阅读说明：本技术 遮光结构的制作方法和遮光结构 (Manufacturing method of shading structure and shading structure ) 是由 曹雪峰 明玉生 孙理斌 汪杰 陈远 于 2021-08-03 设计创作，主要内容包括：本申请提供了一种遮光结构的制作方法和遮光结构。该方法包括：提供基板；采用丝网印刷工艺在基板上印刷油墨,形成油墨层；采用包括激光器的预定装置对油墨层进行处理,去除部分油墨,至少形成包括多个间隔的通光孔的遮光结构。该方法采用丝网印刷工艺在基板上印刷油墨,可以将油墨均匀的涂覆在基板上,形成的油墨层较为均匀,采用包括激光器的预定装置去除至少部分油墨,使得部分油墨层被消除,且不影响基板的透光性,该方法采用了丝网印刷工艺以及预定装置对至少部分油墨层进行处理,从而避免引入光刻胶而导致的设备资产高投入,可以有效降低遮光结构的制作成本,进而解决了现有技术中制备遮光结构的方法成本较高的问题。(The application provides a manufacturing method of a shading structure and the shading structure. The method comprises the following steps: providing a substrate; printing ink on the substrate by adopting a screen printing process to form an ink layer; and processing the ink layer by adopting a preset device comprising a laser, removing part of the ink, and at least forming a shading structure comprising a plurality of spaced light through holes. The method adopts the screen printing process to print the ink on the substrate, can uniformly coat the ink on the substrate, forms a uniform ink layer, and adopts the preset device comprising the laser to remove at least part of the ink, so that part of the ink layer is eliminated without influencing the light transmittance of the substrate.)

1. A manufacturing method of a shading structure is characterized by comprising the following steps:

providing a substrate;

printing ink on the substrate by adopting a screen printing process to form an ink layer;

and processing the ink layer by adopting a preset device comprising a laser, removing part of the ink, and at least forming a shading structure comprising a plurality of spaced light through holes.

2. The method of claim 1, wherein the predetermined device is a laser etching machine, and the step of removing a portion of the ink to form at least a plurality of spaced light holes comprises:

performing laser etching on the ink layer by using the laser etching machine, removing part of the ink, and forming a plurality of closed cutting channels, wherein the cutting channels are arranged at intervals along a preset direction, the preset direction is a direction perpendicular to the thickness of the ink layer, and the cutting channels are arranged around the periphery of a preset ink area in a one-to-one correspondence manner;

performing laser etching on the preset ink areas by using the laser etching machine, removing the ink in a plurality of spaced sub-areas in each preset ink area, and forming a plurality of light through holes;

and cutting the substrate along the cutting channel to form a plurality of shading structures.

3. The method of claim 1, wherein prior to printing ink on the substrate using a screen printing process to form an ink layer, the method further comprises:

and cleaning the substrate by using a cleaning solution comprising an organic solvent.

4. The method of claim 3, wherein the cleaning fluid comprises acetone and isopropyl alcohol.

5. The manufacturing method according to any one of claims 1 to 4, wherein the substrate is a glass substrate, the thickness of the glass substrate is between 0.1 and 1.0mm, and the surface flatness TTV of the glass substrate is less than 20 μm.

6. The method as claimed in any one of claims 1 to 4, wherein the ink is a black ink, the viscosity of the ink is between 1000 and 20000cp, the optical density of the ink is greater than 2, the ink is a thermosetting or photosensitive ink, and the thickness of the ink layer is between 10 μm and 15 μm.

7. The production method according to any one of claims 1 to 4, wherein the screen used for the screen printing is a metal screen.

8. The manufacturing method according to any one of claims 2 to 4, wherein a cross-sectional shape of the light shielding structure in a first predetermined direction is a taper shape, a vertex angle of the taper shape is θ, 0< θ <10 °, the first predetermined direction is a height direction of the light shielding structure, a cross-sectional shape of the light passing hole in a second predetermined direction is a circle, a radius of the circle is between 2 μm and 10 μm, and the second predetermined direction is perpendicular to the first predetermined direction.

9. The method of manufacturing according to any one of claims 1 to 4, wherein the laser is a picosecond laser.

10. A light shielding structure, wherein the light shielding structure is manufactured by the manufacturing method of any one of claims 1 to 9.

11. An optical structure, comprising a substrate, microlenses and a light shielding structure, wherein the microlenses correspond to the light shielding structure one to one, the microlenses are disposed on a first surface of the substrate, the light shielding structure is disposed on a second surface of the substrate, and the first surface and the second surface are disposed opposite to each other, characterized in that the light shielding structure is manufactured by the manufacturing method of any one of claims 1 to 9.

Technical Field

The application relates to the field of photoelectron, in particular to a manufacturing method of a shading structure and the shading structure.

Background

When designing a mobile phone lens, light is often required to be screened, and an imaging light path which is required by people is selected. Meanwhile, because light at different angles can affect the final imaging quality, a smart light path needs to be designed to meet the imaging requirements many times. If a structure can be designed, required light can pass through, and stray light and the like can be completely removed, so that the imaging quality can be effectively improved. Therefore, how to prepare the light-shielding structure becomes critical.

The preparation of such a light shielding structure in the optical path needs to meet two requirements, one being high precision and one being high efficiency. In the prior art, a photoetching process is usually adopted for processing and preparation, and the process is complex, the efficiency is low and the equipment cost is high; and the photoresist needs to be coated on the glass substrate in a spin mode, the thickness is difficult to achieve, the bottom of the photoresist is often not exposed, and the precision is not high.

Therefore, a method for manufacturing a light shielding structure at a low cost is needed.

The above information disclosed in this background section is only for enhancement of understanding of the background of the technology described herein and, therefore, certain information may be included in the background that does not form the prior art that is already known in this country to a person of ordinary skill in the art.

Disclosure of Invention

The main purpose of the present application is to provide a manufacturing method of a light shielding structure and a light shielding structure, so as to solve the problem that the cost of a method for manufacturing a light shielding structure in the prior art is high.

In order to achieve the above object, according to an aspect of the present application, there is provided a method of manufacturing a light shielding structure, including: providing a substrate; printing ink on the substrate by adopting a screen printing process to form an ink layer; and processing the ink layer by adopting a preset device comprising a laser, removing part of the ink, and at least forming a shading structure comprising a plurality of spaced light through holes.

Further, the presetting device is a laser carving machine, adopts the presetting device including the laser to handle the printing ink layer, removes some printing ink, forms a plurality of spaced light-passing holes at least, includes: performing laser etching on the ink layer by using the laser etching machine, removing part of the ink, and forming a plurality of closed cutting channels, wherein the cutting channels are arranged at intervals along a preset direction, the preset direction is a direction perpendicular to the thickness of the ink layer, and the cutting channels are arranged around the periphery of a preset ink area in a one-to-one correspondence manner; performing laser etching on the preset ink areas by using the laser etching machine, removing the ink in a plurality of spaced sub-areas in each preset ink area, and forming a plurality of light through holes; and cutting the substrate along the cutting channel to form a plurality of shading structures.

Further, before printing ink on the substrate by using a screen printing process to form an ink layer, the method further comprises: and cleaning the substrate by using a cleaning solution comprising an organic solvent.

Further, the cleaning solution comprises acetone and isopropanol.

Furthermore, the substrate is a glass substrate, the thickness of the glass substrate is 0.1-1.0mm, and the surface flatness TTV of the glass substrate is less than 20 μm.

Further, the ink is black ink, the viscosity of the ink is between 1000-.

Further, the silk screen adopted by the silk screen printing is a metal silk screen.

Further, the cross-sectional shape of the light shielding structure in a first predetermined direction is a cone, the vertex angle of the cone is theta, 0< theta <10 degrees, the first predetermined direction is the height direction of the light shielding structure, the cross-sectional shape of the light through hole in a second predetermined direction is a circle, the radius of the circle is between 2 and 10 micrometers, and the second predetermined direction is perpendicular to the first predetermined direction.

Further, the laser is a picosecond laser.

According to another aspect of the present application, there is provided a light shielding structure fabricated by any one of the above fabrication methods.

According to another aspect of the present application, an optical structure is provided, which includes a substrate, a micro lens and a light shielding structure, wherein the micro lens corresponds to the light shielding structure one to one, the micro lens is disposed on a first surface of the substrate, the light shielding structure is disposed on a second surface of the substrate, the first surface and the second surface are disposed oppositely, and the light shielding structure is manufactured by using any one of the manufacturing methods.

By applying the technical scheme, the printing ink is printed on the substrate by adopting the screen printing process, the printing ink can be uniformly coated on the substrate, the formed ink layer is uniform, at least part of the printing ink is removed by adopting the preset device comprising the laser, so that part of the ink layer is eliminated, and the light transmittance of the substrate is not influenced. In addition, the method has no sensitivity requirement on ink materials, the ink selection range is greatly expanded, and in the screen printing process, the time for one-time printing is shorter than that of glue spreading/hot plate in the prior art, so that the efficiency of manufacturing the shading structure is improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:

fig. 1 shows a schematic flow chart of a method of manufacturing a light shielding structure according to an embodiment of the present application;

FIG. 2 shows a schematic view of an optical structure of an embodiment of the present application;

FIG. 3 shows a two-dimensional distribution of clear holes;

FIG. 4 shows a schematic view of a glass substrate;

FIG. 5 shows a schematic view of a glass substrate using screen printing;

FIG. 6 shows a schematic diagram of laser etching using a laser etching machine.

Wherein the figures include the following reference numerals:

10. a microlens; 11. a glass substrate; 12. a light through hole; 13. and (4) an ink layer.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Also, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.

As described in the background art, the method for manufacturing the light shielding structure in the prior art has a high cost, and in order to solve the above problem, the present application provides a method for manufacturing the light shielding structure and the light shielding structure.

Fig. 1 is a flowchart of a method for manufacturing a light shielding structure according to the present application, and as shown in fig. 1, the method includes:

providing a substrate;

printing ink on the substrate by adopting a screen printing process to form an ink layer;

and processing the ink layer by adopting a preset device comprising a laser, removing part of the ink, and at least forming a shading structure comprising a plurality of spaced light through holes.

According to the method, the printing ink is printed on the substrate by adopting a screen printing process, the printing ink can be uniformly coated on the substrate, the formed ink layer is relatively uniform, at least part of the printing ink is removed by adopting a preset device comprising a laser, so that part of the ink layer is eliminated, and the light transmittance of the substrate is not influenced. In addition, the method has no sensitivity requirement on ink materials, the ink selection range is greatly expanded, and in the screen printing process, the time for one-time printing is shorter than that of glue spreading/hot plate in the prior art, so that the efficiency of manufacturing the shading structure is improved.

The shading structure generally needs to be prepared by a photoetching technology, the selected ink material is black photoresist, the optical density of the ink is more than 2, general exposure equipment selects direct-writing photoetching, or a stepping motor is used for exposure after a surface film is prepared, the process has the problem that the light absorption capacity is very strong because the ink is black, the photoetching needs to expose light from the surface of the ink to the bottom of the ink, the condition that the photoresist is remained at the bottom after exposure is often met, the yield is greatly reduced, and if the photoetching technology is used for carrying out repeated exposure by overlay, the precision of the equipment cannot be guaranteed.

In an embodiment of this application, above-mentioned pre-installation is radium carving machine, adopts the pre-installation including the laser instrument to handle above-mentioned printing ink layer, gets rid of above-mentioned printing ink of part, forms a plurality of spaced light holes at least, includes: performing laser etching on the ink layer by using the laser etching machine, removing part of the ink, and forming a plurality of closed cutting channels, wherein the cutting channels are arranged at intervals along a preset direction, the preset direction is a direction perpendicular to the thickness of the ink layer, and the cutting channels are arranged around the periphery of a preset ink area in a one-to-one correspondence manner; performing laser etching on the preset ink areas by using the laser etching machine, and removing the ink in a plurality of spaced subregions in each preset ink area to form a plurality of light through holes; and cutting the substrate along the cutting channel to form a plurality of light shielding structures. In this embodiment, adopt radium carving machine to get rid of partial printing ink more high-efficiently, it is better to guarantee the quality at cutting edge to cut along the cutting passageway, this embodiment adopts radium carving machine to carry out the region and carry out radium carving to the printing ink layer and printing ink region, can adjust the laser energy that corresponds to the base plate of not unidimensional, moreover, the steam generator is simple in process, and in this embodiment, adjust through laser light path, can dozens of or hundreds of predetermined printing ink regions of radium carving simultaneously of single time, monolithic base plate can be accomplished in less time, the cost of preparation shading structure has further been reduced, the efficiency of preparation shading structure has further been improved.

Specifically, in the laser etching step, subsequent processes such as development are not needed, when the laser etching is carried out, the printing ink can be vaporized or partially melted under the action of laser energy, the printing ink layer can be blown by the laser etching, redundant printing ink can be removed, and a formed cutting channel is more smooth.

In another embodiment of the present application, before printing ink on the substrate by using a screen printing process to form an ink layer, the method further includes: and cleaning the substrate by using a cleaning solution containing an organic solvent. In this embodiment, the substrate is cleaned to clean and smooth the surface of the substrate, and the ink can be printed more efficiently subsequently.

In another embodiment of the present application, the cleaning solution includes acetone and isopropyl alcohol. Of course, the cleaning liquid is not limited to the above two cleaning liquids, and other cleaning liquids may be used as in the prior art.

In another embodiment of the present application, the substrate is a glass substrate, the thickness of the glass substrate is between 0.1 mm and 1.0mm, and the surface flatness TTV of the glass substrate is less than 20 μm. In this embodiment, a good support function of the substrate can be ensured.

In one embodiment, the glass substrate has a size of 3-12 inches. Of course, in the actual application process, a glass substrate with a suitable size can be selected according to actual requirements.

Certainly, the substrate in the application is not limited to a glass material, and may be made of other suitable transparent materials, and the material not only has a good light transmittance, but also needs to ensure that the substrate is not affected in the screen printing and laser etching processes.

In a specific embodiment of the present application, the ink is a black ink, the viscosity of the ink is between 1000-. In the embodiment, the thermosetting or photosensitive black ink is selected, so that the light shielding effect is better, the light source in the predetermined direction and position is ensured to be allowed to penetrate subsequently, the viscosity of the ink is set to be between 1000-.

Specifically, in one embodiment, the difference in thickness between different positions of the ink layer is less than 1 μm. Therefore, the ink layer can be further ensured to be relatively flat, and the shading action difference of different positions of the ink layer is ensured to be relatively small.

In order to further improve the uniformity of the printed ink layer, in another embodiment of the present application, the screen used in the screen printing is a metal screen. The wire mesh has stable wire mesh size and high printing precision, so the wire mesh is selected for use in the embodiment.

In another embodiment of the present application, a cross-sectional shape of the light shielding structure in a first predetermined direction is a taper shape, a vertex angle of the taper shape is θ, 0< θ <10 °, the first predetermined direction is a height direction of the light shielding structure, a cross-sectional shape of the light transmitting hole in a second predetermined direction is a circle, a radius of the circle is between 2 μm and 10 μm, and the second predetermined direction is perpendicular to the first predetermined direction. In this embodiment, because the upper and lower surface energy of glue film is different when radium carving is peeled off, can cause certain loss, and the area that leads to upper and lower surface to peel off is different, consequently, sets up cross sectional shape to the toper, and the apex angle be theta, and 0< theta <10, can guarantee that upper and lower surface glass's area is the same, with the circular shape size in the second predetermined direction and the size one-to-one of accurate microlens, can guarantee that light can propagate along the light path of formulating.

In particular, in one embodiment, the difference in size of each circle is less than 0.5 μm. Therefore, the difference between the plurality of light through holes can be further ensured to be small, and the light can be further ensured to be transmitted along the formulated light path.

In another embodiment of the present application, the laser is a picosecond laser. The light source of laser instrument needs to carry out special plastic, with laser energy control in the printing ink in situ, and can not lead to the fact the influence to the glass substrate, has weakened glass's intensity, and the picosecond laser instrument carries out the plastic back to the light source, can form a plurality of faculas to adjust the energy of emergent light according to the energy conservation, carve the position of a plurality of structures simultaneously, further improved radium carving's efficiency.

The application also provides a shading structure which is manufactured by any one of the manufacturing methods.

The shading structure is manufactured by any one of the manufacturing methods, the method avoids a complex manufacturing process in photoetching, the yield of the shading structure is high, high equipment investment caused by introducing photoresist is avoided, the manufacturing cost of the shading structure is low, and the structural consistency of the shading structure is good.

The application also provides an optical structure, which comprises a substrate, microlenses and shading structures, wherein the microlenses correspond to the shading structures one to one, the microlenses are arranged on the first surface of the substrate, the shading structures are arranged on the second surface of the substrate, the first surface and the second surface are arranged oppositely, and the shading structures are manufactured by adopting any one of the manufacturing methods.

The optical structure comprises the substrate, the micro lens and the shading structure, the shading structure is manufactured by any manufacturing method, the yield of the shading structure is high, the manufacturing cost is low, the light condensing effect of the micro lens is good, the light filtering effect of the substrate is good, the yield of the optical structure is high, the manufacturing cost is low, and the shading efficiency is high.

As shown in fig. 2, in the optical structure, the upper layer is a microlens 10, the middle layer is a glass substrate 11, and the lowest layer is a light-passing hole 12, and the optical principle is as follows: when a hand touches a fingerprint area of the screen, the OLED of the screen is lightened, the OLED of the screen irradiates on the fingerprint and is reflected to be downwards incident on the surface of the micro lens 10, the micro lens 10 has a light gathering effect, 0-degree incident light is gathered at the center of the light through hole 12, namely, the focus is completely coincided with the center of the light through hole 12, but the non-0-degree incident light is irradiated on the area outside the light through hole 12, so that the light filtering function can be realized, and a CMOS chip is arranged below the device and used for receiving the 0-degree incident light.

As shown in fig. 3, the two-dimensional distribution of the light passing holes is shown, and the area size is generally the size of the finger fingerprint, such as about 10 × 6 mm. Each hole is centrally aligned with an overlying microlens.

In order to make the technical solutions of the present application more clearly understood by those skilled in the art, the technical solutions and technical effects of the present application will be described below with reference to specific embodiments.

Example 1

The manufacturing process of the embodiment comprises the following steps of;

providing a glass substrate, as shown in FIG. 4, the glass substrate 11 having a thickness of 0.1-1.0mm and a size of 3-12 inches, and requiring a surface flatness TTV <20 μm;

as shown in fig. 4, the ink is uniformly coated on the glass substrate by screen printing to form an ink layer 13, as shown in fig. 5, the size of the printing screen is determined according to the size of the substrate, the size limitation is small, the advantages are convenient plate making and printing, less equipment investment, much lower cost compared with photolithography, and good economic benefit in small-batch production; the screen printing has small influence on glass, has small limits on the types and properties of the printing ink and does not need sensitization; the thickness of the printed ink layer is controlled to be 10-15 mu m, the ink layer can be formed by one-time printing, the thickness can be achieved by multiple times of printing, and the thickness tolerance of different positions needs to be controlled within +/-1 mu m. The silk screen used in printing generally adopts a metal silk screen, the size of the silk screen is stable, the precision of a printed product is high, and the uniformity of an ink layer after printing is good and can reach the standard;

then, performing laser etching on the ink layer by using a laser etching machine, as shown in fig. 6, specifically, a laser in the laser etching machine is a picosecond laser, the energy of the laser is actually adjusted to be between 0.1W and 10W according to the thickness and the type of the ink layer, the focal distance is focused on the surface of the ink layer, a CAD drawing of the shading structure is led into a computer, and the laser etching is performed according to set parameters; moreover, the light source of the laser needs to be specially shaped, laser energy is controlled in the ink layer, the glass substrate is not affected, the strength of the glass is weakened, a plurality of light spots can be formed after the laser shapes the light source, the energy of emergent light is adjusted according to energy conservation, a plurality of structural positions are engraved at the same time, the laser engraving efficiency is greatly improved, and 10000 shading structures with the number only need to be engraved for 1-5 min;

the laser engraving machine has high requirement on movement precision, the repeated position precision of the equipment is +/-1 mu m, the image recognition precision is within +/-3 mu m, the laser engraving machine has an automatic cleaning function, ink at the laser engraving part can be vaporized or partially melted under the action of laser energy, the laser engraving machine can blow air at the part to remove redundant ink materials, a plurality of formed light through holes 12 are shown in fig. 4, and the part on the right side of fig. 4 also shows a section view of a shading structure;

the shading structure prepared by the process has an inverted cone structure, the inverted cone angle is more than 0 and more than theta and less than 10 degrees, the size of the circular hole is 2-10 mu m, the circular hole is uniformly distributed, the size of the shading structure hole is 2-10 mu m, and the thickness of the shading ink layer is 10-15 mu m.

From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:

1) the manufacturing method of the shading structure comprises the steps of printing ink on a substrate by adopting a screen printing process, uniformly coating the ink on the substrate, uniformly forming an ink layer, removing at least part of the ink by adopting a preset device comprising a laser, eliminating part of the ink layer, and not influencing the light transmittance of the substrate. In addition, the method has no sensitivity requirement on ink materials, the ink selection range is greatly expanded, and in the screen printing process, the time for one-time printing is shorter than that of glue spreading/hot plate in the prior art, so that the efficiency of manufacturing the shading structure is improved.

2) The shading structure is manufactured by any one of the manufacturing methods, the method avoids a complex manufacturing process in photoetching, the yield of the shading structure is high, high equipment investment caused by introduction of photoresist is avoided, the manufacturing cost of the shading structure is low, and the structural consistency of the shading structure is good.

3) The optical structure comprises a substrate, a micro lens and a shading structure, wherein the shading structure is manufactured by adopting any one of the manufacturing methods, the yield of the shading structure is high, the manufacturing cost is low, the light condensation effect of the micro lens is good, the light filtering effect of the substrate is good, the yield of the optical structure is high, the manufacturing cost is low, and the shading efficiency is high.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.