阅读说明：本技术 贴片式陶瓷热敏电阻基片输送装置中的保序机构 (Order-preserving mechanism in chip-type ceramic thermistor substrate conveying device ) 是由 张志高 蒋建毅 唐晓杰 张培金 张燕琴 于 2021-09-08 设计创作，主要内容包括：本发明提供了一种贴片式陶瓷热敏电阻基片输送装置,属于机械技术领域。它解决了现有技术存在着稳定性差的问题。本贴片式陶瓷热敏电阻基片输送装置中的保序机构设置在输送板处,包括定位筒、弹簧和拨片,上述定位筒固连在输送板下边沿处,上述拨片内端嵌于定位筒内且弹簧位于定位筒与拨片内端之间,上述拨片外端靠近于输送槽端口处。本贴片式陶瓷热敏电阻基片输送装置稳定性高。(The invention provides a chip type ceramic thermistor substrate conveying device, and belongs to the technical field of machinery. It has solved prior art and has had the poor problem of stability. This protect preface mechanism among SMD ceramic thermistor substrate conveyor sets up in delivery board department, including a location section of thick bamboo, spring and plectrum, above-mentioned a location section of thick bamboo links firmly in delivery board lower limb department, and the inner embedding of above-mentioned plectrum is in a location section of thick bamboo and the spring is located between a location section of thick bamboo and the inner of plectrum, and above-mentioned plectrum outer end is close to in delivery chute port department. This SMD ceramic thermistor substrate conveyor stability is high.)

1. The utility model provides an order preserving mechanism among SMD ceramic thermistor substrate conveyor, SMD ceramic thermistor substrate conveyor is including being long banding delivery board, and above-mentioned delivery board lateral part has recessed conveyer trough along its length direction, and its characterized in that, this mechanism sets up in delivery board department, including a location section of thick bamboo, spring and plectrum, and above-mentioned location section of thick bamboo links firmly border department under the delivery board, and the inner inlays in a location section of thick bamboo and the spring is located between a location section of thick bamboo and the plectrum is inner in the above-mentioned plectrum, and above-mentioned plectrum outer end is close to in delivery trough port department.

2. The sequence preserving mechanism of the chip mounting type ceramic thermistor substrate conveying device according to claim 1, wherein the conveying plate is arranged obliquely.

3. The sequence preserving mechanism of the chip mounting type ceramic thermistor substrate conveying device according to claim 2, wherein the inclination angle of the conveying plate is 10-30 degrees.

4. The sequence preserving mechanism of the chip mounting type ceramic thermistor substrate conveying device according to claim 3, wherein an outer end of the paddle is an inclined paddle portion, and an included angle between the paddle portion and the paddle is 150-160 degrees.

5. The sequence preserving mechanism of the chip mounting type ceramic thermistor substrate conveying device according to claim 4, wherein the toggle part and the toggle piece are of an integrated structure.

6. The sequence preserving mechanism of claim 5, wherein the positioning cylinder has a through hole at a side thereof, and the dial has a pin inserted into the through hole, and the pin tends to abut against the port of the through hole under the action of the spring force of the spring.

7. The sequence preserving mechanism of claim 6, wherein the positioning cylinder has a connecting section at a lower portion thereof, and the connecting section is fixedly connected to the lower side of the conveying plate by a fastening member.

8. The sequence preserving mechanism of the chip mounting type ceramic thermistor substrate conveying device according to claim 7, wherein the positioning cylinder and the connecting section are of an integrated structure.

9. The sequence preserving mechanism of claim 8, wherein the conveying plate has a recessed positioning groove at a lower side of the conveying groove, and the positioning groove has a contact strip of ceramic material connected therein, and the contact strip is flush with an inner side of the positioning groove.

10. The sequence preserving mechanism of claim 9, wherein the contact strip has a through positioning hole, and the fastening member is sequentially disposed through the positioning hole of the contact strip, the conveying plate and the connecting segment to connect the three.

Technical Field

The invention belongs to the technical field of machinery, and relates to a sequence preserving mechanism in a surface mount type ceramic thermistor substrate conveying device.

Background

The chip type ceramic thermistor substrate is in a long-direction chip shape, and the resistor substrate needs to be sequentially conveyed from one procedure to the next procedure in industrial production.

The existing conveying device generally comprises a rack and a conveying channel connected to the rack, wherein the resistance substrate continuously enters the conveying channel, and the resistance substrate in the conveying channel is pushed and extruded by the resistance substrate continuously input into the conveying channel, so that the resistance substrate is ensured to stably move along the conveying channel.

In the ideal transport state, each resistor substrate is placed against the transport channel and is adjacent one after the other. However, the vibration generated during the transportation process may cause the resistor substrate to warp, and the warped resistor substrate may overlap two adjacent resistor substrates, which affects the transportation stability.

Chinese patent publication No. CN212608291U discloses a vibration hopper mechanism, which belongs to the field of machinery and comprises a vibration hopper, wherein one side of the vibration hopper is fixedly connected with a hook, one side of the hook is detachably connected with a water pump, one end of the water pump is connected with a water pipe A in an embedded manner, the top of the water pump is detachably connected with a water pipe B, the top of the water pipe B is fixedly connected with a transverse pipe, the surface of the transverse pipe is detachably connected with an atomization nozzle, the bottom of the transverse pipe is detachably connected with a transverse block, the bottom of the transverse block is fixedly connected with the surface of the top of the vibration hopper, the atomization nozzle capable of detachably connecting the surface of the transverse pipe converts water flow into water mist to be sprayed out, namely, the generated dust is quickly degraded, the transverse pipe is fixed with the top of the vibration hopper through the transverse block detachably connected with the bottom, namely, the water pump is connected with the hook fixedly connected with one side of the vibration hopper, so that the whole mechanism has a good dust removing structure, when the dust remover works, the dust pollution is less, and the influence on environment protection is reduced.

It can be seen that the vibratory hopper has only a single annular conveying channel, and materials may overlap during the conveying process, affecting the conveying stability.

Disclosure of Invention

The invention aims to provide a sequence-preserving mechanism in a chip-type ceramic thermistor substrate conveying device, which has high stability and a compact structure and aims to solve the problems in the prior art.

The purpose of the invention can be realized by the following technical scheme:

the utility model provides an order preserving mechanism among SMD ceramic thermistor substrate conveyor, SMD ceramic thermistor substrate conveyor is including being long banding delivery board, and above-mentioned delivery board lateral part has recessed conveyer trough along its length direction, and its characterized in that, this mechanism sets up in delivery board department, including a location section of thick bamboo, spring and plectrum, and above-mentioned location section of thick bamboo links firmly border department under the delivery board, and the inner inlays in a location section of thick bamboo and the spring is located between a location section of thick bamboo and the plectrum is inner in the above-mentioned plectrum, and above-mentioned plectrum outer end is close to in delivery trough port department.

The order-preserving mechanism in the chip-type ceramic thermistor substrate conveying device creatively connects the positioning barrel, the spring and the shifting piece on the side part of the conveying plate.

The lower dial sheet has a tendency of extending out of the positioning cylinder under the elastic force of the spring.

The width of the resistance substrate is matched with the width of the conveying groove, and the ideal state is as follows: the resistance substrates are attached to the bottom of the conveying groove, and the end parts of the two adjacent resistance substrates are abutted together.

However, a part of the resistive substrate may be lifted and stacked on the resistive substrate adjacent thereto due to the influence of vibration during the conveyance. It can be seen that when this occurs, the resistive substrate may fall off during transport and it is not possible to get the resistive substrate into the next process in order.

The sequence protection mechanism creatively enables the outer end of the poking sheet to be close to the port of the conveying groove, and at the moment, the size of the space between the outer end of the poking sheet and the bottom of the conveying groove is slightly larger than the thickness of the resistor substrate. That is, the resistance substrate closely attached to the bottom of the conveying trough can stably pass through the outer end of the poking sheet. On the contrary, when the resistance substrate is tilted, the tilted resistance substrate is blocked by the outer end of the poking sheet and is removed from the conveying groove, and the resistance substrate passed by the poking sheet is tightly attached to the bottom of the positioning groove, so that the purpose of stable conveying is achieved.

When the outer end of the plectrum is contacted with the tilted resistance substrate, the spring is compressed, and the plectrum is prevented from being rigidly contacted with the resistance substrate through the buffer action of the spring.

In the order-preserving mechanism in the chip-type ceramic thermistor substrate conveying device, the conveying plate is obliquely arranged.

In the order-preserving mechanism in the chip-type ceramic thermistor substrate conveying device, the inclination angle of the conveying plate is 10-30 degrees.

The conveying plate inclines, and the conveying groove also inclines, so that the structure can ensure that the resistance substrate is stably positioned in the conveying groove.

In the order preserving mechanism in the chip type ceramic thermistor substrate conveying device, the outer end of the poking piece is an inclined poking part, and an included angle between the poking part and the poking piece is 150-160 degrees.

The structure can ensure that the positioning cylinder and the conveying plate are spaced at a proper interval, avoid the contact of the positioning and reversing cylinder and the resistance substrate in the conveying groove and effectively improve the overall stability of the conveying groove.

In the order-preserving mechanism in the chip-type ceramic thermistor substrate conveying device, the shifting part and the shifting piece are of an integrated structure.

In the order preserving mechanism in the surface mount type ceramic thermistor substrate conveying device, the side part of the positioning cylinder is provided with a limiting hole which is penetrated through in a strip shape, the dial piece is fixedly connected with a limiting pin, the limiting pin is embedded in the limiting hole, and the limiting pin has the tendency of abutting against the port of the limiting hole under the elastic action of the spring.

The structure can ensure that the plectrum moves in the set stroke range, and the plectrum is prevented from being separated from the positioning barrel.

In the order preserving mechanism in the chip-type ceramic thermistor substrate conveying device, the lower part of the positioning cylinder is provided with a connecting section, and the connecting section is fixedly connected with the lower side of the conveying plate through a fastener.

Can not only be with the stable connection of a location section of thick bamboo on the delivery board through the linkage segment, but also can make and keep suitable interval between a location section of thick bamboo and the delivery board.

In the order preserving mechanism in the chip type ceramic thermistor substrate conveying device, the positioning cylinder and the connecting section are of an integrated structure.

In the order preserving mechanism in the chip type ceramic thermistor substrate conveying device, the lower side part of the conveying groove on the conveying plate is provided with a concave positioning groove, a contact strip made of ceramic materials is connected in the positioning groove, and the contact strip is flush with the inner side of the positioning groove.

Because the lower edge of the resistance substrate is contacted with the lower side part of the conveying groove, the abrasion to the resistance substrate can be reduced through the contact strip made of ceramic materials, and the conveying stability is effectively improved.

In the order-preserving mechanism in the chip-type ceramic thermistor substrate conveying device, the contact strip is provided with a through positioning hole, and the fastener is sequentially arranged on the positioning hole, the conveying plate and the connecting section of the contact strip in a penetrating manner to fixedly connect the contact strip, the conveying plate and the connecting section.

The structure not only can stably connect the contact strip, the conveying plate and the connecting section, but also is relatively compact.

Compared with the prior art, the order-preserving mechanism in the surface-mounted ceramic thermistor substrate conveying device can effectively improve the conveying stability because the upwarping resistor substrate in the conveying groove can be stably rejected by the shifting sheet, and avoids the disordered resistor substrate of sundries from entering the next procedure.

Meanwhile, the plectrum can have a buffering action when contacting with the resistance substrate, so that the rigid contact between the plectrum and the resistance substrate is avoided, and the stability of the plectrum is further improved.

In addition, the spring quilt cover is between a positioning cylinder and the shifting piece, and the positioning cylinder is adjacent to the conveying plate, so that the structural compactness of the whole mechanism is effectively improved, and the spring quilt cover has high practical value.

Drawings

Fig. 1 is a schematic front view of a sequence-maintaining mechanism in the chip-type ceramic thermistor substrate conveying device.

Fig. 2 is a schematic side view of the sequence-preserving mechanism in the chip-type ceramic thermistor substrate conveying device.

Fig. 3 is a schematic structural diagram of a connection part of a plectrum and a positioning cylinder in the sequence-preserving mechanism in the chip-type ceramic thermistor substrate conveying device.

In the figure, 1, a conveying plate; 1a, a conveying groove; 1a1, positioning groove; 2. a positioning cylinder; 2a, limiting holes; 2b, a connecting section; 3. a spring; 4. a shifting sheet; 4a, a toggle part; 5. a spacing pin; 6. a contact strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, 2 and 3, the chip type ceramic thermistor substrate conveying apparatus includes a conveying plate 1 having a long strip shape, and the side portion of the conveying plate 1 has a conveying groove 1a recessed along the length direction thereof.

This protect preface mechanism among SMD ceramic thermistor substrate conveyor sets up in delivery board 1 department, including a location section of thick bamboo 2, spring 3 and plectrum 4, above-mentioned a location section of thick bamboo 2 links firmly in delivery board 1 lower limb department, and 4 inner inlays in a location section of thick bamboo 2 and spring 3 is located between 2 and 4 inner of plectrum, and 4 outer ends of above-mentioned plectrum are close to in delivery chute 1a port department.

The conveying plate 1 is arranged obliquely.

The inclination angle of the conveying plate 1 is 10-30 degrees.

The outer end of the poking piece 4 is an inclined poking part 4a, and the included angle between the poking part 4a and the poking piece 4 is 150-160 degrees.

The poking part 4a and the poking sheet 4 are of an integrated structure.

The lateral part of the positioning cylinder 2 is provided with a limiting hole 2a which is penetrated in a strip shape, the shifting piece 4 is fixedly connected with a limiting pin 5, the limiting pin 5 is embedded in the limiting hole 2a, and the limiting pin 5 has the trend of abutting against the port of the limiting hole 2a under the elastic action of the spring 3.

The lower part of the positioning cylinder 2 is provided with a connecting section 2b, and the connecting section 2b is fixedly connected with the lower side of the conveying plate 1 through a fastener.

The positioning cylinder 2 and the connecting section 2b are of an integrated structure.

The conveying plate 1 is provided with a concave positioning groove 1a1 at the lower side part of the conveying groove 1a, a contact strip 6 made of ceramic material is connected in the positioning groove 1a1, and the contact strip 6 is flush with the inner side of the positioning groove 1a 1.

The contact strip 6 is provided with a through positioning hole, and the fasteners are sequentially arranged on the positioning hole of the contact strip 6, the conveying plate 1 and the connecting section 2b in a penetrating manner to fixedly connect the contact strip, the conveying plate and the connecting section.

The poking sheet has a tendency of extending out of the positioning cylinder under the elastic action of the spring, and the limiting pin is embedded in the limiting hole of the positioning cylinder, so that the poking sheet can be prevented from being separated from the positioning cylinder.

The width of the resistance substrate is matched with the width of the conveying groove, and the ideal conveying state is as follows: the resistance substrates are attached to the bottom of the conveying groove, and the end parts of the two adjacent resistance substrates are abutted together.

However, a part of the resistive substrate may be lifted and stacked on the resistive substrate adjacent thereto due to the influence of vibration during the conveyance. It can be seen that when this occurs, the resistive substrate may fall off during transport and it is not possible to get the resistive substrate into the next process in order.

The sequence protection mechanism creatively enables the outer end of the poking sheet to be close to the port of the conveying groove, and at the moment, the size of the space between the outer end of the poking sheet and the bottom of the conveying groove is slightly larger than the thickness of the resistor substrate. That is, the resistance substrate closely attached to the bottom of the conveying trough can stably pass through the outer end of the poking sheet. On the contrary, when the resistance substrate is tilted, the tilted resistance substrate is blocked by the outer end of the poking sheet and is removed from the conveying groove, and the resistance substrate passed by the poking sheet is tightly attached to the bottom of the positioning groove, so that the purpose of stable conveying is achieved.

When the outer end of the plectrum is contacted with the tilted resistance substrate, the spring is compressed, and the plectrum is prevented from being rigidly contacted with the resistance substrate through the buffer action of the spring. Certainly, the poking part at the front end of the poking piece can also keep a proper distance between the positioning barrel and the poking piece and the conveying plate, so that the resistance substrate is prevented from being blocked when normally moving in the conveying groove.

The features of the above-described embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above-described embodiments are not described, but should be construed as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.