阅读说明：本技术 陶瓷片智能分捡排序系统及其方法 (Intelligent sorting and sequencing system and method for ceramic wafers ) 是由 叶建平 叶建兵 汪胜发 甘晓峰 韦国钦 尤桑 于 2021-04-13 设计创作，主要内容包括：本发明公开了一种陶瓷片智能分捡排序系统及其方法。分拣排序系统包括上料机构、导向整理机构、识别剔除机构和排列输送机构；上料机构将无序堆积的多片陶瓷片初步打散并将初步打散的陶瓷片按序单片向下游均匀输送；导向整理机构对陶瓷片进行正反面翻面处理以及公母头换向处理,使陶瓷片持续按设定姿态输出；识别剔除机构识别不合格的陶瓷片后将其剔除,同时将合格的陶瓷片持续输出；排列输送机构将合格陶瓷片排成列,并将排列后的成列陶瓷片输出。本智能分捡排序系统设计巧妙合理,成功实现了陶瓷片的自动分拣作业以及从无序到有序的自动整理排列,大大提高了生产效率,降低了用工成本,市场前景巨大。(The invention discloses an intelligent sorting and sequencing system and method for ceramic wafers. The sorting and sequencing system comprises a feeding mechanism, a guiding and arranging mechanism, a recognition and rejection mechanism and an arranging and conveying mechanism; the feeding mechanism is used for preliminarily scattering a plurality of ceramic plates which are stacked in an unordered mode and uniformly conveying the preliminarily scattered ceramic plates to the downstream in sequence; the guide arrangement mechanism carries out positive and negative turn-over processing and male and female head reversing processing on the ceramic wafer, so that the ceramic wafer is continuously output according to a set posture; the recognition and rejection mechanism rejects unqualified ceramic wafers after recognizing the unqualified ceramic wafers, and continuously outputs the qualified ceramic wafers; the arrangement conveying mechanism arranges the qualified ceramic wafers into rows and outputs the arranged rows of ceramic wafers. The intelligent sorting and sorting system is ingenious and reasonable in design, successfully achieves automatic sorting operation of the ceramic wafers and automatic sorting arrangement from disorder to order, greatly improves production efficiency, reduces labor cost, and is huge in market prospect.)

1. Potsherd intelligence sorting system, its characterized in that includes:

the feeding mechanism is used for preliminarily scattering a plurality of ceramic plates which are accumulated in a disordered way and uniformly conveying the preliminarily scattered ceramic plates to the downstream in sequence;

the guide arrangement mechanism is used for receiving the ceramic plates sequentially output from the feeding mechanism, and performing positive and negative turn-over processing and male and female head reversing processing on the ceramic plates to enable the ceramic plates to be continuously output according to a set posture;

the identification and rejection mechanism is used for receiving the ceramic wafers output from the guide arrangement mechanism, rejecting unqualified ceramic wafers after identifying the unqualified ceramic wafers, and continuously outputting the qualified ceramic wafers;

and the arrangement conveying mechanism receives the qualified ceramic wafers output by the identification and rejection mechanism in sequence, arranges the qualified ceramic wafers in a row, and outputs the arranged ceramic wafers in the row.

2. The ceramic wafer intelligent sorting and sequencing system of claim 1, wherein: the feeding mechanism comprises a hopper and a scattering feeding mechanism arranged at the bottom of the hopper, a first conveying belt is arranged at the output end of the scattering feeding mechanism, and a scattering guide plate is arranged above the first conveying belt.

3. The ceramic wafer intelligent sorting and sequencing system of claim 2, wherein: the scattering and feeding mechanism comprises a first-stage linear vibration feeder and a second-stage linear vibration feeder.

4. The ceramic wafer intelligent sorting and sequencing system of claim 2, wherein: the guide arrangement mechanism comprises an arrangement guide plate, a turnover plate for turning over the ceramic plates with the reverse sides upward and a male-female head orientation arrangement mechanism for arranging the ceramic plate male-female heads.

5. The ceramic chip intelligent sorting and sequencing system of claim 4, wherein: the male head and female head orientation arrangement mechanism comprises a guide substrate, and reversing shifting pieces are arranged on the guide substrate in a protruding mode.

6. The ceramic wafer intelligent sorting and sequencing system of claim 1, wherein: the recognition and rejection mechanism comprises a transfer mechanism, a damaged ceramic chip recognition mechanism, a damaged ceramic chip rejection mechanism, a ceramic chip male and female head recognition mechanism and a non-set posture ceramic chip rejection mechanism.

7. The ceramic chip intelligent sorting and sequencing system of claim 6, wherein: the transfer mechanism comprises a rotary disk and a second conveying belt.

8. The ceramic wafer intelligent sorting and sequencing system of claim 7, wherein: the damaged ceramic wafer identification mechanism and the damaged ceramic wafer removing mechanism are arranged at the rotary disc; and the ceramic wafer male and female head recognition mechanism and the non-attitude-setting ceramic wafer rejection mechanism are arranged at the second conveying belt.

9. The ceramic wafer intelligent sorting and sequencing system of claim 1, wherein: the arrangement conveying mechanism comprises a third conveying belt, a fourth conveying belt and a pushing mechanism, the third conveying belt receives the qualified ceramic chips which are successively output from the identification and rejection mechanism and is arranged in a row, and the pushing mechanism pushes the full row of ceramic chips in the row to the fourth conveying belt.

10. The intelligent ceramic wafer sorting and sequencing method is characterized by comprising the following steps:

firstly, preliminarily scattering a plurality of ceramic wafers which are stacked in disorder, and uniformly conveying the preliminarily scattered ceramic wafers to the downstream in sequence;

step two, after the ceramic wafer output from the step one is subjected to positive and negative turn-over processing and male and female head reversing processing, the ceramic wafer is continuously output basically according to a set posture;

step three, the ceramic plates output from the step two are subjected to damage detection and identification and male and female head orientation detection and identification, and qualified ceramic plates are output after the damaged ceramic plates and the ceramic plates with the male and female head orientations which do not accord with the set posture are removed;

and step four, the qualified ceramic wafers output in the step three are orderly arranged in a row according to a set quantity and then output.

Technical Field

The invention belongs to the technical field of ceramic wafer production, and particularly relates to an intelligent sorting and sequencing system and method for ceramic wafers, which are applied to the arrangement of industrial ceramic wafers.

Background

In industrial ceramic production packaging, the pressed ceramics need to be arranged according to male and female heads and are arranged into a strip packaging in a certain number and single direction. The traditional method is to select ceramics manually and sort the ceramics into strips and paste the strips, so that the working efficiency is low and the labor cost is high.

Disclosure of Invention

The invention aims to solve the technical problem of providing an intelligent ceramic wafer sorting and sequencing system which realizes automation and intellectualization of sorting and arranging of ceramic wafers so as to improve the production efficiency.

In order to solve the technical problems, the technical scheme of the invention is as follows: potsherd intelligence sorting system includes:

the feeding mechanism is used for preliminarily scattering a plurality of ceramic plates which are accumulated in a disordered way and uniformly conveying the preliminarily scattered ceramic plates to the downstream in sequence;

the guide arrangement mechanism is used for receiving the ceramic plates sequentially output from the feeding mechanism, and performing positive and negative turn-over processing and male and female head reversing processing on the ceramic plates to enable the ceramic plates to be continuously output according to a set posture;

the identification and rejection mechanism is used for receiving the ceramic wafers output from the guide arrangement mechanism, rejecting unqualified ceramic wafers after identifying the unqualified ceramic wafers, and continuously outputting the qualified ceramic wafers;

and the arrangement conveying mechanism is used for receiving and arranging the qualified ceramic wafers output from the identification and rejection mechanism in succession and outputting the arranged ceramic wafers in a row.

As an optimized technical scheme, the feeding mechanism comprises a hopper and a scattering and feeding mechanism arranged at the bottom of the hopper, a first conveying belt is arranged at the output end of the scattering and feeding mechanism, and a scattering and guiding plate is arranged above the first conveying belt.

As a preferable technical scheme, the scattering and feeding mechanism comprises a primary linear vibration feeder and a secondary linear vibration feeder.

As a preferred technical scheme, the guiding and arranging mechanism comprises an arranging guide plate, a turnover plate for turning over the ceramic plates with the reverse sides facing upwards and a male-female head orientation arranging mechanism for arranging the male heads and the female heads of the ceramic plates in an orientation way.

According to a preferable technical scheme, the male and female head orientation sorting mechanism comprises a guide substrate, and a reversing shifting piece is arranged on the guide substrate in a protruding mode.

The recognition and rejection mechanism comprises a transfer mechanism, a damaged ceramic chip recognition mechanism, a damaged ceramic chip rejection mechanism, a ceramic chip male-female head recognition mechanism and a non-attitude-setting ceramic chip rejection mechanism.

Preferably, the transfer mechanism comprises a rotary disc and a second conveyor belt.

As a preferred technical scheme, the damaged ceramic wafer identification mechanism and the damaged ceramic wafer removing mechanism are arranged at the rotary disk; and the ceramic wafer male and female head recognition mechanism and the non-attitude-setting ceramic wafer rejection mechanism are arranged at the second conveying belt.

As a preferable technical scheme, the arrangement conveying mechanism includes a third conveying belt, a fourth conveying belt and a pushing mechanism, the third conveying belt receives the qualified ceramic wafers output from the identification and rejection mechanism in parallel in a row, and the pushing mechanism pushes the full row of ceramic wafers in the row to the fourth conveying belt.

The invention also provides an intelligent ceramic chip sorting method adopting the system, which comprises the following steps:

firstly, preliminarily scattering a plurality of ceramic wafers which are stacked in disorder, and uniformly conveying the preliminarily scattered ceramic wafers to the downstream in sequence;

step two, after the ceramic wafer output from the step one is subjected to positive and negative turn-over processing and male and female head reversing processing, the ceramic wafer is continuously output basically according to a set posture;

step three, the ceramic plates output from the step two are subjected to damage detection and identification and male and female head orientation detection and identification, and qualified ceramic plates are output after the damaged ceramic plates and the ceramic plates with the male and female head orientations which do not accord with the set posture are removed;

and step four, the qualified ceramic wafers output in the step three are orderly arranged in a row according to a set quantity and then output.

Due to the adoption of the technical scheme, the invention has the following beneficial effects: primarily scattering a plurality of ceramic wafers which are stacked in disorder through a feeding mechanism and uniformly conveying the primarily scattered ceramic wafers to the downstream in sequence; the ceramic plates which are orderly output are subjected to positive and negative turn-over processing and male and female head reversing processing through the guide arrangement mechanism, so that the ceramic plates are continuously output according to a set posture; identifying unqualified ceramic wafers by an identification and rejection mechanism, rejecting the unqualified ceramic wafers, and continuously outputting the qualified ceramic wafers; arranging the qualified ceramic wafers which are output in succession into rows according to a certain quantity through an arranging and conveying mechanism, and then outputting the ceramic wafers in rows; the whole system is ingenious and reasonable in design, automatic sorting operation of the ceramic wafers and automatic arrangement from disorder to order are successfully realized, the production efficiency is greatly improved, and the labor cost is reduced.

Drawings

The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention. Wherein:

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a loading mechanism in an embodiment of the invention;

FIG. 3 is a schematic structural diagram of a guiding and sorting mechanism and a recognition and rejection mechanism in an embodiment of the invention;

FIG. 4 is a schematic structural view of a roll-over panel in an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a male-female head-facing sorting mechanism according to an embodiment of the present invention;

fig. 6 is a schematic structural view of an arrangement conveying mechanism in the embodiment of the invention.

In the figure: 10-a feeding mechanism; 11-a hopper; 12-a first-stage linear vibration feeder; 13-a two-stage linear vibration feeder; 14-a first conveyor belt; 15-scattering the guide plate; 20-a guiding and arranging mechanism; 21-arranging a guide plate; 22-a turnover plate; 23-the male and female heads face the arranging mechanism; 231-a guide substrate; 232-reversing plectrum; 30-identifying a rejection mechanism; 31-a rotating disc; 32-damaged ceramic wafer identification mechanism; 33-damaged ceramic chip removing mechanism; 34-ceramic piece male and female head identification mechanism; 35-a ceramic chip removing mechanism with a non-set posture; 36-a second conveyor belt; 40-arranging a conveying mechanism; 41-a third conveyor belt; 42-a fourth conveyor belt; 43-a pushing mechanism; 44-a guide mechanism; 431-push plate; 432-a pusher drive mechanism; 50-ceramic plate.

Detailed Description

The invention is further illustrated below with reference to the figures and examples. In the following detailed description, certain exemplary embodiments of the present invention are described by way of illustration only. Needless to say, a person skilled in the art realizes that the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and not intended to limit the scope of the claims.

As shown in fig. 1, the intelligent ceramic wafer sorting system includes a feeding mechanism 10, a guiding and arranging mechanism 20, an identifying and rejecting mechanism 30, and an arranging and conveying mechanism 40, wherein:

the feeding mechanism 10 primarily breaks up a plurality of ceramic sheets 50 stacked in disorder and uniformly conveys the primarily broken ceramic sheets 50 downstream in sequence;

the guide arrangement mechanism 20 receives the ceramic plates 50 sequentially output from the feeding mechanism 10, and performs face-to-face turning processing and male-female head reversing processing on the ceramic plates to enable the ceramic plates to be continuously output according to a set posture;

the identification and rejection mechanism 30 receives the ceramic wafers output from the guide arrangement mechanism 20, rejects the unqualified ceramic wafers after identifying the unqualified ceramic wafers, and continuously outputs the qualified ceramic wafers;

the arrangement conveying mechanism 40 receives the qualified ceramic wafers output from the identification and rejection mechanism 30, arranges the qualified ceramic wafers, and outputs the arranged ceramic wafers in a row.

Referring to fig. 2, in the embodiment, the feeding mechanism 10 includes a hopper 11 and a scattering feeding mechanism installed at the bottom of the hopper 11, the scattering feeding mechanism includes a primary linear vibration feeder 12 and a secondary linear vibration feeder 13, the primary linear vibration feeder 12 is installed at a discharge port of the hopper 11, the secondary linear vibration feeder 13 is installed at an output end of the primary linear vibration feeder 12, and the structure of the linear vibration feeder is a common structure known in the art and is not described herein again; the output end of the second-level linear vibration feeder 13 is provided with a first conveying belt 14, and a scattering guide plate 15 is arranged above the first conveying belt 14. During operation, the ceramic plates stacked out of order are arranged in the hopper 11, the ceramic plates are continuously conveyed to the first conveying belt 14 at a constant speed through the two-stage linear vibration device, the ceramic plates are conveyed by the aid of the working principle of the first-stage linear vibration feeder 12 and the second-stage linear vibration feeder 13, the ceramic plates are conveyed to the first conveying belt 14 after preliminary scattering of the ceramic plates is achieved through multistage linear vibration, the ceramic plates are further scattered through the scattering guide plate 15 on the first conveying belt 14, and the ceramic plates are stacked together and are uniformly fed as far as possible. Of course, the feeding mechanism may also adopt other structures to realize uniform feeding, and all of them should fall into the protection scope of the present invention.

Referring to fig. 3, in the present embodiment, the guiding and collating mechanism 20 includes a collating guide plate 21, a turning plate 22 and a male-female head orienting and collating mechanism 23, and the collating guide plate 21, the turning plate 22 and the male-female head orienting and collating mechanism 23 are all installed above the shaping conveyor belt. When the conveying belt is used, the ceramic plates on the first conveying belt 14 are guided by the arranging guide plate 21 and are firstly conveyed to the turnover plate 22, referring to fig. 4, the turnover plate 22 is of a plate body structure with a turnover surface twisted by 90 degrees, when the ceramic plates with the reverse surfaces facing upwards touch the turnover plate 22, the ceramic plates are approximately of a trapezoidal structure, the front surfaces of the ceramic plates are narrow, the reverse surfaces of the ceramic plates are wide, when the reverse surfaces face upwards (namely, the narrow surfaces of the ceramic plates are in contact with the conveying belt), the two sides of the ceramic plates are turned up, the turned-up ceramic plates slide into the turnover plate 22 from the lower ends of the turnover plate under the forward conveying action of the conveying belt, slide into the conveying belt again after being turned over along the twisted turnover surface on the turnover plate, and are turned over to face upwards and conveyed forwards along with the conveying belt; when the ceramic plate 50 with the right side facing upwards touches the turning plate 22, the wide side of the ceramic plate contacts with the conveyer belt, and the ceramic plate does not slide onto the turning plate after touching the turning plate 22 under the forward conveying action of the conveyer belt, so that the ceramic plate is conveyed forward along with the conveyer belt in a posture that the right side faces upwards. The turnover plate 22 has the advantages of ingenious and reasonable structural design, stability and reliability, no power is needed, and experiments prove that the turnover success rate of the turnover plate on the ceramic wafer with the reverse side upward can reach 100%.

Referring to fig. 5, female and male head orientation arrangement mechanism 23 includes direction base plate 231, the protruding switching-over plectrum 232 that is provided with on the direction base plate 231, the potsherd is handled the back through 22 upsides of returning face plate, all with positive ascending gesture along with the conveyer belt is carried in order forward, under second piece arrangement deflector 21 guide effect, when guaranteeing that the potsherd is sent to direction base plate 231's switching-over plectrum 232 department, the axis of potsherd is the basic perpendicular to direction base plate 231, if potsherd male head (downside protrusion, upside indent) towards direction base plate 231, switching-over plectrum 232 can not contact the potsherd, the potsherd passes through with original gesture, if female head (upside protrusion, downside indent) towards direction base plate 231, switching-over plectrum 232 contacts female head upper portion and realizes that the potsherd leads to the discernment and rejects the mechanism after shifting.

Referring to fig. 3 again, the recognition and rejection mechanism 30 includes a transfer mechanism, a damaged ceramic wafer recognition mechanism 32, a damaged ceramic wafer rejection mechanism 33, a ceramic wafer male-female head recognition mechanism 34, and a ceramic wafer rejection mechanism 35 with a non-set posture. The transfer mechanism comprises a rotary disc 31 made of transparent glass and a second conveying belt 36, so that the ceramic plates can be effectively conveyed in a circulating manner, the structure is more compact, and the space is saved. The damaged ceramic wafer identification mechanism 32 is used for detecting and identifying damaged ceramic wafers; the damaged ceramic chip removing mechanism 33 is used for removing the damaged ceramic chips which are identified and detected from the rotary disc 31; the ceramic chip male and female head recognition mechanism 34 is used for detecting and recognizing the ceramic chips with the male heads facing backwards and in non-set postures; the non-set posture ceramic chip removing mechanism 35 is used for removing the ceramic chips with the non-set postures which are identified and detected from the rotary disc 31;

in this embodiment, the damaged ceramic wafer identification mechanism 32 includes a damage detection camera mounted below the transparent rotary disk 31, and the damaged ceramic wafer removing mechanism 33 may adopt a blowing removing mode or a mechanical removing mode, which all belong to the protection scope of the present invention; when the ceramic plates which are subjected to turn-over processing and male-female head reversing processing on the first conveying belt pass through the rotary disc 31 right above the camera, damaged ceramic plates can be detected and removed through the removing mechanism, and the non-damaged ceramic plates are conveyed to the second conveying belt 36 through the rotary disc 31; the ceramic chip male and female head recognition mechanism 34 comprises a male and female detection camera arranged above the second conveying belt, and the ceramic chip removing mechanism 35 with a non-set posture can also be realized by adopting a blowing removing mode or a mechanical removing mode; after the damaged ceramic wafer is removed, the undamaged ceramic wafer moves to the male and female detection cameras along with the second conveying belt, the male and female detection cameras take pictures of the top of the ceramic wafer, a removal signal is given to the ceramic wafer (in a non-set posture) with the male head facing backwards, the ceramic wafer is removed by the removal mechanism, and the ceramic wafer enters a recovery hopper.

Referring to fig. 6, in this embodiment, the arrangement conveying mechanism 40 includes a third conveying belt 41, a fourth conveying belt 42 and a pushing mechanism 43, the pushing mechanism 43 includes an L-shaped pushing plate 431 and a pushing plate driving mechanism 432 for driving the pushing plate to reciprocate, and the pushing plate driving mechanism 432 may adopt a conventional driving manner such as electric, pneumatic or hydraulic, which all fall within the protection scope of the present invention; during operation, the third conveyor belt 41 receives the qualified ceramic wafers output from the second conveyor belt 36 in succession, the ceramic wafers are sequentially arranged in a row along the push plate 431 under the guiding action of the guiding mechanism 44 according to a certain quantity, when the full-row sensor continuously has a signal, the third conveyor belt 41 stops moving, the push plate driving mechanism 432 drives the push plate 431 to push the full-row ceramic wafers in the row to the fourth conveyor belt 42, and the fourth conveyor belt 42 steps for a distance after the push plate retreats.

In summary, the system works as follows: the ceramic plates are subjected to two-stage direct vibration treatment from the hopper 11, disordered ceramic plates can be continuously conveyed to a first conveying belt at a constant speed, the ceramic plates are subjected to turnover treatment through a turnover plate 22 after being scattered through a scattering guide plate 15 on a first conveying belt 14, and then are subjected to male-female head orientation arrangement through a male-female head orientation arrangement mechanism 23, so that the ceramic plates are conveyed to a transparent rotary disc 31 where the identification and rejection mechanism is located in the same posture; the rotary disc 31 continuously rotates, the ceramic plates conveyed by the first conveying belt 14 pass through a ceramic damage detection camera on the rotary disc, whether the ceramic plates are damaged or not can be accurately identified by an internal algorithm, if the ceramic plates are damaged, the ceramic plates are blown and removed, then the ceramic plates enter the second conveying belt 36 through the guide plate, and when the cameras are detected by a male conveyor and a female conveyor above the second conveying belt, similarly, if the ceramic plates are arranged forwards, the ceramic plates are blown and removed, qualified ceramic plates detected and identified by the two cameras are conveyed to the third conveying belt 41 through the second conveying belt 36 and the transition plate, when a full-row sensor continuously has signals, the ceramic plates are pushed, and when the full-row sensor continuously has signals, the ceramic plates are conveyed to the fourth conveying belt 42 to wait for manual processing.

The intelligent sorting and sorting system is ingenious and reasonable in design, successfully achieves automatic sorting operation of the ceramic wafers and automatic sorting arrangement from disorder to order, greatly improves production efficiency, reduces labor cost, and is huge in market prospect.

The above description is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent changes and modifications that can be made by one skilled in the art without departing from the spirit and principles of the invention should fall within the protection scope of the invention.