阅读说明：本技术 一种声表滤波器件 (Acoustic surface filter ) 是由 弗兰克·李 刘贤栋 于 2021-07-09 设计创作，主要内容包括：一种声表滤波器件,该声表滤波器件包括具有功能电路的芯片和封装基板,芯片表面设置有外接金属盘,功能电路至少包括外接谐振器和非外接谐振器,外接谐振器连接外接金属盘,用于连接外部输入输出电路或接地电路,其中,芯片还包括：设置于芯片表面的散热金属盘,与至少一个非外接谐振器相连,作为非外接谐振器的散热通道,所述非外接谐振器通过所述散热金属盘连接到所述封装基板。本发明实施例通过散热金属盘悬空设置,在不影响性能的情况下,提高了声表滤波器件的散热能力。(The utility model provides a sound table filter, this sound table filter is including chip and the packaging substrate who has the function circuit, and the chip surface is provided with external metal dish, and the function circuit includes external syntonizer and non-external syntonizer at least, and external syntonizer is connected external metal dish for connect external input/output circuit or ground circuit, wherein, the chip still includes: and the heat dissipation metal disc is arranged on the surface of the chip, is connected with at least one non-external resonator and is used as a heat dissipation channel of the non-external resonator, and the non-external resonator is connected to the packaging substrate through the heat dissipation metal disc. According to the embodiment of the invention, the radiating metal plate is arranged in a suspended manner, so that the radiating capacity of the acoustic surface filter device is improved under the condition of not influencing the performance.)

1. The utility model provides an acoustic surface filter, is including chip and the packaging substrate that has functional circuit, the chip surface is provided with external metal disc, functional circuit is at least including external syntonizer and non-external syntonizer, external syntonizer is connected external metal disc for connect external input output circuit or ground circuit, its characterized in that, the chip still includes:

the heat dissipation metal disc is arranged on the surface of the chip and connected with at least one non-external resonator to serve as a heat dissipation channel of the non-external resonator, and the non-external resonator is connected to the packaging substrate through the heat dissipation metal disc.

2. The acoustic surface filter device of claim 1, wherein the heat dissipating metal disk is suspended.

3. The acoustic surface filter device of claim 1, wherein a plurality of connection points having a direct electrical connection to non-external resonators are connected to the same heat sink metal plate.

4. The acoustic surface filter device of claim 1, wherein the acoustic surface filter device comprises at least an external resonator and a non-external resonator connected in series, and the heat-dissipating metal plate is connected to a circuit node between the external resonator and the non-external resonator.

5. The acoustic surface filter device of claim 1, comprising at least two non-external resonators connected in series, wherein the heat sink metal plate connects a circuit node between the two non-external resonators.

6. The acoustic surface filter device of any one of claims 1-5, wherein the acoustic surface filter device comprises at least one package substrate, the package substrate comprising a heat sink, the heat sink metal disk being formed on a chip by a tape-out process, the heat sink metal disk being attached to the heat sink by a packaging process.

7. The acoustic surface filter device of claim 6, wherein the package substrate comprises at least a first package base layer adjacent to the chip and a second package base layer remote from the chip, the first package base layer being provided with a top heat sink, the second package base layer being provided with a bottom heat sink, the two package base layers including a dielectric layer therebetween; the top layer radiating fins are connected with the bottom layer radiating fins through via holes of the medium layer, and the radiating metal plate is connected with the top layer radiating fins in a heat conducting manner.

8. The acoustic surface filter device of claim 6, wherein the equivalent circuit of the heat-dissipating metal plate after being connected to the package substrate is grounded after an inductor and a capacitor are connected in series to a node of a non-external resonator connected to the heat-dissipating metal plate.

9. The acoustic surface filter device of claim 6, wherein the area of the heat spreading layer is related to the electrical performance of the non-external resonator to which it is connected.

10. The acoustic surface filter device of claim 1, wherein one or more external resonators are connected to the same external metal disk.

Technical Field

The embodiment of the invention relates to the heat dissipation technology of electronic components, in particular to a sound meter filter device.

Background

The acoustic surface filter is widely applied to various electronic devices due to the advantages of small volume and good performance. However, the power capacity of the conventional acoustic surface filter is small, and in order to improve the power capacity of the acoustic surface filter, the heat dissipation capability of the interdigital electrode needs to be improved, so that the problem of a short heat dissipation plate of the interdigital electrode is solved.

The sound meter filter based on Chip Scale Package (CSP) packages the Chip wafer and the Package substrate into a complete Chip by ball-planting or gold wire bonding technology, for example, the heat generated by Chip operation can be conducted to the Package substrate through the gold balls implanted in the wafer metal plate, and then conducted to the whole printed circuit board by the metal plate of the Package substrate to complete heat dissipation. As shown in fig. 1, a metal plate is provided on a resonator requiring electrical connection between an input/output terminal and a ground, thereby improving heat dissipation capability of the acoustic surface filter.

The prior art has the defects that: the heat dissipation of syntonizer has the short slab, and the syntonizer does not have good heat conduction channel can lead to the temperature to rise, produces deformation, and then influences the sound table filter performance, and then influences the power capacity of whole sound table filter.

Disclosure of Invention

The embodiment of the invention provides a sound meter filter device, which can be used for optimizing the problem of short plate in heat dissipation of the sound meter filter device and improving the heat dissipation capacity and power capacity of the sound meter filter device.

The embodiment of the invention provides an acoustic surface filter device, which comprises a chip with a functional circuit and a packaging substrate, wherein the surface of the chip is provided with an external metal disc, the functional circuit at least comprises an external resonator and a non-external resonator, the external resonator is connected with the external metal disc and is used for connecting an external input/output circuit or a grounding circuit, and the chip further comprises: the heat dissipation metal disc arranged on the surface of the chip is connected with at least one non-external resonator and used as a heat dissipation channel of the non-external resonator, and the non-external resonator is connected to the packaging substrate through the heat dissipation metal disc.

According to the embodiment of the invention, the problem that a resonator in the acoustic surface filter device is short in heat dissipation is solved by arranging the heat dissipation metal disc, the heat dissipation capacity of the acoustic surface filter device is improved, and the power capacity of the acoustic surface filter device is improved.

Drawings

FIG. 1 is a schematic diagram of a 7-ladder acoustic surface filter topology of the prior art;

fig. 2 is a schematic structural diagram of an acoustic surface filter device according to an embodiment of the present invention;

fig. 3 is a schematic diagram of an equivalent circuit connection of an acoustic surface filter device according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a package substrate in an acoustic surface filter device according to a second embodiment of the present invention;

fig. 5 is a schematic structural diagram of a two-layer package substrate in an acoustic surface filter device according to a second embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

Example one

Fig. 2 is a schematic structural diagram of an acoustic surface filter device according to a first embodiment of the present invention, which is applicable to a scheme for dissipating heat of an acoustic surface filter device including a plurality of resonators in the present embodiment, an embodiment of the present invention provides an acoustic surface filter device 101, where the acoustic surface filter device 101 includes a chip 102 and a package substrate 103 having a functional circuit, an external metal pad 106 is disposed on a surface of the chip, the functional circuit at least includes an external resonator 104 and a non-external resonator 105, the external resonator 104 is connected to the external metal pad 106 and is used for connecting an external input/output circuit or a ground circuit 108, where the chip further includes: the heat dissipation metal plate 107 disposed on the chip surface is connected to at least one non-external resonator 105 to serve as a heat dissipation channel for the non-external resonator 105, and the non-external resonator 106 is connected to the package substrate 103 through the heat dissipation metal plate 107.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating an equivalent circuit connection of an acoustic surface filter device according to an embodiment of the present invention, and this embodiment specifically takes a 7-ladder acoustic surface filter as an example of the acoustic surface filter device for description, but it is known by those skilled in the art that the present invention is not limited to the acoustic surface filter with a ladder structure.

The chip with the functional circuit is composed of a wafer, metal interdigital electrodes (resonators) etched on the piezoelectric wafer, resonator metal wiring and an auxiliary circuit. The surface of the chip is provided with an external metal disc, the functional circuit at least comprises an external resonator and a non-external resonator, and the external resonator is connected with the external metal disc and is used for connecting an external input and output circuit or a grounding circuit. The number of external resonators and the number of non-external resonators may be one or more, and the specific number of resonators is not limited in the embodiments of the present invention. The resonator is a device for generating resonant frequency, has the characteristics of stability and good anti-interference performance, and is widely applied to various electronic products. Illustratively, the external metal disk connected with the input circuit by the external resonator is called an input metal disk, the external metal disk connected with the output circuit by the external resonator is called an output metal disk, and the external metal disk connected with the grounding circuit by the external resonator is called a grounding metal disk.

The chip further comprises: the heat dissipation metal disc arranged on the surface of the chip is connected with at least one non-external resonator and used as a heat dissipation channel of the non-external resonator, and the non-external resonator is connected to the packaging substrate through the heat dissipation metal disc. The non-external resonators are resonators other than the external resonators, and are generally connected between the external resonators. The at least one non-external resonator means that the number of the non-external resonators may be one or more, and the specific number of the non-external resonators is not limited in the embodiment of the present invention.

The heat dissipation metal disc is arranged in a suspension mode, the suspension mode means that the heat dissipation metal disc is not in direct ohmic contact with an external circuit of the substrate, and the heat dissipation metal disc is connected to the heat dissipation fins in the substrate. The radiating metal disc is used as a radiating channel of the non-external resonator, so that the radiating channel is added under the condition of not influencing the performance, the radiating area is enlarged, and the radiating capacity of the resonator can be improved.

This embodiment will be described by taking a 7-ladder acoustic surface filter and a heat dissipation metal plate as an example, as shown in fig. 3. S1, S2, S3 and S4 are 4 groups of series resonators, P1, P2 and P3 are 3 groups of parallel resonators, and L1, L2, L3 and L4 are parasitic inductances of the package substrate; s1, S4, P1 and P3 are external resonators. The S1 resonator is used for connecting an external input circuit, and the S1 resonator is connected with an input metal plate; the S4 resonator is used for connecting an external output circuit, and the S4 resonator is connected with an output metal plate; the P1 and P3 external resonators are used for being connected with a grounding circuit, and the P1 and P3 resonators are respectively connected with the grounding metal plate 1 and the grounding metal plate 2. S2, S3 and P2 are non-external resonators, a heat dissipation metal disc is added at the connection point of S2, S3 and P2, the metal disc is a suspended metal disc, and an equivalent circuit of the heat dissipation metal disc is that an inductor L5 is connected in series with a capacitor C1. The radiating metal plate is not limited to the connection points of S2, S3 and P2, and is not limited to the trapezoidal acoustic surface filter, and the radiating metal plate can be added to the connection points of the resonators needing special radiating treatment for radiating. For example, the method can be used in the special case that only two external series resonators exist, and the middle connection point of the two external resonators can also be connected with the heat dissipation metal plate.

The external resonator of the embodiment of the invention is connected with an external metal disc for connecting an external input/output circuit or a grounding circuit, the heat dissipation metal disc is connected with at least one group of non-external resonators, and the heat dissipation metal disc is arranged in a suspended manner and is used as a heat dissipation channel of the non-external resonators. According to the invention, the radiating metal disc is arranged in a suspended manner, so that the problem of short plate existing in the radiating of the resonator in the acoustic surface filter is solved, the radiating capacity of the acoustic surface filter is improved, and the power capacity of the acoustic surface filter is improved.

Example two

Fig. 4 is a schematic structural diagram of a package substrate of an acoustic surface filter device according to a second embodiment of the present invention. The present embodiment is detailed based on the above-described embodiments.

A plurality of connection points having a direct electrical connection to a non-external resonator are connected to the same heat sink metal plate. The acoustic surface filter device at least comprises an external resonator and a non-external resonator which are connected in series, and the heat dissipation metal disc is connected with a circuit node between the external resonator and the non-external resonator. The acoustic surface filter device at least comprises two non-external resonators connected in series, and the heat dissipation metal disc is connected with a circuit node between the two non-external resonators.

Exemplarily, referring to fig. 3, S1, S2, S3, S4 are 4 series resonators, P1, P2, P3 are 3 parallel resonators, the S1 and S2 resonators located at both ends are external resonators connected in series, and the S2 and S3 located at the middle are non-external resonators connected in series. The connection points of the adjacent series resonators S1 and S2, S2 and S3, and S3 and S4 are respectively connected with the parallel resonators P1, P2 and P3, and the parallel resonators P1, P2 and P3 are external resonators. The connection points of the middle two sets of resonators S2 and S3, one connected to the parallel resonator P2 and one connected to the heat sink metal plate. The acoustic surface filter device at least comprises two non-external resonators connected in series, at least two non-external resonators connected in series can be two or more, and the specific number of the non-external resonators connected in series is not limited in the embodiment of the invention. The point between the S2 and S3 resonators is the connection point for the non-external resonator with a direct electrical connection, and the heat sink metal pad connects the circuit node between the S2 and S3 resonators. A plurality of connection points having a direct electrical connection to a non-external resonator are connected to the same heat sink metal plate. The points between the S2 resonators and the S3 resonators are connected with the heat dissipation metal disc, the same heat dissipation metal disc can also be connected with a plurality of electrical connection points, the connection points of a plurality of non-external resonators needing heat dissipation treatment can be connected with the same heat dissipation metal disc, the heat dissipation metal disc does not need to be arranged independently at each connection point, and cost can be effectively reduced.

The acoustic surface filter device comprises at least one package substrate, the package substrate comprises a heat sink, a heat dissipation metal disc is formed on a chip through a flow sheet process, and the heat dissipation metal disc is connected to the heat sink through a packaging process.

The acoustic surface filter device comprises at least one package substrate, at least one package substrate can be one or more than one, and the specific number of the package substrates is not limited in the embodiment of the invention. The tape-out process refers to a process of forming a circuit on a wafer chip, the packaging process refers to a process of connecting a packaging substrate and a chip together, and the common chip packaging process includes a link of ball mounting or gold wire bonding. Referring to fig. 4, a heat-dissipating metal pad 201 is formed on a chip 202 by a tape-out process, and the heat-dissipating metal pad 201 is connected to a heat sink 204 of a package substrate 203 by ball bonding. The ball planting mainly enables the heat dissipation metal disc and the radiating fins to form stable ohmic contact, and is convenient for the heat dissipation metal disc to be connected with the radiating fins and heat dissipation.

The packaging substrate at least comprises a first packaging base layer adjacent to the chip and a second packaging base layer far away from the chip, the first packaging base layer is provided with a top-layer radiating fin, the second packaging base layer is provided with a bottom-layer radiating fin, and a dielectric layer is arranged between the two packaging base layers; the top-layer radiating fins are connected with the bottom-layer radiating fins through the through holes of the medium layers, and the radiating metal discs are connected with the top-layer radiating fins in a heat conducting manner.

The package substrate may be one layer or multiple layers, and the embodiment specifically takes a two-layer package substrate as an example for description, but those skilled in the art will understand that the package substrate is not limited to a two-layer package substrate. Illustratively, referring to fig. 5, the package substrate 203 includes a first package base layer 205 adjacent to the chip and a second package base layer 206 away from the chip, the first package base layer 205 is provided with a top heat sink 207, the second package base layer 206 is provided with a bottom heat sink 208, a dielectric layer is between the first package base layer 205 and the second package base layer 206, the top heat sink 207 is directly connected to the bottom heat sink 208 provided on the second package base layer 206 through a through hole 209 of the dielectric layer, and the heat dissipation metal plate 201 is connected to the top heat sink 207 through a ball-mounting process. The ball-planting process can be carried out by using gold, silver, copper and other metal materials. The principle of the multi-layer package substrate is the same as above, and is not described herein again. Another special example is that the bottom of the package substrate is also provided with a heat dissipation metal disc connected through a via hole, and the heat dissipation metal disc is not electrically connected with any circuit on the PCB after being connected with a metal heat dissipation island on the PCB main board, and only plays a role in heat dissipation.

The equivalent circuit of the radiating metal disk connected with the packaging substrate is that the node of the non-external resonator connected with the radiating metal disk is connected with an inductor and a capacitor in series and then is grounded. The area of the heat sink layer is related to the electrical performance of the non-external resonator to which it is connected.

The heat dissipation metal disc is connected to the top-layer heat dissipation sheet of the packaging substrate through a ball-planting or gold wire bonding process, the heat dissipation sheets in the substrate are communicated through the through holes, the heat dissipation metal disc is equivalent to an inductor and a capacitor which are connected in series and then grounded, and the influence brought by the inductor and the capacitor needs to be considered during design. The inductance value can be adjusted through the size and the quantity of via hole, and the capacitance value is adjusted through the size of control bottom fin area, and equivalent inductance and electric capacity are relevant with the electric property of non-external resonator. When the heat dissipation capacity is large, the area of the heat dissipation layer needs to be increased, the heat dissipation channel is shortened, and quick heat dissipation is realized; when the heat dissipation amount is small, the area of the heat dissipation layer can be reduced, the electrical performance is mainly the frequency characteristic, and the design of the heat dissipation layer needs to balance the frequency characteristic of the filter.

Optionally, one or more external resonators are connected to the same external metal pad. The external resonator can be connected with one external metal disc, and a plurality of external resonators can also be connected with the same external metal disc.

The embodiment of the invention aims at the problem that the resonator in the current acoustic surface filter has a short plate in the heat dissipation process, solves the problem that the resonator has more heat dissipation by adding a suspended heat dissipation metal disc to the resonator needing heat dissipation, solves the problem that the resonator has no good heat dissipation channel and generates deformation due to overhigh temperature, and improves the heat dissipation capability and performance of the resonator under the condition of not influencing the performance.

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.