阅读说明：本技术 一种感应器件及其灌封方法 (Induction device and encapsulating method thereof ) 是由 凌坚 白云 于 2019-04-12 设计创作，主要内容包括：本发明公开了一种感应器件及其灌封方法,传感器封装器件和方法技术领域。本发明提供了提供精度高和灵敏度高的一种感应器件,以及操作简单、成本可控及规模化实施的一种感应器件灌封方法。其中,感应器件及灌封方法可实现对感应器件的灌封充分定位,包括其导电部的定位,基板及感应部相对于灌封体内的位置,使的感应器件的感应精度获得提高的同时,无需使用大型的灌封设备和精密的灌封模具,降低了感应器件的生产成本,且该器件灌封后定位部不干扰感应器件的接收信号,提高感应器件的精度,且该方法重复度高,可以适用于大规模的生产。(The invention discloses an induction device and an encapsulating method thereof, and belongs to the technical field of sensor encapsulating devices and methods. The invention provides the induction device with high precision and high sensitivity and the induction device encapsulating method which is simple to operate, controllable in cost and large-scale in implementation. The induction device and the encapsulation method can realize full encapsulation positioning of the induction device, including positioning of the conductive part of the induction device, and the positions of the substrate and the induction part in the encapsulation body are relative to each other, so that the induction precision of the induction device is improved, meanwhile, large-scale encapsulation equipment and a precise encapsulation mold are not needed, the production cost of the induction device is reduced, the receiving signal of the induction device is not interfered by the positioning part after the induction device is encapsulated, the precision of the induction device is improved, the method is high in repeatability, and the induction device can be suitable for large-scale production.)

1. An inductor potting method, comprising: manufacturing a positioning part (a 4); manufacturing a potting mold comprising at least one potting cavity (b 1); mounting the positioning part (a 4) and the induction device to be encapsulated into a whole; positioning an induction device mounted with a positioning part (a 4) in the potting cavity (b 1); injecting a potting material into the potting cavity (b 1); and taking out the encapsulated induction device after the encapsulating material is cooled.

2. The inductor potting method according to claim 1, wherein a thimble (b 2) is provided in the potting cavity (b 1), the positioning portion (a 4) is provided with a positioning hole (a 41), and the positioning hole (a 41) is matched with the thimble (b 2) so that the positioning portion (a 4) is inserted and mounted on the thimble (b 2).

3. An induction device potting method as claimed in claim 2 further comprising manufacturing a mounting pin (b 6), the locating portion (a 4) including a mounting hole (a 42), the mounting pin (b 6) cooperating with the mounting hole (a 42) to socket mount the locating portion (a 4) to the mounting pin (b 6), the method further comprising socket mounting the locating portion (a 4) to the mounting pin (b 6), inserting the mounting pin (b 6) deep inside the potting cavity (b 1), and mounting the locating portion (a 4) to the thimble (b 2).

4. The method of claim 1, further comprising manufacturing a potting cap (b 3) and sealing by the potting cap (b 3) after injecting potting material; the induction device to be encapsulated is provided with a conductive part, and the encapsulating cover (b 3) is provided with a conductive part through hole and a bolt hole (b 4).

5. An inductive device manufactured by the potting method of any of claims 1 to 4, comprising: the packaging structure comprises a substrate (a 1), a sensing part (a 2) arranged on the substrate (a 1), and a conductive part electrically connected with the substrate (a 1), and is characterized by further comprising a packaging body (a 5) and a positioning part (a 4), wherein the substrate (a 1) is detachably mounted with the fixing part into a whole, the positioning part (a 4) and the substrate (a 1) are wrapped in the packaging body (a 5), and the conductive part extends out of the packaging body (a 5).

6. The inductive device according to claim 5, characterized in that the positioning portion (a 4) comprises a positioning hole (a 41).

7. The inductive device of claim 6, wherein the locating portion (a 4) further comprises mounting holes (a 42), the mounting holes (a 42) being two or more.

8. The inductive device of claim 7, wherein the positioning portion (a 4) further comprises two posts (a 43), and a slot structure (a 44) is provided in the two posts (a 43) to fit two opposite sides of the substrate (a 1).

9. The inductive device of claim 1, wherein said inductive device is a hydrophone.

10. The inductive device according to claim 1, characterized in that the potting body is a cylinder, or a polygonal prism, or an elliptical cylinder, and a protruding or recessed mark (a 6) is provided on the potting body, said protruding or recessed mark (a 6) being offset from the central axis of the potting body and being in the same plane as the substrate (a 1).

Technical Field

The invention relates to the technical field of sensor packaging devices and methods, in particular to an induction device and an encapsulating method thereof.

Background

With the wide application of semiconductor technology in industrial automation, computer technology and communication technology, the variety of small micro sensors is increasing, and the application scenes and environments are increasingly complex. For example, a hydrophone, also called a hydrophone or an underwater microphone, is a transducer for converting an acoustic signal in water into an electrical signal, is applied to underwater communication, detection, target positioning, tracking, and the like, and is an important component of a sonar. For example, in marine seismic exploration, a hydrocarbon-bearing formation may be located by generating an acoustic source signal within it, and then detecting the acoustic source signal from the formation interaction below the body of water, thus placing very high demands on the accuracy of hydrophone installation, sealing performance, and the like.

When packaging a finished underwater sound detection circuit board connected with a lead, the existing method is to use a special mold, fix the circuit board in the cavity of the mold, inject packaging material by high pressure, and finally complete the packaging by cooling and demolding. This method has the following disadvantages: 1) large-scale injection molding equipment is needed, and requirements on fields and operators are high; 2) the cost is required to be high, but the efficiency improvement for mass production is limited. In the prior art, a mold is used for positioning and packaging is carried out at normal temperature and pressure. This method has the following disadvantages: 1) the packaging and positioning difficulty of the sensor is high; 2) the position consistency of the packaging part relative to the sensor is poor; 3) the demoulding difficulty is large and the operation is complicated; 4) the uniformity of the encapsulating material after solidification is poor.

Disclosure of Invention

In view of this, the present invention provides an inductor with high precision and high sensitivity, and an inductor potting method with simple operation, controllable cost and large-scale implementation, which aims to solve the encapsulation problem of inductors under the encapsulation condition under natural pressure.

The technical problem to be solved by the invention is realized by the following technical scheme:

the invention discloses an inductor encapsulating method, which comprises the following steps: manufacturing a positioning part; manufacturing a potting mold comprising at least one potting cavity; the positioning part and the induction device to be encapsulated are installed into a whole; placing the induction device provided with the positioning part in the encapsulation cavity in a positioned manner; injecting a potting material into the potting cavity; and taking out the encapsulated induction device after the encapsulating material is cooled.

In the above method for encapsulating the sensor, preferably, an ejector pin is disposed in the encapsulation cavity, and the positioning portion is provided with a positioning hole, which is matched with the ejector pin so that the positioning portion is inserted and mounted on the ejector pin.

In the above method for potting the inductor, it is preferable that the method further includes manufacturing a mounting pin, the positioning portion includes a mounting hole, the mounting pin is matched with the mounting hole so that the positioning portion is mounted to the mounting pin in an inserting manner, the method further includes inserting the positioning portion onto the mounting pin, inserting the mounting pin into the potting cavity, and mounting the positioning portion onto the thimble.

In the above method for encapsulating an inductor, preferably, the method further comprises manufacturing an encapsulating cover, and sealing the encapsulating cover after injecting an encapsulating material; the induction device to be encapsulated is provided with a conductive part, and the encapsulation cover is provided with a conductive part through hole and a bolt hole.

The invention discloses an induction device, comprising: the base plate, set up in response portion on the base plate, with the electrically conductive part that the base plate electricity is connected, its characterized in that still includes packaging body and location portion, base plate detachably with the fixed part installation is as an organic whole, location portion and base plate parcel in within the packaging body, the electrically conductive part extends outside the packaging body.

In the above sensing device, preferably, the positioning portion includes a positioning hole.

In the above sensing device, preferably, the positioning portion further includes two or more mounting holes.

In the above sensing device, a preferable scheme is that the positioning portion further includes two columns, and a groove structure is provided in the two columns to match with two opposite sides of the substrate.

In the above sensing device, preferably, the sensing device is a hydrophone.

In the above sensing device, preferably, the potting body is a cylinder, a polygonal prism, or an elliptic cylinder, and a convex or concave mark is provided on the potting body, and the convex or concave mark deviates from a central axis of the potting body and is located on the same plane as the substrate.

Compared with the prior art, the invention has the following advantages: the induction device and the encapsulation method can realize full encapsulation positioning of the induction device, including positioning of the conductive part of the induction device and positioning of the substrate and the induction part relative to the position in the encapsulation body, so that the induction precision of the induction device is improved, large-scale encapsulation equipment and a precise encapsulation mold are not needed, the production cost of the induction device is reduced, and the positioning part does not interfere with a receiving signal of the induction device after encapsulation, so that the precision of the induction device is improved. And the method has high repeatability and can be suitable for large-scale production.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

FIG. 1 is a schematic view, partially in cross-section, of an induction device encapsulation method of the present invention in operation;

FIG. 2 is a schematic cross-sectional view of an inductive device of the present invention;

fig. 3 is a schematic perspective view of the positioning part of the present invention.

The labels in the figure are: the induction device 100 comprises a substrate a1, an induction part a2, a lead a3, a positioning part a4, a positioning hole a41, a mounting hole a42, a stand column a43, a groove structure a44, a packaging body a5, a protruding mark a6, a packaging cavity b1, a thimble b2, a packaging cover b3, a bolt hole b4, a lead hole b5, a mounting needle b6, a needle body b7, a handheld block b8 and a second lead hole b 9.

Detailed Description

Preferred embodiments of the invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the invention, and do not limit the scope of the invention. One embodiment of the present invention will be described below with reference to the accompanying drawings.

A method for encapsulating an induction device 100, wherein the induction device 100 comprises a substrate a1, an induction part a2 arranged on the substrate a1, and a conductive part electrically connected with the substrate a1, the conductive part may be a plug or a lead a3, in this case, the conductive part is a lead a3, and the process steps of the method for encapsulating the induction device 100 include:

step one, manufacturing the positioning part a4, in one embodiment, the positioning part a4 is a plastic piece, and the method for manufacturing the positioning piece is mold injection molding.

Step two, manufacturing a potting mold, wherein the potting mold comprises at least one potting cavity b1, the potting cavity b1 may be a cylinder, a polygonal prism, an elliptic cylinder or the like, and in one embodiment, the potting cavity b1 is a cylinder. The encapsulation mold further comprises a thimble b2, and a thimble b2 is arranged at the bottom of the encapsulation cavity b1 and used for demolding the encapsulated and molded inductor 100. The potting mold further comprises a potting cover b3, in one embodiment, the potting cover b3 is a two-step cylinder, the extension structure is provided with a bolt hole b4, and the potting cover b3 can be fixed on the potting cavity b1 through bolts to implement sealing. The center axis of the encapsulating cover b3 is provided with a wire hole b5, and the wire hole b5 is also a conductive part through hole, which is not described in detail below. The lead a3 connected to the sensing device can extend out of the potting chamber b1 through the lead hole b 5.

And step three, installing the positioning part a4 and the induction device 100 to be encapsulated into a whole. The positioning part a4 is provided with a first engagement structure and a second engagement structure, and the first engagement structure is engaged with the edge of the base plate a1 of the sensing device so that the base plate a1 is fixed to the positioning part a 4. In one embodiment, the first mating structure is two pillars a43 disposed on the positioning portion a4, the width of the pillar a43 is about the width of the base plate a1, the two pillars a43 are respectively provided with opposite groove structures a44, the width of the operation structure is equal to the thickness of the base plate a1, and the base plate a1 is used for installing the positioning portion a4 and the sensing device 100 into a whole through the operation of inserting the two pillars a 43. In another embodiment, the bottom edge of the sensing device 100 may be fixed by a groove, or a hole may be provided in the sensing device 100 and a corresponding hole may be provided in the fixing portion, and the sensing device 100 and the fixing portion may be fixed by a bolt.

Step four, the induction device 100 provided with the positioning part a4 is positioned and placed in the potting cavity b 1. In each embodiment, the positioning manner of the sensing device 100 and the potting cavity b1, that is, the second fitting structure described above, may be that a boss or a groove provided in the potting cavity b1 is fitted with a corresponding groove or a boss provided in the positioning portion a 4. In this embodiment, it is preferable that positioning hole a41, i.e., a square hole in the drawing, is provided at the bottom of positioning portion a4, positioning hole a41 is matched with thimble b2 provided at the bottom of encapsulation cavity b1, the end of thimble b2 is a regular quadrangular prism, and positioning portion a4 is inserted into the end of thimble b2 from positioning hole a41, so as to position encapsulation cavity b1 by positioning portion a 4. The positioning part a4 is not rotatable and not horizontally translatable after being installed inside the potting chamber b 1. It is understood that thimble b2 may have other polygonal prism structures, and may have a polygonal frustum, a multi-step shape, etc. Among them, the shape of the multi-prism stage and the multi-step facilitates alignment when mounting the positioning portion a4 on the thimble b2, and can simplify the operation. In one embodiment, step four further includes manufacturing a mounting pin b6, wherein the positioning part a4 includes a mounting hole a42, the mounting pin b6 cooperates with the mounting hole a42 to insert and mount the positioning part a4 to the mounting pin b6, the method further includes inserting the positioning part a4 to the mounting pin b6, inserting the mounting pin b6 into the encapsulation cavity b1, and mounting the positioning part a4 to the thimble b 2. Specifically, two mounting holes a42 are provided, and are located on the positioning portion a4 on both sides of the mounting plane based on the substrate a 1. The mounting needle b6 comprises a hand-held block b8 and two needle bodies b7 fixed on the hand-held block b8, wherein the distance between the needle bodies b7 corresponds to the distance between the mounting holes a 42. In this embodiment, the hand-held block b8 is further provided with a second wire guide hole b 9.

And step five, injecting a potting material into the potting cavity b 1. The potting material, also called as potting adhesive, is initially in a liquid state after being prepared, and is solidified and molded after standing. The sensing device 100 has sealing properties such as water and gas resistance. In one embodiment, the sensing device 100 is a hydrophone and the potting material is rubber, which has a waterproof sealing function and reduces the impedance to the vibration or sound pressure of the sensing sound source.

And step six, taking out the encapsulated induction device 100 after the encapsulation material is cooled. In the present embodiment, a thimble b2 is disposed at the bottom of the encapsulation cavity b1, and the encapsulated inductive device 100 is separated from the encapsulation cavity b1 by the upward movement of the thimble b 2.

In the present embodiment, a positioning and mounting method of the inductive device 100 can be understood by those skilled in the art after knowing a potting method of the inductive device 100. The mounting method specifically includes mounting the substrate a1 and the positioning part a4 into a whole through a manipulation structure, then enabling a lead a3 to penetrate through a second lead hole b9 of the mounting pin b6 and finally penetrate through a mounting hole a42 of the positioning part a4, placing the mounted part into the encapsulation cavity b1, applying force to the two pin bodies b7 to clamp and press the positioning part a4 when placing the part into the encapsulation cavity b1, aligning with a thimble b2 in the encapsulation cavity b1, enabling the positioning hole a41 to be mounted on a thimble b2, then withdrawing the mounting pin b6, injecting encapsulation materials, enabling the encapsulation cover b3 to penetrate through the lead hole b5, sealing the encapsulation cavity b1, and fixing the encapsulation cavity b1 through a bolt hole b4 by bolts to increase encapsulation pressure.

Based on the method for potting the sensing device 100, the present invention further provides a sensing device 100, in an embodiment, the sensing device 100 is a hydrophone, the preferable material of the corresponding potting body is rubber, and the material of the positioning portion a4 is also rubber, so that the rubber has the smallest impedance to the sound pressure signal, and can receive the sound signal to the greatest extent. In other embodiments, the inductive device 100 may be other circuit boards to be packaged. In the present embodiment, the sensing device 100 includes: a substrate a1, a sensing part a2 arranged on the substrate a1, a conductive part electrically connected with the substrate a1, a positioning part a4 detachably and integrally mounted with the substrate a1, and a packaging body a5 wrapping the positioning part a4 and the substrate a 1. Specifically, in this embodiment, the conductive portion is a wire a3, and the wire a3 extends out of the package a5 to facilitate external wiring of the inductive device 100. In one embodiment, the positioning portion a4 includes a positioning hole a41, the positioning hole a41 is a square hole and is disposed at the bottom of the positioning portion a4, and the positioning hole a41 is disposed to be capable of being matched and fixed with the thimble b2 of the encapsulation cavity b 1. In one embodiment, the positioning portion a4 further includes two mounting holes a42, and the two mounting holes a42 are respectively disposed at two sides of the mounting area of the positioning portion a4 with respect to the substrate a 1. In one embodiment, the positioning portion a4 further includes two posts a43, and two posts a43 are provided with groove structures a44 to fit two opposite sides of the base plate a 1. The base plate a1 can be installed and fixed between the two upright posts a43 by means of splicing. In further embodiments, to mount the fixed base plate a1, upward facing slots may be provided on the locating portions a4 that grip the lower edge of the base plate a 1. In one embodiment, the potting body is a cylinder, a protruding mark a6 is provided on the potting body, the protruding mark a6 is offset from the central axis of the potting body and is located on the same plane as the substrate a1, the protruding mark a6 is obtained by a concave hole structure in the potting cavity b1, and the protruding mark serves to indicate the position of the substrate a1 in the potting body. In other embodiments, the potting body may be a polygonal column or an elliptical column, or other potting shapes, the mark may be in the form of a recess, and the position may be the bottom surface or the side surface of the potting body surface.

The inductor 100 and the potting method in this embodiment have the advantages that the separately manufactured positioners a4 are utilized, the positioners a4 can simultaneously position the inductor 100 and the potting mold, and finally the positioners a4 are included in the package a5, and since the positioners a4 are fixed to the substrate a1, for example, the fixed position of the substrate a1 is parallel to the axis of the positioning hole a41, and the axis of the positioning hole a41 is parallel to the axis of the potting cavity b1, the position of the substrate a1 can be ensured to be parallel to the axis of the potting body a5, so that the arrangement of the inductors a2 to the potting body a5 is uniform and symmetrical, and the sensitivity of the inductors a2 is improved. In addition, the positioning portion a4 is fixed to the edge of the sensor 100, so that the sensing of the sensing portion a2 on external information is not affected. The positioning part a4 can utilize the mounting pin b6 in the method to mount the encapsulation cavity b1, is convenient and easy to operate, and is also provided with an encapsulation cover b3 and a matched conducting part through hole, so that the induction device 100 is encapsulated under full enclosure and keeps a certain encapsulation pressure, the solidification of an encapsulation material is promoted, and the subsequent wiring of the induction device 100 is also facilitated. The upright posts a43 in the positioning part a4 are positioned at two sides of the base plate a1, and do not interfere with the operation of the sensing part a 2.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.