阅读说明：本技术 振动元件、振动器件、振荡器、电子设备以及移动体 (Resonator element, resonator device, oscillator, electronic apparatus, and moving object ) 是由 青木信也 柳炳学 松尾敦司 于 2020-02-26 设计创作，主要内容包括：振动元件、振动器件、振荡器、电子设备以及移动体。能够抑制电极的剥离。振动元件具有：石英基板,其具有支承部、振动部以及连接部,该连接部将支承部和振动部连接起来,并且厚度比支承部的厚度薄,支承部具有第1主面和第1侧面,该第1侧面将第1主面和连接部连接起来；第1激励电极,其配置于振动部；第2激励电极,其配置于振动部,并且隔着振动部与第1激励电极对置；以及第1焊盘电极、第2焊盘电极,它们具有配置于第1主面的部分,并且与第1激励电极、第2激励电极电连接。而且,第1焊盘电极和第2焊盘电极中的至少一方的配置于第1主面的部分与第1主面的连接于第1侧面的外缘的至少一部分分离。(A vibration element, a vibration device, an oscillator, an electronic apparatus, and a moving object. The peeling of the electrode can be suppressed. The vibration element has: a quartz substrate having a support portion, a vibrating portion, and a connecting portion, the connecting portion connecting the support portion and the vibrating portion and having a thickness smaller than that of the support portion, the support portion having a 1 st main surface and a 1 st side surface, the 1 st side surface connecting the 1 st main surface and the connecting portion; a 1 st excitation electrode disposed on the vibration section; a 2 nd excitation electrode disposed on the vibration section and facing the 1 st excitation electrode with the vibration section therebetween; and a 1 st pad electrode and a 2 nd pad electrode which have portions arranged on the 1 st main surface and are electrically connected to the 1 st excitation electrode and the 2 nd excitation electrode. Further, a portion of at least one of the 1 st pad electrode and the 2 nd pad electrode, which is disposed on the 1 st main surface, is separated from at least a portion of an outer edge of the 1 st main surface, which is connected to the 1 st side surface.)

1. A vibration element, characterized by comprising:

a quartz substrate having a support portion, a vibrating portion, and a connecting portion which connects the support portion and the vibrating portion and has a thickness smaller than that of the support portion, the support portion having a 1 st main surface and a 1 st side surface, the 1 st main surface being perpendicular to the thickness direction, the 1 st side surface connecting the 1 st main surface and the connecting portion;

a 1 st excitation electrode disposed on the vibrating portion;

a 2 nd excitation electrode disposed in the vibrating portion and overlapping the 1 st excitation electrode with the vibrating portion therebetween in a plan view;

a 1 st pad electrode electrically connected to the 1 st excitation electrode and having a portion disposed on the 1 st main surface; and

a 2 nd pad electrode electrically connected to the 2 nd excitation electrode and having a portion disposed on the 1 st main surface,

a portion of at least one of the 1 st pad electrode and the 2 nd pad electrode, which is disposed on the 1 st main surface, is separated from at least a portion of an outer edge of the 1 st main surface, which is connected to the 1 st side surface.

2. The vibratory element of claim 1, wherein,

the entire portion of at least one of the 1 st pad electrode and the 2 nd pad electrode, which is disposed on the 1 st main surface, is separated from the outer edge of the 1 st main surface.

3. The vibration element according to claim 1 or 2,

the support portion has: a 1 st support portion, wherein the 1 st pad electrode is disposed on the 1 st support portion; and a 2 nd support part separated from the 1 st support part, wherein the 2 nd pad electrode is disposed on the 2 nd support part,

the connecting portion has a portion between the 1 st support portion and the 2 nd support portion, and connects the 1 st support portion and the 2 nd support portion.

4. The vibratory element of claim 1, wherein,

the support portion further has: a 2 nd main surface in a front-to-back relationship with the 1 st main surface; and a 2 nd side surface which connects the 1 st principal surface and the 2 nd principal surface and constitutes an outer surface of the quartz substrate,

the 1 st pad electrode and the 2 nd pad electrode each have: a 1 st portion disposed on the 1 st main surface; a 2 nd portion disposed on the 2 nd main surface; and a 3 rd portion disposed on the 2 nd side surface and connecting the 1 st portion and the 2 nd portion.

5. A vibration device, characterized by comprising:

the vibration element of any one of claims 1 to 4; and

a package that houses the vibrating element.

6. An oscillator, characterized in that the oscillator has:

the vibration element of any one of claims 1 to 4; and

an oscillation circuit that oscillates the vibration element.

7. An electronic device, characterized in that the electronic device has:

the oscillator of claim 6; and

and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

8. A movable body, comprising:

the oscillator of claim 6; and

and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

Technical Field

The invention relates to a vibration element, a vibration device, an oscillator, an electronic apparatus, and a moving object.

Background

The quartz crystal resonator element described in patent document 1 includes an AT-cut quartz crystal substrate and an electrode disposed on a surface of the quartz crystal substrate. The quartz substrate further includes: a vibrating section; a holding portion thicker than the vibrating portion; and an inclined portion located between the vibrating portion and the holding portion, the inclined portion gradually becoming thicker from the vibrating portion toward the holding portion. On the other hand, the electrode has: a 1 st excitation electrode disposed on an upper surface of the vibrating portion; a 2 nd excitation electrode disposed on a lower surface of the vibrating portion; a 1 st pad electrode disposed on the holding portion and the inclined portion, and connected to the 1 st excitation electrode; and a 2 nd pad electrode disposed on the holding portion and the inclined portion and connected to the 2 nd excitation electrode.

Patent document 1: japanese patent laid-open publication No. 2017-200093

Here, since the principal surface of the inclined portion is inclined, when a metal film for forming an electrode is formed on the surface of the quartz substrate, the thickness of the metal film is thinner than the holding portion and the vibrating portion, and it is difficult to secure a sufficient thickness. Therefore, the 1 st electrode pad and the 2 nd electrode pad formed on the inclined portion do not have sufficient strength and are likely to be partially peeled off, and this peeling may deteriorate the vibration characteristics of the quartz crystal vibration element, particularly the DLD (Drive Level dependency) characteristics.

Disclosure of Invention

The vibration element of the present application example is characterized by including: a quartz substrate having a support portion, a vibrating portion, and a connecting portion which connects the support portion and the vibrating portion and has a thickness smaller than that of the support portion, the support portion having a 1 st main surface and a 1 st side surface, the 1 st main surface being perpendicular to the thickness direction, the 1 st side surface connecting the 1 st main surface and the connecting portion; a 1 st excitation electrode disposed on the vibrating portion; a 2 nd excitation electrode disposed in the vibrating portion and overlapping the 1 st excitation electrode with the vibrating portion therebetween in a plan view; a 1 st pad electrode electrically connected to the 1 st excitation electrode and having a portion disposed on the 1 st main surface; and a 2 nd pad electrode electrically connected to the 2 nd excitation electrode, the 2 nd pad electrode having a portion disposed on the 1 st main surface, the portion disposed on the 1 st main surface of at least one of the 1 st pad electrode and the 2 nd pad electrode being separated from at least a portion of an outer edge of the 1 st main surface connected to the 1 st side surface.

In the vibration element according to the present application example, it is preferable that the entire portion of at least one of the 1 st pad electrode and the 2 nd pad electrode which is disposed on the 1 st main surface be separated from the outer edge of the 1 st main surface.

In the vibration element of the present application example, it is preferable that the support portion includes: a 1 st support portion, wherein the 1 st pad electrode is disposed on the 1 st support portion; and a 2 nd support part separated from the 1 st support part, wherein the 2 nd pad electrode is disposed on the 2 nd support part, and the connection part has a portion located between the 1 st support part and the 2 nd support part, and connects the 1 st support part and the 2 nd support part.

In the vibration element of the present application example, it is preferable that the support portion further includes: a 2 nd main surface in a front-to-back relationship with the 1 st main surface; and a 2 nd side surface which connects the 1 st principal surface and the 2 nd principal surface and constitutes an outer surface of the quartz substrate, wherein each of the 1 st pad electrode and the 2 nd pad electrode has: a 1 st portion disposed on the 1 st main surface; a 2 nd portion disposed on the 2 nd main surface; and a 3 rd portion disposed on the 2 nd side surface and connecting the 1 st portion and the 2 nd portion.

The vibration device of the present application example has: the above-mentioned vibrating element; and a package that houses the vibrating element.

The oscillator of the present application example includes: the above-mentioned vibrating element; and an oscillation circuit that oscillates the vibration element.

The electronic device of the present application example is characterized by including: the above-mentioned oscillator; and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

The moving object of the present application example is characterized by including: the above-mentioned oscillator; and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

Drawings

Fig. 1 is a sectional view showing an oscillator of embodiment 1.

Fig. 2 is a perspective view of a vibration element included in the oscillator of fig. 1.

Fig. 3 is a diagram showing a chamfer of an AT cut.

Fig. 4 is a sectional view showing the state of engagement of the vibration element with the base.

Fig. 5 is a plan view of the vibrating element viewed from the negative side in the Y' axis direction.

Fig. 6 is a plan view of the vibrating element viewed from the Y' axis direction positive side.

Fig. 7 is a sectional view showing the state of engagement of the vibration element with the base.

Fig. 8 is a plan view of the vibration element according to embodiment 2 as viewed from the negative side in the Y' axis direction.

Fig. 9 is a plan view of the vibrating element according to embodiment 2 as viewed from the Y' axis direction positive side.

Fig. 10 is a plan view of the vibration element of embodiment 3 viewed from the negative side in the Y' axis direction.

Fig. 11 is a plan view of the vibrating element according to embodiment 3 as viewed from the Y' axis direction positive side.

Fig. 12 is a sectional view showing a state of joining the vibration element and the base according to embodiment 3.

Fig. 13 is a plan view of the vibration element according to embodiment 4 as viewed from the negative side in the Y' axis direction.

Fig. 14 is a plan view of the vibrating element according to embodiment 4 as viewed from the Y' axis direction positive side.

Fig. 15 is a sectional view showing an oscillator of embodiment 5.

Fig. 16 is a perspective view showing a personal computer as an electronic apparatus of embodiment 6.

Fig. 17 is a perspective view showing a mobile phone as an electronic device of embodiment 7.

Fig. 18 is a perspective view showing a digital still camera as an electronic apparatus of embodiment 8.

Fig. 19 is a perspective view showing an automobile as a moving body of embodiment 9.

Description of the reference symbols

1: an oscillator; 10: a vibrating device; 2: packaging; 3: a base; 31: a recess; 311: 1 st recess; 312: a 2 nd recess; 313: a 3 rd recess; 341. 342: an internal terminal; 343: an external terminal; 4: a cover; 5: a vibrating element; 6: a quartz substrate; 60: an outer side surface; 61: a vibrating section; 611: a lower surface; 612: an upper surface; 62: a support portion; 62A: 1 st support part; 62B: a 2 nd support part; 621: a lower surface; 621 a: an outer edge; 621 a', 621a ": a moiety; 622: an upper surface; 622 a: an outer edge; 622 a', 622a ": a moiety; 623. 624: the 1 st side; 625: a 2 nd side; 63: a connecting portion; 631: a lower surface; 632: an upper surface; 7: an electrode; 70: a metal film; 71: 1 st excitation electrode; 72: a 2 nd excitation electrode; 73: a 1 st pad electrode; 731: part 1; 731 a: an outer edge; 732: part 2; 732 a: an outer edge; 733: part 3; 74: a 2 nd pad electrode; 741: part 1; 741 a: an outer edge; 742: part 2; 742 a: an outer edge; 743: part 3; 75: 1 st lead-out wiring; 76: 2 nd lead-out wiring; 8: a circuit element; 81: an oscillation circuit; 1010: a support substrate; 1011: a connection terminal; 1012: mounting a terminal; 1100: a personal computer; 1102: a keyboard; 1104: a main body portion; 1106: a display unit; 1108: a display unit; 1110: an arithmetic processing circuit; 1200: a mobile phone; 1202: an operation button; 1204: an answering port; 1206: a call port; 1208: a display unit; 1210: an arithmetic processing circuit; 1300: a digital still camera; 1302: a body; 1304: a light receiving unit; 1306: a shutter button; 1308: a memory; 1310: a display unit; 1312: an arithmetic processing circuit; 1500: an automobile; 1510: an arithmetic processing circuit; b1, B2: an engaging member; b3: a conductive bonding member; BW1, BW 2: a bonding wire; g: a gap; m: a molding material; s: a storage space; θ: and (4) an angle.

Detailed Description

Hereinafter, a vibration element, a vibration device, an oscillator, an electronic apparatus, and a moving object according to the present application example will be described in detail based on embodiments shown in the drawings.

< embodiment 1 >

Fig. 1 is a sectional view showing an oscillator of embodiment 1. Fig. 2 is a perspective view of a vibration element included in the oscillator of fig. 1. Fig. 3 is a diagram showing a chamfer of an AT cut. Fig. 4 is a sectional view showing the state of engagement of the vibration element with the base. Fig. 5 is a plan view of the vibrating element viewed from the negative side in the Y' axis direction. Fig. 6 is a plan view of the vibrating element viewed from the Y' axis direction positive side. Fig. 7 is a sectional view showing the state of engagement of the vibration element with the base.

As shown in fig. 1, an oscillator 1 to which a vibration device 10 is applied has a package 2, and a vibration element 5 and a circuit element 8 housed in the package 2. Here, the package 2 and the vibration element 5 constitute a vibration device 10.

Further, the package 2 includes: a box-shaped base 3 having a recess 31 opened on an upper surface thereof; and a plate-like cover 4 that closes the opening of the recess 31 and engages with the upper surface of the base 3. By closing the opening of the recess 31 with the cover 4, a housing space S for housing the vibration element 5 and the circuit element 8 is formed. The storage space S is airtight and is in a reduced pressure state, preferably a state closer to vacuum. This reduces viscous resistance, and enables stable driving of the vibration element 5. However, the environment of the housing space S is not particularly limited, and may be, for example, an environment in which an inert gas such as nitrogen or Ar is sealed, or may be in an atmospheric pressure state instead of a reduced pressure state, or a pressurized state.

The recess 31 formed in the base 3 includes: a 1 st recess 311 opened in the upper surface of the base 3; a 2 nd recess 312 which is open at the bottom surface of the 1 st recess 311; and a 3 rd recess 313 opened at a bottom surface of the 2 nd recess 312. The vibration element 5 is fixed to the bottom surface of the 1 st recess 311, and the circuit element 8 is fixed to the bottom surface of the 3 rd recess 313. However, the structure of the recess 31 is not particularly limited.

Further, a plurality of (two) internal terminals 341 are arranged on the bottom surface of the 1 st recess 311, a plurality of internal terminals 342 are arranged on the bottom surface of the 2 nd recess 312, and a plurality of external terminals 343 are arranged on the lower surface of the base 3. The internal terminals 341 and 342 and the external terminal 343 are electrically connected via a wiring, not shown, formed in the base 3. The plurality of internal terminals 341 are electrically connected to the vibration element 5 via conductive bonding members B1 and B2, respectively, and the plurality of internal terminals 342 are electrically connected to the circuit element 8 via bonding wires BW1, respectively.

The material constituting the susceptor 3 is not particularly limited, and various ceramics such as alumina can be used, for example. On the other hand, the material constituting the cover 4 is not particularly limited, and may be any material having a linear expansion coefficient similar to that of the material constituting the base 3. For example, when the material of the base 3 is ceramic as described above, an alloy such as kovar alloy is preferable.

The circuit element 8 has an oscillation circuit 81. The oscillation circuit 81 is a circuit as follows: which is electrically connected to the vibration element 5, amplifies an output signal of the vibration element 5 and feeds back the amplified signal to the vibration element 5, thereby oscillating the vibration element 5. As the oscillation circuit 81, for example, an oscillation circuit such as a pierce oscillation circuit, an inverter (inverter) type oscillation circuit, a colpitts oscillation circuit, or a hartley oscillation circuit can be used.

As shown in fig. 2, the vibration element 5 includes an AT-cut quartz substrate 6 and an electrode 7 disposed on the quartz substrate 6. The AT-cut quartz substrate 6 has a thickness shear vibration mode and has a frequency-temperature characteristic of three times. Therefore, the vibrating element 5 has excellent temperature characteristics. In addition, the electrode 7 can be formed by, for example, forming a metal film 70 on the surface of the quartz substrate 6 and patterning the metal film 70 by etching.

Briefly describing the AT-cut quartz substrate 6, the quartz substrate 6 has crystal axes X, Y, Z perpendicular to each other. The X, Y, and Z axes are referred to as the electrical, mechanical, and optical axes, respectively. As shown in fig. 3, the quartz substrate 6 is a "Y-cut quartz substrate" cut out along a plane where the X-Z plane is rotated by a predetermined angle θ about the X axis, and a substrate having θ of 35 ° 15' is referred to as an "AT-cut quartz substrate". Hereinafter, the Y axis and the Z axis rotated around the X axis in accordance with the angle θ are referred to as a Y 'axis and a Z' axis. The tip side of the arrow of each axis is referred to as "positive side", and the opposite side is referred to as "negative side". However, the cut angle of the quartz substrate 6 is not particularly limited.

The quartz substrate 6 is rectangular when the quartz substrate 6 is viewed in plan from the Y' axis direction, and particularly, in the present embodiment, the quartz substrate 6 is rectangular with the X axis direction being the longitudinal direction. However, the shape of the quartz substrate 6 in plan view is not particularly limited, and may be, for example, a rectangle whose longitudinal direction is the Z' -axis direction. Further, the quartz substrate 6 includes: a vibrating portion 61; a support portion 62 located on the X-axis direction negative side with respect to the vibration portion 61; and a connecting portion 63 located between the vibrating portion 61 and the support portion 62 and around the support portion 62, and connecting the vibrating portion 61 and the support portion 62. As shown in fig. 1, the vibration element 5 is fixed to the base 3 via conductive joining members B1 and B2 on the lower surface 621 of the support portion 62.

The bonding members B1 and B2 are not particularly limited as long as they have both conductivity and bonding properties, and in the present embodiment, a conductive adhesive or the like is used in which a conductive filler such as a silver filler is dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic adhesives. By using the conductive adhesive, the joining members B1, B2 are relatively flexible, and thermal stress generated by a difference in thermal expansion coefficient between the susceptor 3 and the quartz substrate 6, for example, is relaxed by the joining members B1, B2 and is not easily transmitted to the vibration element 5. However, as the bonding members B1 and B2, metal bumps such as gold bumps and copper bumps may be used in addition to the conductive adhesive. By using the metal bumps, it is possible to suppress the exhaust from the joining members B1, B2, and it is possible to effectively suppress the environmental change, particularly the pressure increase, in the housing space S.

In addition, connecting portion 63 has a smaller thickness than vibrating portion 61 and supporting portion 62. That is, when the thickness of vibration unit 61 in the Y ' axis direction is t1, the thickness of support unit 62 in the Y ' axis direction is t2, and the thickness of connection unit 63 in the Y ' axis direction is t3, t3 < t1, and t3 < t 2. By setting t3 < t1, vibration element 5 is formed in a "mesa shape" in which vibration section 61 protrudes in the Y' axis direction from its surrounding connecting portion 63, and the vibration of vibration section 61 can be effectively confined in vibration section 61. Therefore, the vibration element 5 is suppressed in vibration leakage and has excellent vibration characteristics.

Further, by setting t3 < t2, it becomes easy to mount the vibration element 5 on the base 3, and the handling characteristics of the vibration element 5 are improved. Specifically, by projecting support portion 62 in the Y' axis direction from connecting portion 63, as shown in fig. 4, since engaging members B1 and B2 wet-spread not only on lower surface 621 of support portion 62 but also on the side surfaces of support portion 62, specifically, first side surface 623 and second side surface 625 to be described later, the contact area between vibrating element 5 and engaging members B1 and B2 increases, and accordingly, the engaging strength thereof increases. Further, since the engaging members B1, B2 go around the side surfaces of the support portion 62, further planar expansion (expansion in the X-axis direction) of the engaging members B1, B2 can be suppressed. Therefore, the bonding area between the vibration element 5 and the bonding members B1, B2 can be kept as small as possible in a plan view, and the above-described thermal stress is not easily transmitted to the vibration element 5. The t3/t1 is not particularly limited, but is preferably 0.4. ltoreq. t3/t 1. ltoreq.0.8. the same is true for t3/t 2.

In particular, in the present embodiment, each of the vibrating portion 61 and the supporting portion 62 protrudes symmetrically in the Y' axis direction from the connecting portion 63. Accordingly, the quartz substrate 6 is symmetrical in front and back, and thus, there is no difference between the front and back, and therefore, it can be mounted on the susceptor 3 in either of the front and back orientations. Therefore, handling characteristics when the vibration element 5 is mounted on the base 3 are improved. In the present embodiment, thickness t1 of vibration part 61 is equal to thickness t2 of support part 62, that is, t1 is equal to t2, and the main surfaces of vibration part 61 and support part 62 on the Y 'axis direction positive side are coplanar with each other, and the main surfaces of vibration part 61 and support part 62 on the Y' axis direction negative side are coplanar with each other. Therefore, the quartz substrate 6 is easily manufactured. Specifically, a flat quartz substrate is prepared, and only the portions corresponding to the connection portions 63 are uniformly etched from both surfaces of the quartz substrate to be thinned, whereby the quartz substrate 6 can be obtained.

The support 62 is located at the end of the quartz substrate 6 on the negative side in the X-axis direction. As shown in fig. 4, the support portion 62 includes: a lower surface 621 as a 1 st main surface located on the Y' -axis direction negative side of the lower surface 631 of the connecting portion 63; an upper surface 622 as a 2 nd main surface located on the Y' -axis direction positive side of the upper surface 632 of the connecting portion 63 in a front-back relationship with the lower surface 621; a 1 st side 623 connecting the lower surface 621 and the lower surface 631; a 1 st side 624 connecting the upper surface 622 and the upper surface 632; and a 2 nd side surface 625 connecting the lower surface 621 and the upper surface 622 and constituting a part of the outer surface 60 which is the outer edge of the quartz substrate 6.

However, the quartz substrate 6 is not limited to the illustrated shape, and for example, the vibrating portion 61 and the supporting portion 62 may be each in a shape protruding from the connecting portion 63 only to one side in the Y' axis direction, and the protruding directions may be the same or different from each other. The quartz substrate 6 may be a flat plate type in which the thickness t1 of the vibrating portion 61 is equal to the thickness t3 of the connecting portion 63, or may be a reverse mesa type in which the thickness t1 of the vibrating portion 61 is thinner than the thickness t3 of the connecting portion 63 and the vibrating portion 61 is recessed with respect to the connecting portion 63. Further, chamfering processing for grinding and chamfering the periphery of the quartz substrate 6 and convex processing for making the upper surface and the lower surface of the quartz substrate 6 convex may be performed.

Next, the electrode 7 will be explained. As shown in fig. 5 and 6, the electrode 7 has: a 1 st excitation electrode 71 disposed on the lower surface 611 of the vibrating portion 61; and a 2 nd excitation electrode 72 disposed on the upper surface 612 of the vibrating portion 61, and facing the 1 st excitation electrode 71 so as to sandwich the vibrating portion 61 between the 2 nd excitation electrode 72 and the 1 st excitation electrode 71. Further, the electrode 7 has: a 1 st pad electrode 73 and a 2 nd pad electrode 74 which are arranged on the support portion 62 and arranged in the Z' axis direction; a 1 st lead line 75 for electrically connecting the 1 st excitation electrode 71 and the 1 st pad electrode 73 via the connection portion 63; and a 2 nd lead-out wiring 76 electrically connecting the 2 nd excitation electrode 72 and the 2 nd pad electrode 74 via the connection portion 63.

In addition, the 1 st pad electrode 73 has: a 1 st part 731 disposed on the lower surface 621 of the support portion 62; a 2 nd portion 732 disposed on the upper surface 622 of the support portion 62; and a 3 rd portion 733 disposed on the 2 nd side surface 625 of the support portion 62 and electrically connecting the 1 st portion 731 and the 2 nd portion 732. Similarly, the 2 nd pad electrode 74 has: a 1 st part 741 disposed on the lower surface 621 of the support portion 62; a 2 nd portion 742 disposed on the upper surface 622 of the support portion 62; and a 3 rd portion 743 disposed on the 2 nd side surface 625 of the support portion 62 and electrically connecting the 1 st portion 741 and the 2 nd portion 742. Further, as shown in fig. 7, in the 1 st part 731, the 1 st pad electrode 73 and one internal terminal 341 are electrically connected via a bonding member B1, and in the 1 st part 741, the 2 nd pad electrode 74 and the other internal terminal 341 are electrically connected via a bonding member B2.

In this way, by disposing the 1 st pad electrode 73 and the 2 nd pad electrode 74 on both the lower surface 621 and the upper surface 622 of the support portion 62, the electrodes 7 are disposed in the same front and back directions, and there is no difference between the front and back directions. Therefore, even if the vibration element 5 is turned upside down with respect to the illustrated structure, it can be mounted on the base 3 in the same manner as the illustrated structure. Therefore, handling characteristics when the vibration element 5 is mounted on the base 3 are improved. However, the structures of the 1 st pad electrode 73 and the 2 nd pad electrode 74 are not particularly limited, and the 2 nd portion 732 and the 3 rd portion 733 may be omitted from the 1 st pad electrode 73, or the 2 nd portion 742 and the 3 rd portion 743 may be omitted from the 2 nd pad electrode 74.

As shown in fig. 5, in the 1 st pad electrode 73, the entire outer edge 731a of the 1 st portion 731 is separated from the outer edge 621a of the lower surface 621 and located inside the outer edge 621 a. That is, the entire 1 st part 731 is enclosed by the lower surface 621, and a gap G is formed between the outer edge 731a and the outer edge 621 a. The outer edge 621a of the lower surface 621 may be a connecting portion (boundary) between the lower surface 621 and the 1 st side surface 623 and the 2 nd side surface 625. In this way, by positioning the outer edge 731a of the 1 st part 731 inside the outer edge 621a of the lower surface 621, the 1 st part 731 is less likely to be peeled off, for example, compared to a case where the outer edge 731a coincides with the outer edge 621a, or a case where the outer edge 731a is positioned outside the outer edge 621a, that is, a case where the 1 st part 731 is formed to extend to the 1 st side surface 623 or the 2 nd side surface 625. Therefore, the deterioration of the vibration characteristics of the vibration element 5, particularly, the dld (drive Level dependency) characteristics can be effectively suppressed.

Further, as in the present embodiment, it is most preferable that the entire periphery of the outer edge 731a of the 1 st portion 731 is positioned inside the outer edge 621a of the lower surface 621 apart from the outer edge 621a, but the present invention is not limited thereto, and as in the later-described 2 nd embodiment, the outer edge 731a of the 1 st portion 731 may be positioned inside the outer edge 621a apart from the outer edge 621a of the lower surface 621 at least at the boundary between the lower surface 621 and the 1 st side surface 623. In this case, it is preferable that the outer edge 731a of the 1 st part 731 is located inside the outer edge 621a of the lower surface 621 apart from the outer edge 621a of the lower surface 621 in the entire boundary between the lower surface 621 and the 1 st side surface 623, but the outer edge 731a of the 1 st part 731 may be located inside the outer edge 621a apart from the outer edge 621a of the lower surface 621 in a part of the boundary between the lower surface 621 and the 1 st side surface 623. Since the closer the peeled portion of the electrode 7 is to the vibrating portion 61, the more likely the DLD characteristic is to be degraded, as described above, the outer edge 731a of the 1 st portion 731 is located inside the outer edge 621a of the lower surface 621 apart from the outer edge 621a at least at the boundary between the 1 st side surface 623 closest to the vibrating portion 61 and the lower surface 621 among the side surfaces of the supporting portion 62, and the degradation of the DLD characteristic can be suppressed. The same applies to the 2 nd portion 732 of the 1 st pad electrode 73 and the 1 st portions 741 and 2 nd portions 742 of the 2 nd pad electrode 74.

As shown in fig. 6, in the 1 st pad electrode 73, the entire outer edge 732a of the 2 nd portion 732 is located inside the outer edge 622a of the upper surface 622 apart from the outer edge 622 a. That is, the entire 2 nd portion 732 is enclosed by the upper surface 622, and a gap G is formed between the outer edge 732a and the outer edge 622 a. The outer edge 622a of the upper surface 622 may be a connecting portion (boundary) between the upper surface 622 and the 1 st and 2 nd side surfaces 624, 625. In this way, by positioning the outer edge 732a of the 2 nd portion 732 inside the outer edge 622a of the upper surface 622, the 2 nd portion 732 is less likely to be peeled off, for example, compared with a case where the outer edge 732a coincides with the outer edge 622a, or a case where the outer edge 732a is positioned outside the outer edge 622a, that is, the 2 nd portion 732 is formed to extend to the 1 st side surface 624 or the 2 nd side surface 625. Therefore, the deterioration of the vibration characteristics of the vibration element 5, particularly the DLD characteristics, can be effectively suppressed.

The 3 rd portion 733 connecting the 1 st portion 731 and the 2 nd portion 732 is disposed on the lower surface 621, the upper surface 622, and the 2 nd side surface 625. Since the 2 nd side surface 625 is farther from the vibration part 61 than the 1 st side surfaces 623 and 624, the 3 rd portion 733 is disposed in this portion, and therefore, even if the 3 rd portion 733 is peeled off, the influence on the DLD characteristic can be suppressed to the minimum.

The 2 nd pad electrode 74 has the same structure as the 1 st pad electrode 73. That is, in the 2 nd pad electrode 74, as shown in fig. 5, the entire outer edge 741a of the 1 st part 741 is located inside the outer edge 621a of the lower surface 621, apart from the outer edge 621 a. That is, the entire 1 st part 741 is enclosed by the lower surface 621, and a gap G is formed between the outer edge 741a and the outer edge 621 a. In this way, when the outer edge 741a of the 1 st part 741 is positioned inside the outer edge 621a of the lower surface 621, for example, when the outer edge 741a is aligned with the outer edge 621a, or when the outer edge 741a is positioned outside the outer edge 621a, that is, when the 1 st part 741 is formed to extend to the 1 st side surface 623 or the 2 nd side surface 625, the 1 st part 741 is not easily peeled off. Therefore, the deterioration of the vibration characteristics of the vibration element 5, particularly the DLD characteristics, can be effectively suppressed.

In addition, in the 2 nd pad electrode 74, as shown in fig. 6, the entire outer edge 742a of the 2 nd portion 742 is located inside the outer edge 622a of the upper surface 622 apart from the outer edge 622 a. That is, the entire 2 nd portion 742 is enclosed by the upper surface 622, and a gap G is formed between the outer edge 742a and the outer edge 622 a. In this way, by positioning the outer edge 742a of the 2 nd portion 742 inside the outer edge 622a of the upper surface 622, the 2 nd portion 742 is less likely to be separated, for example, than when the outer edge 742a coincides with the outer edge 622a, or when the outer edge 742a is positioned outside the outer edge 622a, that is, when the 2 nd portion 742 is formed to extend to the 1 st side surface 624 or the 2 nd side surface 625. Therefore, the deterioration of the vibration characteristics of the vibration element 5, particularly the DLD characteristics, can be effectively suppressed.

Further, a 3 rd portion 743 connecting the 1 st portion 741 and the 2 nd portion 742 is disposed on the lower surface 621, the upper surface 622, and the 2 nd side surface 625. Since the 2 nd side surface 625 is farther from the vibrating portion 61 than the 1 st side surfaces 623 and 624, by disposing the 3 rd portion 743 in this portion, even if the 3 rd portion 743 should peel off, the influence on the DLD characteristics can be suppressed to the minimum.

The oscillator 1 has been described above. As described above, the vibration element 5 included in the oscillator 1 includes: a quartz substrate 6 having a support portion 62, a vibrating portion 61, and a connecting portion 63, the connecting portion 63 connecting the support portion 62 and the vibrating portion 61 and having a thickness smaller than that of the support portion 62, the support portion 62 having a lower surface 621 as a 1 st main surface and a 1 st side surface 623 connecting the lower surface 621 and the connecting portion 63; a 1 st excitation electrode 71 disposed on the vibration part 61; a 2 nd excitation electrode 72 disposed in the vibration section 61 and facing the 1 st excitation electrode 71 via the vibration section 61; a 1 st pad electrode 73 electrically connected to the 1 st excitation electrode 71 and having a 1 st portion 731 as a portion disposed on the lower surface 621; and a 2 nd pad electrode 74 electrically connected to the 2 nd excitation electrode 72 and having a 1 st portion 741 disposed on the lower surface 621. In addition, the 1 st portions 731 and 741 of at least one of the 1 st pad electrode 73 and the 2 nd pad electrode 74 disposed on the lower surface 621 are separated from at least a portion of the outer edge 621a of the lower surface 621 connected to the 1 st side surface 623.

With such a configuration, the portions of the 1 st parts 731 and 741 on the side closer to the vibrating portion 61 are less likely to peel off, and the decrease in the vibration characteristics of the vibration element 5, particularly the DLD characteristics, can be effectively suppressed. In particular, in the present embodiment, since both the 1 st pad electrode 73 and the 2 nd pad electrode 74 satisfy the above configuration, this effect can be exhibited more significantly. However, the present invention is not limited thereto, and at least one of the 1 st pad electrode 73 and the 2 nd pad electrode 74 may satisfy the above-described configuration.

As described above, the 1 st portions 731 and 741 of at least one of the 1 st pad electrode 73 and the 2 nd pad electrode 74 disposed on the lower surface 621 are entirely separated from the outer edge 621a of the lower surface 621. This makes the 1 st parts 731 and 741 less likely to peel off, and can more effectively suppress a decrease in the vibration characteristics of the vibration element 5, particularly the DLD characteristics. In particular, in the present embodiment, since both the 1 st pad electrode 73 and the 2 nd pad electrode 74 satisfy the above configuration, this effect can be more remarkably exhibited.

As described above, the support portion 62 further includes: an upper surface 622 as a 2 nd main surface in a front-back relationship with the lower surface 621; and a 2 nd side surface 625 connecting the lower surface 621 and the upper surface 622 and constituting the outer surface 60 of the quartz substrate 6. Further, the 1 st pad electrode 73 and the 2 nd pad electrode 74 each have: 1 st parts 731 and 741 disposed on the lower surface 621; 2 nd portions 732, 742 disposed on upper surface 622; and 3 rd parts 733 and 743 which are disposed on the 2 nd side 625 and connect the 1 st parts 731 and 741 and the 2 nd parts 732 and 742. This enables mounting on the base 3 in any of the upper and lower postures, thereby improving the handling characteristics of the vibration element 5.

In addition, as described above, the vibration device 10 has the vibration element 5 and the package 2 housing the vibration element 5. This protects the vibration element 5. Further, the vibrating device 10 can enjoy the effects of the vibrating element 5 described above and can exhibit excellent reliability.

As described above, oscillator 1 includes vibration element 5 and oscillation circuit 81 for oscillating vibration element 5. This makes it possible to obtain the oscillator 1 that can enjoy the effects of the vibration element 5 and can exhibit excellent reliability.

< embodiment 2 >

Fig. 8 is a plan view of the vibration element according to embodiment 2 as viewed from the negative side in the Y' axis direction. Fig. 9 is a plan view of the vibrating element according to embodiment 2 as viewed from the Y' axis direction positive side.

The oscillator 1 of the present embodiment is the same as the oscillator 1 of embodiment 1 described above except that the structure of the vibration element 5 is different. In the following description, the oscillator 1 according to embodiment 2 will be mainly described focusing on differences from embodiment 1, and descriptions of the same matters will be omitted. In fig. 8 and 9, the same components as those of the above embodiment are denoted by the same reference numerals.

As shown in fig. 8 and 9, the 1 st portion 731 of the 1 st pad electrode 73 is separated from the portion 621 a' of the outer edge 621a of the lower surface 621, which is connected to the 1 st side surface 623, with a gap G formed therebetween, but the 1 st portion 731 overlaps the portion 621a ″ of the outer edge 621a, which is connected to the 2 nd side surface 625. Similarly, the 2 nd portion 732 of the 1 st pad electrode 73 is separated from the portion 622 a' of the outer edge 622a of the upper surface 622 connected to the 1 st side surface 624 with a gap G formed therebetween, but the 2 nd portion 732 overlaps the portion 622a ″ of the outer edge 622a connected to the 2 nd side surface 625.

In addition, the 1 st portion 741 of the 2 nd pad electrode 74 is separated from the portion 621 a' of the outer edge 621a of the lower surface 621, which is connected to the 1 st side surface 623, with a gap G formed therebetween, but the 1 st portion 741 overlaps the portion 621a ″ of the outer edge 621a, which is connected to the 2 nd side surface 625. Similarly, the 2 nd portion 742 of the 2 nd pad electrode 74 is separated from the portion 622 a' of the outer edge 622a of the upper surface 622 connected to the 1 st side surface 624 with a gap G formed therebetween, but the 2 nd portion 742 overlaps the portion 622a ″ of the outer edge 622a connected to the 2 nd side surface 625.

With such a configuration, of the outer edges 731a and 741a of the 1 st portions 731 and 741, the portions closer to the vibrating portion 61 are separated from the outer edge 621a of the lower surface 621. Of outer edges 732a and 742a of 2 nd portions 732 and 742, the portion closer to vibrating portion 61 is separated from outer edge 622a of upper surface 622. Therefore, the portions of the 1 st portions 731 and 741 and the 2 nd portions 732 and 742 on the side close to the vibrating portion 61 are not easily peeled off, and the decrease in the vibration characteristics, particularly the DLD characteristics, of the vibration element 5 can be effectively suppressed.

< embodiment 3 >

Fig. 10 is a plan view of the vibration element of embodiment 3 viewed from the negative side in the Y' axis direction. Fig. 11 is a plan view of the vibrating element according to embodiment 3 as viewed from the Y' axis direction positive side. Fig. 12 is a sectional view showing a state of engagement of the vibration element with the base.

The oscillator 1 of the present embodiment is the same as the oscillator 1 of embodiment 1 described above except that the structure of the vibration element 5 is different. In the following description, the oscillator 1 according to embodiment 3 will be mainly described focusing on differences from embodiment 1, and descriptions of the same matters will be omitted. In fig. 10 to 12, the same components as those of the above embodiment are denoted by the same reference numerals.

As shown in fig. 10 and 11, in the vibration element 5 of the present embodiment, the support portion 62 includes: a 1 st supporting portion 62A, and a 1 st pad electrode 73 disposed on the 1 st supporting portion 62A; and a 2 nd support portion 62B separated from the 1 st support portion 62A, and the 2 nd pad electrode 74 is disposed on the 2 nd support portion 62B. The 1 st support portion 62A and the 2 nd support portion 62B are arranged in line in the Z' axis direction. Further, the connection portion 63 is located between the 1 st support portion 62A and the 2 nd support portion 62B, and the 1 st support portion 62A and the 2 nd support portion 62B are connected via the connection portion 63.

In the vibration element 5, as shown in fig. 12, the 1 st support portion 62A is joined to the base 3 via a joining member B1, and the 2 nd support portion 62B is joined to the base 3 via a joining member B2. By dividing support 62 into 1 st support 62A and 2 nd support 62B and locating connecting portion 63 thinner than these between them, it is possible to suppress expansion of engaging member B1 to the 2 nd support 62B side and to suppress expansion of engaging member B2 to the 1 st support 62A side. Therefore, the contact of the engaging members B1, B2 with each other can be effectively suppressed.

As described above, in the vibration element 5 of the present embodiment, the support portion 62 includes: a 1 st supporting portion 62A, and a 1 st pad electrode 73 disposed on the 1 st supporting portion 62A; and a 2 nd support portion 62B separated from the 1 st support portion 62A, and the 2 nd pad electrode 74 is disposed on the 2 nd support portion 62B. The connecting portion 63 has a portion located between the 1 st support portion 62A and the 2 nd support portion 62B, and connects the 1 st support portion 62A and the 2 nd support portion 62B. With this configuration, the contact of the joining members B1, B2 can be effectively suppressed.

< embodiment 4 >

Fig. 13 is a plan view of the vibration element according to embodiment 4 as viewed from the negative side in the Y' axis direction. Fig. 14 is a plan view of the vibrating element according to embodiment 4 as viewed from the Y' axis direction positive side.

The oscillator 1 of the present embodiment is the same as the oscillator 1 of embodiment 3 described above, except that the structure of the vibration element 5 is different. In the following description, the oscillator 1 according to embodiment 4 will be mainly described focusing on differences from embodiment 3, and descriptions of the same matters will be omitted. In fig. 13 and 14, the same components as those of the above embodiment are denoted by the same reference numerals.

As shown in fig. 13 and 14, in the vibration element 5 of the present embodiment, the connection portion 63 is disposed so as to surround the entire circumference of the 1 st support portion 62A, and similarly, the connection portion 63 is disposed so as to surround the entire circumference of the 2 nd support portion 62B. That is, the side surface of the support portion 62 does not include the 2 nd side surface 625 constituting the outer side surface 60 of the quartz substrate 6, and the entire circumference of the side surface of the support portion 62 is constituted by the 1 st side surfaces 623 and 624. With this configuration, the same effects as those of embodiment 1 can be obtained.

< embodiment 5 >

Fig. 15 is a sectional view showing an oscillator of embodiment 5.

The oscillator 1 shown in fig. 15 includes: a support substrate 1010; a circuit element 8 mounted on the support substrate 1010; a vibration device 10 mounted on the circuit element 8; and a molding material M that molds the circuit element 8 and the vibration device 10. That is, in the oscillator 1 of the present embodiment, the circuit element 8 is disposed outside the package 2.

The support substrate 1010 is, for example, an interposer (interposer) substrate. A plurality of connection terminals 1011 are disposed on the upper surface of the support substrate 1010, and a plurality of mounting terminals 1012 are disposed on the lower surface. Further, an internal wiring, not shown, is disposed in the support substrate 1010, and each connection terminal 1011 is electrically connected to a corresponding mounting terminal 1012 via the internal wiring. The support substrate 1010 is not particularly limited, and for example, a silicon substrate, a ceramic substrate, a resin substrate, a glass epoxy substrate, or the like can be used.

The circuit element 8 is bonded to the upper surface of the support substrate 1010 with a die attach material. The circuit element 8 is electrically connected to the connection terminal 1011 via the bonding wire BW2, and is electrically connected to the vibration device 10 via a conductive bonding member B3 such as solder.

The molding material M molds the circuit element 8 and the vibration device 10, protecting them from moisture, dust, impact, and the like. The molding material M is not particularly limited, and for example, a thermosetting epoxy resin can be used, and molding can be performed by transfer molding.

< embodiment 6 >

Fig. 16 is a perspective view showing a personal computer as an electronic apparatus of embodiment 6.

A personal computer 1100 as an electronic device shown in fig. 16 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1108, and the display unit 1106 is supported rotatably with respect to the main body portion 1104 via a hinge structure portion. The personal computer 1100 includes an oscillator 1. The personal computer 1100 includes an arithmetic processing circuit 1110 that performs arithmetic processing related to control of the keyboard 1102, the display unit 1108, and the like. The arithmetic processing circuit 1110 operates based on the oscillation signal output from the oscillator 1.

As described above, the personal computer 1100 as an electronic device includes: an oscillator 1; and an arithmetic processing circuit 1110 that operates based on the oscillation signal output from the oscillator 1. Therefore, the effect of the oscillator 1 can be enjoyed, and high reliability can be exhibited.

< 7 th embodiment >

Fig. 17 is a perspective view showing a mobile phone as an electronic device of embodiment 7.

A mobile phone 1200 as an electronic device shown in fig. 17 includes an antenna, a plurality of operation buttons 1202, a receiving port 1204, and a call port 1206, which are not shown, and a display unit 1208 is disposed between the operation buttons 1202 and the receiving port 1204. Such a mobile phone 1200 incorporates an oscillator 1. The mobile phone 1200 also includes an arithmetic processing circuit 1210 that performs arithmetic processing related to control of the operation buttons 1202 and the like. The arithmetic processing circuit 1210 operates based on the oscillation signal output from the oscillator 1.

As described above, the mobile phone 1200 as an electronic device includes: an oscillator 1; and an arithmetic processing circuit 1210 that operates based on the oscillation signal output from the oscillator 1. Therefore, the effect of the oscillator 1 can be enjoyed, and high reliability can be exhibited.

< embodiment 8 >

Fig. 18 is a perspective view showing a digital still camera as an electronic apparatus of embodiment 8.

The digital still camera 1300 shown in fig. 18 includes a main body 1302, and a display unit 1310 for displaying an image signal obtained by a CCD is provided on the back surface of the main body 1302. The display unit 1310 functions as a viewfinder for displaying an object as an electronic image. A light receiving unit 1304 including an optical lens, a CCD, and the like is provided on the front surface side (back surface side in the figure) of the body 1302. When the photographer checks the subject image displayed on the display unit 1310 and presses the shutter button 1306, the image pickup signal of the CCD at that time is transmitted to the memory 1308 and stored. Such a digital still camera 1300 incorporates an oscillator 1, for example. The digital still camera 1300 also includes an arithmetic processing circuit 1312 that performs arithmetic processing related to control of the display unit 1310, the light receiving unit 1304, and the like. The arithmetic processing circuit 1312 operates based on the oscillation signal output from the oscillator 1.

In this way, the digital still camera 1300 as an electronic apparatus includes: an oscillator 1; and an arithmetic processing circuit 1312 that operates in accordance with the oscillation signal output from the oscillator 1. Therefore, the effect of the oscillator 1 can be enjoyed, and high reliability can be exhibited.

In addition to the personal computer, the mobile phone, and the digital still camera, the electronic device of the present invention can be applied to, for example, a smart phone, a tablet terminal, a watch (including a smart watch), an ink jet type discharge device (for example, an ink jet printer), a laptop personal computer, a television, a wearable terminal such as an HMD (head mounted display), a video camera, a video tape recorder, a car navigation device, a pager, an electronic notebook (including a case with a communication function), an electronic dictionary, a calculator, an electronic game device, a word processor, a workstation, a video telephone, an anti-crime video monitor, an electronic binocular, a POS terminal, a medical device (for example, an electronic thermometer, a sphygmomanometer, a blood glucose meter, an electrocardiographic measurement device, an ultrasonic diagnostic device, an electronic endoscope), a fish detector, a camera, a digital camera, various measuring devices, devices for mobile terminal base stations, instruments (for example, instruments of vehicles, aircrafts, and ships), flight simulators, web servers, and the like.

< embodiment 9 >

Fig. 19 is a perspective view showing an automobile as a moving body of embodiment 9.

An automobile 1500 shown in fig. 19 includes an oscillator 1 and an arithmetic processing circuit 1510 operating based on an oscillation signal output from the oscillator 1. The oscillator 1 and the arithmetic processing circuit 1510 can be widely used in, for example, an Electronic Control Unit (ECU) such as a keyless entry System, a burglar alarm, a car navigation System, a car air conditioner, an Antilock Brake System (ABS), an air bag, a Tire Pressure Monitoring System (TPMS), an engine control, a battery monitor of a hybrid car or an electric car, and a car body attitude control System.

In this way, the automobile 1500 as a moving body includes: an oscillator 1; and an arithmetic processing circuit 1510 that operates based on the oscillation signal output from the oscillator 1. Therefore, the effect of the oscillator 1 can be enjoyed, and high reliability can be exhibited.

The mobile body is not limited to the automobile 1500, and can be applied to an unmanned aircraft such as an airplane, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and an unmanned aerial vehicle (drone).

The vibration element, the vibration device, the oscillator, the electronic apparatus, and the moving object of the present invention have been described above based on the illustrated embodiments, but the present invention is not limited thereto, and the configuration of each part may be replaced with any configuration having the same function. In addition, other arbitrary structures may be added to the present invention. In the present invention, two or more arbitrary structures in the above embodiments may be combined.