阅读说明：本技术 敏感组件应力消除结构及具有其的振梁加速度计 (Sensitive assembly stress relieving structure and vibration beam accelerometer with same ) 是由 刘晓智 孙刚 丁凯 苏翼 杨亚杰 李陈征 于 2021-08-10 设计创作，主要内容包括：本发明提供了一种敏感组件应力消除结构及具有其的振梁加速度计,该结构包括应力消除主体单元、第一和第二应力释放外环,应力消除主体单元具有振梁阻尼腔和摆挠性支撑阻尼腔,振梁阻尼腔与摆挠性支撑阻尼腔呈夹角设置,振梁阻尼腔用于容纳设置振梁叉指组件,摆挠性支撑阻尼腔用于容纳设置摆挠性支撑组件,第一和第二应力释放外环均设置在应力消除主体单元的周缘,第一和第二应力释放外环之间形成应力释放腔。应用本发明的技术方案,以解决现有技术中振梁加速度计的力学环境适应性差、热学环境适应性差以及输出对称性差的技术问题。(The invention provides a sensitive component stress relieving structure and a vibrating beam accelerometer with the same, the structure comprises a stress relieving main body unit, a first stress relieving outer ring and a second stress relieving outer ring, the stress relieving main body unit is provided with a vibrating beam damping cavity and a pendulum flexible supporting damping cavity, the vibrating beam damping cavity and the pendulum flexible supporting damping cavity are arranged at an included angle, the vibrating beam damping cavity is used for accommodating and arranging a vibrating beam interdigital component, the pendulum flexible supporting damping cavity is used for accommodating and arranging the pendulum flexible supporting component, the first stress relieving outer ring and the second stress relieving outer ring are both arranged on the periphery of the stress relieving main body unit, and the stress relieving outer ring and the second stress relieving outer ring form a stress relieving cavity. By applying the technical scheme of the invention, the technical problems of poor mechanical environment adaptability, poor thermal environment adaptability and poor output symmetry of the vibrating beam accelerometer in the prior art are solved.)

1. A sensing assembly stress relief structure, comprising:

the stress relieving main body unit (10) is provided with a vibration beam damping cavity (10a) and a pendulum flexible support damping cavity (10b), the vibration beam damping cavity (10a) and the pendulum flexible support damping cavity (10b) are arranged at an included angle, the vibration beam damping cavity (10a) is used for accommodating and setting a vibration beam interdigital assembly, and the pendulum flexible support damping cavity (10b) is used for accommodating and setting a pendulum flexible support assembly;

a first stress release outer ring (20) and a second stress release outer ring (30), wherein the first stress release outer ring (20) and the second stress release outer ring (30) are both arranged on the periphery of the stress relief body unit (10), the first stress release outer ring (20) and the second stress release outer ring (30) are arranged at intervals, and a stress release cavity is formed between the first stress release outer ring (20) and the second stress release outer ring (30).

2. The sensitive assembly stress relief structure according to claim 1, wherein the vibration beam damping cavity (10a) comprises a first vibration beam damping cavity unit (101a) and a second vibration beam damping cavity unit (102a), the vibration beam interdigital assembly comprises a first vibration beam interdigital finger and a second vibration beam interdigital finger, the first vibration beam damping cavity unit (101a) and the second vibration beam damping cavity unit (102a) are symmetrically arranged relative to the central axis of the stress relief main body unit (10), the first vibration beam damping cavity unit (101a) is used for accommodating and arranging the first vibration beam interdigital finger, and the second vibration beam damping cavity unit (102a) is used for accommodating and arranging the second vibration beam interdigital finger.

3. The sensitive assembly stress relief structure according to claim 1, wherein the pendulum flexible support damping cavity (10b) comprises a first pendulum flexible support damping cavity unit (101b) and a second pendulum flexible support damping cavity unit (102b), the pendulum flexible support assembly comprises a first pendulum flexible support and a second pendulum flexible support, the first pendulum flexible support damping cavity unit (101b) and the second pendulum flexible support damping cavity unit (102b) are symmetrically arranged relative to the central axis of the stress relief body unit (10), the first pendulum flexible support damping cavity unit (101b) is used for accommodating and arranging a first pendulum flexible support, and the second pendulum flexible support damping cavity unit (102b) is used for accommodating and arranging a second pendulum flexible support.

4. Sensitive component stress relief structure according to any of claims 1 to 3, wherein the material of the stress relief body unit (10) comprises quartz or metal.

5. Sensitive assembly stress relief structure according to claim 4, wherein the vibration beam dampening cavity (10a) and the pendulum flexible support dampening cavity (10b) are both elongated structural cavities.

6. Sensitive assembly stress relief structure according to claim 4, wherein the stress relief body unit (10), the first stress relief outer ring (20) and the second stress relief outer ring (30) are made in one piece.

7. A vibrating beam accelerometer, characterized in that it comprises a sensitive component stress relief structure (100) and a sensitive component (200), the sensitive component stress relief structure (100) being arranged on the sensitive component (200), the sensitive component stress relief structure (100) being a sensitive component stress relief structure (100) according to any of claims 1 to 6.

8. The vibrating beam accelerometer according to claim 7, wherein the vibrating beam accelerometer comprises two said sensitive component stress relief structures (100), a first sensitive component stress relief structure (100) being arranged on one side of the sensitive component (200) and a second sensitive component stress relief structure (100) being arranged on the other side of the sensitive component (200).

9. The vibrating beam accelerometer according to claim 8, wherein the sensing assembly (200) comprises a sensing assembly body (210), a vibrating beam interdigital assembly (220) and a pendulum flexible support assembly (230), the sensing assembly body (210) is fixedly connected with the stress relief main body unit (10) of the sensing assembly stress relief structure (100), the vibrating beam interdigital assembly (220) is arranged in the pendulum flexible support damping cavity (10b), and the pendulum flexible support assembly (230) is arranged in the pendulum flexible support damping cavity (10 b).

10. The vibrating beam accelerometer according to claim 9, wherein the vibrating beam interdigital assembly (220) comprises a first vibrating beam interdigital (221) and a second vibrating beam interdigital (222), the first vibrating beam interdigital (221) is arranged in a first vibrating beam damping cavity unit (101a), the second vibrating beam interdigital (222) is arranged in a second vibrating beam damping cavity unit (102a), and the first vibrating beam interdigital (221) and the second vibrating beam interdigital (222) are symmetrically arranged relative to a central axis of the stress relief main body unit (10); the pendulum flexible support assembly (230) comprises a first pendulum flexible support (231) and a second pendulum flexible support (232), the first pendulum flexible support (231) is arranged in a first pendulum flexible support damping cavity unit (101b), the second pendulum flexible support (232) is arranged in a second pendulum flexible support damping cavity unit (102b), and the first pendulum flexible support (231) and the second pendulum flexible support (232) are symmetrically arranged relative to the central axis of the stress relief main body unit (10).

Technical Field

The invention relates to the technical field of accelerometers, in particular to a sensitive assembly stress relief structure and a vibrating beam accelerometer with the sensitive assembly stress relief structure.

Background

The new generation of strategic weapons represented by cruise missiles, remote bombers, submarines, intercontinental missiles and hypersonic aircrafts has urgent need for small high-precision accelerometers with high precision, high reliability, high stability and low cost. Typical indices are measurement range. + -.50 g, off-set stability 5. mu.g, scale factor stability 5 ppm. At present, a gyro pendulum accelerometer (PIGA for short) is adopted, but the characteristics of complex structure, larger volume and weight, difficult maintenance and the like are difficult to meet the development requirement of strategic weapons in the future. The MEMS accelerometer taking the vibration beam as the principle is the most important technical development direction of the current small-sized high-precision accelerometer, can cover the application in the strategic field, and is the first choice core device of the strategic weapon high-precision inertial navigation system.

The vibration beam accelerometer is characterized in that a detection mass block is constrained by a pair of precise flexible supports to move in a single degree of freedom, a pair of force sensitive vibration beams loaded in a push-pull mode are arranged in the direction of an input shaft of the detection mass block, when acceleration is input, the detection mass block generates a force effect and transmits the force to the vibration beams, so that the frequency of the action of tensile force borne by one vibration beam is increased, the frequency of the action of pressure borne by the other vibration beam is reduced, the two frequency differences are in direct proportion to the input acceleration, the two frequency values are detected by a crystal oscillator circuit, and the acceleration value is calculated according to a mathematical model between the two frequency values.

The sensitive component is the important component of the vibration beam accelerometer, the stress release of the sensitive component under the mechanical environment and the thermal environment directly influences the environmental adaptability of the vibration beam accelerometer, the vibration beam is the key component of the sensitive component for sensing and outputting an acceleration signal, the vibration environment of the double vibration beams directly influences the precision of the vibration beam accelerometer, and the following problems need to be solved in the design of the current vibration beam accelerometer:

1. the mechanical environment adaptability is poor, and the mechanical stress caused by external impact and vibration is directly transmitted to the sensitive component;

2. the adaptability of the thermal environment is poor, and the thermal stress caused by the external temperature is directly transmitted to the sensitive component;

3. the dual vibrating beams have different working environments, resulting in poor output symmetry.

Disclosure of Invention

The invention provides a sensitive component stress relieving structure and a vibrating beam accelerometer with the same, which can solve the technical problems of poor mechanical environment adaptability, poor thermal environment adaptability and poor output symmetry of the vibrating beam accelerometer in the prior art.

According to an aspect of the present invention, there is provided a sensitive component stress relief structure, including: the stress relieving main body unit is provided with a vibration beam damping cavity and a pendulum flexible support damping cavity, the vibration beam damping cavity and the pendulum flexible support damping cavity are arranged at an included angle, the vibration beam damping cavity is used for accommodating and arranging a vibration beam interdigital assembly, and the pendulum flexible support damping cavity is used for accommodating and arranging a pendulum flexible support assembly; the first stress release outer ring and the second stress release outer ring are arranged on the periphery of the stress relief main body unit at intervals, and a stress release cavity is formed between the first stress release outer ring and the second stress release outer ring.

Further, the beam damping cavity that shakes includes that the first beam damping cavity unit and the second shakes the beam damping cavity unit, shakes the beam interdigital subassembly and includes that the first beam interdigital that shakes and the second shakes the beam interdigital, and the first beam damping cavity unit that shakes and the second shakes the beam damping cavity unit and set up for the central axis symmetry of stress relief main part unit, and the first beam damping cavity unit that shakes is used for holding and sets up the first beam interdigital that shakes, and the second shakes the beam damping cavity unit and is used for holding and sets up the second and shakes the beam interdigital.

Furthermore, the pendulum flexible support damping cavity comprises a first pendulum flexible support damping cavity unit and a second pendulum flexible support damping cavity unit, the pendulum flexible support assembly comprises a first pendulum flexible support and a second pendulum flexible support, the first pendulum flexible support damping cavity unit and the second pendulum flexible support damping cavity unit are symmetrically arranged relative to the central axis of the stress relief main body unit, the first pendulum flexible support damping cavity unit is used for accommodating and setting the first pendulum flexible support, and the second pendulum flexible support damping cavity unit is used for accommodating and setting the second pendulum flexible support.

Further, the material of the stress relief body unit comprises quartz or metal.

Further, the vibration beam damping cavity and the pendulum flexible support damping cavity are both elongated structure cavities.

Further, the stress relief body unit, the first stress relief outer ring and the second stress relief outer ring are integrally formed.

According to a further aspect of the present invention, there is provided a vibrating beam accelerometer, which includes a sensitive component stress relief structure and a sensitive component, wherein the sensitive component stress relief structure is disposed on the sensitive component, and the sensitive component stress relief structure is the sensitive component stress relief structure as described above.

Further, the vibration beam accelerometer comprises two sensitive assembly stress relief structures, wherein the first sensitive assembly stress relief structure is arranged on one side of the sensitive assembly, and the second sensitive assembly stress relief structure is arranged on the other side of the sensitive assembly.

Furthermore, the sensitive assembly comprises a sensitive assembly body, a vibration beam interdigital assembly and a pendulum flexible supporting assembly, the sensitive assembly body is fixedly connected with a stress relief main body unit of the sensitive assembly stress relief structure, the vibration beam interdigital assembly is arranged in the pendulum flexible supporting damping cavity, and the pendulum flexible supporting assembly is arranged in the pendulum flexible supporting damping cavity.

Furthermore, the vibration beam interdigital assembly comprises a first vibration beam interdigital and a second vibration beam interdigital, the first vibration beam interdigital is arranged in the first vibration beam damping cavity unit, the second vibration beam interdigital is arranged in the second vibration beam damping cavity unit, and the first vibration beam interdigital and the second vibration beam interdigital are symmetrically arranged relative to the central axis of the stress relief main body unit; the pendulum flexible support assembly comprises a first pendulum flexible support and a second pendulum flexible support, the first pendulum flexible support is arranged in the first pendulum flexible support damping cavity unit, the second pendulum flexible support is arranged in the second pendulum flexible support damping cavity unit, and the first pendulum flexible support and the second pendulum flexible support are symmetrically arranged relative to the central axis of the stress relief main body unit.

By applying the technical scheme of the invention, the stress relief structure of the sensitive component is provided, and a stress relief cavity is formed between the first stress relief outer ring and the second stress relief outer ring by arranging the first stress relief outer ring and the second stress relief outer ring, so that on one hand, the mechanical stress caused by external impact and vibration can be relieved, and the mechanical environment adaptability of the accelerometer is improved; on the other hand, stress caused by external thermodynamics can be isolated, and the thermal environment adaptability of the accelerometer is improved; the same vibration space is provided for the two vibration beams through the vibration beam damping cavity, so that the same damping environment is provided, and the symmetry of the two beams is improved; the same vibration space is provided for the two flexible supports of the pendulous reed through the pendulum flexible support damping cavity, so that the same damping environment is provided, and the precision of the accelerometer is improved. Therefore, compared with the prior art, the sensitive assembly stress relief structure provided by the invention can effectively improve the mechanical environment adaptability and the thermal environment adaptability of the accelerometer, can provide the same damping environment, and improves the double-beam symmetry and the accelerometer precision.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 illustrates a front view of a sensitive component stress relief structure provided in accordance with a particular embodiment of the present invention;

FIG. 2 illustrates a cross-sectional view of a sensitive component stress relief structure provided in accordance with a specific embodiment of the present invention;

FIG. 3 illustrates a front view of a sensitive component stress relief structure provided in accordance with an embodiment of the present invention assembled with a sensitive component;

fig. 4 is a left side view of the assembly of a stress relief structure for a sensitive component and a sensitive component provided in accordance with an embodiment of the present invention.

Wherein the figures include the following reference numerals:

10. a stress relief body unit; 10a, a vibration beam damping cavity; 101a, a first vibration beam damping cavity unit; 102a, a second vibration beam damping cavity unit; 10b, a pendulum flexible support damping cavity; 101b, a first pendulum flexible support damping cavity unit; 102b, a second pendulum flexible support damping cavity unit; 20. a first stress release outer ring; 30. a second stress relief outer ring; 20a, a stress relief cavity; 30a, a stress release cavity; 100. a sensitive component stress relief structure; 200. a sensitive component; 210. a sensitive component body; 220. the vibration beam interdigital assembly; 221. the first vibration beam is interdigital; 222. the second vibration beam is interdigital; 230. a pendulum flexible support assembly; 231. a first pendulum flexible support; 232. the second pendulum is flexibly supported.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1 to 4, a sensitive assembly stress relief structure is provided according to an embodiment of the present invention, the stress relieving structure of the sensitive assembly comprises a stress relieving main body unit 10, a first stress relieving outer ring 20 and a second stress relieving outer ring 30, wherein the stress relieving main body unit 10 is provided with a vibration beam damping cavity 10a and a pendulum flexible supporting damping cavity 10b, the vibration beam damping cavity 10a and the pendulum flexible supporting damping cavity 10b are arranged at an included angle, the vibration beam damping cavity 10a is used for accommodating and arranging a vibration beam interdigital assembly, the pendulum flexible supporting damping cavity 10b is used for accommodating and arranging the pendulum flexible supporting assembly, the first stress relieving outer ring 20 and the second stress relieving outer ring 30 are both arranged on the periphery of the stress relieving main body unit 10, the first stress relieving outer ring 20 and the second stress relieving outer ring 30 are arranged at an interval, and a stress relieving cavity is formed between the first stress relieving outer ring 20 and the second stress relieving outer ring 30.

By applying the configuration mode, the stress relief structure of the sensitive assembly is provided, and a stress relief cavity is formed between the first stress relief outer ring and the second stress relief outer ring by arranging the first stress relief outer ring and the second stress relief outer ring; on the other hand, stress caused by external thermodynamics can be isolated, and the thermal environment adaptability of the accelerometer is improved; the same vibration space is provided for the two vibration beams through the vibration beam damping cavity, so that the same damping environment is provided, and the symmetry of the two beams is improved; the same vibration space is provided for the two flexible supports of the pendulous reed through the pendulum flexible support damping cavity, so that the same damping environment is provided, and the precision of the accelerometer is improved. Therefore, compared with the prior art, the sensitive assembly stress relief structure provided by the invention can effectively improve the mechanical environment adaptability and the thermal environment adaptability of the accelerometer, can provide the same damping environment, and improves the double-beam symmetry and the accelerometer precision.

Further, in the present invention, when the vibration beam of the sensitive component has two vibration beam fingers, in order to provide the same vibration space to the two vibration beam fingers to improve the symmetry of the two vibration beams, the vibration beam damping cavity 10a may be configured to include a first vibration beam damping cavity unit 101a and a second vibration beam damping cavity unit 102a, the vibration beam finger component includes a first vibration beam finger and a second vibration beam finger, the first vibration beam damping cavity unit 101a and the second vibration beam damping cavity unit 102a are symmetrically arranged with respect to the central axis of the stress relief main body unit 10, the first vibration beam damping cavity unit 101a is configured to accommodate and arrange the first vibration beam finger, and the second vibration beam damping cavity unit 102a is configured to accommodate and arrange the second vibration beam finger.

In the present invention, in order to provide the same vibration space for the two pendulum flexible supports to improve the accelerometer accuracy, the pendulum flexible support damping cavity 10b may be configured to include a first pendulum flexible support damping cavity unit 101b and a second pendulum flexible support damping cavity unit 102b, the pendulum flexible support assembly includes a first pendulum flexible support and a second pendulum flexible support, the first pendulum flexible support damping cavity unit 101b and the second pendulum flexible support damping cavity unit 102b are symmetrically arranged with respect to the central axis of the stress relief main unit 10, the first pendulum flexible support damping cavity unit 101b is configured to accommodate and arrange the first pendulum flexible support, and the second pendulum flexible support damping cavity unit 102b is configured to accommodate and arrange the second pendulum flexible support.

Further, in the present invention, the material of the stress relief body unit 10 includes quartz or metal in consideration of practical application. In addition, considering the actual processing condition, the vibration beam damping cavity 10a and the pendulum flexible support damping cavity 10b are both elongated structure cavities.

In the present invention, the stress relief body unit 10, the first stress relief outer ring 20, and the second stress relief outer ring 30 may be configured to be integrally manufactured in consideration of the structural strength of the stress relief structure of the sensitive component. During manufacturing, the two side thin-wall structures left after a circle of solid is dug out of the outer circumference of the circular ring structure are the first stress release outer ring and the second stress release ring.

According to another aspect of the present invention, there is provided a vibrating beam accelerometer, which includes a sensitive component stress relief structure 100 and a sensitive component 200, wherein the sensitive component stress relief structure 100 is disposed on the sensitive component 200, and the sensitive component stress relief structure 100 is the sensitive component stress relief structure 100 as described above.

By applying the configuration mode, the vibration beam accelerometer is provided, and because the stress relief structure of the sensitive assembly is provided with the first stress relief outer ring and the second stress relief outer ring, and the stress relief cavity is formed between the first stress relief outer ring and the second stress relief outer ring, on one hand, the mode can relieve mechanical stress caused by external impact and vibration and improve the mechanical environment adaptability of the accelerometer; on the other hand, stress caused by external thermodynamics can be isolated, and the thermal environment adaptability of the accelerometer is improved; the same vibration space is provided for the two vibration beams through the vibration beam damping cavity, so that the same damping environment is provided, and the symmetry of the two beams is improved; the same vibration space is provided for the two flexible supports of the pendulous reed through the pendulum flexible support damping cavity, so that the same damping environment is provided, and the precision of the accelerometer is improved. Therefore, the sensitive assembly stress relief structure provided by the invention is used in the vibrating beam accelerometer, so that the working performance of the vibrating beam accelerometer can be greatly improved.

Further, in the present invention, in order to provide the same vibration space for the dual vibration beams, as shown in fig. 4, the vibration beam accelerometer includes two sensitive assembly stress relief structures 100, a first sensitive assembly stress relief structure 100 is disposed on one side of the sensitive assembly 200, and a second sensitive assembly stress relief structure 100 is disposed on the other side of the sensitive assembly 200.

In addition, in the present invention, the sensing assembly 200 includes a sensing assembly body 210, a vibrating beam interdigital assembly 220 and a pendulum flexible support assembly 230, in order to effectively improve the mechanical environment adaptability and the thermal environment adaptability of the accelerometer, and at the same time provide the same damping environment, improve the double-beam symmetry and the accelerometer precision, the sensing assembly body 210 is fixedly connected with the stress relief main unit 10 of the sensing assembly stress relief structure 100, the vibrating beam interdigital assembly 220 is disposed in the pendulum flexible support damping cavity 10b, and the pendulum flexible support assembly 230 is disposed in the pendulum flexible support damping cavity 10 b.

As a specific embodiment of the present invention, the vibration beam interdigital assembly 220 includes a first vibration beam interdigital 221 and a second vibration beam interdigital 222, the first vibration beam interdigital 221 is disposed in the first vibration beam damping cavity unit 101a, the second vibration beam interdigital 222 is disposed in the second vibration beam damping cavity unit 102a, and the first vibration beam interdigital 221 and the second vibration beam interdigital 222 are symmetrically disposed with respect to the central axis of the stress relief main body unit 10; the pendulum flexible support assembly 230 includes a first pendulum flexible support 231 and a second pendulum flexible support 232, the first pendulum flexible support 231 is disposed in the first pendulum flexible support damping chamber unit 101b, the second pendulum flexible support 232 is disposed in the second pendulum flexible support damping chamber unit 102b, and the first pendulum flexible support 231 and the second pendulum flexible support 232 are disposed symmetrically with respect to the central axis of the stress relief main unit 10.

For further understanding of the present invention, the stress relief structure of the sensitive component provided by the present invention is described in detail below with reference to fig. 1 to 4.

As shown in fig. 1 to 4, a sensitive assembly stress relief structure is provided according to an embodiment of the present invention, the stress relieving structure of the sensitive assembly comprises a stress relieving main body unit 10, a first stress relieving outer ring 20 and a second stress relieving outer ring 30, wherein the stress relieving main body unit 10 is provided with a vibration beam damping cavity 10a and a pendulum flexible supporting damping cavity 10b, the vibration beam damping cavity 10a and the pendulum flexible supporting damping cavity 10b are vertically arranged, the vibration beam damping cavity 10a is used for accommodating and arranging a vibration beam interdigital assembly, the pendulum flexible supporting damping cavity 10b is used for accommodating and arranging the pendulum flexible supporting assembly, the first stress relieving outer ring 20 and the second stress relieving outer ring 30 are both arranged on the periphery of the stress relieving main body unit 10, the first stress relieving outer ring 20 and the second stress relieving outer ring 30 are arranged at intervals, and a stress relieving cavity 20a (30a) is formed between the first stress relieving outer ring 20 and the second stress relieving outer ring 30.

In the present embodiment, the stress relief body unit 10 is a unitary planar structure, typically circular in shape. The vibration beam damping cavity 10a is a long strip hole structure, the pendulum flexible support damping cavity 10b is a long strip hole structure, and the first stress release outer ring 20 and the second stress release outer ring 30 are two-side thin-wall structures left after a circle of solid is removed from the middle of the side surface of the stress relief main body unit 10. The length of the vibration beam damping cavity 10a is not less than the interdigital length of the vibration beam, the width is greater than the width of the vibration beam, the vibration beam is of an axisymmetric structure, and the symmetry axis coincides with the central axis of the stress relief main body unit 10. The length of the pendulum flexible support damping cavity 10b is not less than that of the pendulum flexible support, and the pendulum flexible support damping cavity is of an axisymmetric structure, and the symmetry axis is coincident with the central axis of the stress relief main body unit 10. The thin wall of one side of the stress release outer ring of the stress relief main body unit 10 is fixedly connected with the sensitive component, and the sensitive component stress relief structures are symmetrically arranged on two sides of the sensitive component.

In summary, the invention provides a stress relieving structure for a sensitive component, which is characterized in that a first stress relieving outer ring and a second stress relieving outer ring are arranged, and a stress relieving cavity is formed between the first stress relieving outer ring and the second stress relieving outer ring, so that on one hand, mechanical stress caused by external impact and vibration can be relieved, and the mechanical environment adaptability of an accelerometer is improved; on the other hand, stress caused by external thermodynamics can be isolated, and the thermal environment adaptability of the accelerometer is improved; the same vibration space is provided for the two vibration beams through the vibration beam damping cavity, so that the same damping environment is provided, and the symmetry of the two beams is improved; the same vibration space is provided for the two flexible supports of the pendulous reed through the pendulum flexible support damping cavity, so that the same damping environment is provided, and the precision of the accelerometer is improved. Therefore, compared with the prior art, the sensitive assembly stress relief structure provided by the invention can effectively improve the mechanical environment adaptability and the thermal environment adaptability of the accelerometer, can provide the same damping environment, and improves the double-beam symmetry and the accelerometer precision.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.