阅读说明：本技术 可自动开合的半导体设备 (Semiconductor device capable of automatically opening and closing ) 是由 刘祥 宋维聪 封拥军 崔世甲 于 2021-09-14 设计创作，主要内容包括：本发明提供一种可自动开合的半导体设备,包括腔体、盖体及自动开合装置,自动开合装置包括电机、减速机和传动部；盖体经旋转轴与腔体的顶部相连接,减速机的输入端与电机连接,输出端通过传动部与盖体相连接,传动部具有确定的传动比；通过电机的旋转驱动减速机和传动部,由此实现盖体的开合。本发明经巧妙设计的自动开合装置,控制盖体绕旋转轴旋转指定角度以实现盖体开合,可有效减少开闭盖体对设备造成的磨损,减少产品污染,且操作过程完全为机械自动操作,开盖操作不涉及设备的升温降温过程,有助于提高设备产出率。同时,由于盖体开闭的角度由开合装置进行控制,可以灵活调整开合角度,满足操作人员的不同需要。(The invention provides a semiconductor device capable of automatically opening and closing, which comprises a cavity, a cover body and an automatic opening and closing device, wherein the automatic opening and closing device comprises a motor, a speed reducer and a transmission part; the cover body is connected with the top of the cavity through a rotating shaft, the input end of the speed reducer is connected with the motor, the output end of the speed reducer is connected with the cover body through a transmission part, and the transmission part has a determined transmission ratio; the speed reducer and the transmission part are driven by the rotation of the motor, so that the cover body is opened and closed. The automatic opening and closing device with the ingenious design controls the cover body to rotate by a specified angle around the rotating shaft so as to open and close the cover body, can effectively reduce the abrasion of the opening and closing cover body to equipment, reduces the product pollution, is completely mechanical and automatic in operation process, does not relate to the temperature rising and cooling process of the equipment in the cover opening operation, and is beneficial to improving the yield of the equipment. Meanwhile, the opening and closing angle of the cover body is controlled by the opening and closing device, so that the opening and closing angle can be flexibly adjusted, and different requirements of operators are met.)

1. The semiconductor equipment capable of being automatically opened and closed is characterized by comprising a cavity, a cover body, a controller and an automatic opening and closing device, wherein the automatic opening and closing device comprises a motor, a speed reducer and a transmission part; the cover body is connected with the top of the cavity through a rotating shaft, the input end of the speed reducer is connected with the motor, the output end of the speed reducer is connected with the cover body through the transmission part, and the transmission part has a determined transmission ratio; the cover body is driven to open and close by the rotation of the motor, the controller is electrically connected with the motor and used for controlling the operation of the motor, the transmission part comprises a connecting rod, one end of the connecting rod is provided with a rack, the cover body is provided with a guide rail, and the length extension direction of the guide rail is vertical to the length extension direction of the rotating shaft; one end of the connecting rod, provided with the rack, penetrates through the speed reducer, the other end of the connecting rod is arranged in the guide rail, and the rack of the connecting rod is matched with the gear of the speed reducer; and/or, the transmission part comprises a first gear and a second gear, the first gear is fixed on the cover body, the second gear is fixed with the speed reducer, and the first gear and the second gear are matched to realize transmission.

2. The semiconductor apparatus according to claim 1, wherein the guide rail is provided on a side surface of the cover body, and the connection bar is an L-shaped bar.

3. The semiconductor device of claim 1, wherein the controller comprises any one or more of a voice control module, a wireless control module, and an alarm module.

4. The semiconductor device of claim 1, further comprising a stop assembly for terminating operation of the motor when the cover reaches a limit travel.

5. The semiconductor device of claim 4, wherein the limiting assembly comprises a sensor disposed on the cover and/or the cavity, and the sensor is electrically connected to the controller, so that the controller terminates the operation of the motor when the sensor detects that the cover reaches a limit stroke.

6. The semiconductor apparatus according to claim 1, further comprising a clutch structure provided between the speed reducer and the motor.

7. The semiconductor device according to any one of claims 1 to 6, wherein the semiconductor device is a CVD device, a heater is provided in the chamber, and a shower head is provided on a surface of the lid body facing the heater, the shower head corresponding to the heater up and down when the lid body closes the chamber.

Technical Field

The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor device, and particularly relates to a semiconductor device capable of being automatically opened and closed.

Background

In the preparation process of the chip, most processes are required to be carried out in a closed reaction chamber to ensure stable process conditions in the reaction chamber and avoid device pollution, so that most reaction chambers are provided with openable covers to seal the chamber in the process. For example, as shown in fig. 1, a conventional CVD apparatus includes a chamber 102 and a cover 101, wherein a heater 104 is disposed at the bottom of the chamber 102, a showerhead 103 is disposed at the bottom of the cover 101, the heater 104 and the showerhead 103 are disposed in parallel and opposite directions (i.e., a spray surface of the showerhead faces an upper surface of the heater), and a projection of a center of the heater 104 and a center of the showerhead 103 in a vertical direction generally needs to coincide (i.e., the showerhead is located right above the heater), the cover 101 is connected to a top of the chamber 102 through a rotating shaft 106, and the cover 101 and the chamber 102 are further connected through a spring. When the reaction chamber is opened, the cover body 101 is manually lifted, and the cover body 101 moves to an opening position around the rotating shaft 106 under the combined action of external force and the spring; when the reaction chamber is closed, the cover 101 is manually pressed, and the cover 101 is moved to the closed position around the rotation shaft 106 by the combined action of the external force and the spring.

In practical use, because the opening and the closing are both manually completed, and the limiting function is also completed by a mechanical structure, after long-term use, the rotating shaft 106 and the spring are easily abraded, and in addition, the contact position of the cover body 101 and the cavity 102 also generates size deviation due to abrasion, so that the abrasion not only easily generates dust particles, but also causes product pollution; more seriously, the size deviation caused by abrasion may cause the closed position of the cover body 101 not to be exactly the same after each opening and closing, and since the shower head 103 is disposed at the bottom of the cover body 101, the above problems may further affect the parallelism of the shower head 103 and the heater 104 and the central position of the shower head 103 and the heater 104, thereby affecting the stability of the process conditions and the uniformity of the film thickness.

In addition, the opening and closing of the mechanical structure cavity cover of the conventional design need to be completed manually, a smaller observation angle needs to be opened sometimes in the process to observe, analyze or adjust the conditions in the cavity, but the high-temperature cavity condition may cause damage to the human body, so the manual cover opening observation can be performed usually only when the cavity is cooled to a certain degree, the temperature needs to be raised again to the required process reaction temperature in the cavity after the observation is finished, the operation efficiency of the process is greatly reduced, and the output rate of equipment is reduced.

Therefore, the technical staff in the field need to solve the problem of how to reduce the abrasion of the opening and closing cover body to the equipment as much as possible, ensure the constancy of the process conditions, and facilitate the automatic opening and closing of the cavity cover to improve the operation efficiency.

Disclosure of Invention

In view of the above drawbacks of the prior art, an object of the present invention is to provide a semiconductor device capable of automatically opening and closing, which is used to solve the problems that the cavity of the semiconductor device such as CVD device in the prior art needs to be manually opened and closed, which is likely to cause device abrasion, further cause product contamination, and is likely to cause process condition change in the reaction chamber, and decrease in device yield due to manual operation.

In order to achieve the above and other related objects, the present invention provides a semiconductor device capable of automatically opening and closing, including a cavity, a cover, a controller, and an automatic opening and closing device, wherein the automatic opening and closing device includes a motor, a speed reducer, and a transmission part; the cover body is connected with the top of the cavity through a rotating shaft, the input end of the speed reducer is connected with the motor, the output end of the speed reducer is connected with the cover body through the transmission part, and the transmission part has a determined transmission ratio; the speed reducer and the transmission part are driven by the rotation of the motor, so that the cover body is opened and closed; the controller is electrically connected with the motor and used for controlling the operation of the motor.

In an alternative scheme, the transmission part comprises a connecting rod, one end of the connecting rod is provided with a rack, the cover body is provided with a guide rail, and the length extension direction of the guide rail is perpendicular to the length extension direction of the rotating shaft; one end of the connecting rod, provided with the rack, penetrates through the speed reducer, the other end of the connecting rod is arranged in the guide rail, and the rack of the connecting rod is matched with the gear of the speed reducer.

More optionally, the guide rail is disposed on a side surface of the cover body, and the connecting rod is an L-shaped rod.

In another alternative, the transmission part comprises a first gear and a second gear, the first gear is fixed on the cover body, the second gear is fixed with the speed reducer, and the first gear and the second gear are matched to realize transmission.

Optionally, the controller comprises any one or more of a voice control module, a wireless control module, and an alarm module.

Optionally, the semiconductor device further comprises a limiting assembly for terminating the operation of the motor when the cover reaches the limit stroke.

More optionally, the limiting assembly includes a sensor disposed on the cover and/or the cavity, and the sensor is electrically connected to the controller, so that when the sensor detects that the cover reaches the limit stroke, the controller terminates the operation of the motor.

Optionally, the semiconductor device further includes a clutch structure disposed between the speed reducer and the motor.

Optionally, the semiconductor device is a CVD device, a heater is disposed in the cavity, a shower head is disposed on a surface of the cover body facing the heater, and when the cover body closes the cavity, the shower head vertically corresponds to the heater.

As described above, the semiconductor device capable of automatically opening and closing according to the present invention has the following advantageous effects: according to the automatic opening and closing device with the ingenious design, the controller is used for controlling the cover body to rotate around the rotating shaft by a specified angle so as to open and close the cover body, so that the abrasion of the opening and closing cover body to equipment can be effectively reduced, the product pollution is reduced, the operation process is completely mechanical automatic operation, the cover opening operation does not involve the temperature rising and cooling process of the equipment, and the yield of the equipment is improved. Simultaneously, because the angle of lid switching is controlled by the device that opens and shuts, can satisfy operating personnel's different needs, for example only need observe the sample, adjustable to less angle, if need install the sample or maintain equipment, adjustable to great angle can show improvement operating efficiency.

Drawings

FIG. 1 is a schematic diagram of a CVD reaction chamber according to the prior art.

Fig. 2 is a schematic structural diagram of an automatically openable and closable semiconductor device according to embodiment 1 of the present invention.

Fig. 3 is a schematic top view of an automatically openable and closable semiconductor device according to embodiment 1 of the present invention.

Fig. 4 is a schematic structural diagram illustrating an open state of the semiconductor device capable of automatically opening and closing according to embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of an automatically openable and closable semiconductor device according to embodiment 2 of the present invention.

Fig. 6 is a schematic structural diagram illustrating an open state of the semiconductor device capable of automatically opening and closing according to embodiment 2 of the present invention.

FIG. 7 is a schematic view showing the results of measuring the uniformity of film thickness distribution in comparative example 1 of the present invention.

FIG. 8 is a schematic view showing the results of measurement of uniformity of film thickness distribution in comparative example 2 of the present invention.

Description of the element reference numerals

101-a cover body; 102-a cavity; 103-a spray header; 104-a heater; 106-axis of rotation; 201-a cover body; 202-a cavity; 203-spray header; 204-a heater; 205-a rotation axis; 206-a motor; 207-a speed reducer; 208-a connecting rod; 209-guide rail; 301-a cover; 302-a cavity; 303-a spray header; 304-a heater; 305-a rotation axis; 306-a motor; 307-speed reducer; 308-second gear.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated. In order to keep the drawings as concise as possible, not all features of a single figure may be labeled in their entirety.

The cavity of most of the existing CVD equipment and other semiconductor equipment is manually operated, so that the equipment is easily abraded, the product pollution and/or the process condition change of the equipment are caused, and the output rate of the equipment is reduced due to low operation efficiency. In view of the above, the inventors of the present application have made a long-term study and have proposed an improvement.

The automatic opening and closing device comprises a motor, a speed reducer and a transmission part; the cover body is connected with the top of the cavity through the rotating shaft (the shape of the cover body and the position of the rotating shaft can be different according to the shape of the cavity, for example, the cavity is a rectangular cavity, the cover body is also rectangular, the rotating shaft is linear and is arranged on one side of the cavity, if the cavity is a circular cavity, the cover body is also circular, the rotating shaft can be positioned on a certain tangent line of the cover body so as to be better attached to the cavity, the position and the length of the rotating shaft can be set according to requirements, the rotating shaft can also adopt a hinge or other forms, as long as the cover body is connected with the cavity through the rotating shaft and can be attached to the cavity, the specific structure is not limited), the input end of the speed reducer is connected with the motor so as to be matched with each other (can be meshed through a gear or adopt other forms of mechanical connection), and the output end is connected with the cover body through the transmission part, the controller is electrically connected with the motor and used for controlling the operation of the motor, and the transmission part has a determined transmission ratio; through fixed drive ratio, will appoint the angle conversion that opens and shuts to the revolution of motor to this is the operation of standard control motor, through the rotatory drive of motor speed reducer and drive division, from this open and shut (also realize opening and shutting of cavity) more accurately control the lid. According to the automatic opening and closing device with the ingenious design, the controller is used for controlling the cover body to rotate around the rotating shaft by a specified angle so as to open and close the cover body, so that the abrasion of the opening and closing cover body to equipment can be effectively reduced, the product pollution is reduced, the operation process is completely mechanical automatic operation, the cover opening operation does not involve the temperature rising and cooling process of the equipment, and the yield of the equipment is improved. Simultaneously, because the angle of lid switching is controlled by the device that opens and shuts, can satisfy operating personnel's different needs, for example only need observe the sample, adjustable to less angle, if need install the sample or when maintaining equipment, adjustable to great angle can show improvement operating efficiency.

The specific structure of the transmission part can be arranged differently, and is further described with reference to specific embodiments.

Example 1

As shown in fig. 2 and fig. 3, in the semiconductor device capable of automatically opening and closing provided by this embodiment, the transmission portion includes a connecting rod 208, one end of the connecting rod 208 is provided with a rack, the cover 201 is provided with a guide rail 209, and in an example, a length extending direction of the guide rail 209 is perpendicular to a length extending direction of the rotating shaft 205; one end of the connecting rod 208, provided with the rack, penetrates through the speed reducer 207, the other end of the connecting rod is arranged in the guide rail 209, and the rack of the connecting rod 208 is matched with the gear of the speed reducer 207. Specifically, the semiconductor device further includes a cavity 202, the top of the cavity 202 is connected to the cover 201 through the rotating shaft 205, and the semiconductor device may be a CVD device, so a shower head 203 may be disposed at the bottom of the cover 201, a heater 204 (also referred to as a pedestal) is disposed at the bottom of the cavity 202, a shower surface of the shower head 203 faces the heater 204, and when the cover 201 closes the cavity 202, the shower head 203 and the heater 204 correspond to each other up and down (centers of the two are on the same vertical line); the side surface of the cover body 201 perpendicular to the rotating shaft 205 is provided with the guide rail 209 (i.e. the guide rail 209 is arranged outside the cavity), the guide rail 209 is provided with an L-shaped connecting rod 208 which is matched with the guide rail 209, one end of the connecting rod 208 is arranged in the guide rail 209, the other end of the connecting rod 208 is provided with a rack which is arranged in a gear of the speed reducer 207 in a penetrating way, the rack of the connecting rod 208 is matched with the gear of the speed reducer 207, the input end of the speed reducer 207 is connected with the motor 206, and the guide rail and the cover body can be integrally connected, for example, a groove is formed on the side surface of the cover body to manufacture the guide rail; the guide rail also can be for can dismantling the connection with the lid, be about to the guide rail of independent preparation in addition is fixed in the lid side, adopts the advantage of the guide rail of this kind of dismantlement mode to lie in, when the guide rail is serious because of long-term use wearing and tearing, can dismantle to get off and repair or direct change. When the cover is used, the motor 206 drives the gear in the speed reducer 207 to rotate, so that the rack of the connecting rod 208 is driven to move, one end, far away from the rack, of the connecting rod 208 moves in the guide rail 209, the cover body 201 is driven to rotate around the rotating shaft 205, and opening and closing of the cover body are achieved. The reaction chamber in the open state is shown in FIG. 4. The automatic opening and closing device can be only one set, namely the guide rail 209 and the connecting rod 208, the speed reducer 207 and the motor 206 are all one, which contributes to the simplification of the equipment structure; in other examples, the number of the guide rails 209 may be two, and the two guide rails are disposed on two opposite sides of the cover 201, and accordingly, the number of the connecting rods 208, the speed reducer 207, and the motor 206 is 2, so as to drive the cover 201 to rotate around the rotating shaft 205 from two opposite sides, so as to achieve opening and closing of the cover, which helps to improve the smoothness of transmission. Of course, in other examples, the guide rail may be disposed on other surfaces of the cover, and the connecting rod may have other shapes as long as it is suitable for transmission and has a certain transmission ratio. It should be noted that, in the conventional chemical vapor deposition apparatus, the source lines such as the reaction gas line are all vertically connected to the showerhead from the upper portion of the cover body, and in this embodiment, the source lines such as the reaction gas line are flexible lines, for example, corrosion-resistant plastic pipes, and the plastic pipes may further be wrapped by corrugated pipes, and the flexible lines extend to be communicated with the gas inlet of the showerhead by being attached to the outer surface of the cover body (or the surface of the cover body may be further provided with grooves for accommodating the flexible lines to embed the flexible lines into the grooves). Such setting makes the lid can not take place the friction with the gas line or make the gas line produce the vibration when opening and shutting (even if the friction also only takes place outside the cavity), avoids leading to the wearing and tearing of gas line in order to lead to leaking gas because of friction or vibration, also avoids simultaneously causing the wafer pollution because of the particle that friction or vibration lead to.

Example 2

As shown in fig. 5, the present invention provides another semiconductor device that can be automatically opened and closed. The semiconductor device of the present embodiment is different from the first embodiment mainly in that in embodiment 1, the transmission portion is a connection rod, and the cover body is provided with a guide rail; in this embodiment, the transmission portion includes a first gear and a second gear 308, the first gear is fixed on the cover 301 (the first gear may be a sector gear and may be fixed on a surface of the cover adjacent to the rotation shaft), the second gear 308 is fixed with the speed reducer 307, and the first gear and the second gear 308 cooperate to realize transmission. The semiconductor apparatus may be a CVD apparatus as well, so that the entire structure inside the chamber is substantially the same as that of embodiment 1. The semiconductor device specifically includes: the top of the cavity 302 is connected with the cover body 301 through a rotating shaft 305, the bottom of the cover body 301 is provided with a spray header 303, the bottom in the cavity 302 is provided with a heater 304, the spray face of the spray header 303 faces the heater 304, and when the cover body 301 closes the cavity 302, the spray header 303 corresponds to the heater 304 up and down; a first gear (preferably, the center of the first gear is located on the center line of the upper surface of the cover, and the center line is also the vertical bisector of the rotating shaft) is fixed on the cover 301, and the cover 301 is connected with a second gear 308 through the first gear (the first gear and the second gear are engaged with each other, the first gear and the second gear may be a single gear and/or a gear set composed of a plurality of gears, and are also located outside the cavity), and the second gear 308 is connected with the motor 306 through a speed reducer 307. When the cover is used, the motor 306 transmits power to the first gear fixedly connected with the cover 301 through the speed reducer 307 and the second gear 308 to drive the cover 301 to rotate around the rotating shaft 305, so that the cover is opened and closed. The semiconductor device in the open state is shown in fig. 6.

Example 3

In this embodiment, the automatic opening and closing device includes two modes in embodiments 1 and 2, that is, includes two sets of transmission portions, one set of the transmission portion includes a connecting rod, one end of the connecting rod is provided with a rack, the cover body is provided with a guide rail, and a length extending direction of the guide rail is perpendicular to a length extending direction of the rotating shaft; one end of the connecting rod, provided with the rack, penetrates through the speed reducer, the other end of the connecting rod is arranged in the guide rail, and the rack of the connecting rod is matched with the gear of the speed reducer; another set the transmission portion includes first gear and second gear, first gear is fixed in on the lid, the second gear with the speed reducer is fixed mutually, just first gear and second gear cooperate in order to realize the transmission, and corresponding motor and speed reducer can be two sets, controls these two sets of transmission portions respectively, and the controller is connected with two sets of motors simultaneously to control these two sets of automatic device synchronous working that opens and shuts. For the specific structure and working manner of the two sets of transmission parts, please refer to the foregoing, which is not repeated for brevity. The traditional semiconductor equipment adopts a single mechanical opening and closing mode, and in the embodiment, two sets of opening and closing devices are creatively used, one set of the opening and closing devices automatically open and close from the side wall of the cover body and the other set of the opening and closing devices automatically from the middle part of the cover body, so that the stability of the cover body in the opening and closing process is improved, and the phenomenon that the residual reactant on the inner surface of the cover body falls off to cause wafer pollution due to the shaking of the cover body in the opening and closing process is avoided. Meanwhile, the stability of the equipment can be improved by arranging the two sets of opening and closing devices, the condition that the equipment cannot be used once the opening and closing devices break down in a single opening and closing mode is avoided (for example, in the single opening and closing mode, once the opening and closing devices break down, the equipment cannot be opened, and then wafers in the equipment are scrapped to cause huge economic loss), and the production safety is improved.

As an example, the controller is electrically connected to the motor for controlling the operation of the motor, including but not limited to controlling the direction of rotation and the number of revolutions of the motor. Since the transmission ratios of the transmission components between the motor and the cover body are determined values, the controller can convert the rotation angle of the cover body into the number of revolutions of the motor, thereby realizing the control of the specified rotation angle of the cover body, further reducing the abrasion of the equipment caused by opening and closing the cover body, and simultaneously increasing the reliability of the equipment, for example, ensuring the parallelism of the heater and the spray header in the embodiments 1 and 2 and the projection coincidence of the center of the heater and the center of the spray header in the vertical direction. The controller comprises but is not limited to a single chip microcomputer or an upper computer and other devices with logic calculation functions. The controller may pre-store process parameters required for the operation of the semiconductor device, such as a gas flow rate, a process time, and the like, so that the controller may control the cover to open or close according to the preset parameters according to the process parameters.

By way of example, the controller includes one or both of a voice control module (not shown) and a wireless control module, whereby voice control or infrared remote control may be implemented to control the motor to perform a specified action in accordance with user instructions. By using the remote control system, the operation can be completed without directly contacting with the equipment by an operator, so that the direct contact between the operator and high-temperature and other dangerous gases is avoided, and the safety is improved; the voice control system further enhances the convenience of the invention.

In other examples, the controller may further include an alarm module, or any one or any number of these modules may be provided, without limitation.

As an example, the semiconductor apparatus further includes a stopper assembly (not shown) for terminating the operation of the motor when the cover reaches a limit stroke. The limit component can be a mechanical switch or a maximum opening and closing angle preset in a control program, as long as the motor can be prevented from continuously working when the cover body reaches the limit stroke. In a preferred example, the position-limiting assembly includes a sensor disposed on the cover and/or the cavity, and the sensor is electrically connected to the controller, so that when the sensor detects that the cover reaches the limit stroke, the controller terminates the operation of the motor. More specifically, the sensor may be a contact sensor, two detection parts of the sensor are respectively mounted on the cover body and the cavity, when the cover body closes the cavity, the two detection parts contact with each other to detect a signal and send the signal to the controller, and the controller controls the motor to stop rotating; the sensor can also be a photoelectric sensor, for example, the sensor comprises an emitting part and a receiving part which are respectively arranged on the cover body and the cavity, when the cover body and the cavity are closed, the emitting part and the receiving part vertically correspond to each other, and the receiving part receives an optical signal emitted by the emitting part, converts the optical signal into an electrical signal and transmits the electrical signal to the controller. The limiting assembly can also adopt other types of sensors, the setting position is determined according to different types of the sensors, the limiting assembly is not strictly limited in the embodiment, and only the cover body can timely transmit signals to the controller when reaching the limit stroke.

As an example, the semiconductor apparatus further includes a clutch structure (not shown) provided between the reducer and the motor; when the clutch mechanism is separated, namely when the motor is powered off, the transmission can be controlled manually, and the cover body is opened and closed.

It should be noted that, although the above is only exemplified by a CVD apparatus, the semiconductor apparatus provided by the present invention may also be a PVD apparatus, a dry etching apparatus or other types of apparatuses, and the apparatus may also include other structures according to different apparatus types, for example, if the apparatus is a PVD apparatus, a magnetron sputtering apparatus is usually disposed on the chamber, and details thereof are not specifically shown.

The inventor carries out comparative verification on the semiconductor equipment provided by the invention, and the verification result is as follows:

comparative example 1

In the conventional CVD apparatus which was opened and closed manually, the CVD coating operation was carried out after 1000 times of manual opening and closing, and the uniformity of the film thickness distribution of the coated substrate was measured by a spectral film thickness analyzer, as shown in FIG. 7 (the same color depth region in the figure indicates the same film thickness).

Comparative example 2

The CVD coating operation was carried out under the same environmental conditions as in comparative example 1 after the automatic opening and closing operation was carried out 1000 times by using the CVD apparatus capable of automatic opening and closing provided in examples 1 and 2 of the present invention, and the uniformity of the film thickness distribution of the coated substrate was measured by using a spectral film thickness analyzer, and the result is shown in FIG. 8 (in the same manner, the same region of the same color depth indicates the same film thickness).

As can be seen from the combination of the figures 7 and 8, the automatic opening and closing reaction chamber has better film thickness uniformity, and the cover body is opened and closed under the accurate control of the automatic opening and closing device, so that the abrasion of the equipment caused by manually opening and closing the cover body is reduced, the parallelism and the centering of the spray header and the heater can be better ensured, and the film thickness uniformity of the product can be still ensured after the automatic opening and closing reaction chamber is used for a plurality of times for a long time.

In summary, the present invention provides a semiconductor device capable of automatically opening and closing, including a cavity, a cover, a controller and an automatic opening and closing device, wherein the automatic opening and closing device includes a motor, a speed reducer and a transmission part; the cover body is connected with the top of the cavity through a rotating shaft, the input end of the speed reducer is connected with the motor, the output end of the speed reducer is connected with the cover body through the transmission part, and the transmission part has a determined transmission ratio; the speed reducer and the transmission part are driven by the rotation of the motor, so that the cover body is opened and closed, and the controller is electrically connected with the motor and used for controlling the operation of the motor. According to the automatic opening and closing device with the ingenious design, the controller is used for controlling the cover body to rotate around the rotating shaft by a specified angle so as to open and close the cover body, so that the abrasion of the opening and closing cover body to equipment can be effectively reduced, the product pollution is reduced, the operation process is completely mechanical automatic operation, the cover opening operation does not involve the temperature rising and cooling process of the equipment, and the yield of the equipment is improved. Simultaneously, because the angle of lid switching is controlled by the device that opens and shuts, can satisfy operating personnel's different needs, if only need observe the sample, adjustable to less angle, if need install the sample or maintain equipment, adjustable to great angle can show improvement operating efficiency. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.