阅读说明：本技术 一种pcba主板焊锡用浮动隔离式气流散热方法 (Floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin ) 是由 涂艳红 于 2021-08-02 设计创作，主要内容包括：本发明涉及一种PCBA主板焊锡用浮动隔离式气流散热方法,其步骤在于：S1：调整PCBA承托装置的承托区距离,使承托区与PCBA主板尺寸匹配；S2：将PCBA主板放置在PCBA承托装置的承托区内；S3：在焊锡装置移动至与待焊接元器件的针脚接触的同时,通过三维移位机构运行牵引散热机构移动,使PCBA主板上待焊接的元器件位于散热机构的散热区内；S4：在焊锡装置对元器件针脚进行焊接的同时,抽吸构件中的高压风机a运行通过进风构件向散热区内提供散热风力,同时,抽吸构件中的高压风机b运行通过排风构件将散热区内的热空气抽吸排走,在元器件的周围形成了一股由上至下的持续气流,气流带走元器件上因焊接产生的热量。(The invention relates to a floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin, which comprises the following steps: s1: adjusting the distance of a bearing area of the PCBA bearing device to enable the bearing area to be matched with the size of the PCBA mainboard; s2: placing the PCBA mainboard in a bearing area of the PCBA bearing device; s3: when the soldering tin device moves to be in contact with pins of the components to be welded, the three-dimensional displacement mechanism operates to draw the heat dissipation mechanism to move, so that the components to be welded on the PCBA mainboard are located in a heat dissipation area of the heat dissipation mechanism; s4: when the soldering device welds the stitch of the component, the high-pressure fan a in the suction component operates to provide heat dissipation wind power into the heat dissipation area through the air inlet component, and meanwhile, the high-pressure fan b in the suction component operates to suck and exhaust hot air in the heat dissipation area through the air exhaust component, so that a continuous airflow from top to bottom is formed around the component, and heat generated by welding on the component is taken away by the airflow.)

1. A floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin comprises the following steps:

s1: adjusting the distance of a bearing area of a PCBA bearing device arranged on the main frame according to the size of the PCBA main plate, so that the size of the bearing area is matched with that of the PCBA main plate;

s2: placing the PCBA mainboard in a bearing area of the PCBA bearing device;

s3: the heat dissipation device arranged on the main frame comprises a mounting frame arranged on the main frame, and a three-dimensional displacement mechanism and a heat dissipation mechanism which are arranged on the mounting frame, wherein when the soldering tin device arranged on the main frame moves to be in contact with pins of components to be welded, the three-dimensional displacement mechanism operates to draw the heat dissipation mechanism to move, so that the components to be welded on the PCBA mainboard are positioned in a heat dissipation area of the heat dissipation mechanism;

s4: the heat dissipation mechanism comprises an installation component, an air inlet component, an air exhaust component and a suction component, when the soldering device welds pins of the components, a high-pressure fan a in the suction component operates to provide heat dissipation wind power into the heat dissipation area through the air inlet component, and a high-pressure fan b in the suction component operates to suck and exhaust hot air in the heat dissipation area through the air exhaust component, so that a continuous airflow from top to bottom is formed around the components, and heat generated by welding on the components is taken away by the airflow.

2. The floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin of claim 1, wherein the PCBA supporting device comprises a spacing adjustment mechanism and a fixed frame installed on the main frame, the spacing adjustment mechanism comprises a supporting member, the supporting member comprises a screw rod d and an adjustment motor which are horizontally installed on the fixed frame, the adjustment motor is in power connection with the screw rod d, a connecting support is installed on the outer portion of the screw rod d in a threaded mode, the connecting support and the fixed frame form sliding guide fit, the guide direction of the sliding guide fit is parallel to the axial direction of the screw rod d, and a supporting platform is arranged on one side, facing the supporting area, of the connecting support;

the bearing members are provided with two groups of bearing members which are symmetrically arranged along the axial direction of the screw rod d, and the area between the bearing platforms in the two groups of bearing members is a bearing area of the PCBA mainboard.

3. The floating isolation type airflow heat dissipation method for PCBA motherboard solder as recited in claim 2, wherein the supporting platform has a mounting groove on its upper end surface, a conveying member and a conveying motor are disposed in the mounting groove, the conveying member is a conveying belt structure, the conveying direction of the conveying member is parallel to the ground and perpendicular to the axial direction of the screw rod d, and the conveying motor is in power connection with the input end of the conveying member.

4. The floating isolation type airflow heat dissipation method for PCBA motherboard solder according to claim 3, wherein said supporting area adjustment step in step S1 is as follows:

s11: the adjustment motor operates to drive the screw rod d to rotate, and the screw rod d rotates to pull the connecting bracket and the bearing platform to move along the axial direction of the screw rod d;

s12: when the distance between the bearing platforms in the two groups of bearing components is matched with the size of the PCBA mainboard, the motor is adjusted to stop running;

the PCBA motherboard placement step in step S2 described above:

s21: placing the PCBA mainboard between two supporting platforms, and after the PCBA mainboard is contacted with the conveying component, operating the conveying motor to pull the PCBA mainboard to move through the conveying component;

s22: when the PCBA mainboard moves to the preset position, the conveying motor stops running.

5. The floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin according to claim 2 or 3, wherein the heat dissipation device comprises a mounting frame mounted on the main frame, and a three-dimensional displacement mechanism and a heat dissipation mechanism mounted on the mounting frame, the heat dissipation mechanism is mounted on the three-dimensional displacement mechanism, the three-dimensional displacement mechanism is used for drawing the heat dissipation mechanism to move and enabling a component to be welded to be located in a heat dissipation area of the heat dissipation mechanism, and the heat dissipation mechanism is used for carrying out heat dissipation treatment on the component;

the heat dissipation mechanism comprises an installation component, an air inlet component, an air exhaust component and a suction component;

the mounting component comprises a supporting bracket mounted on the three-dimensional displacement mechanism, the exhaust component comprises an exhaust pipe vertically mounted on the supporting bracket, the top end of the exhaust pipe is coaxially provided with an exhaust hood in a funnel structure, the outer circular surface of the exhaust hood is provided with avoidance gaps, and two avoidance gaps are arranged in an array manner along the circumferential direction of the exhaust hood;

the mounting component also comprises a rotating shaft, a main shaft and a connecting shaft, the rotating shaft is coaxially sleeved outside the exhaust pipe, the main shaft and the connecting shaft are coaxially sleeved outside the rotating shaft, and the top end of the main shaft is connected with the bottom end of the connecting shaft;

the supporting bracket is also provided with a driving motor a and a driving motor b, a power transmission piece a used for realizing power transmission between the driving motor a and the rotating shaft is arranged between the driving motor a and the rotating shaft, a power transmission piece b used for realizing power transmission between the driving motor b and the main shaft is arranged between the driving motor b and the main shaft, and the transmission ratio of the power transmission piece a to the power transmission piece b is the same.

6. The floating isolation type airflow heat dissipation method for PCBA main board soldering tin according to claim 5, wherein an external step is arranged at the top end of the connecting shaft, and the air inlet component comprises an air inlet component and an adjusting component;

the adjusting assembly comprises a connecting seat arranged on the external step and adjusting parts arranged on the connecting seat, and two groups of adjusting parts are arranged along the radial direction of the connecting shaft and are symmetrically arranged;

the adjusting component comprises a screw rod e which is radially arranged on the connecting seat along the connecting shaft, a bearing seat is arranged on the external thread of the screw rod e, the bearing seat and the connecting seat form a sliding guide fit with the guiding direction parallel to the axial direction of the screw rod e, a connecting body extends upwards from the upper end of the bearing seat, the connecting body is of a hollow shell structure, an air outlet joint is arranged on the side surface of the connecting body facing the exhaust hood, the tail end of the air outlet joint penetrates through an avoiding gap and is positioned in the exhaust hood, an air blowing head is arranged at the tail end of the air outlet joint, the air blowing head and the connecting body are communicated with each other through the air outlet joint, a plurality of air blowing holes are formed in the side surface of the air blowing head, which is far away from the air outlet joint, and the top end of the air blowing head is positioned above the exhaust hood;

the area between the blowing heads in the two groups of adjusting components is a heat dissipation area;

the screw rods e in the two groups of adjusting components are in power connection with the rotating shaft through power connecting pieces, and the power connecting pieces are in a bevel gear group structure;

the air inlet assembly comprises a connecting main pipe, the connecting main pipe is of an annular pipeline structure coaxially sleeved outside the connecting shaft, and an air inlet nozzle and an air outlet nozzle are arranged on the outer circular surface of the connecting main pipe;

the side of the connecting body is also provided with an air inlet joint, a connecting branch pipe used for realizing the connection between the air inlet joint and the air outlet nozzle is arranged between the air inlet joint and the air outlet nozzle, and two groups of adjusting parts corresponding to the connecting branch pipe and the air outlet nozzle are arranged.

7. The floating isolation type airflow heat dissipation method for PCBA main board soldering tin according to claim 6, wherein the suction member comprises a high pressure fan a and a high pressure fan b, an air inlet pipe for realizing the connection between the air outlet end of the high pressure fan a and the air inlet nozzle is arranged between the air outlet end of the high pressure fan a and the air inlet nozzle, an air outlet pipe for realizing the connection between the air inlet end of the high pressure fan b and the bottom end of the exhaust pipe is arranged between the air inlet end of the high pressure fan b and the bottom end of the exhaust pipe, the air outlet end of the high pressure fan b is connected with a discharge pipe, and the discharge pipe is far away from the air inlet end of the high pressure fan a.

8. The floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin as recited in claim 7, wherein the step of locating the components to be soldered on the PCBA mainboard in the heat dissipation area of the heat dissipation mechanism in step S3 is as follows:

s31: the driving motor a drives the rotating shaft to rotate through the power transmission piece a, the rotating shaft drives the screw rods e in the two groups of adjusting parts to rotate through the power connecting piece, and the screw rods e rotate to pull the blowing heads in the two groups of adjusting parts to move away from or close to each other, so that a heat dissipation area between the two blowing heads is matched with a component to be welded;

s32: the three-dimensional shifting mechanism operates to drive the heat dissipation mechanism to move, so that the components to be welded are located in the heat dissipation area.

9. The floating isolation type airflow heat dissipation method for PCBA motherboard solder according to claim 7, wherein the component heat dissipation step in the heat dissipation area in step S4 is:

s41: the high-pressure fan a operates to provide wind power for the components in the heat dissipation area through the blowing head, the high-pressure fan b operates to suck and discharge hot air in the heat dissipation area through the exhaust hood, under the matched operation of the high-pressure fan a and the high-pressure fan b, a continuous airflow from top to bottom is formed around the components, and the heat of the components is taken away by the airflow;

s42: the driving motor a and the driving motor b run while the high-pressure fan a and the high-pressure fan b run;

the driving motor b drives the main shaft to rotate ninety degrees through the power transmission piece b, so that the two groups of adjusting parts and the air inlet assembly are driven to synchronously rotate ninety degrees, and the driving motor b runs reversely to drive the main shaft, the two groups of adjusting parts and the air inlet assembly to rotate reversely by one hundred eighty degrees;

in the process that the adjusting part rotates along with the main shaft, the screw rod e rotates while revolving around the rotating shaft, and the rotating shaft is driven to rotate by the operation of the driving motor b to offset the rotation of the screw rod e.

Technical Field

The invention relates to the field of PCBA (printed circuit board assembly) mainboards, in particular to the field of PCBA mainboard soldering tin, and particularly relates to a floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin.

Background

In the production process of the PCBA mainboard, pins of diodes, triodes, resistors, capacitors, sensors and other components are generally inserted into a jack on the PCBA mainboard, the components are welded on the PCBA mainboard through soldering operation, and the soldering tin is melted through high temperature in the welding process, so that the PCBA mainboard and the components are burnt and damaged sometimes, and the probability is low, therefore, the PCBA mainboard and the components need to be radiated in the soldering process, but the direct radiation of the heat of the surface of the PCBA mainboard can influence the soldering temperature, so that the soldering process is influenced, and the quality of welding spots is also influenced, therefore, the invention provides a floating isolation type airflow radiating method for soldering tin of the PCBA mainboard, which is used for radiating the heat of the components, wherein the components and the pins are positioned at two sides of the PCBA mainboard and used for radiating the heat of the components, not only can not cause the influence to the welding process, can also reduce the temperature of welding point department fast, avoid PCBA mainboard, components and parts themselves to receive the damage and accelerate the solidification of welding point.

Disclosure of Invention

In order to solve the defects of the prior art, the invention provides the floating isolation type airflow heat dissipation method for the tin soldering of the PCBA mainboard.

In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.

A floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin comprises the following steps:

s1: adjusting the distance of a bearing area of a PCBA bearing device arranged on the main frame according to the size of the PCBA main plate, so that the size of the bearing area is matched with that of the PCBA main plate;

s2: placing the PCBA mainboard in a bearing area of the PCBA bearing device;

s3: the heat dissipation device arranged on the main frame comprises a mounting frame arranged on the main frame, and a three-dimensional displacement mechanism and a heat dissipation mechanism which are arranged on the mounting frame, wherein when the soldering tin device arranged on the main frame moves to be in contact with pins of components to be welded, the three-dimensional displacement mechanism operates to draw the heat dissipation mechanism to move, so that the components to be welded on the PCBA mainboard are positioned in a heat dissipation area of the heat dissipation mechanism;

s4: the heat dissipation mechanism comprises an installation component, an air inlet component, an air exhaust component and a suction component, when the soldering device welds pins of the components, a high-pressure fan a in the suction component operates to provide heat dissipation wind power into the heat dissipation area through the air inlet component, and a high-pressure fan b in the suction component operates to suck and exhaust hot air in the heat dissipation area through the air exhaust component, so that a continuous airflow from top to bottom is formed around the components, and heat generated by welding on the components is taken away by the airflow.

Furthermore, the PCBA supporting device comprises an interval adjusting mechanism and a fixing frame arranged on the main frame, the interval adjusting mechanism comprises a supporting component, the supporting component comprises a screw rod d and an adjusting motor which are horizontally arranged on the fixing frame, the adjusting motor is in power connection with the screw rod d, a connecting support is arranged on the outer portion of the screw rod d in a threaded mode, the connecting support and the fixing frame form sliding guide fit, the guiding direction of the sliding guide fit is parallel to the axial direction of the screw rod d, and a supporting platform is arranged on one side, facing the supporting area, of the connecting support;

the bearing members are provided with two groups of bearing members which are symmetrically arranged along the axial direction of the screw rod d, and the area between the bearing platforms in the two groups of bearing members is a bearing area of the PCBA mainboard.

Furthermore, the upper end surface of the bearing platform is provided with a mounting groove, a conveying component and a conveying motor are arranged in the mounting groove, the conveying component is of a conveying belt structure, the conveying direction of the conveying component is parallel to the ground and perpendicular to the axial direction of the screw rod d, and the conveying motor is in power connection with the input end of the conveying component.

Further, the holding area adjusting step in step S1 includes:

s11: the adjustment motor operates to drive the screw rod d to rotate, and the screw rod d rotates to pull the connecting bracket and the bearing platform to move along the axial direction of the screw rod d;

s12: when the distance between the bearing platforms in the two groups of bearing components is matched with the size of the PCBA mainboard, the motor is adjusted to stop running;

the PCBA motherboard placement step in step S2 described above:

s21: placing the PCBA mainboard between two supporting platforms, and after the PCBA mainboard is contacted with the conveying component, operating the conveying motor to pull the PCBA mainboard to move through the conveying component;

s22: when the PCBA mainboard moves to the preset position, the conveying motor stops running.

Furthermore, the heat dissipation device comprises a mounting frame arranged on the main frame, and a three-dimensional displacement mechanism and a heat dissipation mechanism which are arranged on the mounting frame, wherein the heat dissipation mechanism is arranged on the three-dimensional displacement mechanism and is used for drawing the heat dissipation mechanism to move and enabling the component to be welded to be located in a heat dissipation area of the heat dissipation mechanism, and the heat dissipation mechanism is used for carrying out heat dissipation treatment on the component;

the heat dissipation mechanism comprises an installation component, an air inlet component, an air exhaust component and a suction component;

the mounting component comprises a supporting bracket mounted on the three-dimensional displacement mechanism, the exhaust component comprises an exhaust pipe vertically mounted on the supporting bracket, the top end of the exhaust pipe is coaxially provided with an exhaust hood in a funnel structure, the outer circular surface of the exhaust hood is provided with avoidance gaps, and two avoidance gaps are arranged in an array manner along the circumferential direction of the exhaust hood;

the mounting component also comprises a rotating shaft, a main shaft and a connecting shaft, the rotating shaft is coaxially sleeved outside the exhaust pipe, the main shaft and the connecting shaft are coaxially sleeved outside the rotating shaft, and the top end of the main shaft is connected with the bottom end of the connecting shaft;

the supporting bracket is also provided with a driving motor a and a driving motor b, a power transmission piece a used for realizing power transmission between the driving motor a and the rotating shaft is arranged between the driving motor a and the rotating shaft, a power transmission piece b used for realizing power transmission between the driving motor b and the main shaft is arranged between the driving motor b and the main shaft, and the transmission ratio of the power transmission piece a to the power transmission piece b is the same.

Furthermore, the top end of the connecting shaft is provided with an external step, and the air inlet component comprises an air inlet assembly and an adjusting assembly;

the adjusting assembly comprises a connecting seat arranged on the external step and adjusting parts arranged on the connecting seat, and two groups of adjusting parts are arranged along the radial direction of the connecting shaft and are symmetrically arranged;

the adjusting component comprises a screw rod e which is radially arranged on the connecting seat along the connecting shaft, a bearing seat is arranged on the external thread of the screw rod e, the bearing seat and the connecting seat form a sliding guide fit with the guiding direction parallel to the axial direction of the screw rod e, a connecting body extends upwards from the upper end of the bearing seat, the connecting body is of a hollow shell structure, an air outlet joint is arranged on the side surface of the connecting body facing the exhaust hood, the tail end of the air outlet joint penetrates through an avoiding gap and is positioned in the exhaust hood, an air blowing head is arranged at the tail end of the air outlet joint, the air blowing head and the connecting body are communicated with each other through the air outlet joint, a plurality of air blowing holes are formed in the side surface of the air blowing head, which is far away from the air outlet joint, and the top end of the air blowing head is positioned above the exhaust hood;

the area between the blowing heads in the two groups of adjusting components is a heat dissipation area;

the screw rods e in the two groups of adjusting components are in power connection with the rotating shaft through power connecting pieces, and the power connecting pieces are in a bevel gear group structure;

the air inlet assembly comprises a connecting main pipe, the connecting main pipe is of an annular pipeline structure coaxially sleeved outside the connecting shaft, and an air inlet nozzle and an air outlet nozzle are arranged on the outer circular surface of the connecting main pipe;

the side of the connecting body is also provided with an air inlet joint, a connecting branch pipe used for realizing the connection between the air inlet joint and the air outlet nozzle is arranged between the air inlet joint and the air outlet nozzle, and two groups of adjusting parts corresponding to the connecting branch pipe and the air outlet nozzle are arranged.

Further, the suction component comprises a high-pressure fan a and a high-pressure fan b, an air inlet pipeline used for achieving the connection between the air outlet end of the high-pressure fan a and the air inlet nozzle is arranged between the air outlet end of the high-pressure fan a and the air inlet nozzle, an air outlet pipeline used for achieving the connection between the air inlet end of the high-pressure fan b and the bottom end of the exhaust pipe is arranged between the air inlet end of the high-pressure fan b and the bottom end of the exhaust pipe, the air outlet end of the high-pressure fan b is connected with a discharge pipeline, and the discharge pipeline is far away from the air inlet end of the high-pressure fan a.

Further, the step of positioning the components to be welded on the PCBA motherboard in the heat dissipation area of the heat dissipation mechanism in step S3 is as follows:

s31: the driving motor a drives the rotating shaft to rotate through the power transmission piece a, the rotating shaft drives the screw rods e in the two groups of adjusting parts to rotate through the power connecting piece, and the screw rods e rotate to pull the blowing heads in the two groups of adjusting parts to move away from or close to each other, so that a heat dissipation area between the two blowing heads is matched with a component to be welded;

s32: the three-dimensional shifting mechanism operates to drive the heat dissipation mechanism to move, so that the components to be welded are located in the heat dissipation area.

Further, the heat dissipation step of the component in the heat dissipation area in step S4 includes:

s41: the high-pressure fan a operates to provide wind power for the components in the heat dissipation area through the blowing head, the high-pressure fan b operates to suck and discharge hot air in the heat dissipation area through the exhaust hood, under the matched operation of the high-pressure fan a and the high-pressure fan b, a continuous airflow from top to bottom is formed around the components, and the heat of the components is taken away by the airflow;

s42: the driving motor a and the driving motor b run while the high-pressure fan a and the high-pressure fan b run;

the driving motor b drives the main shaft to rotate ninety degrees through the power transmission piece b, so that the two groups of adjusting parts and the air inlet assembly are driven to synchronously rotate ninety degrees, and the driving motor b runs reversely to drive the main shaft, the two groups of adjusting parts and the air inlet assembly to rotate reversely by one hundred eighty degrees;

in the process that the adjusting part rotates along with the main shaft, the screw rod e rotates while revolving around the rotating shaft, and the rotating shaft is driven to rotate by the operation of the driving motor b to offset the rotation of the screw rod e.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention carries out heat dissipation on the components, not only can not influence the welding process, but also can quickly reduce the temperature at the welding point, avoid the PCBA mainboard and the components from being damaged and accelerate the solidification of the welding point;

2. the distance between the two groups of supporting components for placing the PCBA mainboard is adjustable, so that PCBA mainboards of different models can be placed, namely the scheme is suitable for PCBA mainboards of different models;

3. in the PCBA mainboard placing process, after the PCBA mainboard is contacted with a conveying component, the PCBA mainboard is pulled to move through the conveying component, and then the PCBA mainboard is placed in a bearing area;

4. after the components are positioned in the heat dissipation area, cooling air is provided for the components through the air blowing head, and hot air around the components is exhausted through the exhaust hood, so that a continuous airflow from top to bottom is formed around the components, the airflow is not in contact with the PCBA mainboard, the heat of the components is directly taken away, and the PCBA mainboard and the components are prevented from being damaged and the solidification of welding points is accelerated while the welding result is not influenced;

in addition, the two groups of blowing heads are matched in a rotating mode, so that three hundred and sixty degrees of dead-angle-free air cooling on components can be achieved, and the heat dissipation effect is better;

5. the tail end of the discharge pipeline is far away from the air inlet end of the high-pressure fan a, so that the hot air sucked and discharged by the discharge pipeline is prevented from being sucked and sent back to the heat dissipation area by the high-pressure fan a to influence the heat dissipation effect;

6. the tin soldering process can produce the peculiar smell, and the peculiar smell is not only bad smell, still can influence staff's health in being in the peculiar smell environment for a long time, consequently, is provided with gas storage equipment or gas purification equipment at the end of discharge pipe, and the peculiar smell is discharged by discharge pipe together and waits to handle or directly is purified the emission by gas purification equipment in the gas storage equipment along with the air.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural diagram of a soldering apparatus according to the present invention;

FIG. 3 is a schematic view of the PCBA supporting device of the present invention;

FIG. 4 is a schematic structural diagram of a spacing adjustment mechanism according to the present invention;

FIG. 5 is a schematic structural diagram of a heat dissipation device according to the present invention;

FIG. 6 is a schematic structural diagram of a three-dimensional displacement mechanism of the present invention;

FIG. 7 is an exploded view of the three-dimensional displacement mechanism of the present invention;

FIG. 8 is a schematic structural diagram of a heat dissipation mechanism according to the present invention;

FIG. 9 is a schematic view of the structure of the installation member, the air intake member and the air exhaust member of the present invention;

FIG. 10 is a schematic view of the structure of the mounting member and the air exhausting member of the present invention;

FIG. 11 is a schematic view of the structure of the air discharge member, the rotary shaft, the main shaft and the connecting shaft of the present invention;

FIG. 12 is a schematic structural diagram of a driving motor a, a driving motor b, a rotating shaft and a spindle according to the present invention;

FIG. 13 is a schematic view of the structure of the air intake member of the present invention;

FIG. 14 is a schematic view of the structure of the air intake member of the present invention;

fig. 15 is a schematic view of the structure of the sucking member of the present invention.

The reference numbers in the drawings are:

100. a PCBA supporting device;

110. a fixed mount;

120. a spacing adjustment mechanism; 121. a screw rod d; 122. adjusting the motor; 123. connecting a bracket; 124. a support platform; 125. a conveying motor; 126. a conveying member;

200. a soldering device;

300. a heat sink;

400. a mounting frame;

500. a three-dimensional displacement mechanism;

510. an X-axis displacement member; 511. a shift motor a; 512. a screw rod a; 513. a base;

520. a Y-axis displacement member; 521. a shift motor b; 522. a screw rod b; 523. a movable seat;

530. a Z-axis displacement member; 531. a shift motor c; 532. a guide bar; 533. a screw rod c; 534. a mounting seat;

600. a heat dissipation mechanism;

610. a mounting member; 611. a support bracket; 612. a rotating shaft; 613. a main shaft; 614. a connecting shaft; 615. driving a motor a; 616. a power transmission member a; 617. a drive motor b; 618. a power transmission member b;

620. an air intake member; 621. connecting the main pipe; 622. a connecting nozzle; 623. connecting branch pipes; 624. a connecting seat; 625. a screw rod e; 626. a bearing seat; 627. a power connection; 628. a linker; 629. a blowing head;

630. an air exhaust member; 631. an exhaust duct; 632. an exhaust hood; 633. avoiding the notch;

640. a suction member; 641. a high-pressure fan a; 642. an air inlet pipeline; 643. a high-pressure fan b; 644. an air outlet pipeline; 645. a discharge conduit.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.

A floating isolation type airflow heat dissipation method for PCBA mainboard soldering tin comprises the following steps:

s1: adjusting the distance of a bearing area of a PCBA bearing device 100 arranged on the main frame according to the size of the PCBA main plate to enable the bearing area to be matched with the size of the PCBA main plate;

s2: placing the PCBA mainboard in a bearing area of the PCBA bearing device 100;

s3: the heat dissipation device 300 arranged on the main frame comprises an installation frame 400 arranged on the main frame, and a three-dimensional displacement mechanism 500 and a heat dissipation mechanism 600 which are arranged on the installation frame 400, wherein when the soldering tin device 200 arranged on the main frame moves to be in contact with pins of components to be welded, the three-dimensional displacement mechanism 500 operates to draw the heat dissipation mechanism 600 to move, so that the components to be welded on the PCBA mainboard are positioned in a heat dissipation area of the heat dissipation mechanism 600;

s4: the heat dissipation mechanism 600 includes an installation component 610, an air intake component 620, an air exhaust component 630, and a suction component 640, when the soldering device 200 performs soldering on pins of the component, a high pressure fan a641 in the suction component 640 operates to provide heat dissipation wind power to the heat dissipation area through the air intake component 620, and a high pressure fan b643 in the suction component 640 operates to suck and exhaust hot air in the heat dissipation area through the air exhaust component 630, so that a continuous airflow from top to bottom is formed around the component, and the airflow takes away heat generated by soldering on the component.

As shown in fig. 1-15, a numerical control unit floating isolation type directional airflow heat dissipation automatic soldering tin apparatus for PCBA comprises a main frame, a PCBA supporting device 100, a soldering tin device 200, and a heat dissipation device 300, wherein the PCBA motherboard is placed on the PCBA supporting device 100, the soldering tin device 200 performs automatic soldering tin operation on the PCBA motherboard, the soldering tin device 200 is realized by the existing soldering tin technology, when the soldering tin device 200 performs soldering tin on the PCBA motherboard, the soldering tin generally performs soldering on pins of components such as diodes, triodes, resistors, capacitors, sensors, etc. on the PCBA motherboard, during the soldering process, the soldering tin is melted by high temperature, so that the PCBA motherboard and the components themselves sometimes generate burning damage, and the probability is not low, therefore, the PCBA motherboard and the components need to be dissipated during the soldering tin process, but directly dissipate heat of the board surface of the PCBA motherboard, can influence soldering tin temperature, make the soldering tin process receive the influence, and still can influence the quality of solder joint, so this scheme dispels the heat to the welding process through heat abstractor 300, heat abstractor 300 mainly dispels the heat to components and parts itself, components and parts itself and stitch are the both sides that are located the PCBA mainboard, dispel the heat to components and parts itself, not only can not cause the influence to the welding process, can also reduce the temperature of splice point department fast, avoid the PCBA mainboard, components and parts themselves receive the damage and accelerate the solidification of welding point.

The soldering device 200 is located directly above the PCBA holding device 100, and the heat sink 300 is located directly below the PCBA holding device 100.

As shown in fig. 3-4, the size of the PCBA mainboard of different models is different, in order to make this scheme adapt to the PCBA mainboard of different models, PCBA bearing device 100 include interval adjustment mechanism 120, interval adjustment mechanism 120 includes the bearing component, the bearing component is provided with two sets ofly and the PCBA mainboard is placed in the bearing district between two sets of bearing components, the distance between two sets of bearing components is adjustable, so can place the PCBA mainboard of different models, this scheme is suitable for the PCBA mainboard of different models promptly.

The PCBA holding device 100 includes a fixed frame 110 mounted on the main frame, the holding member includes a screw rod d121 and an adjusting motor 122 horizontally mounted on the fixed frame 110, and the adjusting motor 122 is in power connection with the screw rod d 121.

The external thread of the screw rod d121 is provided with a connecting bracket 123, and the connecting bracket 123 also forms sliding guiding fit with the fixed frame 110, wherein the guiding direction of the sliding guiding fit is parallel to the axial direction of the screw rod d 121.

The connecting bracket 123 is provided with a bearing platform 124 on the side facing the bearing area.

The bearing components are arranged in two groups along the axial direction of the screw rod d121, the two groups of bearing components are symmetrically arranged, and the PCBA mainboard is placed on the bearing platforms 124 in the two groups of bearing components, so that the distance between the two bearing platforms 124 is adjusted through rotation of the screw rod d121, and the PCBA mainboard with different models can be adapted.

In a preferred embodiment, in order to assist in placing the PCBA motherboard, an installation groove is formed in the upper end surface of the supporting platform 124, a conveying member 126 and a conveying motor 125 are arranged in the installation groove, the conveying member 126 is a conveying belt structure, the conveying direction of the conveying member 126 is parallel to the ground and perpendicular to the axial direction of the lead screw d121, and the conveying motor 125 is in power connection with the input end of the conveying member 126; in-process is placed to the PCBA mainboard, after the PCBA mainboard contacts with transport member 126, transport motor 125 operation draws the PCBA mainboard to remove through transport member 126, and then make the PCBA mainboard place in the bearing district, on two sets of bearing platform 124 promptly, set up the meaning of carrying member 126 and lie in, the placing of supplementary PCBA mainboard on the one hand, on the other hand, draw the PCBA mainboard to be located preset position through transport member 126, play the positioning action, on the other hand, carry the member 126 through two sets of transport and carry the centre gripping to the PCBA mainboard, in welding process, prevent that the PCBA mainboard from taking place the skew and influencing the welding result.

As shown in fig. 5, the heat dissipation apparatus 300 includes a mounting frame 400, and a three-dimensional displacement mechanism 500 and a heat dissipation mechanism 600 which are located on the mounting frame 400, wherein the mounting frame 400 is mounted on the main frame, the heat dissipation mechanism 600 is mounted on the three-dimensional displacement mechanism 500, and the three-dimensional displacement mechanism 500 operates to pull the heat dissipation mechanism 600 to move to any coordinate point in a three-dimensional coordinate system, so that the component which is being welded is located in a heat dissipation area of the heat dissipation mechanism 600 at the same time, and the heat dissipation mechanism 600 performs heat dissipation processing on the component itself.

As shown in fig. 6 to 7, the three-dimensional displacement mechanism 500 includes an X-axis displacement member 510, a Y-axis displacement member 520, and a Z-axis displacement member 530, wherein the pulling direction of the X-axis displacement member 510 is an X-axis, the pulling direction of the Y-axis displacement member 520 is a Y-axis, the pulling direction of the Z-axis displacement member 530 is a Z-axis, the X-axis is perpendicular to the Y-axis, and the Z-axis is vertically arranged.

Specifically, the X-axis displacement member 510 includes a screw rod a512 horizontally installed on the mounting frame 400, an axial direction of the screw rod a512 is an X-axis, a base 513 is installed on an external thread of the screw rod a512, the base 513 forms a sliding guiding fit with the mounting frame 400 in a guiding direction parallel to the X-axis, a displacement motor a511 dynamically connected with the screw rod a512 is further installed on the mounting frame 400, and the displacement motor a511 operates to drive the base 513 to move along the X-axis direction through the screw rod a 512.

The Y-axis shifting component 520 comprises a screw rod b522 horizontally arranged on the base 513, the axial direction of the screw rod b522 is a Y axis, a movable seat 523 is arranged on the outer thread of the screw rod b522, the movable seat 523 and the base 513 form a sliding guide fit with a guide direction parallel to the Y axis, a shifting motor b521 dynamically connected with the screw rod b522 is also arranged on the base 513, and the shifting motor b521 operates to drive the movable seat 523 to move along the Y axis direction through the screw rod b 522.

The Z-axis displacement member 530 includes a screw rod c533 and a guide rod 532 vertically mounted on the movable seat 523, wherein the guide rod 532 is fixed, the screw rod c533 rotates, an installation seat 534 is mounted on an external thread of the screw rod c533, the installation seat 534 forms a sliding guide fit with the guide rod 532, a displacement motor c531 in power connection with the screw rod c533 is further mounted on the movable seat 523, the displacement motor c531 operates to drive the installation seat 534 to move along the Z-axis direction through the screw rod c533, and optimally, in order to enable the vertical movement of the installation seat 534 to be more stable and smooth, two sets of the screw rod c533, the guide rod 532 and the displacement motor c531 may be provided, and are respectively located at two sides of the installation seat 534.

Through the cooperation of the shift motor a511, the shift motor b521 and the shift motor c531, the heat dissipation mechanism 600 mounted on the mounting base 534 can be pulled to move to any coordinate point in the three-dimensional coordinate system, so that the component being welded is located in the heat dissipation area of the heat dissipation mechanism 600.

As shown in fig. 8 to 15, the heat dissipation mechanism 600 includes an installation member 610, an air intake member 620, an air exhaust member 630, and a suction member 640, wherein the air intake member 620 supplies wind power to the component itself, and air around the component itself is sucked and exhausted by the air exhaust member 630, so as to cool the component itself, and the installation member 610 can adjust a distance between two blowing heads 629 in the air intake member 620, so that any component itself can be located in the heat dissipation area.

As shown in fig. 9 and 11-12, the mounting member 610 includes a supporting bracket 611 connected with the mounting base 534, the exhaust member 630 includes an exhaust duct 631 vertically installed on the supporting bracket 611, an exhaust cover 632 in a funnel structure is coaxially disposed at a top end of the exhaust duct 631, an avoiding gap 633 is disposed on an outer circumferential surface of the exhaust cover 632, and two avoiding gaps 633 are arranged in an array along a circumferential direction of the exhaust cover 632.

The mounting member 610 further includes a rotating shaft 612, a main shaft 613, and a connecting shaft 614, wherein the rotating shaft 612 is coaxially sleeved outside the exhaust duct 631, the main shaft 613 and the connecting shaft 614 are coaxially sleeved outside the rotating shaft 612, and a top end of the main shaft 613 is connected to a bottom end of the connecting shaft 614.

The support bracket is further provided with a driving motor a615 and a driving motor b617, wherein the driving motor a615 is in power connection with the rotating shaft 612 through a power transmission element a616, the driving motor b617 is in power connection with the main shaft 613 through a power transmission element b618, and the transmission ratio of the power transmission element a616 to the power transmission element b618 is the same.

As shown in fig. 13-14, the top end of the connecting shaft 614 is provided with an external step, and the air inlet member 620 includes an air inlet assembly and an adjusting assembly.

The adjusting assembly comprises a connecting seat 624 mounted on the external step and adjusting components mounted on the connecting seat 624, and two sets of adjusting components are arranged along the radial direction of the connecting shaft 614 and are symmetrically arranged.

The adjusting part includes the lead screw e625 of radially installing on connecting seat 624 along connecting axle 614, the bearing seat 626 is installed to the outside screw thread of lead screw e625, bearing seat 626 still constitutes the direction of guide and is on a parallel with the axial sliding guide cooperation of lead screw e625 with connecting seat 624 simultaneously, the up end of bearing seat 626 upwards extends there is connector 628, connector 628 is inside hollow shell structure, connector 628 is provided with the joint of giving vent to anger towards the side of exhaust hood 632, the end that the joint of giving vent to anger passes dodges breach 633 and is located exhaust hood 632, the end that the joint of giving vent to anger is provided with blowing head 629, blowing head 629 and connector 628 connect each other through the joint of giving vent to anger, a plurality of blowholes have been seted up to the side that blowing head 629 deviates from the joint of giving vent to anger, the top that blows head 629 is located exhaust hood 632.

The area between the blowing heads 629 in the two groups of adjusting parts is a heat dissipation area, after the components are located in the heat dissipation area, cooling air is provided for the components through the blowing heads 629, and air around the components is exhausted through the exhaust hood 632, so that continuous airflow from top to bottom is formed around the components, the heat of the components can be taken away by the airflow, and the PCBA mainboard and the components are prevented from being damaged and the solidification of welding points is accelerated while the welding result is not influenced.

The screw rod e625 of the two sets of adjusting components is in power connection with the rotating shaft 612 through a power connecting piece 627, and the power connecting piece 627 is in a bevel gear set structure.

The air inlet component comprises a connecting main pipe 621, the connecting main pipe 621 is an annular pipeline structure coaxially sleeved outside the connecting shaft 614, a connecting nozzle 622 is arranged on the outer circular surface of the connecting main pipe 621, and the connecting nozzle 622 is divided into two types and is an air inlet nozzle and an air outlet nozzle respectively.

The side of the connector 628 is also provided with an air inlet connector, the air inlet connector is communicated with the air outlet nozzle through a connecting branch pipe 623, and two groups of adjusting components are arranged, so that the connecting branch pipe 623 and the air outlet nozzle are correspondingly provided with two groups.

As shown in fig. 15, the suction member 640 includes a high pressure fan, the high pressure fan is provided with two high pressure fans a641 and b643, wherein the air outlet end of the high pressure fan a641 is communicated with the air inlet nozzle through an air inlet duct 642, the air inlet end of the high pressure fan b643 is communicated with the bottom end of the exhaust duct 631 through an air outlet duct 644, the air outlet end of the high pressure fan b643 is connected with an exhaust duct 645, and the exhaust duct 645 is away from the air inlet end of the high pressure fan a641, so as to prevent the hot air sucked and exhausted by the exhaust duct 645 from being sucked and sent back to the heat dissipation area by the high pressure fan a641, which affects the heat dissipation effect.

In the preferred embodiment, the soldering process generates odor which is not only unpleasant, but also affects the health of workers in an odor environment for a long time, so that the tail end of the exhaust duct 645 is provided with an air storage device or an air purification device, and the odor is exhausted into the air storage device along with the air by the exhaust duct 645 to wait for treatment or is directly purified and exhausted by the air purification device.

The specific working process of the heat dissipation device 300 is as follows:

firstly, a driving motor a615 drives a rotating shaft 612 to rotate through a power transmission piece a616, the rotating shaft 612 drives a screw rod e625 in two groups of adjusting components to rotate through a power connecting piece 627, and the screw rod e625 rotates to finally pull the blowing heads 629 in the two groups of adjusting components to move away from or close to each other, so that a heat dissipation area between the two blowing heads 629 is matched with a component to be welded;

then, the three-dimensional displacement mechanism 500 operates to drive the heat dissipation mechanism 600 to move, so that the component to be welded is located in the heat dissipation area;

next, the soldering device 200 operates to solder the components, and simultaneously, the high-pressure fan a621, the high-pressure fan b643, the driving motor a615, and the driving motor b617 operate, in which:

the high-pressure fan a621 runs to provide wind power for components in a heat dissipation area through the blowing head 629, the high-pressure fan b643 runs to suck and discharge hot air in the heat dissipation area through the exhaust hood 632, and under the matched running of the high-pressure fan a621 and the high-pressure fan b643, a continuous airflow from top to bottom can be formed around the components, the airflow can take away the heat of the components, so that the PCBA mainboard and the components are prevented from being damaged and the solidification of welding points is accelerated while the welding result is not influenced;

the driving motor b617 drives the main shaft 613 to rotate ninety degrees through the power transmission member b618, and further drives the two sets of adjusting components and the air inlet component to synchronously rotate ninety degrees, and then the driving motor b617 drives the main shaft 613, the two sets of adjusting components and the air inlet component to rotate in the reverse direction by one hundred eighty degrees, in short, the blowing heads 629 in the two sets of adjusting components are driven to rotate and cooperate to complete three hundred sixty degrees of dead-angle-free air cooling of the components, so that the heat dissipation effect is better;

in addition, when the adjusting member rotates along with the main shaft 613, if the rotating shaft 612 does not move, under the influence of the power connector 627, the screw e625 rotates while revolving axially around the rotating shaft 612, and the distance between the two blowing heads 629 increases or decreases, which affects the heat dissipation process, so that when the driving motor b617 operates, the driving motor a615 operates synchronously to drive the rotating shaft 612 to rotate, so as to counteract the rotation of the screw e625, and not affect the heat dissipation process.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.