阅读说明：本技术 发光元件封装件及其应用 (Light emitting element package and application thereof ) 是由 张锺敏 金彰渊 于 2020-03-19 设计创作，主要内容包括：发光元件封装件包括：印刷电路板,具有正面和背面；至少一个发光元件,设置于所述正面上,并且向所述正面所朝向的方向射出光；以及模制层,设置于所述印刷电路板上并包围所述发光元件,其中,所述发光元件包括：发光结构体,设置于所述印刷电路板上；基板,设置于所述发光结构体上；以及多个凸起电极,设置于所述发光结构体与所述印刷电路板之间。所述模制层可以覆盖所述基板的上表面,并且可以将外部光的一部分反射、散射或吸收。(The light emitting element package includes: a printed circuit board having a front side and a back side; at least one light emitting element that is provided on the front surface and emits light in a direction in which the front surface faces; and a molding layer disposed on the printed circuit board and surrounding the light emitting element, wherein the light emitting element includes: a light emitting structure body disposed on the printed circuit board; a substrate disposed on the light emitting structure; and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board. The molding layer may cover an upper surface of the substrate, and may reflect, scatter, or absorb a portion of external light.)