阅读说明：本技术 一种镂空电路板的回流炉 (Reflow oven of hollow circuit board ) 是由 薛梦 于 2021-08-03 设计创作，主要内容包括：本发明公开了一种镂空电路板的回流炉,包括底座,所述底座内部开有冷却腔,所述冷却腔开口朝上,所述冷却腔左侧与右侧内壁上左右位置对称开有两个移动槽,每个所述移动槽上滑动有一个支撑杆；本发明通过红外线的反射,将经过镜面发射的红外辐射能传递至电路板的锡膏添置处,并且利用移动的反射镜面覆盖至电路板的元器件遮挡处以及镂空电路板的缝隙处,避免出现锡膏不完全熔化的现象,还通过吸气罩装置形成一个相对负压的环境,使得电路板上的锡膏与元器件随主板运动不会发生较大的偏移,同时,将极小部分落入电路板缝隙的锡膏吸走,避免出现堵塞现象。(The invention discloses a reflow oven of a hollow circuit board, which comprises a base, wherein a cooling cavity is formed in the base, the opening of the cooling cavity is upward, two moving grooves are symmetrically formed in the left side and the right side of the inner wall of the cooling cavity at the left and right sides, and a supporting rod slides on each moving groove; according to the invention, infrared radiation energy emitted by the mirror surface is transmitted to the solder paste adding position of the circuit board through infrared reflection, the movable reflecting mirror surface is used for covering the component shielding position of the circuit board and the gap of the hollowed-out circuit board, the phenomenon of incomplete melting of the solder paste is avoided, a relative negative pressure environment is formed through the air suction cover device, so that the solder paste on the circuit board and the components do not generate large deviation along with the movement of the main board, and meanwhile, the solder paste with a small part falling into the gap of the circuit board is sucked away, and the blocking phenomenon is avoided.)

1. The utility model provides a reflow oven of fretwork circuit board, includes the base, its characterized in that: the cooling device is characterized in that a cooling cavity is arranged in the base, the opening of the cooling cavity faces upwards, two moving grooves are symmetrically formed in the left side and the right side of the inner wall of the cooling cavity at the left and right sides, a supporting rod slides on each moving groove, two guide rails are symmetrically formed in the left side and the right side of the inner wall of the cooling cavity at the left and right sides, an air cooler is fixedly arranged on the lower side of the inner wall of the cooling cavity, a negative pressure mechanism capable of forming negative pressure is arranged on the left side of the air cooler, two hydraulic rods are symmetrically fixed on the left side and the right side of the inner wall of the cooling cavity at the center, each hydraulic rod is fixedly connected with the supporting rod, a sliding rail is arranged on the upper side of each supporting rod, a recovery mechanism for recovering tin beads is arranged on the sliding rail and the supporting rod, a mirror face box is fixedly connected to the upper side of the base, and a mirror face cavity with a downward opening is formed in the mirror face box, mirror surface case rear side is opened there is the convection hole, the fixed fan that is equipped with in the convection hole, about on the inner wall of mirror surface chamber left and right both sides open to the convection hole bilateral position symmetry has six location guide rails, every it has electric slider to slide on the location guide rail, fixedly connected with infrared reflector on the electric slider, mirror surface case upside is opened there is the resettlement groove, the resettlement groove cooperation has an apron, apron upside fixed surface is connected with the handle, apron downside fixed surface is connected with infrared emission device.

2. The reflow oven of the hollow circuit board according to claim 1, wherein: negative pressure machine constructs including sliding negative pressure plate in the guide rail, negative pressure plate is about two spacing of center bilateral position symmetry fixedly connected with, negative pressure plate inside is opened there is the air cavity, eight hole posts of negative pressure plate upside fixedly connected with, every be equipped with the gas hood in the hole post, the gas hood pass through the trachea with the air cavity intercommunication, the air cavity still passes through gas-supply pipe and air cock intercommunication, the air cock is fixed to be established at the fan up end, fan fixed connection be in on the cooling chamber downside inner wall.

3. The reflow oven of the hollow circuit board according to claim 1, wherein: the recovery mechanism comprises a sieve plate which slides in the slide rail, eight air holes which are communicated up and down are formed in the sieve plate, and a vertical rod is fixedly connected to the upper end face of the supporting rod.

4. The reflow oven of the hollow circuit board according to claim 3, wherein: the swing groove that link up about pole setting upside is opened has, swing groove front and back side inner wall rotates between and is connected with the oscillating axle, the last fixedly connected with swing arm of oscillating axle, the intercommunication has the muffler on the swing arm left side terminal surface, the muffler other end and suction fan intercommunication, the suction fan is fixed to be established on the rear side inner wall in mirror surface chamber.

5. The reflow oven of the hollow circuit board according to claim 3, wherein: the hole column is arranged right above the vent hole.

6. The reflow oven of the hollow circuit board according to claim 3, wherein: one end of the sieve plate is fixedly connected with a sealing plate, and a support hand is fixedly connected to the surface of the sealing plate.

7. The reflow oven of the hollow circuit board according to claim 4, wherein: the right end face of the swing arm is fixedly connected with a suction nozzle, and the suction nozzle is in a semicircular arc shape.

Technical Field

The invention relates to the technical field of reflow furnaces, in particular to a reflow furnace for a hollow circuit board.

Background

The reflow furnace process is to realize the soldering of the mechanical and electrical connection between the soldering terminal or pin of the surface-mounted component and the pad of the printed board by re-melting the paste soft solder pre-distributed on the pad of the printed board. The reflow oven is the last key process of SMT (surface mount technology), is a real-time process control, has complicated process changes, and relates to a plurality of process parameters, wherein the setting of a temperature curve is the most important and directly determines the reflow soldering quality.

The existing reflow oven is mainly applied to rectangular circuit boards, and aiming at some special hollow circuit boards, the existing device is easy to generate the phenomenon that solder paste deviates and blocks gaps, and the solder paste is easy to be incompletely melted.

Disclosure of Invention

The invention aims to provide a reflow oven for a hollow circuit board, which is used for overcoming the defects in the prior art.

The reflow furnace of the hollow circuit board comprises a base, wherein a cooling cavity is formed in the base, the opening of the cooling cavity is upward, two moving grooves are symmetrically formed in the left side inner wall and the right side inner wall of the cooling cavity at the left and right positions, a support rod is arranged on each moving groove in a sliding manner, two guide rails are further symmetrically formed in the left side inner wall and the right side inner wall of the cooling cavity at the left and right positions, an air cooler is fixedly arranged on the lower side inner wall of the cooling cavity, a negative pressure mechanism capable of forming negative pressure is arranged on the left side of the air cooler, two hydraulic rods are symmetrically fixed on the lower side inner wall of the cooling cavity at the left and right positions relative to the center, the support rod is fixedly connected to each hydraulic rod, a slide rail is formed on the upper side of each support rod, a recovery mechanism for recovering tin beads is arranged on the slide rail and the support rod, and a mirror box is fixedly connected to the upper side of the base, mirror surface incasement portion opens there is the mirror surface chamber of opening down, mirror surface case rear side is opened there is the convection hole, the fixed fan that is equipped with in the convection hole, about on the inner wall of mirror surface chamber left and right both sides open there are six location guide rails, every the last slip of location guide rail has electric slider, fixedly connected with infrared reflector on the electric slider, mirror surface case upside is opened there is the resettlement groove, the resettlement groove cooperation has an apron, the side fixed surface is connected with the handle on the apron, the side fixed surface is connected with infrared emission device under the apron.

Further technical scheme, negative pressure machine constructs including sliding negative pressure plate in the guide rail, negative pressure plate is about two spacing of center bilateral position symmetry fixedly connected with, the inside air cavity that opens of negative pressure plate, eight hole posts of negative pressure plate upside fixedly connected with, every be equipped with the air casing in the hole post, the air casing pass through the trachea with the air cavity intercommunication, the air cavity still passes through gas-supply pipe and air cock intercommunication, the air cock is fixed to be established at the fan up end, fan fixed connection be in on the cooling chamber downside inner wall.

According to the technical scheme, the recovery mechanism comprises a sieve plate which slides in the sliding rail, eight vent holes which are communicated up and down are formed in the sieve plate, and a vertical rod is fixedly connected to the upper end face of the supporting rod.

Further technical scheme, the pole setting upside is opened has the swing groove that link up about one, the swing is connected with the oscillating axle before the groove, the rotation between the rear side inner wall, fixedly connected with swing arm on the oscillating axle, the intercommunication has the muffler on the swing arm left side terminal surface, the muffler other end and suction fan intercommunication, the suction fan is fixed to be established on the rear side inner wall in mirror surface chamber.

According to the further technical scheme, when the supporting rod descends to a certain height, the hole column is just embedded into the vent hole.

According to the technical scheme, one end of the sieve plate is fixedly connected with a sealing plate, and a support hand is fixedly connected to the surface of the sealing plate, so that raw materials can be conveniently carried to advance and retreat.

According to a further technical scheme, a suction nozzle is fixedly connected to the end face of the right side of the swing arm, and the suction nozzle is in a semicircular arc shape.

According to the technical scheme, when the infrared transmitting device normally operates, the electric sliding block descends to a certain height, and through the combination of the infrared reflecting mirrors, infrared rays and gaps placed on the hollowed-out circuit board of the sieve plate form a certain angle.

The invention has the beneficial effects that:

according to the invention, through reflection of infrared rays, infrared radiation energy emitted by the mirror surface is transmitted to the solder paste adding position of the circuit board, and the movable reflecting mirror surface is utilized to cover the component shielding position of the circuit board and the gap of the hollowed-out circuit board, so that the phenomenon of incomplete melting of the solder paste is avoided;

the invention also forms a relative negative pressure environment through the air suction cover device, so that the solder paste on the circuit board and the components do not deviate greatly along with the movement of the main board, and meanwhile, the solder paste with a small part falling into the gaps of the circuit board is sucked away, thereby avoiding the blocking phenomenon.

Drawings

FIG. 1 is a schematic external view of the present invention;

FIG. 2 is a schematic view of the overall structure of a reflow oven with a hollow circuit board according to the present invention;

FIG. 3 is a block diagram of the suction plate of FIG. 2 according to the present invention;

figure 4 is a side view of the pole of figure 2 of the present invention;

fig. 5 is an external view of the positioning rail of fig. 2 according to the present invention.

Detailed Description

For purposes of making the objects and advantages of the present invention more apparent, the following detailed description of the present invention will be taken in conjunction with the accompanying examples, it being understood that the following text is only intended to describe the reflow oven of a kind of hollowed-out circuit board of the present invention or several specific embodiments thereof, and does not strictly limit the scope of the protection specifically claimed herein, as used herein, the terms up, down, left and right are not limited to their strict geometric definitions, but include tolerances for reasonable and inconsistent machining or human error, the following detailed description of the specific features of the reflow oven of a kind of hollowed-out circuit board:

referring to the attached drawings, the reflow oven for the hollow circuit board according to the embodiment of the invention comprises a base 11, a cooling cavity 12 is formed in the base 11, the opening of the cooling cavity 12 faces upward, two moving grooves 14 are symmetrically formed on the left and right inner walls of the cooling cavity 12 at the left and right positions, a support rod 15 slides on each moving groove 14, two guide rails 21 are symmetrically formed on the left and right inner walls of the cooling cavity 12 at the left and right positions, an air cooler 17 is fixed on the inner wall of the lower side of the cooling cavity 12, a negative pressure mechanism 73 capable of forming negative pressure is arranged on the left side of the air cooler 17, two hydraulic rods 13 are symmetrically fixed on the inner wall of the lower side of the cooling cavity 12 at the left and right positions relative to the center, the support rod 15 is fixedly connected to each hydraulic rod 13, a slide rail 29 is formed on the upper side of each support rod 15, a recovery mechanism 71 for recovering tin beads is arranged on the slide rail 29 and the support rod, 11 upside fixedly connected with mirror surface case 33 of base, mirror surface case 33 is inside to be opened has opening mirror surface chamber 35 down, mirror surface case 33 rear side is opened there is convection hole 39, the last fixed fan 40 that is equipped with of convection hole 39, about on the inner wall of mirror surface chamber 35 left and right both sides open to the symmetry of convection hole 39 left and right sides position has six location guide rails 35, every it has electric slider 36 to slide on the location guide rail 35, fixedly connected with infrared reflector 37 on the electric slider 36, mirror surface case 33 upside is opened has the groove of settling 42, the cooperation of groove of settling 42 has a apron 41, 41 side fixed surface is connected with handle 43 on the apron, 41 side fixed surface is connected with infrared emission device 38 under the apron 41.

Advantageously or exemplarily, said negative pressure means 73 comprise a negative pressure plate 22 sliding inside said guide 11, the left and right positions of the negative pressure plate about the center are symmetrically and fixedly connected with two limiting strips 24, an air cavity 23 is arranged inside the negative pressure plate 22, eight hole columns 26 are fixedly connected with the upper side of the negative pressure plate 22, an air hood 28 is arranged in each hole column 26, the air cover 28 is communicated with the air cavity 23 through an air pipe 27, the air cavity 23 is also communicated with the air tap 18 through an air conveying pipe 19, the air tap 18 is fixedly arranged on the upper end surface of the fan 16, the fan 16 is fixedly connected on the inner wall of the lower side of the cooling cavity 12, when the circuit board needs to be stabilized, the fan 16 is started, the fan 16 pumps the air pressure in the air cavity 23 to a relative negative pressure state through the air nozzle 18 and the air suction pipe 19, the air chamber 23 is communicated with an air hood 28 through an air pipe 27, and the inside of the air hood 28 is also in a negative pressure state.

Advantageously or exemplarily, the recovery mechanism 71 includes the screen plate 31 sliding in the slide rail 29, eight ventilation holes 32 penetrating up and down are formed in the screen plate 31, and an upright 46 is fixedly connected to the upper end surface of the support rod 15.

Beneficially or exemplarily, the upper side of the vertical rod 46 is provided with a swing groove 47 penetrating left and right, a swing shaft 48 is rotatably connected between the inner walls of the front and rear sides of the swing groove 47, a swing arm 51 is fixedly connected to the swing shaft 48, a return air pipe 49 is communicated with the left end face of the swing arm 51, the other end of the return air pipe 49 is communicated with a suction fan 50, the suction fan 50 is fixedly arranged on the inner wall of the rear side of the mirror cavity 34, the suction fan 50 is started, the suction fan 50 is communicated with the swing arm 51 through the return air pipe 49 to suck the tin beads dropping on the side surface of the circuit board and the screen plate 31, and meanwhile, part of the tin beads dropping in the gap of the circuit board is adsorbed by the fan 16 through the vent holes 32.

Advantageously or exemplarily, the hole column 26 is just embedded in the vent hole 32 when the support rod 15 is lowered to a certain height.

Advantageously or exemplarily, a sealing plate 44 is fixedly connected to one end of the screen plate 31, and a holding hand 45 is fixedly connected to the surface of the sealing plate 44, so that when a circuit board needs to be put in or taken out, a user can conveniently carry the raw material forward and backward by holding the holding hand 45.

Advantageously or exemplarily, a suction nozzle 52 is fixedly connected to a right end face of the swing arm 51, and the suction nozzle 52 has a semicircular arc shape.

Beneficially or exemplarily, during the normal operation of the infrared ray emitting device 38, the electrical slider 36 descends to a certain height, the infrared ray forms a certain angle with the gap on the hollowed circuit board of the screen plate 31 through the combination of the infrared ray reflectors 37, the electrical slider 36 is started, the electrical slider 36 moves downwards slowly in the positioning guide rail 35 for combination, part of the infrared ray reflectors 37 are aligned to the bottom surface of the hollowed circuit board exactly through the reflected angle, and the infrared ray illuminates the solder paste covered by the component through reflection.

The invention relates to a reflow oven of a hollow circuit board, which comprises the following working procedures:

before the hollowed-out circuit board is not placed, a user covers the cover plate 41 on the mirror surface box 33 in advance, starts the infrared emitting device 38 and preheats the ambient temperature inside the mirror surface cavity 34;

after a period of time, a user places the hollow circuit board to be processed on the sieve plate 31, starts the fan 16, the fan 16 pumps the air pressure inside the air cavity 23 to a relative negative pressure state through the air suction pipe 19, the user pushes the sealing plate 44 slowly to send the sieve plate 31 to an extreme position, the vent hole 32 is just above the hole column 26, the hydraulic rod 13 is started, and the hydraulic rod 13 drives the support rod 15 to descend by a certain height, so that the vent hole 32 and the hole column 26 are embedded with each other;

at this time, the power of the infrared emission device 38 is increased, the solder paste on the hollowed circuit board begins to melt by direct infrared radiation, and liquid solder paste overflowing from the part where some solder paste is applied unevenly is recovered through the air hood 28, so that the solder paste is prevented from blocking the gap of the hollowed circuit board in the cooling process, after a while, the hydraulic rod 13 is restarted, and the hydraulic rod 13 drives the support rod 13 to move upwards until the sieve plate 31 is higher than the inner wall of the lower side of the mirror surface cavity 34 by a certain distance;

at the moment, the electric slider 36 is started, the electric slider 36 moves and combines slowly in the positioning guide rail 35, part of the infrared reflector 37 just aims at the bottom surface of the hollowed-out circuit board through the reflection angle, infrared rays can irradiate the part of the tin paste shielded by the component through reflection, meanwhile, the suction fan 50 is started, and the suction fan 50 sucks tin beads dropping on the side surface of the circuit board and the sieve plate 31 through the air return pipe 49 and the swing arm 51;

after a certain time of operation, the infrared emitter 38 is turned off, the air cooler 17 and the fan 40 are started to form a convection environment, and the liquid solder paste on the circuit board is cooled.

The invention has the beneficial effects that: according to the invention, through reflection of infrared rays, infrared radiation energy emitted by the mirror surface is transmitted to the solder paste adding position of the circuit board, and the movable reflecting mirror surface is utilized to cover the component shielding position of the circuit board and the gap of the hollowed-out circuit board, so that the phenomenon of incomplete melting of the solder paste is avoided;

the invention also forms a relative negative pressure environment through the air suction cover device, so that the solder paste on the circuit board and the components do not deviate greatly along with the movement of the main board, and meanwhile, the solder paste with a small part falling into the gaps of the circuit board is sucked away, thereby avoiding the blocking phenomenon.

It will be apparent to those skilled in the art that various modifications may be made to the above embodiments without departing from the general spirit and concept of the invention. All falling within the scope of protection of the present invention. The protection scheme of the invention is subject to the appended claims.