Over-and-under type chemical plating bath system convenient to wash fast
阅读说明：本技术 一种便于快速清洗的升降式化学镀槽系统 (Over-and-under type chemical plating bath system convenient to wash fast ) 是由 俞波 闻丽君 叶继春 盛江 邹子玉 张修飞 王泽明 于 2020-08-10 设计创作，主要内容包括：本发明公开了一种便于快速清洗的升降式化学镀槽系统,该系统包括镀槽和补液装置,镀槽包括镀槽本体,所述的补液装置包括药液管道和碱液管道；该系统还包括有加热系统和外设的循环系统；所述的镀槽铺设有耐高温耐酸碱的PE袋子；所述的补液装置包括储液容器、计量泵、流量计与PLC控制电箱,储液容器的输出端口与计量泵的输入端口连接,镀槽的输入端口与流量计的物理输出端口连接,流量计与PLC控制电箱信号连接,PLC控制电箱与计量泵电连接；具备全自动化学药液循环、补液流量精确、药液温度均匀、化学药液自动补给、化学药液稳定、镀槽不易沉积且清洗方便、维护方便等诸多特点。(The invention discloses a lifting type chemical plating bath system convenient for quick cleaning, which comprises a plating bath and a liquid supplementing device, wherein the plating bath comprises a plating bath body, and the liquid supplementing device comprises a liquid medicine pipeline and an alkali liquor pipeline; the system also comprises a heating system and a peripheral circulating system; the plating bath is paved with a PE bag which is resistant to high temperature and acid and alkali; the liquid supplementing device comprises a liquid storage container, a metering pump, a flow meter and a PLC control electronic box, wherein an output port of the liquid storage container is connected with an input port of the metering pump, an input port of the plating tank is connected with a physical output port of the flow meter, the flow meter is in signal connection with the PLC control electronic box, and the PLC control electronic box is electrically connected with the metering pump; the automatic chemical liquid medicine replenishing device has the characteristics of full-automatic chemical liquid medicine circulation, accurate liquid medicine replenishing flow, uniform liquid medicine temperature, automatic chemical liquid medicine replenishing, stable chemical liquid medicine, difficult deposition of a plating tank, convenience in cleaning, convenience in maintenance and the like.)
1. The utility model provides a over-and-under type chemical plating bath system convenient to wash fast which characterized in that: the system comprises a plating bath and a liquid supplementing device, wherein the plating bath comprises a plating bath body, and the liquid supplementing device comprises a liquid medicine pipeline and an alkali liquor pipeline; the system also comprises a heating system and a peripheral circulating system; the plating bath is paved with a PE bag which is resistant to high temperature and acid and alkali; the liquid supplementing device further comprises a liquid storage container, a metering pump, a flow meter and a PLC control electronic box, wherein an output port of the liquid storage container is connected with an input port of the metering pump, input ports of a liquid medicine pipeline and an alkali liquor pipeline are respectively connected with physical output ports of the flow meters corresponding to the liquid medicine pipeline and the alkali liquor pipeline, output ports of the liquid medicine pipeline and the alkali liquor pipeline are arranged in the plating tank, the flow meters are in signal connection with the PLC control electronic box, and the PLC control electronic box is electrically connected with the metering pump.
2. The lift-type electroless plating bath system facilitating rapid cleaning of claim 1 wherein: heating system set up in the coating bath bottom, including steam circulating pipe, steam circulating pipe be many parallel arrangement's connecting pipe, the connecting pipe end to end constitutes steam circulating pipe, and is provided with the interval between the connecting pipe, steam circulating pipe's one end be provided with steam inlet, the other end is provided with steam outlet in order to realize steam cycle.
3. The lift-type electroless plating bath system facilitating rapid cleaning of claim 2 wherein: the steam circulating pipeline is a stainless steel pipe, and the stainless steel pipe is a straight pipe; the outer contour of the steam circulating pipeline is slightly smaller than the bottom of the plating tank.
4. The lift-type electroless plating bath system facilitating rapid cleaning of claim 1 wherein: the circulating system comprises a circulating pump and a filter, the circulating pump and the filter are arranged outside the plating tank, an output port of the circulating pump is connected with an input port of the filter, and an output port of the filter is connected with an input port of the plating tank.
5. The lift-type electroless plating bath system facilitating rapid cleaning of claim 4, wherein: and plating solution circulating pipelines communicated with the circulating system are also arranged in the plating tank, the number of the plating solution circulating pipelines is two, one ends of the two plating solution circulating pipelines are communicated with each other and are connected with the circulating system, and the other ends of the two plating solution circulating pipelines are arranged in a closed manner.
6. The lift-type electroless plating bath system facilitating rapid cleaning of claim 5 wherein: the plating solution circulating pipeline is provided with a plurality of liquid flowing holes, and the liquid flowing holes are used for allowing the plating solution to enter the circulating system.
7. The lift-type electroless plating bath system facilitating rapid cleaning of claim 1 wherein: the alkali liquor pipeline and the liquid medicine pipeline are fixed on the side wall of the plating tank and are higher than the upper liquid surface of the plating solution, a plurality of spray heads are arranged along the length direction of the alkali liquor pipeline and the liquid medicine pipeline, and the angle of each spray head is adjustable so that the supplemented alkali liquor or the plating solution can be uniformly sprayed into the plating tank through the spray nozzles.
8. The lift-type electroless plating bath system facilitating rapid cleaning of claim 1 wherein: the bottom of the plating tank is paved with a bubbling device which comprises a bubbling pipeline, and the bubbling pipeline is connected with an air source and an output port of a circulating system; the bubbling pipeline is provided with a plurality of bubbling holes, and the bubbling holes are used for introducing gas into the plating solution.
Technical Field
The application relates to the technical field of chemical plating wastewater treatment, in particular to an elevation type chemical plating tank system convenient for rapid cleaning.
Background
Electroless plating, also known as electroless plating, is a plating method in which metal ions in a plating solution are reduced to metal by means of a suitable reducing agent in the absence of an applied current and deposited on the surface of various materials or parts. The chemical nickel plating is a Ni-P amorphous plating layer generated by the reaction of nickel salt, hypophosphite and the like, has the advantages of no need of an external power supply, uniform plating layer, high hardness, good wear resistance, no limitation of the size and the shape of a plated part and the like, and is widely applied to the technical field of surface treatment of products such as electronics, chemical engineering, machinery and the like. However, in the process of plating chemical nickel plating solution using nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent, phosphite radicals, sulfate radicals and sodium ions are continuously accumulated in the plating solution, so that the aging of the plating solution is caused, the deposition speed of the chemical nickel plating is reduced, the performance of the plating solution is reduced, the quality of the plating layer is reduced, and the service life of the plating solution is seriously influenced.
The deposition rate of the chemical plating solution is mainly influenced by the operation temperature, the concentration of metal ions in the plating solution, the concentration of a reducing agent and the pH value of the plating solution during plating. In order to ensure the deposition rate of the plating solution and prolong the service life of the plating solution, the components of the plating solution need to be reasonably and effectively adjusted to ensure timely replenishment of the consumed components of the plating solution such as metal ions, reducing agents and the like. Along with the increase of the plating time of the chemical nickel plating, the impurities in the plating solution are gradually increased, in the chemical nickel plating process, the reduction center on the wall of the bath, the catalytic particles in the plating solution and the deposited nickel layer all cause nickel reduction, and the local temperature difference of the plating solution is too large to easily cause nickel ion precipitation, so the consumption range of the nickel ions cannot be accurately estimated, in addition, the change of the nickel ion concentration and other complex ion concentrations of the plating solution can influence the utilization rate of hypophosphite ions, and the consumption range of the hypophosphite ions cannot be accurately estimated. Therefore, the technology of chemical plating automatic solution replenishment is also important, and the consumption of various reactants in the plating solution needs to be accurately estimated by a chemical plating tank, so that plating, detection and solution replenishment are automatically and synchronously carried out.
Therefore, as the automation degree and the function of the chemical plating production line are more and more perfect, the corresponding chemical plating bath system becomes more and more large and complex. In order to solve the problem that the system elements are too bulky due to more and more functional requirements of the chemical plating bath system, a novel chemical plating bath system is required to be provided, and the chemical plating bath system adopts a functional integration design and realizes the following functions: bubbling constant-temperature plating, automatic liquid supplement, difficult deposition and improvement of the cleaning efficiency of the plating bath.
In the process of automatic dosing, because the intermittent continuous injection of concentrated liquid medicine exists, the plating solution of coating bath and auxiliary tank has certain concentration difference, can cause the homogeneity and the stability of the plating solution temperature at both ends of the cell body to be relatively poor, but the chemical plating process needs to keep the plating solution temperature stable at about 85 ℃ all the time, and how to maintain the temperature of the plating solution under the premise of not reducing the plating solution concentration is a technical problem.
The existing dosing and fluid supplementing method is based on a manual dosing mode, and the defects of large workload, inaccurate dosing control, out-of-control liquid medicine and the like exist when the liquid medicine consumption is controlled by adopting manual dosing. The additive in the replenishment solution is a trace substance in the chemical plating solution, but the additive can greatly change the properties of the plating layer such as appearance quality, physical quality and the like, and the additive is frequently added in excess or insufficient manually or the additive is added for too long time intervals. Both of these problems cause quality problems.
The existing chemical cleaning technology is that a liquid supply system conveys chemical cleaning liquid in a ton bucket to a tank body, the tank body is chemically cleaned, deposited nickel layers on the tank wall and the tank bottom are often difficult to clean, the tank body can be cleaned thoroughly only by manually putting the tank into the tank for cleaning, the chemical cleaning liquid has certain corrosivity, serious potential safety hazards exist for the personal safety of operators, the worker cleaning method is poor in working environment, low in cleaning speed, low in efficiency and safety and low in influence on the production efficiency of enterprises, but if the plating tank is not cleaned in time, the deposited nickel layers can cause the deposition phenomenon to be more serious, the consumption of nickel ions can be more and more, and unnecessary waste can be caused; in addition, due to the limitation of the structure of the bath body, the plating solution or cleaning solution therein is difficult to be completely discharged, and the residual solution which cannot be discharged completely also affects the accurate concentration of the subsequent plating solution.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the lifting type chemical plating bath system which can realize bubbling constant-temperature plating, automatic liquid supplementing, difficult deposition and improvement of the cleaning efficiency of the plating bath and is convenient for quick cleaning.
In order to solve the technical problem, the technical scheme adopted by the application is as follows: a lifting chemical plating bath system convenient for quick cleaning comprises a plating bath and a liquid supplementing device, wherein the plating bath comprises a plating bath body, and the liquid supplementing device comprises a liquid medicine (concentrated solution of plating solution) pipeline and an alkali liquor pipeline; the system also comprises a heating system and a peripheral circulating system; the plating bath is paved with a PE (polyethylene) bag which is resistant to high temperature and acid and alkali; the liquid supplementing device comprises a liquid storage container, a metering pump, a flow meter and a PLC control electronic box, wherein an output port of the liquid storage container is connected with an input port of the metering pump, input ports of a liquid medicine pipeline and an alkali liquor pipeline are respectively connected with physical output ports of the flow meters corresponding to the liquid medicine pipeline and the alkali liquor pipeline, output ports of the liquid medicine pipeline and the alkali liquor pipeline are arranged in a plating tank, the flow meter connected with the PLC control electronic box is arranged outside the plating tank, the flow meter is in signal connection with the PLC control electronic box, and the PLC control electronic box is electrically connected with.
Preferably, the heating system is arranged at the bottom of the plating tank and comprises a steam circulating pipeline, the steam circulating pipeline is a plurality of connecting pipes arranged in parallel, the connecting pipes are connected end to form the steam circulating pipeline, a space is arranged between the connecting pipes, one end of the steam circulating pipeline is provided with a steam inlet, and the other end of the steam circulating pipeline is provided with a steam outlet to realize steam circulation; the heating pipe with the structure can increase the contact area between the heating pipe and the plating solution, not only increase the heating rate, but also avoid the problem of unstable plating solution caused by overhigh local temperature of the plating solution due to the compact heating pipe. The heating pipe is laid at the bottom of the plating tank, and does not cause the plating solution to deposit a nickel layer on the surface of the heating pipe; when the plating tank needs to be cleaned or the stainless steel heating pipe needs to be cleaned, replaced and maintained, the stainless steel heating pipeline paved at the bottom of the tank can be hoisted and laid away by using a flying bar of a navigation vehicle; the operation and maintenance are convenient.
Further preferably, the steam circulating pipe is a stainless steel pipe, and the stainless steel pipe is a straight pipe; the outer contour of the steam circulating pipeline is slightly smaller than the bottom of the plating tank; by adopting the structure, the steam circulation is smooth and the heating is more uniform.
Preferably, the circulating system comprises a circulating pump and a filter, the circulating pump and the filter are arranged outside the plating tank, an output port of the circulating pump is connected with an input port of the filter, and an output port of the filter is connected with an input port of the plating tank; by adopting the structure, the heated plating solution is always circularly input into the plating tank, the temperature of the plating solution in the tank body can be effectively maintained, and the uniformity of the plating solution temperature of the plating tank depends on the circulating action of the circulating system; the filter is added, so that impurity dirt in the whole plating solution in the plating process can be filtered, and the interference of the impurities in the plating tank on the plating solution is reduced.
Preferably, plating solution circulating pipelines communicated with the circulating system are further arranged in the plating tank, the number of the plating solution circulating pipelines is two, one ends of the two plating solution circulating pipelines are communicated with each other and connected with the circulating system, and the other ends of the two plating solution circulating pipelines are arranged in a closed mode. The plating solution is conveniently pumped into the circulating pipeline by the circulating pump, and one end of the circulating pump is closed, so that the condition that the plating solution is uneven due to the fact that the flow speed of the local position is too high can be effectively prevented, and the quality stability of the product is guaranteed.
Further preferably, the plating solution circulation pipeline is provided with a plurality of liquid flowing holes, and the liquid flowing holes are used for allowing the plating solution to enter the circulation system.
Preferably, the alkali liquor pipeline and the liquid medicine pipeline are fixed on the side wall of the plating tank and are higher than the upper liquid surface of the plating solution, a plurality of spray heads are arranged on the alkali liquor pipeline and the liquid medicine pipeline along the length direction, and the angles of the spray heads are adjustable so that the supplemented alkali liquor or the plating solution can be uniformly sprayed into the plating tank through the spray nozzles. The above-mentioned structure of this application, the creative nozzle that has set up on the pipeline to directly lay alkali lye pipeline and liquid medicine pipeline on the coating bath rather than setting up at the auxiliary tank, avoid the solution supplement of alkali lye and plating bath to concentrate and add in the narrow and small auxiliary tank in space and lead to the concentration and the temperature anomaly of local plating bath, cause the unstability of plating bath state. In addition, the structure that the large space of the plating tank is utilized and the nozzles are arranged at intervals is beneficial to uniformly scattering the fluid replacement into the plating solution in the plating tank, so that the transient reduction of the temperature of the whole plating solution caused by excessive fluid replacement at one time is avoided; in addition, the liquid supplement (alkali liquor) can cause the local concentration of the plating solution to be too high, and white flocculent precipitate can be generated due to the too high concentration of the supplemented alkali, namely, hydroxyl and nickel ions react to generate nickel hydroxide, and after the nozzle is arranged through the liquid supplement pipeline, the spraying is more uniform, the local concentration is reduced, and the phenomenon is avoided.
Preferably, a bubbling device is laid at the bottom of the plating tank, and the bubbling device comprises a bubbling pipeline which is connected with an air source and an output port of the circulating system; the bubbling pipeline is provided with a plurality of bubbling holes, and the bubbling holes are used for introducing gas into the plating solution; when the solution supplementing system is used for supplementing excessive solution for one or more times, the concentration and the temperature of the local plating solution can be too high due to insufficient circulation of the circulating system, the state of the plating solution is unstable due to too high local alkali solution concentration and too low local temperature, and the quality of the plating layer can be affected; the bubbling device is electrically connected with a high-power air compressor outside the tank body to provide an air source, and when the device works, the bubbling device is started to gush air upwards from the bottom of the tank body, so that the whole plating solution is stirred and rolled under the action of the air, the solution can be easily and rapidly diffused and blended into the plating solution, and the temperature and the concentration of the plating solution are uniform; the working stability of the plating solution is maintained.
The system of the application has the working process as follows:
a heating system, a peripheral circulation system and a filtering system are arranged in the plating tank. The inner wall and the bottom of the periphery of the plating bath are sleeved with high-temperature-resistant and acid-resistant and alkali-resistant PE (polyethylene) bags. Heating the plating solution in the plating tank by a stainless steel heating pipe to raise the temperature, and circulating the plating solution in the plating tank by a circulating filter until the temperature of each part of the plating solution is uniform to 85 ℃; a temperature controller is arranged in the tank, the temperature is lower than a set value to start heating, and the temperature is higher than the set value to stop heating. The chemical plating automatic liquid supplementing system is provided with a PLC control electric box outside the plating bath, and the control electric box comprises a control panel and a flowmeter. The working personnel calculate the required fluid infusion amount and the fluid infusion times of each plating bath according to the daily consumption of the plating solution, and set the starting time, the cycle time and the fluid infusion (alkali liquor and concentrated solution) times on the panel in advance. The control electronic box sends a corresponding control signal to the metering pump to command the metering pump to work; when the metering pump is started, the metering pump extracts liquid medicine (alkali liquor and concentrated solution) from the storage container, the liquid medicine enters the liquid supplementing pipeline (the alkali liquor pipeline and the concentrated solution pipeline) through the flowmeter and then enters the plating tank, the supplemented liquid medicine circulates and circulates in the interior of the tank body through the internal circulation filtering system, and meanwhile, the consumption and the pH value of the plating solution are timely adjusted.
The application has the advantages and beneficial effects that:
1. by adopting the structure, the automatic feeding system is designed, and the defects of large workload, inaccurate medicine feeding control, out-of-control liquid medicine and the like in manual feeding are overcome; the additive in the solution supplementing is a trace substance in the chemical plating solution, but the additive can greatly change the properties of the plating layer such as appearance quality, physical quality and the like, and the manual addition often has the influence of excessive or insufficient addition or overlong addition time interval, so that the technical problem of manual addition successfully solved by the automatic feeding system is solved; in the process of automatic dosing, due to the intermittent continuous injection of concentrated liquid medicine, the plating solution in the plating tank has certain concentration difference, which can cause the poor uniformity and stability of the temperature of the plating solution at two ends of the tank body, but the temperature of the plating solution needs to be kept stable at about 85 ℃ all the time in the chemical plating process, and by arranging a heating system in the plating tank, the technical problem is perfectly solved, and the stability of the temperature of the plating solution is maintained on the premise of not reducing the concentration of the plating solution.
2. In addition, the current chemical cleaning technique of this application is that the chemical cleaning liquid of liquid supply system in with ton bucket carries the cell body, carry out chemical cleaning to the cell body, the deposit nickel layer of cell wall and cell bottom often is difficult to the sanitization, it just can thoroughly clean to need the manual work to descend the groove to wash, chemical cleaning liquid itself has certain corrosivity, there is serious potential safety hazard to operation workman's personal safety, and this kind of workman abluent method operational environment is poor, the cleaning speed is low, inefficiency, the security is low, influence enterprise production efficiency, but if not in time wash the coating bath, the deposited nickel layer can make the deposition phenomenon more and more serious, can lead to nickel ion's consumption can more and more, cause unnecessary waste. The application has solved the difficult problem that the coating bath easily arouses nickel deposit through inner wall and bottom cover all around at the coating bath has the PE (polyethylene) sack of high temperature resistant acid and alkali-resistance. The impurity particles in the plating tank remain on the bottom and inner wall of the tank body and the stainless steel heating pipe, which often become a reduction center to cause the reduction and deposition of nickel ions. Through the PE bag, the deposited nickel layer is deposited in the PE bag, when the coating bath is cleaned, the coating bath is not required to be emptied, cleaning liquid is injected to clean the coating bath, and only the PE bag is required to be taken out and a new PE bag is sleeved again. The mode of covering the PE bag to replace cleaning the plating bath reduces the personal safety hidden danger of plating bath cleaning workers, reduces the cleaning time of the plating bath and improves the production efficiency of enterprises.
3. The invention has the advantages of full-automatic chemical liquid medicine circulation, accurate liquid supplementing flow, uniform liquid medicine temperature, automatic chemical liquid medicine supply, stable chemical liquid medicine, difficult deposition of a plating bath, convenient cleaning, convenient maintenance and the like.
Drawings
FIG. 1 is a schematic structural view of an elevating electroless plating bath system for facilitating rapid cleaning according to the present application.
Fig. 2 a schematic structural view of a stainless steel heating tube of the present application.
FIG. 3 is a schematic structural view of a top view of the plating tank of the present application.
FIG. 4 is a schematic structural view of a plating tank bottom module of the present application.
FIG. 5 is a schematic view of the structure of the bottom module of the plating tank and the plating tank.
Fig. 6 is a schematic structural view of a plating bath in which a PE (polyethylene) bag resistant to high temperature and acid and alkali is laid.
As shown in the attached drawings: 1. the device comprises a plating tank, 1.1. a plating tank body, 1.2. a plating solution circulating pipeline, 1.3. a liquid flowing hole, 2 liquid supplementing devices, 2.1. a liquid medicine pipeline, 2.2. an alkali liquor pipeline, 2.3. a liquid storage container, 2.4. a metering pump, 2.5. a flow meter, 2.6. a PLC control electric box, 3. a heating system, 3.1. a steam circulating pipeline, 3.2. a connecting pipe, 3.3. a steam inlet, 3.4. a steam outlet, 4. a circulating system, 4.1. a circulating pump, 4.2. a filter, 5. a PE bag, 6. a spray head, 7. a bubbling device, 7.1. a bubbling pipeline, 7.2. a bubble hole and 8. a support.
Detailed Description
The present application will be described in further detail with reference to the following specific embodiments, but the present application is not limited to the following embodiments.
As shown in the attached figures 1 and 6: the lifting type chemical plating bath system convenient for quick cleaning comprises a plating bath 1 and a liquid supplementing device 2, wherein the plating bath comprises a square plating bath body 1.1, the liquid supplementing device 2 comprises a liquid medicine (concentrated solution of plating solution) pipeline 2.1 and an alkali liquor pipeline 2.2, and the liquid medicine (concentrated solution of plating solution) pipeline and the alkali liquor pipeline are used for supplementing the plating solution and the alkali liquor in the plating bath body 1.1 respectively; the system also comprises a heating system 3 and an external circulating system 4, wherein the heating system 3 is used for heating the solution in the plating tank body 1.1, and the external circulating system 4 enables the solution in the plating tank body 1.1 to flow, so that the uniformity of the solution in the plating tank body 1.1 is improved, and the production efficiency and the consistency of products are improved; the plating bath is paved with a PE (polyethylene) bag 5 which is high temperature resistant and acid and alkali resistant and is used for containing the plating solution in the PE bag 5 to avoid the contact of the plating solution with the bath wall and the bath bottom, thus effectively preventing the corrosion of the plating bath and prolonging the service life of the plating bath, and the PE bag 5 is easy to replace and has lower cost; fluid infusion device 2 still include liquid storage container 2.3, measuring pump 2.4, flowmeter 2.5 and PLC control electronic box 2.6, liquid storage container 2.3's output port and measuring pump 2.4's input port connection (middle through the measuring pump carry out transitional coupling, realize the accurate input of fluid infusion and the power of fluid infusion provides), the input port of coating bath 1 (the input port of liquid medicine pipeline and the input port of alkali lye pipeline) is connected with flowmeter 2.5's physical output port, flowmeter 2.5 that is connected with PLC control electronic box electricity sets up in the coating bath outside, flowmeter 2.5 and measuring pump 2.4 all are connected with PLC control electronic box 2.6, flowmeter 2.5 transmits the signal of flow to PLC control electronic box 2.6, PLC control electronic box 2.6 controls the operating condition of measuring pump 2.4 according to flowmeter 2.5's flow signal, thereby realize the accurate control to the volume of the fluid infusion of joining the input. The program that the control system that PLC control electronic box 2.6 of this application realized adopted is conventional flow control program, is the conventional PLC control technology of trade, only needs to pass through the design of software company according to the above-mentioned function that will realize of this application and can realize to the technique that technical staff in the field just can't know not through creative work, for the conventional technique of trade.
As shown in fig. 2 and 4-5, the
As shown in fig. 2, the steam circulation pipeline 3.1 is a stainless steel pipe, which has good corrosion resistance and acid resistance and good thermal conductivity, and is a straight pipe, i.e., a stainless steel straight pipe with smooth inner wall, and the ending joint is bent (or the straight pipe and the bent pipe are welded) to form a circulating heating pipeline; the outer contour of the steam circulating pipeline 3.1 is slightly smaller than the bottom of the plating tank, so that the steam circulating pipeline 3.1 is easier to disassemble and assemble, and the situation that the local temperature is too high can not be caused; by adopting the structure, the steam circulation is smooth and the heating is more uniform.
As shown in attached figures 1 and 4-5, the circulating system 4 comprises a circulating pump 4.1 and a filter 4.2, the circulating pump 4.1 and the filter 4.2 are arranged outside the plating bath, an output port of the circulating pump 4.1 is connected with an input port of the filter 4.2, and an output port of the filter 4.2 is communicated with the plating bath 1 through a pipeline; the input port of the circulating pump 4.1 is communicated with the coating bath 1 through a pipeline to realize circulation; in addition, a plating solution circulating pipeline 1.2 communicated with a circulating system 4 is arranged in the plating tank, and as can be seen from the attached drawing 4, two plating solution circulating pipelines 1.2 are arranged, one ends of the two plating solution circulating pipelines 1.2 are communicated with each other and communicated with the circulating system 4, and the other ends are arranged in a closed manner, so that the plating solution is conveniently extracted from the plating tank 1 by the circulating pump 4.1, and the circulation of the plating solution is realized; the plating solution circulating pipeline is provided with a plurality of liquid flowing holes 1.3, the liquid flowing holes 1.3 are positioned at the bottom of the plating solution circulating pipeline 1.2, so that the plating solution can conveniently enter the plating solution circulating pipeline 1.2, and the liquid flowing holes are used for the plating solution to enter the circulating system.
By adopting the structure, the heated plating solution is always circularly input into the plating tank, the temperature of the plating solution in the tank body can be effectively maintained, and the uniformity of the plating solution temperature of the plating tank depends on the circulating action of the circulating system; and 4.2, a filter is added, and the filter is a common commercially available particle filter product (a ceramic filter element is used), so that impurity dirt in the whole plating solution in the plating process can be filtered, and the interference of the impurities in the plating tank on the plating solution is reduced.
As shown in attached figures 1 and 4-5, the alkali liquor pipeline 2.2 and the liquid medicine pipeline 2.1 are arranged on the side wall of the plating tank, and usually, in order to facilitate the recovery and placement of the PE bag 5, the alkali liquor pipeline 2.2 and the liquid medicine pipeline 2.1 are connected to the side wall of the
As shown in attached figures 1 and 4-5, a bubbling device 7 is laid at the bottom of the plating tank 1, the bubbling device comprises a bubbling pipeline 7.1 and an air pump, and the bubbling pipeline 7.1 is communicated with an air source (or the air pump); the bubbling pipeline 7.1 is provided with a plurality of bubbling holes 7.2 (in order to increase the time of bubbles in the liquid, the bubbling holes can also be arranged on one side of the bubbling pipeline facing the bottom of the plating tank), and the bubbling holes 7.2 are used for introducing gas, liquid or a gas-liquid mixture into the plating solution (according to the situation, independent air inlet bubbling can be carried out, independent liquid inlet turbulent flow can be carried out, and the gas-liquid mixture can also be fed, namely the gas-liquid mixture in the embodiment); specifically, as can be seen from fig. 4, as a specific example, the bubbling pipe 7.1 described in the present application presents a closed frame similar to a rectangle, and a pipe communicated with an air pump is disposed on one wide side of the frame, so that the gas is ejected from the bubbling hole 7.2, the bubbles stir the plating solution more sufficiently, the uniformity of the plating solution is better, and the quality of the plated part is provided; the frame body is provided with a plurality of drum bubble holes 7.2, the drum bubble holes 7.2 can be arranged on the visible side, namely the visible side as shown in the attached drawing, or can be arranged on the invisible side, namely the side close to the bottom of the plating tank, or can be arranged on the side surface, and can be arranged in the arrangement that the plating solution can be bubbled; when the solution supplementing system is used for supplementing excessive solution for one or more times, the concentration and the temperature of the local plating solution can be too high due to insufficient circulation of the circulating system, the state of the plating solution is unstable due to too high local alkali solution concentration and too low local temperature, and the quality of the plating layer can be affected; the bubbling device is electrically connected with a high-power air compressor outside the tank body to provide an air source, and when the device works, the bubbling device is started to gush air upwards from the bottom of the tank body, so that the whole plating solution is stirred and rolled under the action of the air, the solution can be easily and rapidly diffused and blended into the plating solution, and the temperature and the concentration of the plating solution are uniform; the working stability of the plating solution is maintained.
As shown in the attached figure 4, the pipeline, the plating solution circulating pipeline and the bubbling pipeline of the heating system are all arranged on the
In the present application, the plating tank and the PE bag are shown in a transparent state for clearly showing the positions and installation manners of the respective components, but the present application is not limited to the scope of the present application.