阅读说明：本技术 用于硅片的分片装置 (Slicing device for silicon wafer ) 是由 陈宏� 何志明 陆进进 丁晓 于 2021-08-09 设计创作，主要内容包括：本发明公开一种用于硅片的分片装置,包括：水槽,用于储存水；座体,位于水槽内部；片托,用于装载硅片堆垛,片托连同硅片堆垛能够被浸没在水槽的水中；升降机构,其与所述的片托传动设置,以驱动装载有硅片堆垛的片托沿上下方向移动；吸片输送机构,用于从硅片堆垛的上侧吸起最上层的单张硅片并向后侧传输,吸片输送机构包括至少一个吸嘴以及传送组件,至少一个吸嘴以及所述的传送组件能够被浸没在水槽的水中；以及分片机构,包括设置在水槽内的两组喷水器,两组喷水器位于至少一个吸嘴的下侧；两组喷水器左右相对设置,以吹散放置于所述片托上的所述硅片堆垛的上层硅片。该分片装置能够防止发生崩边和破碎的情况。(The invention discloses a slicing device for a silicon wafer, which comprises: a water tank for storing water; the seat body is positioned inside the water tank; the wafer support is used for loading the silicon wafer stack, and the wafer support and the silicon wafer stack can be immersed in water in the water tank; the lifting mechanism is in transmission arrangement with the sheet support so as to drive the sheet support loaded with the silicon wafer stack to move along the vertical direction; the wafer sucking and conveying mechanism is used for sucking up a single uppermost silicon wafer from the upper side of the silicon wafer stack and transmitting the single uppermost silicon wafer to the rear side, and comprises at least one suction nozzle and a conveying assembly, and the at least one suction nozzle and the conveying assembly can be immersed in water in the water tank; the slicing mechanism comprises two groups of water sprayers arranged in the water tank, and the two groups of water sprayers are positioned on the lower side of at least one suction nozzle; the two groups of water sprayers are oppositely arranged left and right to blow off the upper silicon wafers of the silicon wafer stack on the wafer support. The slicing device can prevent the situation of edge breakage and breakage.)

1. A slicing apparatus for silicon wafers, comprising:

a water tank (1) for storing water;

a wafer support (6) for loading a stack of silicon wafers (10), said wafer support (6) being capable of being immersed in the water of said tank (1) together with said stack of silicon wafers (10);

the lifting mechanism (3) is arranged in a transmission way with the wafer support (6) so as to drive the wafer support (6) loaded with the silicon wafer stack (10) to move along the vertical direction;

the suction piece conveying mechanism (5) can suck the single silicon chip of the uppermost layer from the upper side of the silicon chip stack (10) and convey the single silicon chip to the rear side, the suction piece conveying mechanism (5) comprises at least one suction nozzle (56) and a conveying assembly (52), and the at least one suction nozzle (56) and a part of the conveying assembly (52) can be immersed in the water tank (1); and

the slicing mechanism (4) comprises two groups of water sprayers (42) arranged in the water tank (1), and the two groups of water sprayers (42) are positioned on the lower side of the at least one suction nozzle (56); the two groups of water sprayers (42) are oppositely arranged left and right to blow off the upper silicon wafers of the silicon wafer stack (10) placed on the wafer support (6).

2. The silicon wafer slicing apparatus according to claim 1, wherein the wafer holder (6) comprises an upper wall (64), the upper wall (64) is capable of supporting the silicon wafer stack (10), and the upper wall (64) is a wall surface gradually inclined downward from the rear to the front.

3. The silicon wafer slicing device according to claim 2, wherein the conveying assembly (52) comprises a conveyor belt (521), and the conveyor belt (521) has an inclined section (522) parallel to the upper wall (64).

4. The wafer slicing apparatus for silicon wafers as claimed in claim 3, wherein said at least one suction nozzle (56) is located on an upper side of said inclined section (522) and adjacent to said inclined section (522).

5. The silicon wafer slicing device according to claim 4, wherein the conveyor (521) comprises two sets of belts arranged side by side, and the at least one suction nozzle (56) is located between the two sets of belts.

6. The wafer slicing apparatus according to claim 1, wherein each group of the water jets (42) comprises two nozzle heads (44) in tandem.

7. The silicon wafer slicing device according to claim 1, wherein the lifting mechanism (3) further comprises a lifting motor (31) and a lifting block (34) in transmission connection with the lifting motor (31), and the lifting block (34) is arranged in transmission connection with the wafer holder (6).

8. The slicing device according to claim 7, wherein the lifting motor (31) is a stepping motor.

9. The slicing device according to claim 1, wherein the water tank (1) is provided with a longitudinal partition (13), the longitudinal partition (13) divides the inner space of the water tank (1) into a slicing chamber (11) and a slice outlet chamber (12) which are adjacent to each other, and the slice holder (6) and the two sets of water sprayers (44) are positioned in the slicing chamber (11).

Technical Field

The application relates to the technical field of production and manufacturing of silicon wafers, in particular to a slicing device for a silicon wafer.

Background

The silicon wafer separating device is used for separating single silicon wafers from the cut and preliminarily cleaned silicon wafer stack and sequentially inserting the single silicon wafers into the flower basket. Debris, static electricity and surface tension exist among silicon wafers which are not separated, so that edge breakage or cracking is easy to occur during the separation of the silicon wafers, and economic loss is caused.

Disclosure of Invention

In order to solve the technical problem that the edge breakage or breakage is easy to occur during the separation of the silicon wafers, the invention aims to provide an improved slicing device which can reduce the probability of edge breakage and breakage during the separation of the silicon wafers.

In order to achieve the above object, the present application provides the following technical solutions: a slicing apparatus for a silicon wafer, comprising: a water tank for storing water; the seat body is positioned inside the water tank; the wafer support is used for loading the silicon wafer stack and can be immersed in the water of the water tank together with the silicon wafer stack; the lifting mechanism is in transmission arrangement with the sheet support so as to drive the sheet support loaded with the silicon wafer stack to move along the vertical direction; the wafer sucking and conveying mechanism is used for sucking up the single uppermost silicon wafer from the upper side of the silicon wafer stack and conveying the single uppermost silicon wafer to the rear side, the wafer sucking and conveying mechanism comprises at least one suction nozzle and a conveying assembly, and the at least one suction nozzle and part of the conveying assembly can be immersed in the water tank; the slicing mechanism comprises two groups of water sprayers arranged in the water tank, and the two groups of water sprayers are positioned on the lower side of the at least one suction nozzle; the two groups of water sprayers are oppositely arranged left and right to blow off the upper silicon wafers of the silicon wafer stack on the wafer support.

In the above technical solution, preferably, the wafer support includes an upper wall, the upper wall is used for supporting the silicon wafer stack, and the upper wall is a wall gradually inclined downward from back to front. Further preferably, the conveyor assembly includes a conveyor belt having an angled section parallel to the upper wall.

In the above preferred aspect, it is further preferred that the at least one suction nozzle is located above and adjacent to the inclined section. In a further preferred embodiment, the conveyor belt comprises two sets of belts arranged side by side, and the at least one suction nozzle is located between the two belts.

In the above solution, each group of water jets preferably comprises two nozzle heads in tandem.

In the above technical solution, preferably, the lifting mechanism further includes a lifting motor and a lifting block in transmission connection with the lifting motor, and the lifting block is configured to be in transmission connection with the sheet holder. Further preferably, the lifting motor is a stepping motor.

In the above technical solution, preferably, the water tank is provided therein with a longitudinal partition plate, the longitudinal partition plate divides the inner space of the water tank into a front and a rear adjacent slicing chamber and a slice outlet chamber, and the slice holder and the two groups of water sprayers are both located in the slicing chamber.

Compared with the prior art, the slicing device provided by the application can blow away the upper silicon wafers of the silicon wafer stack through the water sprayers arranged at the left side and the right side of the silicon wafer stack, so that the silicon wafers are stressed uniformly during separation, large deformation and local stress are not easy to generate, and the conditions of edge collapse and breakage are prevented.

Drawings

Fig. 1 is a first perspective view of a slicing apparatus provided in the present application;

FIG. 2 is a second perspective view of the slicing apparatus of FIG. 1, with the water trough removed;

FIG. 3 is a perspective view of a sink provided herein;

FIG. 4 is a perspective view of a lift mechanism provided herein;

fig. 5 is a perspective view of a slicing mechanism provided in the present application;

FIG. 6 is a perspective view of a discharge mechanism provided herein;

FIG. 7 is a left side view of the outfeed mechanism of FIG. 6 with the suction plate removed;

FIG. 8 is a perspective view of the flusher provided herein;

fig. 9 is a schematic view of an operating principle of the slicing apparatus provided in the present application.

Detailed Description

To explain technical contents, structural features, achieved objects and effects of the invention in detail, the technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. Moreover, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, the particular shapes, configurations and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

Further, spatially relative terms such as "below … …," "below … …," "below … …," "below," "above … …," "above," "… …," "higher," "side" (e.g., as in "side wall"), etc., are used herein to describe one element's relationship to another (other) element as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below … …" can encompass both an orientation of above and below. Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate.

Fig. 1-2 illustrate a singulating device 100 provided herein, the singulating device 100 being capable of separating individual wafers from a stack 10 (see fig. 8) of wafers and transporting the separated individual wafers outwardly. The slicing device 100 comprises a water tank 1 for storing water, a base body 2 positioned in the water tank 1, a lifting mechanism 3 for driving the silicon wafer stack 10 to lift, a slicing mechanism 4 for separating a single silicon wafer from the silicon wafer stack 10, a wafer sucking and conveying mechanism 5 for conveying the separated silicon wafer outwards, and a wafer support 6 for placing the silicon wafer stack 10.

Referring to fig. 3, the water tank 1 has a longitudinal partition 13 therein, and the partition 13 partitions the inner space of the water tank 1 into a slicing chamber 11 and a sheet discharging chamber 12 adjacent to the rear side of the slicing chamber 11. The body 2 is immersed in the water in the chamber 11 and has a pair of oppositely disposed feed strips 21 disposed side-to-side, the feed strips 21 extending from front to rear and being adjacent to a lifting floor 35 (see below) at the rear, the feed strips 21 being arranged to drive the sheet holders 6 back and forth within the chamber.

The lifting mechanism 3 is fixedly connected to the wall surface of the water tank 1. As shown in fig. 4, the lifting mechanism 3 includes a lifting motor 31, a threaded column 32 in transmission connection with the lifting motor 31, a slide rail 33 extending in the vertical direction, a lifting block 34 movable up and down along the slide rail 33, and a lifting base plate 36 in transmission connection with the lifting block 34. The lifting block 34 is configured such that one end portion is hinged to the threaded post 32 and the other end portion is movably connected to the slide rail 33, and the threaded post 32 can convert the rotation of the lifting motor 31 into the up-and-down movement of the lifting block 34. The lifting motor 31 is a two-phase stepping motor, and the lifting block 34 generates a displacement with the same thickness as that of a single silicon wafer when the lifting motor 31 rotates for a pulse angle.

The sheet holder 6 includes a sheet holder bottom plate 61, an upper wall 64 of the sheet holder bottom plate 61 facing the discharging mechanism 5, a pair of side pallets 63 located on both left and right sides of the upper wall 64, and a front pallet 62 located on the front side of the upper wall 64. The wafer holder base plate 61, the pair of side blades 63, and the front blade 62 are fixedly attached to the wafer holder base plate 61 and together define a space for receiving and placing a stack of silicon wafers. The top wall 64 is configured to slope downwardly to the rear and to the front to prevent the stack of silicon wafers placed on the top wall from tipping over. The wafer support base plate 61 is configured to be able to engage with and disengage from the lifting base plate 36, and the lifting block 34 is configured to be in driving connection with the lifting base plate 35 through a pair of driving shafts 35 and to move the entire wafer support 6 and the silicon wafer stack placed inside the wafer support 6 together in a lifting manner through the lifting base plate 36.

Referring to fig. 2 and 5, the slicing mechanism 4 can spray water toward the upper silicon wafer of the silicon wafer stack 10 to break up the upper silicon wafer and wash away debris between two adjacent silicon wafers. The slicing mechanism 4 includes a pair of oppositely disposed slicing bases 41 and two sets of water sprayers 42 fixedly connected to the pair of slicing bases 41, respectively. A pair of slice bases 41 are respectively located on the left and right sides above the slice holder base plate 61, and the slice bases 41 are parallel to the upper wall 64 and configured such that the rear end portions thereof are fixedly attached to the mounting plate 53 (see below). Each group of water jets 42 has a front and a rear water jets 42, the water jets 42 have water inlets 43 connected to an external water pump and a nozzle head 44 capable of generating water flow, and the nozzle head 44 is disposed toward a space for placing the silicon wafer stack. In other embodiments, the number of nozzle heads connected to each slice base may be one or more than two.

As shown in fig. 6, the suction sheet conveying mechanism 5 includes a mounting plate 53, a conveying motor 51 fixedly connected to the mounting plate 53, a conveying assembly 52 in transmission connection with the conveying motor 51, and a suction plate 55 fixedly connected to the mounting plate 53. The mounting plate 53 is fixedly connected to the wall surface of the water tank 1 by a pair of connectors 54 on the left and right sides. The suction plate 55 is located on the lower side of the mounting plate 53 and has a suction nozzle 56 facing the wafer stack, and the suction nozzle 56 is configured to be in fluid communication with an external water pump to suck the separated individual wafers.

Referring to fig. 7, the conveying assembly 52 is used for conveying the separated single silicon wafers to the wafer discharging chamber 12, and has a conveyor 521 and a plurality of gears as necessary. The conveyor 521 has two sets of belts (shown as labels) disposed opposite to each other on the left and right sides of the suction nozzle 56, and the two sets of belts are respectively disposed on the left and right sides of the suction nozzle 56 and have a section 522 parallel to the upper wall 64, and the inclined section 522 protrudes outward relative to the bottom end surface of the suction plate 55 to contact the separated silicon wafers. Wherein the length of the inclined segment 522 is less than the length of a single silicon wafer.

The front end of the water suction plate 55 is fixedly connected with a sensing seat 57, the sensing seat 57 is provided with a sensor 58, and the sensor 58 is in signal connection with a controller (not shown) of the slicing device 100 and is configured to monitor the position of the uppermost silicon wafer so as to facilitate the controller to control the operation of the water sprayer 42, the lifting motor 31 and the suction nozzle 56.

As shown in fig. 8, the slicing apparatus 100 further comprises a flusher 7, and the flusher 7 is used for flushing away the debris carried by the separated silicon wafers. The flusher 7 has a mounting back plate 71, a water conduit 72, and a flushing port 73. The flusher 7 is fixedly connected to the partition plate 13 of the water tank 1 by a mounting back plate 71, and a water conduit 72 is configured to be able to draw water in the splitting chamber 11. The rinse port 73 is in fluid communication with the water conduit 72 and is disposed toward the front to rinse the separated individual wafers.

Referring to fig. 9, the arrows in fig. 9 are used to indicate the direction of movement of the stack of silicon wafers 10 and the individual silicon wafers being separated. Now, describing the working principle of the slicing apparatus 100, the silicon wafer stack 10 to be sliced is placed in the wafer holder 6, and under the action of the feeding belt 21, the wafer holder 6 and the silicon wafer stack 10 move backward until the wafer holder base plate 61 is engaged with the lifting base plate 36. The lifting motor 31 drives the silicon wafer stack to rise through the wafer support 6. When the sensor 58 detects that the uppermost silicon wafer of the stack 10 has reached the predetermined position, the controller activates the external water pump to eject water simultaneously from the 4 nozzle heads 44. The uppermost silicon wafer of the silicon wafer stack 10 is scattered by the jetted water flow and lifted upward by the water flow, and the washing port 63 washes away the chips carried by the silicon wafers. Finally, under the action of the suction nozzle 56, the separated silicon wafers are adhered to the inclined section 522 of the conveyor 521 and are conveyed out of the wafer separation groove 11 by the pair of conveyors 521 to the wafer outlet chamber 12. The separated silicon wafers are inserted into the basket one by one in the wafer discharge chamber 12.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the foregoing description only for the purpose of illustrating the principles of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims, specification, and equivalents thereof.