阅读说明：本技术 断线修复装置及断线修复装置调试方法 (Broken line repairing device and debugging method thereof ) 是由 陈少甫 于 2020-12-24 设计创作，主要内容包括：本申请提供一种断线修复装置及断线修复装置调试方法,所述断线修复装置包括基座、安装于所述基座上的支撑架、以及设置于所述支撑架上的可移动的镀膜单元和阻值测试单元,使用所述断线修复装置对基板进行镀膜操作时,所述阻值测试单元可随时对所述镀膜单元形成的膜层阻值进行测试,而无需移动基板,相较于现有技术,减小了基板转运的时间,提高了断线修复装置的调试效率和断线修复效率。(The application provides a broken string prosthetic devices and broken string prosthetic devices debugging method, broken string prosthetic devices include the base, install in support frame on the base and set up in mobilizable coating film unit and resistance test unit on the support frame use when broken string prosthetic devices carries out the coating film operation to the base plate, resistance test unit can be right at any time the rete resistance that the coating film unit formed tests, and need not to remove the base plate, compares in prior art, has reduced the time that the base plate transported, has improved broken string prosthetic devices' debugging efficiency and broken string prosthetic efficiency.)

1. A broken wire repair device, comprising:

a base;

the supporting frame is arranged on the base and comprises an upper end face, and a gap is formed between the upper end face and the base;

the coating unit is arranged on the upper end face and movably connected with the upper end face;

and the resistance value testing unit is arranged on the upper end face and movably connected with the upper end face.

2. The broken wire repairing device according to claim 1, further comprising a housing, a sealable cavity is formed between the housing and the base, and the support frame, the coating unit and the resistance value testing unit are located in the cavity.

3. The broken line restoration device according to claim 2, wherein a sealing door is provided on the housing, and the sealing door is used for opening or sealing the cavity.

4. The broken wire repair device according to claim 3, wherein a vacuum port is further provided in the cavity, and the vacuum port is used for pumping out gas in the cavity in a sealed state.

5. The broken wire restoration device according to claim 1, wherein the coating unit includes a laser emission unit for emitting a reaction gas and a reaction gas emission unit for emitting laser light and inducing the reaction gas to chemically react.

6. The broken wire repairing device according to claim 1, wherein the resistance value testing unit comprises a probe, a resistance value calculating unit and a resistance value displaying unit, the resistance value calculating unit is used for calculating the resistance value of an object to be tested contacted by the probe, and the resistance value displaying unit is used for displaying the resistance value calculated by the resistance value calculating unit.

7. The debugging method of the broken wire repairing device is characterized in that the broken wire repairing device comprises a base, a supporting frame arranged on the base, a movable film coating unit and a resistance value testing unit, wherein the movable film coating unit and the resistance value testing unit are arranged on the upper end surface of the supporting frame; the debugging method comprises the following steps:

providing a test substrate, wherein the test substrate comprises a test end and is placed on the base;

moving the film coating unit to the testing end, and coating a film on the testing end to form a film layer;

moving the resistance value testing unit to the testing end, and testing the resistance value of the film layer;

judging whether the resistance value of the film layer meets a preset value or not, and if so, finishing debugging; if the resistance value does not meet the requirement, the film coating parameters of the film coating unit are adjusted, and the film coating step of the film coating unit and the resistance value test step of the resistance value test unit are repeated.

8. The debugging method for a disconnection repairing apparatus according to claim 7, wherein a plating parameter of said plating unit is adjusted to adjust a thickness of said film layer formed.

9. The debugging method of a disconnection repairing device according to claim 7, wherein said coating unit comprises a laser emitting unit and a reactive gas emitting unit;

and in the coating step, the reaction gas radiation unit radiates reaction gas, the laser emission unit emits laser and induces the reaction gas to generate chemical reaction, and a reaction product is deposited on the testing end to form the film layer.

10. The debugging method of the disconnection repairing device according to claim 7, wherein the method for judging whether the resistance value of the film layer meets a preset value is:

manually judging; or

And connecting the resistance value test unit with a resistance value judgment unit for automatic judgment.

Technical Field

The present application relates to the field of display technologies, and in particular, to a broken line repairing apparatus and a debugging method of the broken line repairing apparatus.

Background

In the field of electronic devices, especially in the semiconductor display industry, the problem of wire breakage of metal wires inside electronic devices is often encountered, and this problem may occur in the whole process or in the detection process after the electronic devices are manufactured. The performance of the display panel is greatly affected by the broken metal wires in the display panel, and the display panel is scrapped seriously or even caused, so that the yield loss and the resource waste are caused.

At present, a method for solving the problem of metal wire breakage is to deposit a conductive film layer at the wire breakage position by using Laser Chemical Vapor Deposition (LCVD) equipment, so as to repair a conductive path at the wire breakage position. In order to ensure that the resistance of the conductive film layer formed in the broken line repairing process can meet the broken line repairing requirement at one time, the chemical vapor deposition equipment needs to be debugged for multiple times before the broken line repairing operation is carried out, so that the conductive film layer which is stable and meets the requirement can be generated. The prior art debugs the chemical vapor deposition equipment by the method that: firstly, placing a glass substrate in chemical vapor deposition equipment, and depositing a metal film layer on the glass substrate by the chemical vapor deposition equipment; and then the glass substrate is moved out of the chemical vapor deposition equipment and conveyed to resistance testing equipment to test the resistance of the formed metal film layer, and a testing result is judged. Because the chemical vapor deposition equipment has more parameters for regulating and controlling the resistance of the metal film layer, the debugging of the chemical vapor deposition equipment usually needs to be operated by depositing the metal film layer for multiple times and testing the resistance for multiple times, so that the glass substrate needs to be repeatedly conveyed between the chemical vapor deposition equipment and the resistance testing equipment, the time for transferring the glass substrate is greatly spent, the time for completing the debugging of the chemical vapor deposition equipment is usually about 2-3 days, and a large amount of capacity waste is caused.

Disclosure of Invention

Based on the defects in the prior art, the application provides the broken line repairing device and the debugging method of the broken line repairing device, the resistance value testing unit is directly arranged in the broken line repairing device, the resistance value of the film layer formed by the broken line repairing device is conveniently tested, and the debugging efficiency of the broken line repairing device is greatly improved.

The application provides a broken string prosthetic devices includes:

a base;

the supporting frame is arranged on the base and comprises an upper end face, and a gap is formed between the upper end face and the base;

the coating unit is arranged on the upper end face and movably connected with the upper end face;

and the resistance value testing unit is arranged on the upper end face and movably connected with the upper end face.

According to an embodiment of the application, the broken line repairing device further comprises a shell, a sealable cavity is formed between the shell and the base, and the support frame, the coating unit and the resistance value testing unit are located in the cavity.

According to an embodiment of the application, be provided with sealing door on the casing, sealing door is used for opening or sealed the cavity.

According to an embodiment of the present application, a vacuum pumping port is further provided in the cavity, and the vacuum pumping port is used for pumping out gas in the cavity in a sealed state.

According to an embodiment of the present application, the coating unit includes a laser emission unit and a reaction gas emission unit, the reaction gas emission unit is used for emitting reaction gas, and the laser emission unit is used for emitting laser and inducing the reaction gas to generate a chemical reaction.

According to an embodiment of the application, the resistance value testing unit comprises a probe, a resistance value calculating unit and a resistance value displaying unit, wherein the resistance value calculating unit is used for calculating the resistance value of an object to be tested, which is contacted with the probe, and the resistance value displaying unit is used for displaying the resistance value calculated by the resistance value calculating unit.

The application also provides a debugging method of the broken line repairing device, the broken line repairing device comprises a base, a support frame arranged on the base, and a movable film coating unit and a resistance value testing unit which are arranged on the upper end surface of the support frame, and a gap is formed between the upper end surface of the support frame and the base; the debugging method comprises the following steps:

providing a test substrate, wherein the test substrate comprises a test end and is placed on the base;

moving the film coating unit to the testing end, and coating a film on the testing end to form a film layer;

moving the resistance value testing unit to the testing end, and testing the resistance value of the film layer;

judging whether the resistance value of the film layer meets a preset value or not, and if so, finishing debugging; if the resistance value does not meet the requirement, the film coating parameters of the film coating unit are adjusted, and the film coating step of the film coating unit and the resistance value test step of the resistance value test unit are repeated.

According to an embodiment of the present disclosure, a coating parameter of the coating unit is adjusted to adjust a thickness of the formed film.

According to an embodiment of the present application, the coating unit includes a laser emitting unit and a reaction gas emitting unit;

and in the coating step, the reaction gas radiation unit radiates reaction gas, the laser emission unit emits laser and induces the reaction gas to generate chemical reaction, and a reaction product is deposited on the testing end to form the film layer.

According to an embodiment of the present application, the method for determining whether the resistance value of the film layer satisfies a preset value includes:

manually judging; or

And connecting the resistance value test unit with a resistance value judgment unit for automatic judgment.

The beneficial effect of this application is: in the broken wire repairing device and the debugging method thereof, the broken wire repairing device comprises a film coating unit and a resistance value testing unit, and the resistance value testing unit can test the film resistance value formed by the film coating unit at any time, so that compared with the prior art, the time for transferring the substrate is shortened, and the debugging efficiency of the broken wire repairing device is improved; and when the broken wire repairing device is used for repairing broken wires, the resistance characteristic of the repaired broken wires can be detected constantly, and the broken wire repairing efficiency is improved.

Drawings

In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a broken line repairing device provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a coating unit provided in the embodiment of the present application;

FIG. 3 is a schematic structural diagram of a resistance value testing unit according to an embodiment of the present disclosure;

fig. 4 is a flowchart of a method for debugging a broken line repairing apparatus according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a test substrate according to an embodiment of the present disclosure;

fig. 6 is a schematic view of a test substrate provided in an embodiment of the present application being placed in a broken line repairing apparatus.

Detailed Description

The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.

The embodiment of the application provides a broken line repairing device, wherein a film coating unit and a resistance value testing unit are arranged in the broken line repairing device at the same time, and the resistance value testing unit can test the film resistance value formed by the film coating unit at any time; and when the broken wire repairing device is used for repairing broken wires, the resistance characteristic of the repaired broken wires can be detected constantly, and the broken wire repairing efficiency is improved.

Fig. 1 is a schematic structural diagram of a broken wire repairing apparatus 10 according to an embodiment of the present application. The broken line repairing device comprises a base 11, a support frame 12 installed on the base 11, a film coating unit 13 arranged on the support 12 and a resistance value testing unit 14; the supporting frame 12 comprises an upper end surface 121, and a gap exists between the upper end surface 121 and the base 11; the film plating unit 13 and the resistance value testing unit 14 are arranged on the upper end surface 121, and the upper end surface 121 is movably connected with each other, that is, the film plating unit 13 and the resistance value testing unit 14 can freely move back and forth, left and right on the upper end surface 121; the coating unit 13 is used for forming a conductive film layer to complete broken line repair, and the resistance value testing unit 14 is used for detecting the resistance of the conductive film layer formed by the coating unit 13. It should be noted that, when the broken line repairing device 10 performs self-debugging operation or broken line repairing operation, the coating unit 13 is moved to form a conductive film layer at a designated position of the substrate to be coated, then the coating unit 13 is moved away, and the resistance value testing unit 14 is moved to the conductive film layer to perform resistance value testing on the conductive film layer; in the whole operation process, the substrate to be coated does not need to be moved, so that the debugging efficiency and the broken line repairing efficiency are greatly improved.

Optionally, the broken wire repairing device 10 further includes a housing 15, a sealable cavity is formed between the housing 15 and the base 11, and the supporting frame 12, the coating unit 13 and the resistance value testing unit 14 are located in the cavity defined by the housing 15 and the base 11. It should be noted that, the wire breakage repairing operation performed on the substrate to be coated often needs to be performed in a sealed environment, and the wire breakage repairing device 10 provided in this embodiment has a sealable cavity, so as to meet the sealing requirement of the wire breakage repairing operation.

Optionally, a sealing door 151 is disposed on the housing 15, and the sealing door 151 is configured to open or seal a cavity enclosed by the housing 15 and the base 11, so as to implement a sealable feature of the cavity.

Optionally, a vacuum pumping port 16 is further disposed in a cavity enclosed by the housing 15 and the base 11, and the vacuum pumping port 16 is configured to pump out gas in the cavity in a sealed state. Optionally, the vacuum pumping port 16 is connected to an external vacuum pumping device, and air in the cavity is pumped out by the vacuum pumping device, so that the influence of components in the air on the coating quality during the coating operation is prevented.

Alternatively, as shown in fig. 2, the coating unit 13 is a laser-induced chemical vapor deposition unit, and includes a laser emitting unit 131 and a reaction gas emitting unit 132, wherein the reaction gas emitting unit 132 is configured to emit a reaction gas, and the laser emitting unit 131 is configured to emit laser and induce the reaction gas to generate a chemical reaction. When carrying out self debugging operation or broken string repair operation, reaction gas emission unit 132 emits reaction gas extremely in the cavity, laser emission unit 131 sends laser and directional removal, reaction gas deposits the electrically conductive rete that has certain trend and yardstick under the induction of laser.

Optionally, as shown in fig. 3, the resistance value testing unit 14 includes a probe 141, a resistance value calculating unit 142, and a resistance value displaying unit 143, where the resistance value calculating unit 142 is configured to calculate a resistance value of an object to be tested, which is contacted by the probe 141, and the resistance value displaying unit 143 is configured to display the resistance value calculated by the resistance value calculating unit 142. When the self-debugging operation or the broken line repairing operation is performed, the probe 141 contacts the conductive film layer after the conductive film layer is formed; the resistance value calculating unit 142 sends a detection signal to the conductive film layer through the probe 141, and calculates the resistance value of the conductive film layer through the detection signal; the resistance value display unit 143 displays the resistance value calculated by the resistance value calculation unit 142, so as to facilitate manual monitoring or automatic monitoring.

In summary, the broken line repairing device provided by the embodiment of the application comprises the film coating unit and the resistance value testing unit, and the resistance value testing unit can test the film resistance value formed by the film coating unit at any time, so that compared with the prior art, the time for transferring the substrate is shortened, and the debugging efficiency of the broken line repairing device is improved; and when the broken wire repairing device is used for repairing broken wires, the resistance characteristic of the repaired broken wires can be detected constantly, and the broken wire repairing efficiency is improved.

An embodiment of the present application further provides a method for debugging a broken line repairing apparatus, as shown in fig. 4, which is a flowchart of the method for debugging a broken line repairing apparatus provided in the embodiment of the present application. It should be noted that the broken line repairing apparatus described in this embodiment is the broken line repairing apparatus 10 provided in the above-mentioned embodiment of the present application, and reference is made to fig. 1, structural features of the broken line repairing apparatus 10 have been described in detail in the above-mentioned embodiment, and are not described again here. The debugging method of the broken line repairing device 10 comprises the following steps:

step S1, providing a test substrate 20, as shown in fig. 5 and fig. 6, where fig. 5 is a schematic structural diagram of the test substrate 20 provided in the embodiment of the present application, and fig. 6 is a schematic diagram of the test substrate 20 placed in the broken line repairing apparatus; the test substrate 20 includes a test end 21, and the test substrate 20 is placed on the base 11. Optionally, the test substrate 20 may include a plurality of the test terminals 21 to facilitate a plurality of plating operations.

Step S2, referring to fig. 5 and 6, moves the plating unit 13 to the testing end 21, and forms a film on the testing end 21.

Specifically, the coating unit 13 further includes the following steps before performing the coating operation: closing the sealing door 151 to seal the cavity formed between the housing 15 and the base 11; and opening the vacuum pumping port 16 to pump out the gas in the cavity to form a vacuum or near vacuum environment.

Further, the coating unit 13 includes a laser emitting unit and a reaction gas emitting unit. When the coating unit 13 is used for coating, the reaction gas radiation unit radiates reaction gas, the laser emission unit emits laser and induces the reaction gas to generate chemical reaction, and a reaction product is deposited on the testing end 21 to form the film.

Step S3, referring to fig. 5 and 6, moves the resistance value testing unit 14 to the testing terminal 21, and tests the resistance value of the film formed at the testing terminal 21 in step S2.

Specifically, referring to fig. 3, the resistance value testing unit 14 includes a probe 141, a resistance value calculating unit 142 and a resistance value displaying unit 143, the resistance value calculating unit 142 is configured to calculate a resistance value of an object to be tested, which is contacted by the probe 141, and the resistance value displaying unit 143 is configured to display the resistance value calculated by the resistance value calculating unit 142. When the resistance value of the film layer is tested, the probe 141 is used for contacting the film layer; the resistance value calculating unit 142 sends a detection signal to the film layer through the probe 141, and calculates the resistance value of the film layer through the detection signal; the resistance value display unit 143 displays the resistance value calculated by the resistance value calculation unit 142.

Step S4, judging whether the resistance value of the film layer meets a preset value; if yes, finishing debugging; if not, adjusting the coating parameters of the coating unit, and repeating the coating step in the step S2 and the resistance value testing step in the step S3; and then judging whether the newly formed film resistance value meets the preset value again to judge whether the debugging is finished or continued.

It should be noted that, when the resistance of the formed film does not satisfy the preset value, the steps 2 to S4 may be performed for multiple cycles. It should be understood that, during the multiple cycles of the steps 2 to S4, the test substrate 20 does not need to be moved, which greatly reduces the complexity of the debugging process, shortens the debugging time to within 3 hours, and improves the debugging efficiency compared with the prior art.

Optionally, adjusting the parameters of the coating unit 13 includes adjusting a coating voltage, a coating time, and the like; the purpose of adjusting the thickness of the formed film layer is achieved by adjusting the parameters of the film coating unit 13.

Alternatively, the method for determining whether the resistance value of the film layer satisfies the preset value may be manual determination or automatic determination by connecting the resistance value testing unit 14 to a resistance value determining unit.

To sum up, compared with the prior art, the method for debugging the broken line repairing device provided by the embodiment of the application reduces the time for transferring the test substrate and improves the debugging efficiency.

It should be noted that, although the present application has been described with reference to specific examples, the above-mentioned examples are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be limited by the appended claims.