阅读说明：本技术 固化性组合物、其固化物及半导体装置 (Curable composition, cured product thereof, and semiconductor device ) 是由 平野大辅 安田成纪 于 2020-09-29 设计创作，主要内容包括：本发明的目的在于提供一种给予硬度及韧性高,短波长区域的透光性优异的固化物的固化性组合物。所述固化性组合物含有下述(A)、(B)及(C)：(A)下述式(1)所表示的有机硅化合物与一分子中具有2个以上烯基且不含硅原子的有机化合物的加成反应产物,其在一分子中具有2个以上SiH基；(B)一分子中具有2个以上烯基的化合物；(C)氢化硅烷化反应催化剂,式中,R～1为取代或非取代的碳原子数为1～12的二价烃基。(The purpose of the present invention is to provide a curable composition that gives a cured product that has high hardness and toughness and excellent light transmittance in a short wavelength region. The curable composition contains the following (A), (B) and (C): (A) an addition reaction product of an organosilicon compound represented by the following formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, which has 2 or more SiH groups in one molecule; (B) a compound having 2 or more alkenyl groups in one molecule;(C) a catalyst for the hydrosilylation reaction, in the formula, R 1 Is a substituted or unsubstituted divalent hydrocarbon group having 1 to 12 carbon atoms.)

1. A curable composition comprising the following (A), (B) and (C):

(A) an addition reaction product of an organosilicon compound represented by the following formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, which has 2 or more SiH groups in one molecule,

in the formula, R¹Is a substituted or unsubstituted divalent hydrocarbon group with 1-12 carbon atoms;

(B) a compound having 2 or more alkenyl groups in one molecule;

(C) a hydrosilylation reaction catalyst.

2. The curable composition according to claim 1, wherein R is¹Is phenylene.

3. The curable composition according to claim 1, wherein the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom is at least one of diallyl phthalate, triallyl trimellitate, tetraallyl pyromellitate, and triallyl isocyanurate.

4. The curable composition according to claim 2, wherein the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom is at least one of diallyl phthalate, triallyl trimellitate, tetraallyl pyromellitate, and triallyl isocyanurate.

5. The curable composition according to claim 1, wherein (B) is a compound represented by the following formula (2),

in the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is1 to 100; the arrangement of the siloxane units with brackets may be arbitrary.

6. The curable composition according to claim 2, wherein (B) is a compound represented by the following formula (2),

in the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is an integer of 1 to 100; the arrangement of the siloxane units with brackets may be arbitrary.

7. The curable composition according to claim 3, wherein (B) is a compound represented by the following formula (2),

in the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is an integer of 1 to 100; the arrangement of the siloxane units with brackets may be arbitrary.

8. The curable composition according to claim 4, wherein (B) is a compound represented by the following formula (2),

in the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is an integer of 1 to 100; the arrangement of the siloxane units with brackets may be arbitrary.

9. A cured product obtained by curing the curable composition according to any one of claims 1 to 8.

10. The cured product according to claim 9, wherein the light transmittance at a wavelength of 400nm (25 ℃) is 80% or more when the thickness is 2 mm.

11. The cured product according to claim 9, wherein the hardness defined by ASTM D2240 measured by an A durometer is 30 or more.

12. The cured product according to claim 10, wherein the hardness defined by ASTM D2240 measured by an A durometer is 30 or more.

13. A semiconductor device, which is characterized in that a semiconductor element is covered with the cured product according to claim 9.

14. A semiconductor device, which is characterized in that a semiconductor element is covered with the cured product according to claim 10.

15. A semiconductor device, which is characterized in that a semiconductor element is covered with the cured product according to claim 11.

16. A semiconductor device, which is characterized in that a semiconductor element is covered with the cured product according to claim 12.

Technical Field

The present invention relates to a curable composition, a cured product thereof, and a semiconductor device using the cured product.

Background

Conventionally, epoxy resins have been generally used as materials for optical devices and optical components, particularly as sealing materials for Light Emitting Diode (LED) elements. Further, there have been attempts to use silicone resin as a mold member of an LED element or the like (patent documents 1 and 2) and to use silicone resin as a color filter material (patent document 3), but there are few practical examples of use.

In recent years, white LEDs have attracted attention, but epoxy sealing materials that have not been problematic in the past have problems such as yellowing due to ultraviolet rays and the like, and cracking due to an increase in the amount of heat generated as a result of miniaturization, and it is urgent to address these problems. As a countermeasure against these problems, the use of a silicone resin cured product having a large number of phenyl groups in the molecule has been studied. However, such a composition has low toughness and is likely to cause cracking.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 10-228249

Patent document 2: japanese patent laid-open publication No. 10-242513

Patent document 3: japanese patent laid-open No. 2000-123981

Disclosure of Invention

Technical problem to be solved by the invention

The present invention has been made to solve the above problems, and an object of the present invention is to provide a curable composition that gives a cured product having high hardness and toughness and excellent light transmittance in a short wavelength region.

Means for solving the problems

In order to solve the above-mentioned problems, the present invention provides a curable composition comprising the following (a), (B) and (C):

(A) an addition reaction product of an organosilicon compound represented by the following formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, which has 2 or more SiH groups in one molecule,

in the formula, R¹Is a substituted or unsubstituted divalent hydrocarbon group with 1-12 carbon atoms;

(B) a compound having 2 or more alkenyl groups in one molecule;

(C) a hydrosilylation reaction catalyst.

The curable composition of the present invention can provide a curable composition that can give a cured product having high hardness and toughness and excellent light transmittance in a short wavelength region.

In the curable composition of the present invention, R is preferably R¹Is phenylene.

In the curable composition of the present invention, it is further preferable that the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom is at least one of diallyl phthalate, triallyl trimellitate, tetraallyl pyromellitate (tetraallyl pyromallate), and triallyl isocyanurate.

In the curable composition of the present invention, it is further preferable that (B) is a compound represented by the following formula (2).

In the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is an integer of 1 to 100. The arrangement of the siloxane units with brackets may be arbitrary.

In the present invention, if R¹And the component (B) is the above-mentioned group or compound, the effects of the present invention can be more surely exhibited.

The present invention also provides a cured product obtained by curing the curable composition.

The cured product of the present invention has high hardness and toughness and excellent light transmittance in a short wavelength region.

The cured product of the present invention preferably has a light transmittance (25 ℃) of 80% or more at a wavelength of 400nm at a thickness of 2 mm.

The cured product having such light transmittance can be suitably used for protection, sealing or adhesion, wavelength change or adjustment of a light emitting diode element, or applications such as a lens, and is also useful as a material for various optical parts such as a lens material, a sealing material for an optical device or an optical part, a display material, an insulating material for an electronic device or an electronic part, and a coating material.

In addition, the cured product of the present invention preferably has a hardness of 30 or more as determined by ASTM D2240, which is measured by a durometer a (durometer a).

Such a cured product is less susceptible to external stress and can suppress adhesion of impurities and the like as much as possible.

The present invention also provides a semiconductor device in which a semiconductor element is covered with the cured product.

In the semiconductor device of the present invention, the hardness and toughness of the cured product used are high, and therefore the semiconductor device has excellent durability. Further, since the light transmittance in the short wavelength region is excellent, the semiconductor device is also useful as a semiconductor device which requires light transmittance such as a light emitting diode element.

Effects of the invention

The curable composition of the present invention can provide a cured product having high hardness and toughness and excellent light transmittance in a short wavelength region. Therefore, the present invention can be suitably used for protection, sealing or adhesion, wavelength change or adjustment, or lens of a light emitting diode element. Therefore, the cured product obtained from the curable composition of the present invention can be suitably used for protection, sealing or adhesion of a light emitting diode element, wavelength change or adjustment, or applications such as a lens. Further, the resin composition is also useful as a lens material, a sealing material for optical devices or optical parts, a material for various optical parts such as a display material, an insulating material for electronic devices or electronic parts, and a coating material. Further, the semiconductor device of the present invention using such a curable composition is excellent in reliability.

Drawings

FIG. 1 is a schematic cross-sectional view showing an example of an optical semiconductor device using a cured product of the curable composition of the present invention.

FIG. 2 is a GPC chart of the addition reaction product (A-1) obtained in Synthesis example 1.

FIG. 3 is a GPC chart of the addition reaction product (A-2) obtained in Synthesis example 2.

FIG. 4 is a GPC chart of the addition reaction product (A-3) obtained in Synthesis example 3.

FIG. 5 is a GPC chart of addition reaction product (A-4) obtained in Synthesis example 4.

Description of the reference numerals

1: a semiconductor device; 2: a silver-plated substrate; 3: packaging; 4: a semiconductor chip; 5: bonding wires; 6: a cured product of the curable composition.

Detailed Description

As described above, development of a curable composition capable of providing a cured product having high hardness and toughness and excellent light transmittance in a short wavelength region has been desired.

The present inventors have conducted extensive studies on the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a curable composition containing a specific component, and have completed the present invention.

That is, the present invention is a curable composition containing the following (a), (B), and (C):

(A) an addition reaction product of an organosilicon compound represented by the following formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, which has 2 or more SiH groups in one molecule,

in the formula, R¹Is a substituted or unsubstituted divalent hydrocarbon group with 1-12 carbon atoms;

(B) a compound having 2 or more alkenyl groups in one molecule;

(C) a hydrosilylation reaction catalyst.

The present invention will be described in detail below, but the present invention is not limited thereto.

[ curable composition ]

[ (A) component ]

The component (a) in the curable composition of the present invention functions as a crosslinking agent that undergoes a hydrosilylation reaction with the component (B) described later.

The component (A) in the curable composition of the present invention is an addition reaction product of an organosilicon compound represented by the following formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, and having 2 or more SiH groups in one molecule,

in the formula, R¹Is a substituted or unsubstituted divalent hydrocarbon group having 1 to 12 carbon atoms.

As R¹The divalent hydrocarbon group having 1 to 12 carbon atoms includes alkylene groups such as methylene, ethylene, n-propylene, n-butylene, n-pentylene, n-hexylene, cyclohexylene, and n-octylene; arylene groups such as phenylene and naphthylene; or a group in which some or all of the hydrogen atoms of these groups are substituted with a halogen atom such as fluorine, bromine or chlorine, as R¹Particularly preferred is phenylene.

Preferred specific examples of the organosilicon compound represented by the above formula (1) are shown below, but not limited thereto. The organosilicon compound represented by the above formula (1) may be used singly or in combination of two or more.

Preferred specific examples of the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom are shown below, but not limited thereto. The organic compound may be used alone or in combination of two or more.

More preferably, the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom is at least one of diallyl phthalate, triallyl trimellitate, tetraallyl pyromellitate, and triallyl isocyanurate.

Examples of the alkenyl group include linear alkenyl groups such as vinyl, allyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, and octenyl; a cyclic alkenyl group such as a norbornenyl group or cyclohexenyl group, and a vinyl group or allyl group is preferable.

Preferred examples of the component (a) which is an addition reaction product of the organosilicon compound represented by the above formula (1) and an organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom include compounds having a structural unit ratio represented by the following formula.

Wherein n is an integer of 1 to 10, and the dotted line represents a bond.

Specific examples of the compound having such a structural unit ratio include, but are not limited to, compounds represented by the following structural formulae.

[ (preparation of component A ]

The component (a) in the curable composition of the present invention can be obtained by: the compound represented by the formula (1) is mixed in an excess amount, preferably in an amount of more than 1 mol and 10 mol or less, more preferably in an amount of more than 1.5 mol and 5 mol or less, based on 1 mol of the alkenyl group contained in the organic compound having 2 or more alkenyl groups in one molecule and containing no silicon atom, and a hydrosilylation reaction is carried out in the presence of both.

(A) Unreacted alkenyl groups derived from the organic compound may be present in the component (a), but it is preferable that all alkenyl groups are subjected to a hydrosilylation reaction.

As the catalyst used in the hydrosilylation reaction, a known catalyst can be used. Examples of the catalyst include platinum catalysts such as platinum metal-supported carbon powder, platinum black, platinum tetrachloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid and olefins, and platinum bis (acetoacetate); platinum group metal catalysts such as palladium catalysts and rhodium catalysts. The addition reaction conditions, purification conditions, use of a solvent, and the like are not particularly limited, and a known method may be used.

The component (a) in the curable composition of the present invention may be composed of one compound or may be composed of a combination (mixture) of two or more compounds.

By selecting an appropriate measurement method, it can be confirmed that the compound constituting the component (a) has 2 or more SiH groups in one molecule. When two or more compounds constituting the component (a) are used, the compound can be measured by selecting an appropriate combination of measurement methods (for example,¹H-NMR, GPC, etc.) to confirm that each compound has 2 or more SiH groups in one molecule.

[ (B) component ]

The component (B) in the curable composition of the present invention is a compound having 2 or more alkenyl groups in one molecule.

Examples of the alkenyl group include linear alkenyl groups such as vinyl, allyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, and octenyl; a cyclic alkenyl group such as a norbornenyl group or cyclohexenyl group, and a vinyl group or allyl group is preferable.

Specific examples of the component (B) are not particularly limited, and examples thereof include dimethylsiloxane/methylvinylsiloxane copolymers having both molecular chain terminals blocked with trimethylsiloxy groups, dimethylsiloxane/diphenylsiloxane/methylvinylsiloxane copolymers having both molecular chain terminals blocked with trimethylsiloxy groups, and dimethylsiloxane/diphenylsiloxane copolymers having both molecular chain terminals blocked with dimethylvinylsiloxy groups.

Examples of the compound other than siloxane include compounds represented by the following formulae, but are not limited thereto.

h is an integer of 0 to 10.

(B) One of the components may be used alone, or two or more of the components may be used in combination.

The component (B) is preferably a linear organopolysiloxane represented by the following formula (2).

In the formula, R²Independently is methyl or phenyl, R³Independently a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a is an integer of 0 to 50, and b is an integer of 0 to 100; wherein, when a is 0, R²Is phenyl and b is an integer of 1 to 100; the arrangement of the siloxane units with brackets may be arbitrary.

AsR³Examples of the monovalent hydrocarbon group having 1 to 12 carbon atoms include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl and octyl; cycloalkyl groups such as cyclohexyl; alkenyl groups such as vinyl, allyl, and propenyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl, phenethyl, and phenylpropyl; or those in which some or all of the hydrogen atoms are substituted with a halogen atom such as fluorine, bromine, chlorine, etc., among them, an alkyl group having 1 to 6 carbon atoms, a phenyl group, and a vinyl group are preferable, and a methyl group is particularly preferable.

In the formula (2), a is an integer of 0 to 50, preferably 1 to 10, more preferably 1 to 7, and further preferably 1 to 4. B is an integer of 0 to 100, preferably 0 to 50, more preferably 0 to 10, and further preferably 0 to 4.

The organopolysiloxane represented by formula (2) can be obtained, for example, by: hydrolyzing and condensing a bifunctional silane such as dichlorodiphenylsilane or dialkoxydiphenylsilane, and capping the resultant with a siloxane unit containing an aliphatic unsaturated group; the terminal is terminated with a siloxane unit containing an aliphatic unsaturated group by hydrolytic condensation of a bifunctional silane such as dichlorodiphenylsilane or dialkoxydiphenylsilane.

(B) The amount of the component (b) is preferably such that the molar ratio of the SiH groups to the aliphatic unsaturated groups (SiH groups/aliphatic unsaturated groups) in the composition is 0.5 or more and 5 or less, and more preferably such that the molar ratio of the SiH groups to the aliphatic unsaturated groups (SiH groups/aliphatic unsaturated groups) in the composition is 0.8 or more and 2 or less. When the molar ratio (SiH group/aliphatic unsaturated group) is 0.5 or more and 5 or less, the composition of the present invention can be sufficiently cured.

[ (C) ingredient ]

As the hydrosilylation catalyst of the component (C) of the present invention, the same catalysts as those used for the preparation of the component (A) can be used.

The amount of the component (C) to be added to the curable composition of the present invention is not particularly limited as long as it is an effective amount as a catalyst, but is preferably 1 to 500ppm, more preferably 1 to 100ppm, and further preferably 2 to 12ppm, in terms of platinum group metal atom, based on the mass of the entire composition. By setting the blending amount within the above range, the time required for the curing reaction is appropriate, and the coloring of the cured product can be suppressed.

[ other ingredients ]

In addition to the components (a) to (C), components such as an antioxidant, an inorganic filler, and an adhesion promoter may be blended in the curable composition of the present invention as needed.

[ antioxidant ]

In the cured product of the curable composition of the present invention, the addition-reactive carbon-carbon double bond in the component (B) may remain as it is without reaction, and may be oxidized by oxygen in the atmosphere, thereby causing coloring of the cured product. In contrast, if necessary, an antioxidant may be blended in the curable composition of the present invention to prevent such coloring.

As the antioxidant, known antioxidants can be used, and examples thereof include 2, 6-di-tert-butyl-4-methylphenol, 2, 5-di-tert-amylhydroquinone, 2, 5-di-tert-butylhydroquinone, 4 ' -butylidenebis (6-tert-butyl-3-methylphenol), 2 ' -methylenebis (4-methyl-6-tert-butylphenol), 2 ' -methylenebis (4-ethyl-6-tert-butylphenol), and the like. These antioxidants may be used alone or in combination of two or more.

When the antioxidant is used, the amount of the antioxidant is not particularly limited, but is usually about 1 to 10,000ppm, and particularly preferably about 10 to 1,000ppm, based on the total mass of the components (A) and (B). By setting the blending amount within the above range, the antioxidant ability can be sufficiently exhibited, and a cured product excellent in optical properties can be obtained without causing coloration, cloudiness, oxidative deterioration, and the like.

[ inorganic Filler ]

Inorganic fillers such as nano silica, fused silica, crystalline silica, titanium oxide, nano alumina, and alumina may be added to adjust the viscosity of the curable composition of the present invention, the hardness of a cured product obtained from the curable composition of the present invention, and the like, to improve the strength, and to optimize the dispersion of the phosphor.

[ adhesion promoter ]

An adhesion promoter may be blended in the curable composition of the present invention. Examples of the adhesion promoter include a silane coupling agent or an oligomer thereof, and a polysiloxane having the same reactive group as the silane coupling agent.

The adhesion promoter is an arbitrary component blended in the curable composition of the present invention for the purpose of improving the adhesion of the composition and the cured product thereof to a substrate. Wherein, the base material is metal material such as gold, silver, copper, nickel, etc.; ceramic materials such as alumina, aluminum nitride, and titanium oxide; high polymer materials such as silicone resin and epoxy resin. The adhesion promoter may be used alone or in combination of two or more.

The amount of the adhesion promoter used is preferably 1 to 30 parts by mass, more preferably 1 to 10 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). When the amount is such an amount, the adhesion of the thermosetting silicone composition of the present invention and the cured product thereof to a substrate is effectively improved, and coloration is less likely to occur.

Preferred specific examples of the adhesion promoter include, but are not limited to, adhesion promoters represented by the following formulae.

[ others ]

In addition, in order to secure the pot life (pot life), an addition reaction control agent such as 1-ethynylcyclohexanol, 3, 5-dimethyl-1-hexyn-3-ol, or the like may be blended.

Further, a light stabilizer for imparting resistance to light deterioration due to light energy such as sunlight and fluorescent lamps may be used. As the light stabilizer, a hindered amine stabilizer that traps radicals generated by photooxidative deterioration is preferable, and the antioxidant effect is further improved by using an antioxidant in combination. Specific examples of the light stabilizer include bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate, 4-benzoyl-2, 2,6, 6-tetramethylpiperidine and the like.

When the composition of the present invention is used as a sealing material, a silane coupling agent for improving adhesion to a substrate may be blended, or a plasticizer for preventing cracks may be added.

[ cured product ]

The curable composition of the present invention is cured to obtain a cured product of the present invention. The cured product has high hardness and toughness and excellent light transmittance in a short wavelength region. The curing conditions of the curable composition of the present invention are not particularly limited, and preferably 60 to 180 ℃ for 5 to 180 minutes.

The cured product obtained from the curable composition of the present invention preferably has a light transmittance (25 ℃) of 80% or more at a wavelength of 400nm at a thickness of 2 mm.

The cured product of the present invention having such optical properties can be suitably used for protection, sealing, adhesion, wavelength change, adjustment, or lens of a light-emitting diode element, and is also useful as a lens material, a sealing material for an optical device or an optical component, a material for various optical components such as a display material, an insulating material for an electronic device or an electronic component, and a coating material.

[ semiconductor device ]

The present invention also provides a semiconductor device in which a semiconductor element is covered with a cured product obtained from the curable composition.

Hereinafter, a semiconductor device using a cured product of the curable composition of the present invention (hereinafter, also referred to as "semiconductor device of the present invention") will be described with reference to fig. 1, but the present invention is not limited thereto.

Fig. 1 is a schematic sectional view showing one example of a semiconductor device of the present invention. In a semiconductor device 1 of the present invention, a semiconductor chip 4 is die-bonded to a package 3 on which a silver-plated substrate 2 is formed, and the semiconductor chip 4 is wire-bonded by a bonding wire 5. Then, the semiconductor chip 4 is covered with the cured product 6 of the curable composition of the present invention. The curable composition (addition curable silicone composition) of the present invention is applied, and the curable composition is cured by heating, thereby covering the semiconductor chip 4. The curable composition may be cured by a known curing method under other known curing conditions.

In this case, it is preferable that the curable composition is cured to form a cured product having a hardness of 30 or more as determined by JIS or ASTM D2240 measured by an a durometer, from the viewpoint of being less susceptible to external stress and suppressing adhesion of impurities and the like as much as possible.

The curable composition of the present invention forms a cured product having high hardness and toughness and excellent light transmittance in a short wavelength region, and thus the semiconductor device of the present invention using the curable composition has excellent reliability.

Examples

The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited thereto.

In addition, in the embodiments, the first and second electrodes,¹AVANCE III manufactured by Bruker BioSpin Corporation was used for H-NMR measurement. GPC (gel permeation chromatography) measurement was carried out using HLC-8320GPC manufactured by TOSOH CORPORATION and Tetrahydrofuran (THF) as a mobile phase in terms of polystyrene.

[ Synthesis example 1] (A-1) preparation of component

Into a 500mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, 220g (1.1 mol) of 1, 4-bis (dimethylsilyl) benzene (HOKKO CHEMICAL INDUSTRY co., ltd.) and 0.11g of 5% platinum carbon powder (n.e. chemcat CORPORATION) were charged and heated to 85 ℃. 42g (0.1 mol) of tetraallylpyromellitate (WAKO PURE CHEMICAL INDUSTRIES, LTD, TRIAM-805) was added dropwise thereto. After the dropwise addition, stirring for 3 hours at 90-100 ℃. After stirring, the temperature is returned to 25 ℃ by¹When the H-NMR spectrum was measured, the allyl group peak was confirmed to have disappeared. Adding 4g of active carbon, and stirring the mixture for 1After the lapse of time, platinum charcoal powder and activated charcoal were filtered out, and the remaining 1, 4-bis (dimethylsilyl) benzene was removed by concentration to obtain 104g of (A-1) (pale yellow transparent, viscosity at 23 ℃ 240 pas).

As a result of analyzing the reaction product by GPC (fig. 2) or the like, the obtained reaction product was a mixture of compounds having structures represented by the following formulae (a1) to (c1), and the ratio of each compound was (a1), (b1) and (c1) was 51:24:25 (mol%). Further, the SiH group content ratio of the whole mixture was 0.0027 mol/g.

(a1)

(b1)

(c1)

n is 3 to 10, and the dotted line represents a bond.

[ Synthesis example 2] (A-2) preparation of component

166g (0.85 mol) of 1, 4-bis (dimethylsilyl) benzene (HOKKO CHEMICAL INDUSTRY co., ltd.) and 0.08g of 5% platinum carbon powder (n.e. chemcat CORPORATION) were put into a 500mL four-neck flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, and heated to 85 ℃. To this was added dropwise 33g (0.1 mol) of triallyl trimellitate (WAKO PURE CHEMICAL INDUSTRIES, manufactured by LTD, TRIAM-705). After the dropwise addition, stirring for 3 hours at 90-100 ℃. After stirring, the temperature is returned to 25 ℃ by¹When the H-NMR spectrum was measured, the allyl group peak was confirmed to have disappeared. Adding 4g of activated carbon, stirring for 1 hr, filtering out platinum carbon powder and activated carbon, concentrating to remove residual 1, 4-bis (dimethylsilyl) benzene to obtain 75g of (A-2)And (pale yellow transparent, viscosity at 23 ℃ 66 pas).

As a result of analyzing the reaction product by GPC (fig. 3) or the like, the obtained reaction product was a mixture of compounds having structures represented by the following formulae (a2) to (d2), and the proportions of the respective compounds were (a2), (b2), (c2), (d2) 58:22:9:11 (mol%), yielding oligomers containing these compounds as main components. Further, the SiH group content ratio of the whole mixture was 0.0028 mol/g.

(a2)

(b2)

(c2)

(d2)

n is 4 to 10, and the dotted line represents a bond.

[ Synthesis example 3] (A-3) preparation of component

Into a 500mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, 152g (0.8 mol) of 1, 4-bis (dimethylsilyl) benzene (HOKKO CHEMICAL INDUSTRY co., ltd.) and 0.1g of 5% platinum carbon powder (n.e. chemcat CORPORATION) were charged, and the mixture was heated to 85 ℃. To this was added dropwise a mixture of 25g (0.075 mol) of triallyl trimellitate (manufactured by WAKO PURE CHEMICAL INDUSTRIES, LTD, TRIAM-705) and 6g (0.025 mol) of diallyl phthalate (manufactured by WAKO PURE CHEMICAL INDUSTRIES, LTD). After the dripping is finished, 90 toStirring is carried out for 5 hours at 100 ℃. After stirring, the temperature is returned to 25 ℃ by¹When the H-NMR spectrum was measured, the allyl group peak was confirmed to have disappeared. 2.7g of activated carbon was added thereto, and after stirring for 1 hour, the platinum carbon powder and the activated carbon were filtered out, and the remaining 1, 4-bis (dimethylsilyl) benzene was removed by concentration to obtain 74g of the (A-3) component (colorless and transparent, viscosity at 23 ℃ C.: 25 pas).

Figure 4 shows the GPC profile of the reaction product. The obtained reaction product was a mixture of oligomers composed of the following structural units, and the content ratio of SiH groups in the whole mixture was 0.0032 mol/g.

[ Synthesis example 4] (A-4) preparation of component

Into a 500mL four-necked flask equipped with a stirrer, a condenser, a dropping funnel and a thermometer, 165g (0.85 mol) of 1, 4-bis (dimethylsilyl) benzene (HOKKO CHEMICAL INDUSTRY co., ltd.) and 0.1g of 5% platinum carbon powder (n.e. chemcat CORPORATION) were charged, and the mixture was heated to 85 ℃. 25g (0.1 mol) of triallyl isocyanurate was added dropwise thereto. After the dropwise addition, stirring is carried out for 5 hours at the temperature of 90-100 ℃. After stirring, the temperature is returned to 25 ℃ by¹When the H-NMR spectrum was measured, the allyl group peak was confirmed to have disappeared. 2.9g of activated carbon was added thereto, and after stirring for 1 hour, the platinum carbon powder and the activated carbon were filtered out, and the remaining 1, 4-bis (dimethylsilyl) benzene was removed by concentration to obtain 63g of the (A-4) component (colorless and transparent, viscous at 23 ℃).

As a result of analyzing the reaction product by GPC (fig. 5) or the like, the obtained reaction product was a mixture of compounds having structures represented by the following formulae (a4) to (d4), and the proportions of the respective compounds were (a4), (b4), (c4), (d4) 57:24:11:8 (mol%), and the content of SiH groups in the entire mixture was 0.0033 mol/g.

(a4)

(b4)

(c4)

(d4)

n is 4 to 10, and the dotted line represents a bond.

Examples 1 to 7 and comparative examples 1 and 2

The following components were mixed in the composition ratios (numerical values represent parts by mass) shown in table 1, and a curable composition was prepared so that the molar ratio of SiH groups to alkenyl groups ([ SiH groups ]/[ alkenyl groups ]) in the composition was 1.1. In the following examples, symbols representing structural units of the organopolysiloxane are shown below.

M^Vi：(CH₂＝CH)(CH₃)₂SiO_1/2

M^H：H(CH₃)₂SiO_1/2

D^2Φ：(C₆H₅)₂SiO_2/2

T^Φ：(C₆H₅)SiO_3/2

(A) Composition (I)

(A-1) addition reaction product obtained in Synthesis example 1

(A-2) addition reaction product obtained in Synthesis example 2

(A-3) addition reaction product obtained in Synthesis example 3

(A-4) addition reaction product obtained in Synthesis example 4

Comparative Components

(A-5)M^H ₃T^Φ ₁A branched organopolysiloxane represented by

(B) Composition (I)

(B-1)M^Vi ₂D^2Φ ₁The straight-chain organopolysiloxane represented by

(B-2) bisphenol bis allyl ether (HOKKO CHEMICAL INDUSTRY CO., LTD. manufactured by product name "BPA-AE")

(C) Composition (I)

Polysiloxane dilution of platinum-1, 3-divinyl-1, 1,3, 3-tetramethyldisiloxane complex (platinum content: 1 wt%).

[ Table 1]

[ Performance evaluation method ]

The properties of the cured products of the curable compositions obtained in the examples and comparative examples were evaluated by the following methods. In comparative example 2, the crosslinking agent was incompatible with the main agent (component (B)), and a cured product could not be obtained.

(1) Hardness of

A curable composition was injected into a mold composed of glass plates, and the resulting mixture was cured at 150 ℃ for 4 hours to obtain a cured product. The results of measuring the hardness (Shore D or Type A) of each cured product at 23 ℃ based on ASTM D2240 are shown in Table 2. Furthermore, Shore D hardness was measured using a cured product having a thickness of 2mm, and note D was added before the numerical value. Further, the TypeA hardness was measured using a cured product having a thickness of 6mm, and note A was added before the numerical value.

(2) Light transmittance

For cured products having a thickness of 2mm prepared in the same manner as in the above hardness measurement, the light transmittance at 400nm of each cured product was measured using a spectrophotometer. The measurement results are shown in table 2.

(3) Evaluation of toughness

In the same manner as in the above hardness measurement, cured products having a thickness of 2mm were prepared in examples 1,3, 5 and 6 and comparative example 1, and cured products having a thickness of 0.3mm were prepared in examples 2, 4 and 7. The state of each cured product when bent at right angles along a metal rod having a diameter of 1mm at 23 ℃ was evaluated as ≈ bending without cracking and × (cracking).

(4) Elongation and tensile strength

For a cured product having a thickness of 2mm prepared in the same manner as in the above hardness measurement, the elongation and tensile strength of each cured product were measured at 23 ℃ in accordance with JIS-K-6249: 2003. The measurement results are shown in table 2. In addition, examples 2, 4, 6 and 7 had very high hardness, and elongation and tensile strength could not be measured.

[ Table 2]

As shown in tables 1 and 2, the curable composition of the present invention has good compatibility between the component (a) and the component (B), and can provide a cured product having excellent hardness, toughness, and transparency.

On the other hand, using M^H ₃T^Φ ₁The organopolysiloxane represented by (a) is inferior in toughness, elongation, and tensile strength in the composition in place of the component (a) of the present invention (comparative example 1), and the compatibility is insufficient when the component (B) having no siloxane is used (comparative example 2).

In addition, the present invention is not limited to the above embodiments. The above embodiments are illustrative, and any embodiments having substantially the same configuration as the inventive concept described in the claims of the present invention and exhibiting the same operational effects are included in the technical scope of the present invention.