阅读说明：本技术 超声辅助振动加工方法 (Ultrasonic auxiliary vibration processing method ) 是由 滕翔宇 杜泽东 陈万群 霍德鸿 丁辉 于 2021-07-23 设计创作，主要内容包括：本发明提供了一种超声辅助振动加工方法,包括如下步骤：S1：提供机床,安装超声振动辅助加工装置；S2：固定工件在机床主轴上,进行打表,将主轴与工件的回转轴线调整到重合；S3：在所述机床上安装金刚石刀具,对工件光平面；S4：将金刚石刀具更换为成型刀,调整所述成型刀的位置,进行对刀；S5：获取成型刀零点位置；S6：编制程序用成型刀进行试切,对试切结构进行检测,计算编制程序与实际检测结果的差值；S7：对步骤S6中的差值进行补偿,启动超声振动辅助加工装置,重新编制程序对工件进行刻划；S8：完成加工,取下工件。本发明的超声辅助振动加工方法,延长刀具寿命,改善加工精度和质量,更好的保证微结构的形貌及深度。(The invention provides an ultrasonic auxiliary vibration processing method, which comprises the following steps: s1: providing a machine tool, and installing an ultrasonic vibration auxiliary machining device; s2: fixing a workpiece on a main shaft of a machine tool, performing meter making, and adjusting the main shaft to be coincident with the rotation axis of the workpiece; s3: mounting a diamond cutter on the machine tool, and performing smooth surface treatment on a workpiece; s4: replacing the diamond cutter with a forming cutter, adjusting the position of the forming cutter, and carrying out tool setting; s5: acquiring a zero position of a forming cutter; s6: trial cutting is carried out on the programming program by using a forming cutter, a trial cutting structure is detected, and the difference value between the programming program and an actual detection result is calculated; s7: compensating the difference in the step S6, starting the ultrasonic vibration auxiliary processing device, and reprogramming to scratch the workpiece; s8: and finishing the machining and taking down the workpiece. The ultrasonic-assisted vibration machining method prolongs the service life of the cutter, improves the machining precision and quality, and better ensures the appearance and depth of the microstructure.)

1. An ultrasonic auxiliary vibration processing method is used for processing a workpiece and is characterized in that: the ultrasonic auxiliary vibration processing method comprises the following steps:

s1: providing a machine tool, and installing an ultrasonic vibration auxiliary machining device;

s2: fixing a workpiece on a main shaft of a machine tool, performing meter making, and adjusting the main shaft to be coincident with the rotation axis of the workpiece;

s3: mounting a diamond cutter on the machine tool, and performing smooth surface treatment on a workpiece;

s4: replacing the diamond cutter with a forming cutter, adjusting the position of the forming cutter, and carrying out tool setting;

s5: acquiring a zero position of a forming cutter;

s6: trial cutting is carried out on the programming program by using a forming cutter, a trial cutting structure is detected, and the difference value between the programming program and an actual detection result is calculated;

s7: compensating the difference in the step S6, starting the ultrasonic vibration auxiliary processing device, and reprogramming to scratch the workpiece;

s8: and finishing the machining and taking down the workpiece.

2. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: and when the dial gauge is marked in the step S2, the dial gauge needle of the machine tool is jumped to be less than 5um, and the rotational inertia is adjusted to be less than 5 nm.

3. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: the forming tool in step S4 is designed and manufactured according to the different microarray structures processed by the workpiece.

4. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: in step S4, the manner of adjusting the position of the forming blade is: and adjusting the position of the forming cutter by using a cross light mark line of a camera on the machine tool.

5. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: in step S5, the mode of acquiring the zero point position of the forming cutter is: and controlling the forming cutter to approach the workpiece, and recording the zero point position of the forming cutter when the forming cutter contacts the workpiece to cut.

6. The ultrasonic-assisted vibration machining method according to claim 5, characterized in that: in step S5, when the forming blade approaches the workpiece, the forming blade is controlled to feed at a pitch of 0.01 um.

7. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: the program in step S6 uses Zygo.

8. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: in step S7, when the workpiece is scribed, the cutting speed of the forming cutter is 300mm/min, and the fast cutter moving speed is 500 mm/min.

9. The ultrasonic-assisted vibration machining method according to claim 8, characterized in that: in step S7, the cutting depth of the final cut is 0.001 mm.

10. The ultrasonic-assisted vibration machining method according to claim 1, characterized in that: the ultrasonic-assisted vibration processing method further includes, after step S8, step S9: and (6) submitting for inspection.

Technical Field

The invention relates to an ultrasonic-assisted vibration machining method.

Background

With the development of scientific and technological products in the directions of high performance, high precision and high integration, microstructures are more and more widely applied to high-end industries such as aerospace, electronic manufacturing, biomedical treatment and the like, and the development of ultra-precision machining technology for manufacturing the microstructures is also correspondingly driven by traction. The microstructure array has become a key part in the fields of photoelectron, information communication, precision engineering and the like due to incomparably superior performance, such as a micro-lens array optical film for flat panel display, a micro-pyramid array for spatial optical retroreflection, a micro-groove array structure grating for solar cells and the like. However, the required precision of the microstructure is still a technical problem to be overcome by ultra-precision machining.

At present, traditional ultra-precision processing methods such as mask etching, laser processing and the like are mostly adopted for processing microstructures, and the defects of uncertainty in material removal, poor surface quality, more burrs, over-quick tool abrasion and the like are caused.

In view of the above, there is a need to improve the existing processing method to solve the above problems.

Disclosure of Invention

The invention aims to provide an ultrasonic auxiliary vibration machining method, which aims to solve the problems that a cutter is easy to wear and a product quality is poor when an existing machining method is used for machining a microstructure of a workpiece.

In order to achieve the above object, the present invention provides an ultrasonic auxiliary vibration processing method for processing a workpiece, including the steps of:

s1: providing a machine tool, and installing an ultrasonic vibration auxiliary machining device;

s2: fixing a workpiece on a main shaft of a machine tool, performing meter making, and adjusting the main shaft to be coincident with the rotation axis of the workpiece;

s3: mounting a diamond cutter on the machine tool, and performing smooth surface treatment on a workpiece;

s4: replacing the diamond cutter with a forming cutter, adjusting the position of the forming cutter, and carrying out tool setting;

s5: acquiring a zero position of a forming cutter;

s6: trial cutting is carried out on the programming program by using a forming cutter, a trial cutting structure is detected, and the difference value between the programming program and an actual detection result is calculated;

s7: compensating the difference in the step S6, starting the ultrasonic vibration auxiliary processing device, and reprogramming to scratch the workpiece;

s8: and finishing the machining and taking down the workpiece.

As a further improvement of the invention, when the dial gauge is used in the step S2, the jitter of the dial gauge needle of the machine tool is adjusted to be less than 5um, and the rotational inertia is adjusted to be less than 5 nm.

As a further improvement of the present invention, the forming tool in step S4 is designed and manufactured according to different microarray structures processed by the workpiece.

As a further improvement of the present invention, in step S4, the position of the forming blade is adjusted by: and adjusting the position of the forming cutter by using a cross light mark line of a camera on the machine tool.

As a further improvement of the present invention, in step S5, the zero point position of the forming blade is obtained by: and controlling the forming cutter to approach the workpiece, and recording the zero point position of the forming cutter when the forming cutter contacts the workpiece to cut.

As a further improvement of the present invention, in step S5, when the shaping blade approaches the workpiece, the shaping blade is controlled to be fed at a pitch of 0.01 um.

As a further improvement of the present invention, Zygo is used in the programming of step S6.

As a further improvement of the invention, in step S7, when the workpiece is scribed, the cutting speed of the forming cutter is 300mm/min, and the fast cutter moving speed is 500 mm/min.

As a further improvement of the invention, in step S7, the cutting depth of the final cut finishing of the scoring is 0.001 mm.

As a further improvement of the present invention, the ultrasonic-assisted vibration processing method further includes step S9 after step S8: and (6) submitting for inspection.

The invention has the beneficial effects that: according to the ultrasonic auxiliary vibration processing method, the ultrasonic auxiliary vibration processing device is arranged, so that the cutter can be directly processed on the surface of the workpiece without nickel plating, the contact time of the cutter and the workpiece is shortened, the service life of the cutter is prolonged, and the processing precision and quality are improved; by the trial cutting step, the shape and depth of the microstructure can be better ensured.

Drawings

FIG. 1 is a flow chart of the ultrasonic-assisted vibration machining method of the present invention.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

As shown in fig. 1, an ultrasonic auxiliary vibration processing method for processing a workpiece includes the steps of:

s1: providing a machine tool, and installing an ultrasonic vibration auxiliary machining device;

s2: fixing a workpiece on a machine tool spindle, performing meter reading, adjusting the spindle to be coincident with the rotation axis of the workpiece, and adjusting the jitter of a dial indicator needle of the machine tool to be less than 5um and the rotational inertia to be less than 5nm during meter reading;

s3: mounting a diamond cutter on the machine tool, wherein the diamond cutter is an R2 diamond cutter for the workpiece optical plane in step S3;

s4: replacing the diamond cutter with a forming cutter, and adjusting the position of the forming cutter by using a cross-shaped cursor line of a camera on a machine tool to perform cutter setting; in step S4, only the approximate position of the forming tool needs to be adjusted, and the forming tool in step S4 is designed and manufactured according to different microarray structures processed by the workpiece;

s5: controlling the forming cutter to approach the workpiece, controlling the forming cutter to feed in a step pitch of 0.01um when the forming cutter approaches the workpiece, and recording the zero position of the forming cutter when the forming cutter is contacted with the workpiece to cut so as to obtain the zero position of the forming cutter;

s6: using a Zygo programming program, using a forming cutter to perform trial cutting, detecting a trial cutting structure, and calculating a difference value between the programming program and an actual detection result; the purpose of the step is to detect whether the placing angle and the processing depth of the forming cutter meet the set requirements, and only a small part of the forming cutter is processed;

s7: compensating the difference in the step S6, starting the ultrasonic vibration auxiliary processing device, reprogramming to score the workpiece, wherein when the workpiece is scored, the cutting speed of the forming cutter is 300mm/min, the quick cutter moving speed is 500mm/min, and the cutting depth of the finish machining of the last scoring cutter is 0.001 mm;

s8: finishing the machining and taking down the workpiece;

s9: and (6) submitting for inspection.

The ultrasonic auxiliary machining device assists in cutting, changes the contact state and action mechanism of the cutter and a machined material through the mechanical and ultrasonic combined action of the cutter on a workpiece, and removes the material mainly through the mechanical cutting action, the high-frequency micro-impact action, the ultrasonic cavitation action and the like. Due to the introduction of the ultrasonic auxiliary processing device, the material removing mechanism is changed, the friction force between the cutter and the workpiece is reduced, the contact time between the cutter and the workpiece is reduced, and the cutting removing effect of the cutter on the workpiece is enhanced, so that the material removing rate is effectively improved, the cutting force is reduced, the cutting heat is reduced, the cutter abrasion is reduced, and the processing precision and quality are improved.

According to the ultrasonic auxiliary vibration processing method, the ultrasonic auxiliary vibration processing device is arranged, so that the cutter can be directly processed on the surface of the workpiece without nickel plating, the contact time of the cutter and the workpiece is shortened, the service life of the cutter is prolonged, and the processing precision and quality are improved; by the trial cutting step, the shape and depth of the microstructure can be better ensured.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.