阅读说明：本技术 圆片堆叠打磨装置及其堆叠打磨方法 (Wafer stacking and polishing device and stacking and polishing method thereof ) 是由 刘彦良 林爱国 潘玉成 林巧玲 杨霞 林珊珊 于 2021-06-23 设计创作，主要内容包括：本发明涉及电机加工技术领域,特别涉及一种圆片堆叠打磨装置及其堆叠打磨方法,使冲压得到的圆片经过输送带输送后能够自动掉落第一转盘上部,当堆叠完毕后,通过上方的连接板向下移动,使上方的限位套与限位柱上方限位配合,通过限位套带动限位柱转动90度,使限位柱的磨砂层朝内,使第二转盘与第一转盘夹持住堆叠的圆片,通过驱动第二转盘转动即可驱动所有堆叠的圆片一同转动,使圆片的边缘与限位柱的磨砂层产生滑动摩擦,从而起到圆片边缘毛刺的打磨目的,不再需要人工对圆片进行额外的整理,更不需要额外的工序对圆片边缘的毛刺进行打磨,大幅提高工作效率。(The invention relates to the technical field of motor processing, in particular to a wafer stacking and polishing device and a wafer stacking and polishing method, which can lead a punched wafer to automatically fall off the upper part of a first turntable after being conveyed by a conveying belt, after the stacking is finished, the upper limiting sleeve is in limiting fit with the upper part of the limiting column through the downward movement of the upper connecting plate, the limiting column is driven to rotate 90 degrees by the limiting sleeve, the frosted layer of the limiting column faces inwards, the second rotating disc and the first rotating disc clamp the stacked wafers, all the stacked wafers can be driven to rotate together by driving the second turntable to rotate, so that the edges of the wafers generate sliding friction with the frosting layer of the limiting column, thereby play the purpose of polishing of disk edge burr, no longer need the manual work to carry out extra arrangement to the disk, more need not extra process and polish to the burr at disk edge, improve work efficiency by a wide margin.)

1. Wafer piles up grinding device, its characterized in that includes:

a base;

the first three-jaw chuck is connected to the upper part of the base, and a first through hole in the vertical direction is formed in the middle of the first three-jaw chuck;

the three limiting columns are respectively vertically and rotatably connected to the upper parts of the clamping jaws of the three-jaw chuck, and one side of each limiting column is provided with a frosting layer;

the cylinder body of the first cylinder is fixed on the base, and the piston rod of the first cylinder vertically and upwards penetrates through the first through hole;

the first rotating disc is connected to the upper part of a piston rod of the first air cylinder;

the second air cylinder is vertically arranged downwards above the rotary table;

the connecting plate is connected to the lower end of the second air cylinder;

the second three-jaw chuck is connected to the lower part of the connecting plate, each jaw of the second three-jaw chuck corresponds to each jaw of the first three-jaw chuck in position one to one, and each lower part of the third three-jaw chuck is connected with a limiting sleeve matched with the upper end of the limiting column;

the first driving device is in transmission connection with the limiting sleeve and is used for driving the limiting sleeve to rotate;

the second turntable is connected to the lower part of the connecting plate;

the second driving device is in transmission connection with the second turntable and is used for driving the second turntable to rotate;

and the PLC is electrically connected with the first cylinder, the second cylinder, the first driving device and the second driving device respectively.

2. The wafer stack grinding device as set forth in claim 1, comprising:

the two upright columns are distributed on two sides of the first three-jaw chuck;

the brackets are provided with hoops, and the two brackets are respectively connected to the two stand columns through the hoops;

the transmitting end of the photoelectric sensor is connected to one of the brackets, and the receiving end of the photoelectric sensor is connected to the other bracket;

the PLC is electrically connected with the photoelectric sensor.

3. The wafer stack grinding device as recited in claim 1, wherein the limiting column is shaped as a cylinder, and the upper end of the limiting column on the side away from the grinding layer is provided with a chamfer.

4. The wafer stack grinding device as recited in claim 1, wherein a flat key is provided at the upper end of the limiting column facing the grinding layer, and the limiting sleeve is provided with a key groove matched with the flat key.

5. The wafer stack grinding device as recited in claim 1, wherein the first drive means is a stepper motor.

6. The wafer stack grinding device as recited in claim 1, wherein the second drive means is a motor.

7. A wafer stack polishing method for a wafer stack polishing apparatus as set forth in any one of claims 1 to 6, comprising the steps of:

step 1: adjusting the first three-jaw chuck and the second three-jaw chuck to enable the diameter of a cylinder where the inner side surfaces of the three limiting columns are located to be equal to that of the wafer, enabling each limiting sleeve to correspond to the upper end of each limiting column one by one, and enabling one side, provided with a frosting layer, of each limiting column to face outwards;

step 2: the wafer continuously falls to the first rotating disc and is stacked on the upper part of the first rotating disc under the limiting action of the limiting column;

and step 3: when the wafers are stacked to a set height, stopping stacking the wafers, controlling a second air cylinder by the PLC to drive a connecting plate to move downwards, enabling each limiting sleeve to be correspondingly matched and connected with each limiting column one by one, and tightly pressing the wafer positioned at the top by a second rotary table;

and 4, step 4: the PLC controls the first driving device to drive the limiting sleeve to rotate 90 degrees, so that the limiting column is driven to rotate 90 degrees, one side of the limiting column, which is provided with the frosting layer, faces the inner side and contacts with the edge of the stacked wafer;

and 5: the PLC controls a second driving device to drive a second turntable to rotate and drive the stacked wafers to rotate, and the edges of the wafers are in sliding friction with the frosting layers of the limiting columns so as to polish the edges of the wafers;

step 6: after polishing is finished, the PLC controls the first driving device to drive the limiting sleeve to rotate for 90 degrees, so that the limiting column is driven to rotate for 90 degrees, and one side of the limiting column, which is provided with the frosting layer, faces outwards;

and 7: the PLC controls the second cylinder and the first cylinder to move upwards, so that the stacked wafers move upwards to be separated from the limiting position of the limiting column.

8. Wafer stack grinding method for a wafer stack grinding device as set forth in claim 7, wherein the step 2 is specifically: PLC controls first cylinder to drive first carousel to upwards promote to preset height, and the disk drops to first carousel in succession, piles up on first carousel upper portion under the limiting displacement of spacing post, and when the disk piled up highly being higher than photoelectric sensor place height, photoelectric sensor's receiving terminal did not receive light signal, PLC controls first cylinder and drives first carousel decline take the altitude, makes photoelectric sensor's receiving terminal receive light signal to this is reciprocal, descends to the minimum until first carousel.

Technical Field

The invention relates to the technical field of motor processing, in particular to a wafer stacking and polishing device and a stacking and polishing method thereof.

Background

In the technical field of motor production, a whole coil of steel needs to be unfolded into a steel band and conveyed to a punching machine for punching to obtain a steel disc, and the Chinese patent with the publication number of CN203091502U discloses an automatic deflection feeding timing blanking punching mechanism which combines an automatic deflection feeder, a punching machine, a conveyor belt and a blanking device together, so that the production automation is realized, the corner waste is effectively reduced, the waste of raw materials is reduced, the labor intensity of workers is greatly reduced, the production efficiency is improved, and meanwhile, the safety of the workers is ensured.

In the above patent, the punched wafers fall onto a conveyor belt and are conveyed, and a worker can remove the product from the conveyor belt while the punch is operating.

Therefore, the labor cost is consumed when workers take down the wafer products from the conveyor belt and arrange and stack the wafer products, burrs are formed on the edge of the punched wafer, and the edge of the punched wafer is often polished by an extra process before subsequent finish machining, so that the product quality is guaranteed.

To sum up, after the coil of strip pressed into the disk product, the disk needs to be collected and arranged by the manual work to polish the disk through extra process, how to realize the automatic stacking arrangement of disk and realize polishing at the disk edge through simple device is the technical problem that needs to be solved urgently.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: how to realize the automatic stacking and sorting of the wafers and realize the polishing of the edges of the wafers through a simple device is a technical problem to be solved urgently.

In order to solve the technical problems, the invention adopts the technical scheme that:

a wafer stack polishing device comprising:

a base;

the first three-jaw chuck is connected to the upper part of the base, and a first through hole in the vertical direction is formed in the middle of the first three-jaw chuck;

the three limiting columns are vertically and rotatably connected to the upper parts of the clamping jaws of the three-jaw chuck respectively, and one side of each limiting column is provided with a frosting layer;

the cylinder body of the first cylinder is fixed on the base, and the piston rod of the first cylinder vertically and upwards penetrates through the first through hole;

the first rotating disc is connected to the upper part of a piston rod of the first air cylinder;

the second air cylinder is vertically arranged downwards above the rotary table;

the connecting plate is connected to the lower end of the second air cylinder;

the second three-jaw chuck is connected to the lower part of the connecting plate, each jaw of the second three-jaw chuck corresponds to each jaw of the first three-jaw chuck in position one to one, and each lower part of the third three-jaw chuck is connected with a limiting sleeve matched with the upper end of the limiting column;

the first driving device is in transmission connection with the limiting sleeve and is used for driving the limiting sleeve to rotate;

the second turntable is connected to the lower part of the connecting plate;

the second driving device is in transmission connection with the second turntable and is used for driving the second turntable to rotate;

and the PLC is electrically connected with the first cylinder, the second cylinder, the first driving device and the second driving device respectively.

The invention also relates to a wafer stacking and polishing method of the wafer stacking and polishing device, which comprises the following steps:

step 1: adjusting the first three-jaw chuck and the second three-jaw chuck to enable the diameter of a cylinder where the inner side surfaces of the three limiting columns are located to be equal to that of the wafer, enabling each limiting sleeve to correspond to the upper end of each limiting column one by one, and enabling one side, provided with a frosting layer, of each limiting column to face outwards;

step 2: the wafer continuously falls to the first rotating disc and is stacked on the upper part of the first rotating disc under the limiting action of the limiting column;

and step 3: when the wafers are stacked to a set height, stopping stacking the wafers, controlling a second air cylinder by the PLC to drive a connecting plate to move downwards, enabling each limiting sleeve to be correspondingly matched and connected with each limiting column one by one, and tightly pressing the wafer positioned at the top by a second rotary table;

and 4, step 4: the PLC controls the first driving device to drive the limiting sleeve to rotate 90 degrees, so that the limiting column is driven to rotate 90 degrees, one side of the limiting column, which is provided with the frosting layer, faces the inner side and contacts with the edge of the stacked wafer;

and 5: the PLC controls a second driving device to drive a second turntable to rotate and drive the stacked wafers to rotate, and the edges of the wafers are in sliding friction with the frosting layers of the limiting columns so as to polish the edges of the wafers;

step 6: after polishing is finished, the PLC controls the first driving device to drive the limiting sleeve to rotate for 90 degrees, so that the limiting column is driven to rotate for 90 degrees, and one side of the limiting column, which is provided with the frosting layer, faces outwards;

and 7: the PLC controls the second cylinder and the first cylinder to move upwards, so that the stacked wafers move upwards to be separated from the limiting position of the limiting column.

The invention has the beneficial effects that: through a simple structure, the punched wafer can automatically fall to the upper part of the first turntable after being conveyed by the conveying belt, and is orderly stacked and collected under the limiting action of three limiting columns, because the three limiting columns are all designed to be provided with a frosted layer on one side, after the stacking is finished, the stacked wafer is downwards moved through the upper connecting plate, on one hand, the upper limiting sleeve is in limiting fit with the upper part of the limiting column, the limiting column is driven by the limiting sleeve to rotate for 90 degrees, so that the frosted layer of the limiting column faces inwards, on the other hand, the second turntable and the first turntable clamp the stacked wafer, all the stacked wafers can be driven to rotate together by driving the second turntable to rotate, so that the edge of the wafer and the frosted layer of the limiting column generate sliding friction, thereby the polishing purpose of the burr of the edge of the wafer is achieved, namely, the structure can efficiently and automatically complete the burr of the edge of the wafer while the wafer is orderly stacked wafer, the wafer is not required to be manually arranged, and the burrs at the edge of the wafer are not required to be polished by additional processes, so that the working efficiency is greatly improved.

Drawings

Fig. 1 is a schematic structural view of a wafer stack polishing apparatus according to an embodiment of the present invention;

fig. 2 is a transverse cross-sectional view of a limiting column of a wafer stacking and polishing device according to an embodiment of the present invention;

description of reference numerals:

1. a base; 2. a first three-jaw chuck; 21. a first through hole; 3. a limiting column; 31. sanding layer; 32. chamfering; 33. a flat bond; 34. a groove; 4. a first cylinder; 5. a first turntable; 6. a second cylinder; 7. a connecting plate; 8. a second three-jaw chuck; 9. a limiting sleeve; 10. a first driving device; 11. a second turntable; 12. a second driving device; 13. a column; 14. a support; 15. a photoelectric sensor.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 and 2, the present invention relates to a wafer stack polishing apparatus, including:

a base 1;

the first three-jaw chuck 2 is connected to the upper part of the base 1, and a first through hole 21 in the vertical direction is formed in the middle of the first three-jaw chuck 2;

the three limiting columns 3 are respectively vertically and rotatably connected to the upper parts of the clamping jaws of the three-jaw chuck, and one side of each limiting column 3 is provided with a frosting layer 31;

the cylinder body of the first cylinder 4 is fixed on the base 1, and the piston rod of the first cylinder 4 vertically and upwards passes through the first through hole 21;

a first rotary table 5, wherein the first rotary table 5 is connected to the upper part of the piston rod of the first cylinder 4;

the second air cylinder 6 is vertically and downwards arranged above the rotary table;

the connecting plate 7 is connected to the lower end of the second air cylinder 6;

the second three-jaw chuck 8 is connected to the lower portion of the connecting plate 7, each jaw of the second three-jaw chuck 8 corresponds to each jaw of the first three-jaw chuck 2 in position one by one, and each lower portion of the three-jaw chuck is connected with a limiting sleeve 9 matched with the upper end of the limiting column 3;

the first driving device 10 is in transmission connection with the limiting sleeve 9 and is used for driving the limiting sleeve 9 to rotate;

the second rotating disc 11, the said second rotating disc 11 is connected to the inferior part of the tie plate 7;

the second driving device 12 is in transmission connection with the second rotating disc 11 and is used for driving the second rotating disc 11 to rotate;

and the PLC is electrically connected with the first air cylinder 4, the second air cylinder 6, the first driving device 10 and the second driving device 12 respectively.

The wafer stacking and polishing method of the wafer stacking and polishing device comprises the following steps:

step 1: adjusting the first three-jaw chuck 2 and the second three-jaw chuck 8 to enable the diameter of a cylinder where the inner side surfaces of the three limiting columns 3 are located to be equal to that of the wafer, enabling the limiting sleeves 9 to correspond to the upper ends of the limiting columns 3 one by one, and enabling one side, provided with the frosting layer 31, of each limiting column 3 to face outwards;

step 2: the wafer continuously falls to the first rotating disc 5 and is stacked on the upper part of the first rotating disc 5 under the limiting action of the limiting column 3;

and step 3: after the wafers are stacked to a set height, stopping stacking the wafers, controlling the second air cylinder 6 by the PLC to drive the connecting plate 7 to move downwards, enabling the limiting sleeves 9 to be correspondingly matched and connected with the limiting columns 3 one by one, and tightly pressing the wafer positioned at the top by the second rotary disc 11;

and 4, step 4: the PLC controls the first driving device 10 to drive the limiting sleeve 9 to rotate 90 degrees, so that the limiting column 3 is driven to rotate 90 degrees, and one side, provided with the frosting layer 31, of the limiting column 3 faces the inner side and contacts with the edge of the stacked wafer;

and 5: the PLC controls a second driving device 12 to drive a second turntable 11 to rotate and drive the stacked wafers to rotate, and the edges of the wafers are in sliding friction with the frosting layers 31 of the limiting columns 3 so as to polish the edges of the wafers;

step 6: after polishing is finished, the PLC controls the first driving device 10 to drive the limiting sleeve 9 to rotate for 90 degrees, so that the limiting column 3 is driven to rotate for 90 degrees, and one side of the limiting column 3, which is provided with the frosted layer 31, faces outwards;

and 7: the PLC controls the second cylinder 6 and the first cylinder 4 to move upwards, so that the stacked wafers move upwards to be separated from the limiting columns 3 for limiting.

In the structure of the wafer stacking and polishing device, through designing a simple structure, the punched wafers can automatically fall off the upper part of the first turntable 5 after being conveyed by the conveying belt, and are neatly stacked and collected under the limiting action of the three limiting columns 3, because the three limiting columns 3 are all designed to be provided with the frosted layers 31 on one side, after the stacking is finished, the wafers are moved downwards through the connecting plates 7 on the upper part, on one hand, the limiting sleeves 9 on the upper part are in limiting fit with the upper parts of the limiting columns 3, the limiting columns 3 are driven to rotate for 90 degrees through the limiting sleeves 9, the frosted layers 31 of the limiting columns 3 face inwards, on the other hand, the second turntable 11 and the first turntable 5 clamp the stacked wafers, all the stacked wafers can be driven to rotate together by driving the second turntable 11 to rotate, the edges of the wafers and the frosted layers 31 of the limiting columns 3 generate sliding friction, and the purpose of polishing burrs on the edges of the wafers is achieved, the burr that above-mentioned structure was accomplished the disk neatly and is piled up promptly, can accomplish the disk edge high-efficiently, automatically is polished, no longer need the manual work to carry out extra arrangement to the disk, more does not need extra process to polish the burr at disk edge, improves work efficiency by a wide margin.

Further, among the grinding device structure is piled up to above-mentioned disk, still include:

the two upright columns 13 are distributed on two sides of the first three-jaw chuck 2;

the brackets 14 are provided with hoops, and the two brackets 14 are respectively connected to the two upright posts 13 through the hoops;

a photoelectric sensor 15, wherein the emitting end of the photoelectric sensor 15 is connected to one of the brackets 14, and the receiving end of the photoelectric sensor 15 is connected to the other bracket 14;

the PLC is electrically connected to the photosensor 15.

In the wafer stacking and polishing method of the wafer stacking and polishing device, the step 2 is specifically as follows: PLC controls first cylinder 4 to drive first carousel 5 to upwards promote to preset height, and the disk drops to first carousel 5 in succession, piles up on first carousel 5 upper portion under spacing post 3's limiting displacement, and when the disk piled up highly being higher than photoelectric sensor 15 place height, photoelectric sensor 15's receiving terminal did not receive light signal, and PLC controls first cylinder 4 to drive first carousel 5 and descends a take the altitude, makes photoelectric sensor 15's receiving terminal receive light signal to this is reciprocal, descends to the minimum until first carousel 5.

Through the position relation of the upright column 13, the support 14 and the photoelectric sensor 15 and the control method, when the wafers fall from the conveying belt to the first rotating disc 5 to be stacked and collected, the first rotating disc 5 and the conveying belt can be always controlled within a smaller fall range, and the problem that the wafers are not stacked orderly due to the fact that the wafers are bounced due to too large fall of the wafers is avoided.

Further, in the above wafer stacking and polishing device structure, the shape of the limiting column 3 is a cylinder, and the upper end of the limiting column 3, which is away from one side of the frosting layer 31, is provided with a chamfer 32.

Above-mentioned chamfer 32's design on the one hand can make things convenient for the disk to get into smoothly between three spacing posts 3 to guarantee that it neatly piles up on first carousel 5, on the other hand, stop collar 9 design for with spacing 3 upper end complex structures of post, stop collar 9 also can design the structure of cooperation chamfer 32 promptly, thereby chamfer 32 structure naturally forms spacing cooperation structure, makes things convenient for stop collar 9 to drive spacing post 3 and takes place to rotate.

Further, among the grinding device structure is piled up to above-mentioned disk, the upper end of spacing post 3 is equipped with flat key 33 towards dull polish layer 31 one side, stop collar 9 is equipped with the keyway with flat key 33 complex.

In one embodiment, the flat key 33 is arranged at the upper end of the limiting column 3 facing the frosted layer 31, the limiting sleeve 9 is provided with a key groove matched with the flat key 33, on one hand, the matching of the flat key 33 and the key groove can enable the limiting column 3 and the limiting sleeve 9 to be stably matched in a limiting way, and on the other hand, the flat key 33 is arranged on the side facing the frosted layer 31, so that the wafers cannot be influenced to fall onto the first rotary disc 5 to be stacked and collected.

Further, in the above structure of the wafer stacking and polishing device, the first driving device 10 is a stepping motor.

Further, in the above structure of the wafer stacking and polishing device, the second driving device 12 is a motor.

Example 1

A wafer stack polishing device comprising:

a base 1; the first three-jaw chuck 2 is connected to the upper part of the base 1, and a first through hole 21 in the vertical direction is formed in the middle of the first three-jaw chuck 2; the three limiting columns 3 are respectively vertically and rotatably connected to the upper parts of the clamping jaws of the three-jaw chuck, and one side of each limiting column 3 is provided with a frosting layer 31; the other side of the limiting column 3 is a smooth surface; the cylinder body of the first cylinder 4 is fixed on the base 1, and the piston rod of the first cylinder 4 vertically and upwards passes through the first through hole 21; a first rotary table 5, wherein the first rotary table 5 is connected to the upper part of the piston rod of the first cylinder 4; the second air cylinder 6 is vertically and downwards arranged above the rotary table; the connecting plate 7 is connected to the lower end of the second air cylinder 6; the second three-jaw chuck 8 is connected to the lower portion of the connecting plate 7, each jaw of the second three-jaw chuck 8 corresponds to each jaw of the first three-jaw chuck 2 in position one by one, and each lower portion of the three-jaw chuck is connected with a limiting sleeve 9 matched with the upper end of the limiting column 3; the first driving device 10 is in transmission connection with the limiting sleeve 9 and is used for driving the limiting sleeve 9 to rotate; the second rotating disc 11, the said second rotating disc 11 is connected to the inferior part of the tie plate 7; the second driving device 12 is in transmission connection with the second rotating disc 11 and is used for driving the second rotating disc 11 to rotate; and the PLC is electrically connected with the first air cylinder 4, the second air cylinder 6, the first driving device 10 and the second driving device 12 respectively. The two upright columns 13 are distributed on two sides of the first three-jaw chuck 2; the brackets 14 are provided with hoops, and the two brackets 14 are respectively connected to the two upright posts 13 through the hoops; a photoelectric sensor 15, wherein the emitting end of the photoelectric sensor 15 is connected to one of the brackets 14, and the receiving end of the photoelectric sensor 15 is connected to the other bracket 14; the PLC is electrically connected to the photosensor 15.

In the above structure, please refer to fig. 2, recess 34 can be set up to the one side of spacing post 3, set up the magic subsides in recess 34, dull polish layer 31 (sand paper) is pasted through the magic and is laminated in recess 34, when making the magic of dull polish layer 31 laminating in recess 34 paste, the surface parallel and level of dull polish layer 31 and spacing post 3, or the protruding spacing post 3 surface 1-2mm, specifically, can set up the hair side that the magic was pasted in recess 34, and the one side design of dull polish layer 31 and the hook face that the hair side corresponds, dull polish layer 31 passes through the laminating of hook face and hair side, fix in one side of spacing post 3, after dull polish layer 31 surface wear, conveniently change new dull polish layer 31, in order to guarantee the quality that the disc edge was polished.

The limiting column 3 is cylindrical, and the upper end of one side of the limiting column 3, which deviates from the frosting layer 31, is provided with a chamfer 32. The upper end of the limiting column 3 is provided with a flat key 33 towards one side of the frosting layer 31, and the limiting sleeve 9 is provided with a key groove matched with the flat key 33. The first driving device 10 is a stepping motor. The second driving device 12 is a motor.

Example 2

The wafer stacking and polishing method of the wafer stacking and polishing device comprises the following steps:

step 1: adjusting the first three-jaw chuck 2 and the second three-jaw chuck 8 to enable the diameter of a cylinder where the inner side surfaces of the three limiting columns 3 are located to be equal to that of the wafer, enabling the limiting sleeves 9 to correspond to the upper ends of the limiting columns 3 one by one, and enabling one side, provided with the frosting layer 31, of each limiting column 3 to face outwards;

step 2: the PLC controls the first air cylinder 4 to drive the first rotating disc 5 to be lifted upwards to a preset height, the wafers continuously fall to the first rotating disc 5 and are stacked on the upper portion of the first rotating disc 5 under the limiting effect of the limiting column 3, when the stacked height of the wafers is higher than the height of the photoelectric sensor 15, the receiving end of the photoelectric sensor 15 does not receive an optical signal, the PLC controls the first air cylinder 4 to drive the first rotating disc 5 to fall by a certain height, and the receiving end of the photoelectric sensor 15 receives the optical signal to reciprocate until the first rotating disc 5 falls to the lowest position;

and step 3: after the wafers are stacked to a set height, stopping stacking the wafers, controlling the second air cylinder 6 by the PLC to drive the connecting plate 7 to move downwards, enabling the limiting sleeves 9 to be correspondingly matched and connected with the limiting columns 3 one by one, and tightly pressing the wafer positioned at the top by the second rotary disc 11;

and 4, step 4: the PLC controls the first driving device 10 to drive the limiting sleeve 9 to rotate 90 degrees, so that the limiting column 3 is driven to rotate 90 degrees, and one side, provided with the frosting layer 31, of the limiting column 3 faces the inner side and contacts with the edge of the stacked wafer;

and 5: the PLC controls a second driving device 12 to drive a second turntable 11 to rotate and drive the stacked wafers to rotate, and the edges of the wafers are in sliding friction with the frosting layers 31 of the limiting columns 3 so as to polish the edges of the wafers;

step 6: after polishing is finished, the PLC controls the first driving device 10 to drive the limiting sleeve 9 to rotate for 90 degrees, so that the limiting column 3 is driven to rotate for 90 degrees, and one side of the limiting column 3, which is provided with the frosted layer 31, faces outwards;

and 7: the PLC controls the second cylinder 6 and the first cylinder 4 to move upwards, so that the stacked wafers move upwards to be separated from the limiting columns 3 for limiting.

In summary, in the wafer stacking and polishing device and the polishing method thereof provided by the invention, a rotatable limiting column structure is utilized, a polishing layer is arranged on one side of the limiting column, and the structures of an upper rotating disc and a lower rotating disc are matched, so that the automatic orderly stacking and edge polishing processes after the wafers are punched are automatically realized.

(review all the technical effects that the invention can achieve, i.e. the sum of the technical effects of the independent claims, the independent claims and the examples)

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.