阅读说明：本技术 一种纯钛板TA2上化学镀Ni-P合金工艺 (Process for chemically plating Ni-P alloy on pure titanium plate TA2 ) 是由 郭昊 徐俊阳 王嘉雨 于 2020-06-29 设计创作，主要内容包括：本发明涉及一种纯钛板TA2上化学镀Ni-P合金工艺,主要包括以下步骤：(1)对纯钛板TA2表面进行机械打磨(2)用碱性脱脂剂对打磨后的表面进行脱脂清洗1-5min。并用去离子水清洗1-5min(3)将纯钛板TA2放入氢氟酸为主要成分、无机酸性物质为辅助成分的混合溶液中进行活化,并用去离子水清洗1-5min。(4)将活化后的纯钛TA2放入以硫酸镍为镍源次亚磷酸钠为还原剂的化学镍溶液中。此工艺镀层结合力好,生产成本较低,产品质量好。(The invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which mainly comprises the following steps: (1) mechanically polishing the surface of a pure titanium plate TA2 (2), and degreasing and cleaning the polished surface for 1-5min by using an alkaline degreasing agent. And cleaning with deionized water for 1-5min (3), putting pure titanium plate TA2 into mixed solution containing hydrofluoric acid as main component and inorganic acidic substance as auxiliary component for activation, and cleaning with deionized water for 1-5 min. (4) The activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate as a nickel source and sodium hypophosphite as a reducing agent. The process has the advantages of good plating binding force, low production cost and good product quality.)

1. A process for chemically plating Ni-P alloy on a pure titanium plate TA2 is characterized by comprising the following steps:

1) mechanically grinding the surface of the pure titanium plate TA 2;

2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;

3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;

4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.

2. The pure titanium plate TA2 chemical plating Ni-P alloy according to claim 1, wherein in step 1), the mechanical grinding is performed by grinding the surface with 180# to 400# sandpaper, and the surface is smoothed with green snake melon cloth after the grinding.

3. The process of claim 1, wherein the step 2) is performed with degreasing and cleaning for 1-5min, and is performed with deionized water for 1-5 min.

4. The process of claim 1, wherein the hydrofluoric acid used in step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the cleaning water after activation exceeds 200K Ω -cm.

5. The process of claim 1, wherein the nickel sulfate hexahydrate used in step 4) is of analytical grade.

6. The process of claim 1, wherein the mixed solution of step 3) contains hydrofluoric acid 2% -5%, inorganic acidic substance 1% -5%, and water in balance.

7. The process of claim 1, wherein the concentration of nickel sulfate hexahydrate in step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.

8. The process of claim 1, wherein the pure titanium plate TA2 is fully cleaned with deionized water in the process interval of steps 1-4.

Technical Field

The invention relates to the field of material chemical nickel technology application, in particular to a process for chemically plating Ni-P alloy on a pure titanium plate TA 2.

Background

Titanium is a thermodynamically unstable metal, and when the surface thereof is exposed to an oxygen-containing medium such as air or an aqueous solution, a new oxide film is rapidly regenerated. However, this oxide film makes it difficult to perform electrochemical surface treatment on titanium, and particularly when it is used for electroless plating and conversion coating, it is difficult to obtain a coating layer of satisfactory quality, because the adhesion is poor when the titanium is pretreated by a conventional method. Thus. In order to obtain a satisfactory and qualified surface film layer on titanium and titanium alloy, plating pretreatment is a very important step, and the key of the pretreatment is activation film forming treatment.

Disclosure of Invention

The invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which has good plating layer bonding force, lower production cost and good product quality. Is convenient for large-scale production.

The technical scheme adopted by the invention is as follows:

a process for chemically plating Ni-P alloy on a pure titanium plate TA2 comprises the following steps:

1) mechanically grinding the surface of the pure titanium plate TA 2;

2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;

3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;

4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.

In the step 1), the mechanical grinding needs to use sand paper of 180# -400# to grind the surface, and after the mechanical grinding is finished, the surface is evenly ground by using green snake melon cloth.

And 2) degreasing and cleaning for 1-5min, and cleaning for 1-5min by using deionized water.

The hydrofluoric acid adopted in the step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the activated cleaning water exceeds 200K omega cm.

The nickel sulfate hexahydrate used in the step 4) is of analytical grade.

In the step 3), the mixed solution contains 2-5% of hydrofluoric acid, 1-5% of inorganic acidic substance and the balance of water according to volume fraction.

The concentration of the nickel sulfate hexahydrate in the step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.

The invention has the beneficial effects that:

the invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which has the advantages of good film quality, lower price of chemicals used for pretreatment and activation, simple and convenient operation and good stability compared with some chemical nickel processes. Most importantly, the chemical nickel produced by the process can reach 50um in thickness, and the appearance and the corrosion resistance of the coating are excellent.

Detailed Description

A process for chemically plating Ni-P alloy on a pure titanium plate TA2 comprises the following steps:

1) mechanically grinding the surface of the pure titanium plate TA 2;

2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;

3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;

4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.

In the step 1), the mechanical grinding needs to use sand paper of 180# -400# to grind the surface, and after the mechanical grinding is finished, the surface is evenly ground by using green snake melon cloth.

And 2) degreasing and cleaning for 1-5min, and cleaning for 1-5min by using deionized water.

The hydrofluoric acid adopted in the step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the activated cleaning water exceeds 200K omega cm.

The nickel sulfate hexahydrate used in the step 4) is of analytical grade.

In the step 3), the mixed solution contains 2-5% of hydrofluoric acid, 1-5% of inorganic acidic substance and the balance of water according to volume fraction.

The concentration of the nickel sulfate hexahydrate in the step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.

And 4, fully cleaning by using deionized water in the process interval of the steps 1 to 4.