阅读说明：本技术 一种石英透镜的移除方法 (Method for removing quartz lens ) 是由 朱祝司 龚荟卓 于 2021-08-30 设计创作，主要内容包括：本发明提供一种石英透镜的移除方法,所述石英透镜设置于一反应腔内,所述反应腔内还设置有光源,所述光源设置于所述石英透镜上方,其特征在于,包括：将所述光源取出所述反应腔；提供保护罩,所述保护罩为一端开口的腔体,所述保护罩的顶面具有贯穿的通孔,将所述保护罩盖在所述石英透镜上,所述通孔露出所述石英透镜的部分顶面；以及,利用真空吸盘吸附所述石英透镜露出的顶面,以将所述石英透镜移出所述反应腔,避免所述石英透镜在移动过程中与外界设备磕碰造成损伤。(The invention provides a quartz lens removing method, wherein the quartz lens is arranged in a reaction chamber, a light source is also arranged in the reaction chamber, and the light source is arranged above the quartz lens, and the quartz lens removing method is characterized by comprising the following steps: taking the light source out of the reaction cavity; providing a protective cover, wherein the protective cover is a cavity with an opening at one end, a through hole is formed in the top surface of the protective cover, the protective cover covers the quartz lens, and the through hole exposes out of part of the top surface of the quartz lens; and adsorbing the exposed top surface of the quartz lens by using a vacuum chuck to move the quartz lens out of the reaction cavity, so as to avoid damage caused by collision of the quartz lens with external equipment in the moving process.)

1. A quartz lens removing method is provided, the quartz lens is arranged in a reaction chamber, a light source is further arranged in the reaction chamber, and the light source is arranged above the quartz lens, and the quartz lens removing method is characterized by comprising the following steps:

taking the light source out of the reaction cavity;

providing a protective cover, wherein the protective cover is a cavity with an opening at one end, a through hole is formed in the top surface of the protective cover, the protective cover covers the quartz lens, and the through hole exposes out of part of the top surface of the quartz lens; and the number of the first and second groups,

and adsorbing the exposed top surface of the quartz lens by using a vacuum chuck so as to move the quartz lens out of the reaction cavity.

2. The method of claim 1, wherein the top surface and the side surface of the protective cover are rounded.

3. The method of claim 1, wherein the protective cap is made of teflon.

4. The method of claim 1, wherein a first elastic protection layer is disposed on an inner wall of the protective cover.

5. The method for removing a quartz lens according to claim 4, wherein the first elastic protection layer is made of silicone rubber or fluorinated rubber.

6. The method of claim 1, wherein the quartz lens is removed and placed on a movable base.

7. The method according to claim 1, wherein a center axis of the through hole coincides with a center axis of the quartz lens after the protective cap is placed on the quartz lens.

8. The method of claim 1, wherein the inner diameter of the protective cover is 295mm to 305 mm.

9. The method of claim 1, wherein the through hole has an inner diameter of 170mm to 230 mm.

10. The method of claim 1, wherein the reaction chamber is a reaction chamber of a light-enhanced chemical vapor deposition apparatus, and the light source is an ultraviolet light source.

Technical Field

The invention relates to the field of semiconductors, in particular to a quartz lens removing method.

Background

The quartz lens has good mechanical property, thermal physical property, optical property and chemical stability, and can transmit ultraviolet rays, so that the quartz lens is widely applied to high-temperature instruments and optical equipment. When high-stress silicon nitride film deposition is realized, a light-enhanced chemical vapor deposition device is needed to form a light-enhanced film, when a reaction cavity of the light-enhanced chemical vapor deposition device is overhauled, a light source and a quartz lens in the reaction cavity need to be removed, but the brittleness of the quartz lens is poor, and in the transfer process, the quartz lens easily collides with the inner wall of the reaction cavity or other devices, so that the edge is damaged, and the quartz lens cannot be used continuously.

Disclosure of Invention

The invention aims to provide a quartz lens removing method to protect the edge of a quartz lens from being damaged in the moving process.

In order to achieve the above object, the present invention provides a method for removing a quartz lens, wherein the quartz lens is disposed in a reaction chamber, the reaction chamber is further disposed with a light source disposed above the quartz lens, the method comprising:

taking the light source out of the reaction cavity;

providing a protective cover, wherein the protective cover is a cavity with an opening at one end, a through hole is formed in the top surface of the protective cover, the protective cover covers the quartz lens, and the through hole exposes out of part of the top surface of the quartz lens; and the number of the first and second groups,

and adsorbing the exposed top surface of the quartz lens by using a vacuum chuck so as to move the quartz lens out of the reaction cavity.

Optionally, a rounded corner is formed between the top surface and the side surface of the protective cover.

Optionally, the material of the protective cover is teflon.

Optionally, a first elastic protection layer is arranged on the inner wall of the protection cover.

Optionally, the first elastic protection layer is made of silicon rubber or fluorinated rubber.

Optionally, the quartz lens is taken out and placed on a movable base.

Optionally, after the protective cover is placed on the quartz lens, a central axis of the through hole coincides with a central axis of the quartz lens.

Optionally, the inner diameter of the protective cover is 295 mm-305 mm.

Optionally, the inner diameter of the through hole is 170 mm-230 mm.

Optionally, the reaction chamber is a reaction chamber in a light-enhanced chemical vapor deposition apparatus, and the light source is an ultraviolet light source.

In the quartz lens removing method provided by the invention, a light source and a quartz lens are arranged in the reaction cavity, the light source is positioned on the quartz lens, and the light source is taken out of the reaction cavity; providing a protective cover, wherein the protective cover is a cavity with an opening at one end, a through hole is formed in the top surface of the protective cover, the protective cover covers the quartz lens, and the through hole exposes out of part of the top surface of the quartz lens; and utilize vacuum chuck absorption the top surface that quartz lens exposes, in order to with quartz lens shifts out the reaction chamber, the safety cover can protect quartz lens is not collided with at the removal in-process, reduces the edge impaired, can save manpower and material resources of maintaining effectively to can reduce the number of times of changing damaged quartz lens, save financial resources.

Drawings

FIG. 1 is a schematic structural diagram of a reaction chamber of a light-enhanced chemical vapor deposition apparatus;

FIG. 2 is a flowchart illustrating a method for removing a quartz lens according to an embodiment of the present invention;

FIGS. 3a to 3d are schematic structural diagrams corresponding to respective steps of a method for removing a quartz lens according to an embodiment of the present invention;

wherein the drawings are described as follows:

100-a reaction chamber; 101-a light source; 102-quartz lens; 103-wafer carrying module; 104-a protective cover; 106-a via; 108-vacuum chuck; 110-a first elastic protective layer; 112-a base; 114-a card board; 116-a second elastic protection layer.

Detailed Description

To further clarify the objects, advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.

The light-enhanced chemical vapor deposition equipment can excite the process gas under ultraviolet light and low temperature conditions (<150 ℃) to realize dielectric film deposition, and can be used for depositing silicon dioxide films, silicon nitride films, silicon oxynitride films and the like. Fig. 1 is a schematic structural diagram of a reaction chamber of a light-enhanced chemical vapor deposition apparatus, as shown in fig. 1, a quartz lens 102, a light source 101 and a wafer carrying module 103 are disposed in a reaction chamber 100 of the light-enhanced chemical vapor deposition apparatus, the quartz lens 102 is located above the wafer carrying module 103, the light source 101 is located above the quartz lens 102, and the light source 101 is typically an ultraviolet light source. Fig. 2 is a flowchart of a method for removing a quartz lens according to the present embodiment, and as shown in fig. 2, the present invention provides a method for removing a quartz lens, including:

step S1: taking the light source out of the reaction cavity;

step S2: providing a protective cover, wherein the protective cover is a cavity with an opening at one end, a through hole is formed in the top surface of the protective cover, the protective cover covers the quartz lens, and the through hole exposes out of part of the top surface of the quartz lens;

step S3: and adsorbing the exposed top surface of the quartz lens by using a vacuum chuck so as to move the quartz lens out of the reaction cavity.

Fig. 3a to 3c are schematic structural diagrams corresponding to corresponding steps of a method for removing a quartz lens according to this embodiment, and the method for removing a quartz lens according to this embodiment is described in more detail below with reference to fig. 3a to 3c, in which alternative embodiments of the present invention are illustrated.

As shown in fig. 3a, step S1 is performed, and the reaction chamber 100 has an opening, for example, at the top of the reaction chamber 100, through which the light source is taken out of the reaction chamber 100.

As shown in fig. 3b, step S2 is executed to provide a protective cover 104, where the protective cover 104 is a cavity with an open end, a top surface of the protective cover 104 has a through hole 106, the protective cover 104 is covered on the quartz lens 102, and the through hole 106 exposes a part of the top surface of the quartz lens 102.

In this embodiment, the protective cover 104 is a cylinder, and the inner diameter of the protective cover 104 is 300mm to 305 mm. The protective cover 104 is moved into the reaction chamber 100 through the opening and the protective cover 104 is covered on the quartz lens 102.

Because the temperature of the quartz lens 102 is higher than the room temperature when the quartz lens 102 works in the reaction chamber 100, the influence of thermal expansion and cold contraction on the size of the quartz lens 102 and the size of the protection cover 104 is considered, the difference between the inner diameter of the protection cover 104 and the outer diameter of the quartz lens 102 is larger than 2mm, and the situation that the quartz lens 102 and the protection cover 104 are difficult to sleeve or separate due to the fact that the difference is too small in size is avoided. Meanwhile, the difference between the inner diameter of the protective cover 104 and the outer diameter of the quartz lens 102 is smaller than 5mm, so that the quartz lens 102 is prevented from colliding with the inner wall of the protective cover 104 in the moving process to cause damage.

In this embodiment, the height of the protective cover 104 is 20mm to 30mm, which is not limited in the present invention, and it is only required to ensure that the height of the protective cover 104 is greater than the height of the quartz lens 102, so that the quartz lens 102 is entirely located in the protective cover 104, and the quartz lens 102 is more comprehensively protected.

Further, the inner wall of the protective cover 104 is rounded off from the top side to the side. Because the difference between the outer diameter of the protective cover 104 and the inner diameter of the quartz lens 102 is less than 5mm, and considering the influence of thermal expansion and contraction of the quartz lens 102 and the protective cover 104, the rounded corner between the top surface and the side surface of the inner wall can make the quartz lens 102 more easily come out of the protective cover 104, and better protect the edge of the quartz lens 102.

In this embodiment, the top surface and the side surface of the outer wall of the protective cover 104 are rounded to avoid damage to the reaction chamber 100 when the quartz lens 102 collides with the reaction chamber 100. In alternative embodiments, the top and side surfaces of the protective cover 104 may be chamfered at other angles.

The inner wall of the protective cover 104 is provided with a first elastic protection layer 110, specifically, a rounded corner is formed between the top surface and the side surface of the inner wall of the first elastic protection layer 110, so that the quartz lens 102 can be smoothly released from the quartz lens protection device under the condition of large temperature change, and the edge of the quartz lens 102 is better protected from being damaged. The material of the first elastic protection layer 110 is a heat-resistant elastic material, such as: silicone rubber and fluorinated rubber, which protect the quartz lens 110 while withstanding the higher temperatures in the apparatus.

In other alternative embodiments, the first elastic protection layer 110 may not be provided.

The protective cover 104 needs to be placed in the reaction chamber 100 to transfer the quartz lens 102, and since the temperature of the quartz lens 102 is higher than 100 ℃ when the quartz lens 102 works in the reaction chamber 100, the protective cover 104 is made of a heat-resistant material. In this embodiment, the protective cover 104 is made of teflon (polytetrafluoroethylene), which has excellent heat resistance, can resist high temperature up to 300 ℃ in a short time, and can continuously work at 240-260 ℃; the friction coefficient of Teflon is low, the friction coefficient is only 0.05-0.15 when a load slides, and the quartz lens 102 can be effectively prevented from being damaged by friction between the quartz lens 102 and the protective cover 104; meanwhile, Teflon has good corrosion resistance, wear resistance and non-adhesion, the service life of the protective cover 104 can be effectively prolonged, and workers can clean the protective cover conveniently. Meanwhile, the hardness of teflon is shore D59, which is relatively low, so that the quartz lens 102 can be better protected.

As shown in fig. 3c, step S3 is executed to suck the exposed top surface of the quartz lens 102 by the vacuum chuck 108, and to move the quartz lens 102 out of the reaction chamber 100 through the opening.

Specifically, the vacuum chuck 108 penetrates through the through hole 106 to adsorb the quartz lens 102 and drives the quartz lens 102 and the protective cover 104 to move together, in this embodiment, the through hole 106 is circular, and a central axis of the through hole 106 coincides with a central axis of the quartz lens 102, so that the vacuum chuck 108 adsorbs the center of the quartz lens 102, thereby ensuring stability of the quartz lens 102 and the protective cover 104 in the moving process. Further, the inner diameter of the through hole 106 is 170 mm-230 mm, the size difference between the through hole 106 and the protective cover 104 is smaller than 100mm, and the remaining circular ring part on the top surface of the protective cover 104 is used for protecting the quartz lens 102 and further ensuring the stability of the quartz lens 102 and the protective cover 104 in the moving process.

As shown in FIG. 3d, the quartz lens 102 and the protective cover 104 are placed on the pedestal 112 after the vacuum chuck 108 removes the lens from the reaction chamber 100.

Specifically, the base 112 is disposed at the bottom of the protection cover 104, and the base 112 and the protection cover 104 are detachably connected, in this embodiment, at least four clamping plates 110 are disposed on the base 112, and the clamping plates 114 are uniformly distributed outside the protection cover 104 and used for limiting the position of the protection cover 104. In other alternative embodiments, a snap-fit connection may be used, or a groove may be formed in the base 112 to fit the cover 104 to secure the cover 104.

After the quartz lens 102 and the protection cover 104 are taken out of the reaction chamber 100 by the vacuum chuck 108, they are placed on the base 108, so as to avoid damage to the bottom surface of the quartz lens 102 in the process of contacting with the outside, and meanwhile, the base 112 can bear the quartz lens 102 and the protection cover 104 for subsequent movement, thereby facilitating the operation of the staff. The base 112 is made of a heat-resistant material with hardness less than that of the quartz lens 102, so as to avoid damage to the quartz lens 102.

In this embodiment, a second elastic protection layer 116 is disposed on the base 112, and the second elastic protection layer 116 is made of a heat-resistant elastic material, such as: silicone rubber and fluorinated rubber; or the second elastic protection layer 116 is made of teflon, so as to further avoid the damage caused by the friction between the quartz lens 102 and the base 112.

In alternative embodiments, the quartz lens 102 and the protective cover 104 may be placed directly on a table top.

In summary, in the method for removing a quartz lens provided by the present invention, a light source and a quartz lens 102 are disposed in the reaction chamber 100, the light source is located on the quartz lens 102, and the light source is taken out of the reaction chamber 100; providing a protective cover 104, wherein the protective cover 104 is a cavity with an open end, the top surface of the protective cover 104 is provided with a through hole 106, the protective cover 104 is covered on the quartz lens 102, and the through hole 106 exposes a part of the top surface of the quartz lens 102; and the exposed top surface of the quartz lens 102 is adsorbed by the vacuum chuck 108, so that the quartz lens 102 is moved out of the reaction chamber 100, the protective cover 104 can protect the quartz lens 102 from being collided in the moving process, the edge damage is reduced, the manpower and material resources for maintenance can be effectively saved, the number of times of replacing and damaging the quartz lens 102 can be reduced, and the financial resources are saved. A round angle is formed between the top surface and the side surface of the inner wall of the protective cover 104, so that the edge of the quartz lens 102 is further protected from being damaged; the base 112 is arranged at the bottom of the protective cover 104, so that the quartz lens 102 is prevented from colliding with the outside during the placement process of the quartz lens 102, and meanwhile, the subsequent movement of the quartz lens 102 by workers is facilitated.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.