阅读说明：本技术 一种低硅高导热压铸铝合金材料及其制备方法 (Low-silicon high-thermal-conductivity die-casting aluminum alloy material and preparation method thereof ) 是由 徐澄 刘宝旦 于 2021-07-05 设计创作，主要内容包括：本发明公开了一种低硅高导热压铸铝合金材料及其制备方法,其特征在于：包括按重量比份的Si4.5％--5.5％、Cu≤0.015％、Mn≤0.015％、Mg≤0.03％、Fe0.78--0.82％、Ni≤0.015％、Zn≤0.015％、Pb≤0.015％、Sn≤0.015％、Ti≤0.015％,其余为Al。制备方法包括精炼步骤,本发明通过降低合金中Si的含量,优化主要合金元素配比,同时严格控制其它元素(杂质)的百分比,并通过高温去除异质形核降低晶界势能,在保证良好的流动性和压铸成形性能前提下,铸态下导热率可达到180～185W/(m.k),热处理后导热率可以达到200-210W/(m.k)。因此,在无需热处理工艺时基站壳体的散热能力即可得到很大地提高,减少了热处理工艺,节约了能源和生产成本。(The invention discloses a low-silicon high-heat-conductivity die-casting aluminum alloy material and a preparation method thereof, and the low-silicon high-heat-conductivity die-casting aluminum alloy material is characterized in that: comprises, by weight, 4.5% -5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% -0.82% of Fe0, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, and the balance of Al. The preparation method comprises a refining step, the proportion of main alloy elements is optimized by reducing the content of Si in the alloy, the percentage of other elements (impurities) is strictly controlled, heterogeneous nucleation is removed by high temperature to reduce the potential energy of a grain boundary, the thermal conductivity can reach 180-185W/(m.k) in an as-cast state on the premise of ensuring good fluidity and die-casting forming performance, and the thermal conductivity can reach 200 plus 210W/(m.k) after heat treatment. Therefore, the heat dissipation capacity of the base station shell can be greatly improved without a heat treatment process, the heat treatment process is reduced, and energy and production cost are saved.)

1. The utility model provides a low silicon high heat conduction die-casting aluminum alloy material which characterized in that: comprises, by weight, 4.5% -5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% -0.82% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.018% -0.025% of Sr, less than or equal to 0.15% of other impurities, and the balance of Al.

2. The low-silicon high-thermal-conductivity die-casting aluminum alloy material as claimed in claim 1, wherein: comprises, by weight, 4.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.018% of Sr, less than or equal to 0.15% of other impurities, and the balance of Al

3. The low-silicon high-thermal-conductivity die-casting aluminum alloy material as claimed in claim 1, wherein: comprises, by weight, 5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.82% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.025% of Sr, less than or equal to 0.15% of the total amount of other impurities, and the balance of Al.

4. A method for preparing the low-silicon high-heat-conductivity die-casting aluminum alloy material as claimed in any one of claims 1 to 3, wherein the method comprises the following steps: comprises the following steps of (a) carrying out,

s1, high-temperature smelting is carried out on the aluminum and aluminum-silicon intermediate alloy which is prepared according to the components of the high-heat-conductivity aluminum alloy material, and the smelting temperature is 750-780 ℃;

s2, adding iron element into the melt obtained in the step S1, wherein the melting temperature is 740-760 ℃;

s3, adding a boron element releaser into the melt obtained in the step S2, pressing the releaser into the bottom of a furnace for full release, wherein the melting temperature is 720-740 ℃;

s4, adding an aluminum-strontium intermediate alloy into the melt obtained in the step S3, wherein the melting temperature is 710-730 ℃;

s5, degassing and refining the melt obtained in the step S4, wherein the refining temperature is 700-720 ℃;

and S6, rapidly heating the melt obtained in the step S5 to 800 ℃, keeping for 3-6 hours, and cooling to 740 ℃ to obtain the low-silicon high-heat-conductivity die-casting aluminum alloy material.

Technical Field

The invention relates to the field of die-casting materials, in particular to a low-silicon high-heat-conductivity die-casting aluminum alloy material and a preparation method thereof.

Background

With the continuous development of mobile communication services, massive data needs to be processed, the transmission rate is doubled, and the 5G base station is constructed and applied in a large scale. And 5G basic station power consumption has reached 2.5 ~ 3.5 times of 4G basic station, and the rise of power consumption will mean the increase of the heat generation volume, if the heat dissipation is not timely, can lead to the inside ambient temperature of basic station to rise, in case exceed rated temperature, will seriously influence the stability of network and the life of equipment. Thus, the large scale development of 5G base stations creates significant challenges for heat dissipation solutions. The existing base station cooling scheme mainly depends on natural air cooling heat dissipation of structural parts (shells), such as optimizing the design of radiating blades, increasing the surface area, thickening the shells by adopting cast aluminum and the like. Because the base station is usually installed on the iron frame of the roof and the high place in the field, the reduction of the volume and the weight is very important for the installation convenience of the equipment, and the appearance size and the product weight are limited to a certain extent and cannot be increased at will. Therefore, in order to better solve the problem of heat dissipation of the 5G base station, it is required to improve the heat exchange efficiency of the base station and reduce the heat transfer resistance as much as possible in a limited space. In addition to using high thermal conductivity interface materials, it is more important to improve the thermal conductivity of the base station housing. Therefore, it is necessary to develop a novel die-casting aluminum alloy material, so that the die-casting aluminum alloy material has higher heat conductivity on the premise of meeting the die-casting forming process. At present, the thermal conductivity of the conventional die-casting aluminum alloy in an as-cast state is between 90 and 120W/(m.k), and the heat dissipation requirement of a communication base station cannot be met.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides the low-silicon high-heat-conductivity die-casting aluminum alloy material which has good heat conductivity and meets the heat dissipation requirement of a communication base station.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a low silicon high heat conduction die-casting aluminum alloy material which characterized in that: comprises, by weight, 4.5% -5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% -0.82% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.018% -0.025% of Sr0.018%, less than or equal to 0.15% of other impurities, and the balance of Al.

Further comprises, by weight, 4.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.018% of Sr, less than or equal to 0.15% of the total amount of other impurities, and the balance of Al

Further comprises, by weight, 5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.82% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.025% of Sr, less than or equal to 0.15% of the total amount of other impurities, and the balance of Al.

The invention also aims to provide a preparation method of the low-silicon high-heat-conductivity die-casting aluminum alloy material, which is characterized by comprising the following steps of: comprises the following steps of (a) carrying out,

s1, high-temperature smelting is carried out on the aluminum and aluminum-silicon intermediate alloy which is prepared according to the components of the high-thermal-conductivity aluminum alloy material, and the smelting temperature is 750-780 ℃;

s2, adding iron element into the melt obtained in the step S1, wherein the melting temperature is 740-760 ℃;

s3, adding a boron element releaser into the melt obtained in the step S2, pressing the releaser into the bottom of a furnace for full release, wherein the melting temperature is 720-740 ℃;

s4, adding an aluminum-strontium intermediate alloy into the melt obtained in the step S3, wherein the melting temperature is 710-730 ℃;

s5, degassing and refining the melt obtained in the step S4, wherein the refining temperature is 700-720 ℃;

and S6, rapidly heating the melt obtained in the step S5 to 800 ℃, keeping for 3-6 hours, and cooling to 740 ℃ to obtain the low-silicon high-heat-conductivity die-casting aluminum alloy material.

The beneficial effects of the invention include: the content of Si in the alloy is reduced, the proportion of main alloy elements is optimized, the percentage of other elements (impurities) is strictly controlled, heterogeneous nucleation is removed at high temperature, the potential energy of a grain boundary is reduced, the thermal conductivity can reach 180-185W/(m.k) in an as-cast state on the premise of ensuring good fluidity and die-casting forming performance, and the thermal conductivity can reach 200 plus one grade of 210W/(m.k) after heat treatment. Therefore, the heat dissipation capacity of the base station shell can be greatly improved without a heat treatment process, the heat treatment process is reduced, and energy and production cost are saved.

Detailed Description

The present invention will be described in further detail with reference to the following examples.

Example 1

A high-thermal-conductivity die-casting aluminum alloy material comprises, by weight, 4.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.78% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.018% of Sr, less than or equal to 0.15% of other impurities, and the balance Al.

The preparation method for preparing the low-silicon high-heat-conductivity die-casting aluminum alloy by using the high-heat-conductivity die-casting aluminum alloy material comprises the following steps,

s1, high-temperature smelting is carried out on the aluminum and aluminum-silicon intermediate alloy which is prepared according to the components of the high-heat-conductivity aluminum alloy material, and the smelting temperature is 750-780 ℃;

s2, adding iron element into the melt obtained in the step S1, wherein the melting temperature is 740-760 ℃;

s3, adding a boron element releaser into the melt obtained in the step S2, pressing the releaser into the bottom of a furnace for full release, wherein the melting temperature is 720-740 ℃;

s4, adding an aluminum-strontium intermediate alloy into the melt obtained in the step S3, wherein the melting temperature is 710-730 ℃;

s5, degassing and refining the melt obtained in the step S4, wherein the refining temperature is 700-720 ℃;

and S6, rapidly heating the melt obtained in the step S5 to 800 ℃, keeping for 3-6 hours, and cooling to 740 ℃ to obtain the low-silicon high-heat-conductivity die-casting aluminum alloy material for later use.

The 5G base station shell is prepared by die-casting the low-silicon high-heat-conductivity die-casting aluminum alloy material prepared by the steps, the fluidity is good, the product forming rate is high, and the heat conductivity of the product after heat treatment can reach 210W/(m.k).

Example 2

A high-thermal-conductivity die-casting aluminum alloy material comprises, by weight, 5.5% of Si, less than or equal to 0.015% of Cu, less than or equal to 0.015% of Mn, less than or equal to 0.03% of Mg, 0.82% of Fe, less than or equal to 0.015% of Ni, less than or equal to 0.015% of Zn, less than or equal to 0.015% of Pb, less than or equal to 0.015% of Sn, less than or equal to 0.015% of Ti, 0.025% of Sr, less than or equal to 0.15% of the total amount of other impurities, and the balance of Al.

The preparation method for preparing the low-silicon high-heat-conductivity die-casting aluminum alloy by using the high-heat-conductivity die-casting aluminum alloy material comprises the following steps,

s1, high-temperature smelting is carried out on the aluminum and aluminum-silicon intermediate alloy which is prepared according to the components of the high-heat-conductivity aluminum alloy material, and the smelting temperature is 750-780 ℃;

s2, adding iron element into the melt obtained in the step S1, wherein the melting temperature is 740-760 ℃;

s3, adding a boron element releaser into the melt obtained in the step S2, pressing the releaser into the bottom of a furnace for full release, wherein the melting temperature is 720-740 ℃;

s4, adding an aluminum-strontium intermediate alloy into the melt obtained in the step S3, wherein the melting temperature is 710-730 ℃;

s5, degassing and refining the melt obtained in the step S4, wherein the refining temperature is 700-720 ℃;

and S6, rapidly heating the melt obtained in the step S5 to 800 ℃, keeping for 3-6 hours, and cooling to 740 ℃ to obtain the low-silicon high-heat-conductivity die-casting aluminum alloy material for later use.

The 5G base station shell is prepared by die-casting the low-silicon high-heat-conductivity die-casting aluminum alloy material prepared by the steps, the fluidity is good, the product forming rate is high, and the heat conductivity of the product after heat treatment can reach 200W/(m.k).

The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.