wt% of water;

The sum of the use amounts of all the components in the deplating liquid A is 100 percent;

The deplating liquid B comprises:

The sum of the use amounts of all the components in the deplating liquid B is 100 percent.

2. The deplating solution according to claim 1, wherein said strong oxidizing agent is potassium permanganate.

3. the deplating solution according to claim 1, wherein the alkaline substance is selected from one or more of sodium hydroxide solids, potassium hydroxide solids, sodium carbonate solids and potassium carbonate solids.

4. The deplating solution according to claim 1, wherein the perfluoropolyether-based surfactant is selected from one or more of perfluorooctanoic acid, sodium perfluorooctanoic acid, and potassium perfluorooctanoic acid.

5. The deplating solution according to claim 1 wherein the metal chelating agent is selected from one or more of sodium ethylene diamine tetra phosphonic acid, tetrasodium iminodisuccinate, and nitrilotriacetic acid.

6. The deplating solution according to claim 1, wherein the inorganic acid is phosphoric acid.

7. The deplating solution according to claim 1, wherein the workpiece is made of one or more of simple metal, alloy, metal oxide and metal salt;

The coating is a metal coating and/or a metal oxide coating.

8. The deplating method for the surface coating of the workpiece by the deplating solution according to any one of claims 1 to 7, comprising the following steps:

A) Soaking the product to be deplated in the deplating liquid A for 30-60 min to obtain a product subjected to primary deplating;

B) and soaking the product subjected to primary deplating in a deplating liquid B for 3-10 min to obtain a deplating product.

9. The deplating method according to claim 8, wherein in the step A), the temperature of the soaking is 85-90 ℃;

And after soaking, washing with water.

10. The deplating method according to claim 8, wherein in step B), the temperature of the soaking is room temperature;

And after soaking, washing and drying.

Technical Field

the invention relates to the technical field of deplating solutions, in particular to a deplating solution and a deplating method for removing a coating on the surface of a workpiece.

Background

The key and camera component with the surface plated with the metal coating is applied to protective windows of mobile phones, tablet computers and the like on a large scale, and metals such as molybdenum, manganese, tin, copper, niobium, aluminum and the like and metal oxides thereof are electroplated, so that the effects of corrosion resistance and improvement of decoration highlight are achieved. In industrial production, the electroplated product has the problems of process leakage, slight scratch on the surface of the product but no damage to a workpiece, dirt on the surface of the product cannot be effectively cleaned and the like, and the plating layer needs to be removed for reprocessing.

For the coating of the non-active metal elements, deplating solutions such as concentrated sulfuric acid, concentrated nitric acid, inorganic strong base and the like are generally adopted for treatment, the operation flow is too long, a plurality of potential safety hazards exist, and the environment friendliness is not facilitated. In addition, strong acid or strong alkaline deplating liquid can also corrode the surface of a workpiece to a certain degree, so that bad phenomena such as matte and the like are easy to occur, and secondary electroplating is influenced.

The electrolytic process can effectively remove the coating, but the problems of incomplete coating removal and the like still occur in the metal coatings on the surfaces of metal components such as keys, cameras and the like by adopting the electrolytic process, and the electrolyte is difficult to post-treat, has higher cost and is not beneficial to industrial production.

The Chinese patent with the publication number of CN106283056A provides a deplating solution and a deplating method suitable for a metal coating on the surface of a workpiece, and relates to a technology for removing a metal film layer on the surface of glass, ceramics and sapphire. Because the bonding force of the metal bond between the metal material and the metal plating layer is mainly higher than that of the nonmetal material and the plating layer, the metal plating layer of the metal components such as the keys, the camera and the like is more difficult to remove. The deplating solution adopting the formula of the patent cannot completely remove the metal coating on the surface of the metal component.

Disclosure of Invention

In view of the above, the technical problem to be solved by the present invention is to provide a deplating solution and a deplating method for removing a plating layer on a surface of a workpiece, wherein the deplating solution of the present invention can completely remove a metal plating layer on the surface of a metal workpiece without damaging the metal workpiece.

the invention provides a deplating solution for removing a coating on the surface of a workpiece, which comprises a deplating solution A and a deplating solution B;

The deplating liquid A comprises:

3-9 wt% of strong oxidant;

15 wt% -30 wt% of alkaline substance;

60-85 wt% of water;

the sum of the use amounts of all the components in the deplating liquid A is 100 percent;

The deplating liquid B comprises:

the sum of the use amounts of all the components in the deplating liquid B is 100 percent;

Preferably, the strong oxidant is potassium permanganate.

preferably, the alkaline substance is selected from one or more of sodium hydroxide solid, potassium hydroxide solid, sodium carbonate solid and potassium carbonate solid.

Preferably, the perfluoropolyether-based surfactant is selected from one or more of perfluorooctanoic acid, sodium perfluorooctanoic acid, and potassium perfluorooctanoic acid.

Preferably, the metal chelating agent is selected from one or more of sodium ethylene diamine tetra phosphonic acid, tetrasodium iminodisuccinate and nitrilotriacetic acid.

preferably, the inorganic acid is phosphoric acid.

Preferably, the workpiece is made of one or more of metal simple substances, alloys, metal oxides and metal salts;

the coating is a metal coating and/or a metal oxide coating.

The invention also provides a deplating method for the workpiece surface coating by the deplating liquid, which comprises the following steps:

A) soaking the product to be deplated in the deplating liquid A for 30-60 min to obtain a product subjected to primary deplating;

B) And soaking the product subjected to primary deplating in a deplating liquid B for 3-10 min to obtain a deplating product.

Preferably, in the step A), the soaking temperature is 85-90 ℃;

and after soaking, washing with water.

preferably, in the step B), the temperature for soaking is room temperature;

And after soaking, washing and drying.

the invention provides a deplating solution for removing a coating on the surface of a workpiece, which comprises a deplating solution A and a deplating solution B;

the deplating liquid A comprises:

3-9 wt% of strong oxidant;

15 wt% -30 wt% of alkaline substance;

60-85 wt% of water;

the sum of the use amounts of all the components in the deplating liquid A is 100 percent;

The deplating liquid B comprises:

The sum of the use amounts of all the components in the deplating liquid B is 100 percent.

The deplating liquid comprises a deplating liquid A and a deplating liquid B, wherein in deplating, a product to be deplated is soaked in the deplating liquid A, inactive metal in a plating layer is removed to obtain a product subjected to primary deplating, and then the product subjected to primary deplating is soaked in the deplating liquid B to remove metal salt on the surface of a workpiece, so that the surface of the workpiece can be cleaned, and the deplated product is obtained. The stripping solution provided by the invention can completely remove the metal coating on the surface of the metal workpiece, and does not damage the metal workpiece.

Experimental results show that when the stripping solution provided by the invention is used for removing the metal coatings of metal components such as keys, cameras and the like, the stripping rate of the coatings is 100%, and the metal components such as the keys, the cameras and the like are not corroded, so that secondary electroplating can be completely realized.

Detailed Description

the technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

the invention provides a deplating solution for removing a coating on the surface of a workpiece, which comprises a deplating solution A and a deplating solution B;

The deplating liquid A comprises:

3-9 wt% of strong oxidant;

15 wt% -30 wt% of alkaline substance;

60-85 wt% of water;

The sum of the use amounts of all the components in the deplating liquid A is 100 percent;

the deplating liquid B comprises:

the sum of the use amounts of all the components in the deplating liquid B is 100 percent.

The deplating liquid provided by the invention is a combination of two deplating liquids, namely a deplating liquid A and a deplating liquid B, preferably, the deplating liquid A and the deplating liquid B are not mixed together, and the deplating liquid A and the deplating liquid B are stored separately.

The deplating liquid A comprises 3-9 wt% of strong oxidant. In certain embodiments of the invention, the strong oxidant is present in an amount of 3 wt%, 5 wt%, or 8 wt%. The strong oxidizing agent is preferably potassium permanganate.

The deplating liquid A comprises 15-30 wt% of alkaline substances. In certain embodiments of the invention, the alkaline material is present in an amount of 15 wt%, 20 wt%, or 30 wt%. The alkaline substance is preferably one or more of sodium hydroxide solid, potassium hydroxide solid, sodium carbonate solid and potassium carbonate solid.

the deplating liquid A comprises 60-85 wt% of water. In certain embodiments of the invention, the water is present in an amount of 82 wt%, 75 wt%, or 62 wt%. The water is preferably deionized water.

The preparation method of the deplating solution A is not particularly limited, and the preparation method of the deplating solution known by the technical personnel in the field can be adopted. In some embodiments of the present invention, the deplating solution a is preferably prepared according to the following method:

and mixing the strong oxidant, the alkaline substance and the water, and uniformly stirring to obtain the deplating liquid A.

the stirring method is not particularly limited in the present invention, and a stirring method known to those skilled in the art may be used.

The deplating liquid B comprises 11-22 wt% of perfluoropolyether-based surfactant. In certain embodiments of the invention, the perfluoropolyether-based surfactant is present in an amount of 11, 16, or 22 wt%. The perfluoropolyether-based surfactant is preferably one or more of perfluorooctanoic acid, sodium perfluorooctanoic acid and potassium perfluorooctanoic acid.

The deplating liquid B comprises 0.6-8 wt% of metal chelating agent. In certain embodiments of the invention, the metal chelating agent is present in an amount of 0.6 wt%, 4 wt%, or 8 wt%. The metal chelating agent is preferably one or more of ethylene diamine tetra phosphonic acid sodium, iminodisuccinic acid tetrasodium and nitrilotriacetic acid.

The deplating liquid B comprises 10-15 wt% of inorganic acid. In certain embodiments of the invention, the inorganic acid is present in an amount of 10 wt%, 12 wt%, or 15 wt%. The inorganic acid is preferably phosphoric acid.

the deplating liquid B comprises 20-80 wt% of water. In certain embodiments of the invention, the water is present in an amount of 78.4 wt%, 68 wt%, or 55 wt%. The water is preferably deionized water.

The preparation method of the deplating solution B is not particularly limited, and the preparation method of the deplating solution known by the technical personnel in the field can be adopted. In some embodiments of the present invention, the deplating solution B is preferably prepared according to the following method:

Mixing the perfluoropolyether-based surfactant, the metal chelating agent, the inorganic acid and water, and uniformly stirring to obtain the deplating liquid B.

The stirring method is not particularly limited in the present invention, and a stirring method known to those skilled in the art may be used.

The mass ratio of the deplating liquid A to the deplating liquid B is not particularly limited, and can be selected according to actual conditions. In some embodiments of the present invention, the mass ratio of the deplating solution a to the deplating solution B is 1: 1.

The material of the workpiece is preferably one or more of simple metal, alloy, metal oxide and metal salt. The alloy is preferably stainless steel. In some embodiments of the present invention, the workpiece is made of SUS 316. In some embodiments of the invention, the workpiece is a key and camera assembly.

the coating is preferably a metal coating and/or a metal oxide coating. In some embodiments of the present invention, the coating is a common coating on the surface of the key and the camera assembly, and specifically includes one or more of molybdenum, molybdenum oxide, manganese oxide, tin oxide, copper oxide, niobium oxide, aluminum oxide, strontium, rubidium, silver and tungsten.

The stripping solution provided by the invention can completely remove the metal coating on the surface of the workpiece, and does not damage the workpiece.

the invention also provides a deplating method for the workpiece surface coating by the deplating liquid, which comprises the following steps:

A) Soaking the product to be deplated in the deplating liquid A for 30-60 min to obtain a product subjected to primary deplating;

B) and soaking the product subjected to primary deplating in a deplating liquid B for 3-10 min to obtain a deplating product.

step A) is primary deplating. In the step A), the soaking temperature is preferably 85-90 ℃. In certain embodiments of the invention, the temperature of the soaking is 90 ℃ or 85 ℃. The soaking time is 30-60 min. In certain embodiments of the invention, the soaking time is 30min, 45min or 60 min. The immersion is preferably carried out in an deplating bath.

After the soaking, water washing is preferably further included. The method of washing with water is not particularly limited in the present invention, and a washing method known to those skilled in the art may be used. In certain embodiments of the invention, the method of water washing is a water spray rinse. The water is preferably deionized water. The time for the water washing is not particularly limited, and can be selected according to actual needs. In certain embodiments of the invention, the time of the water wash is 20 s.

After the washing, it is preferable to further drain water. The method of draining is not particularly limited in the present invention, and a draining method known to those skilled in the art may be used.

And removing the inactive metal in the plating layer from the product subjected to primary deplating.

And step B) is secondary deplating. In step B), the temperature of the soaking is preferably room temperature. The soaking time is 3-10 min. In certain embodiments of the invention, the soaking time is 5min, 8min or 10 min. The immersion is preferably carried out in an deplating bath.

And after soaking, preferably washing and drying. The method of washing with water is not particularly limited in the present invention, and a washing method known to those skilled in the art may be used. In certain embodiments of the invention, the method of water washing is a water spray rinse. The water is preferably deionized water. The time for the water washing is not particularly limited, and can be selected according to actual needs. In certain embodiments of the invention, the time of the water wash is 1 min.

The method and parameters for drying are not particularly limited in the present invention, and those known to those skilled in the art can be used.

After secondary deplating, the metal salt on the surface of the workpiece can be removed, and the surface of the workpiece can be cleaned to obtain a deplated product.

The source of the raw material components used in the present invention is not particularly limited, and may be generally commercially available.

the invention provides a deplating solution for removing a coating on the surface of a workpiece, which comprises a deplating solution A and a deplating solution B;

The deplating liquid A comprises:

3-9 wt% of strong oxidant;

15 wt% -30 wt% of alkaline substance;

60-85 wt% of water;

the sum of the use amounts of all the components in the deplating liquid A is 100 percent;

The deplating liquid B comprises:

The sum of the use amounts of all the components in the deplating liquid B is 100 percent.

The deplating liquid comprises a deplating liquid A and a deplating liquid B, wherein in deplating, a product to be deplated is soaked in the deplating liquid A, inactive metal in a plating layer is removed to obtain a product subjected to primary deplating, and then the product subjected to primary deplating is soaked in the deplating liquid B to remove metal salt on the surface of a workpiece, so that the surface of the workpiece can be cleaned, and the deplated product is obtained. The stripping solution provided by the invention can completely remove the metal coating on the surface of the metal workpiece, and does not damage the metal workpiece.

experimental results show that the stripping solution provided by the invention is used for removing metal coatings of metal components such as keys, cameras and the like, the stripping rate of the coatings is 100%, and workpieces of the metal components such as the keys, the cameras and the like are free of corrosion.

In order to further illustrate the present invention, the following describes in detail a deplating solution and a deplating method for deplating a surface of a workpiece, which are provided by the present invention, with reference to examples, but the present invention should not be construed as limiting the scope of the present invention.

The starting materials used in the following examples are all commercially available industrial starting materials.