阅读说明：本技术 镀膜方法及其防护层 (Coating method and protective layer thereof ) 是由 宗坚 于 2020-04-30 设计创作，主要内容包括：本发明提供了一种镀膜方法及其防护层,其中所述镀膜方法包括：A、形成至少一防沉积层于基材的至少一无需镀膜部件的表面；和B、通过镀膜设备对所述基材进行镀膜处理,其中所述防沉积层阻止镀膜工艺中的成膜化学分子在其表面沉积成膜。(The invention provides a film coating method and a protective layer thereof, wherein the film coating method comprises the following steps: A. forming at least one anti-deposition layer on the surface of at least one part of the base material without coating; and B, carrying out film coating treatment on the base material through film coating equipment, wherein the anti-deposition layer prevents film-forming chemical molecules in the film coating process from depositing on the surface of the anti-deposition layer to form a film.)

1. A method of coating a film, comprising:

A. forming at least one anti-deposition layer on the surface of at least one part of the base material without coating; and

B. and carrying out film coating treatment on the base material through film coating equipment, wherein the anti-deposition layer prevents film-forming chemical molecules in the film coating process from depositing on the surface of the anti-deposition layer to form a film.

2. The plating method according to claim 1, wherein the step A comprises: and coating the anti-deposition layer on the surface of the component without film coating.

3. The plating method according to claim 1, wherein the non-plating member is a circuit interface element, wherein the deposition preventing layer allows conductive connection between the circuit interface element and another circuit interface.

4. The plating method according to claim 1, wherein the step B comprises: b1, placing the substrate in a coating cavity of the coating equipment; b2, performing negative pressure generation operation on the film coating cavity; and B3, preparing a film layer on the surface of the base material in a chemical vapor deposition mode, wherein the film layer is not formed on the surface of the anti-deposition layer in a deposition mode.

5. The plating method according to claim 4, wherein the surface of the substrate treated in the step B has the film layer and the deposition preventing layer, wherein the film layer is adjacent to the deposition preventing layer.

6. The plating method according to any one of claims 1 to 5, wherein the material of the deposition preventing layer comprises squalene.

7. The plating method according to any one of claims 1, 2, 4 and 5, wherein the substrate is a circuit board, and wherein the no-plating member is on the circuit board selected from the group consisting of: one or a combination of a circuit interface element, an antenna elastic sheet, an inductor, a camera module and an acoustic device.

8. A method of coating a film, comprising:

a. placing a base material in a coating cavity of coating equipment, wherein at least one anti-deposition layer is arranged on the surface of at least one part of the base material, which does not need coating;

b. performing negative pressure generation operation on the coating cavity; and

c. and preparing a film layer on the surface of the base material in a chemical vapor deposition mode, wherein the anti-deposition layer prevents film-forming chemical molecules in a coating process from depositing to form a film on the surface of the anti-deposition layer, and the film layer is not deposited on the surface of the anti-deposition layer.

9. The plating method according to claim 8, further comprising: and removing the anti-deposition layer on the surface of the base material.

10. The plating method according to claim 8 or 9, wherein the substrate is a circuit board, wherein the no-plating member is on the circuit board selected from the group consisting of: one or a combination of a circuit interface element, an antenna elastic sheet, an inductor, a camera module and an acoustic device.

11. The plating method according to claim 8 or 9, wherein the material of the deposition preventing layer comprises squalene.

12. A protective layer formed on a surface of a substrate, comprising:

at least one anti-deposition layer, wherein the anti-deposition layer is made of a material which can prevent film-forming chemical molecules in a film-coating process from depositing a film on the surface of the anti-deposition layer; and

at least one film layer, wherein the film layer is prepared on the surface of the base material through film coating equipment, and the film layer is adjacent to the anti-deposition layer.

13. The armor layer of claim 12, wherein the substrate has at least one electroless plating part, wherein the anti-deposition layer is formed on a surface of the electroless plating part.

14. The protective layer of claim 13, wherein the anti-deposition layer is applied to the surface of the non-deposition part of the substrate.

15. The protective layer of claim 13, wherein the non-plating requiring component is a circuit interface element, wherein the anti-deposition layer allows for conductive connection between the circuit interface element and other circuit interfaces.

16. The overcoat of claim 13 wherein the method of preparing the film layer on the substrate surface by a coating apparatus comprises: b1, placing the substrate in a coating cavity of the coating equipment; b2, performing negative pressure generation operation on the film coating cavity; and B3, preparing a film layer on the surface of the base material in a chemical vapor deposition mode, wherein the film layer is not formed on the surface of the anti-deposition layer in a deposition mode.

17. The overcoat of claim 16 wherein the film layer is selected from the group consisting of: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof click-through resistant film layer, a low-adhesion corrosion resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion aging resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.

18. The armor layer of claim 13, wherein the material of the anti-settling layer comprises squalene.

19. The protective layer of any of claims 13, 14, 16, 17 and 18, wherein the substrate is a circuit board, and wherein the non-plating requiring component is on the circuit board selected from the group consisting of: one or a combination of a circuit interface element, an antenna elastic sheet, an inductor, a camera module and an acoustic device.

20. The circuit board comprises a main board and at least one component which is arranged on the main board and does not need to be coated, and is characterized by further comprising a protective layer, wherein the protective layer comprises at least one anti-deposition layer and at least one film layer, the anti-deposition layer is formed on the surface of the component which does not need to be coated, and the film layer is formed on the surface of the main board.

21. The circuit board of claim 20, wherein the film layer is prepared by a coating apparatus, wherein the method of preparing the film layer by the coating apparatus comprises: b1, placing the circuit board in a film coating cavity of the film coating equipment; b2, performing negative pressure generation operation on the film coating cavity; and B3, preparing a film layer on the surface of the circuit board by means of chemical vapor deposition, wherein the film layer is not formed on the surface of the anti-deposition layer by deposition.

22. The circuit board of claim 21, wherein the anti-deposition layer is applied to the surface of the non-deposition part before the film layer is prepared.

23. The circuit board of claim 20, wherein the material of the anti-settling layer comprises squalene.

24. The circuit board of claim 21, wherein the film layer is selected from the group consisting of: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof click-through resistant film layer, a low-adhesion corrosion resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion aging resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.

25. The circuit board of any one of claims 21 to 25, wherein the no-plating part is on the circuit board selected from the group consisting of: one or a combination of a circuit interface element, an antenna elastic sheet, an inductor, a camera module and an acoustic device.

Technical Field

The invention relates to the field of film coating, and further relates to a film coating method and a protective layer thereof.

Background

In recent years, the rapid development of film coating technology, especially the vapor deposition technology, has become mature, so that the improvement of the performance of electronic products by using the surface film coating technology becomes a technological hotspot. The surface coating technology can endow electronic products with performances such as high falling-resistant times, excellent scratch-resistant and wear-resistant properties, good heat dissipation, water resistance, water-down conductivity, corrosion resistance and the like. The plasma chemical vapor deposition technology is a commonly used coating technology at present, generates plasma under the action of an electric field, and makes gaseous substances containing film component atoms generate chemical reaction by means of the plasma to deposit a protective film on the surface of a product.

Because the film-forming raw materials in the chemical vapor deposition method are in a vapor phase state, the vapor phase coating material can be deposited to form a film on the surfaces of all the components which are placed in the vapor phase coating material and can be contacted with the film-forming material. In order to ensure the electrical connection performance of the circuit connection port of the product to be coated, such as a circuit board, or the stability of the electronic element or the circuit connection port, the antenna elastic sheet, the inductor, the camera module, the acoustic device and other parts which do not need to be coated on the surface of the product to be coated, the parts which do not need to be coated need to be shielded in the coating process so as to ensure that the surface of the parts which do not need to be coated is not coated with a film layer or a coating. For example, after the antenna spring is coated, the impedance of the formed film can change the radio frequency performance of the antenna; after the optical device is coated, the transmission effect of the optical device can be changed even if a formed film is transparent; after the acoustic device is coated, the formed film, even if thin, can affect the vibration of the diaphragm of the acoustic device to change the acoustic effect. However, the selection of a proper shielding manner to meet the coating requirement of the substrate is a difficulty of the coating technology.

The common masking methods currently used to meet the above-mentioned substrate selective coating are dispensing and pasting. And before coating protection, the component without coating is subjected to glue dispensing or sticker pasting. And after the film coating is finished, stripping the shielded resin glue or tearing off the sticker. This way of masking undoubtedly results in: (1) when the shielding is removed, secondary damage to the electronic element, the antenna elastic sheet or the circuit interface is caused, and the performance of the electronic element, the antenna elastic sheet or the circuit interface is influenced; (2) the process of shielding and shielding removal is usually carried out manually, automation cannot be realized, so that the labor cost is increased, the film coating time is prolonged, the film coating efficiency is seriously influenced, and the defective product rate of the film coating process is influenced due to the possible adverse effects of adhesive residue and the like.

Or, a coating fixture with a coating hole is adopted to shield parts of the product to be coated which do not need to be coated, wherein the part of the product to be coated exposed out of the coating hole can be coated with a coating, and the parts which do not need to be coated are shielded by the coating fixture and cannot be coated with the coating.

Disclosure of Invention

One advantage of the present invention is to provide a coating method and a protective layer thereof, which are used for shielding a component without coating on the surface of a substrate to prevent chemical molecules forming a film from depositing on the surface of the component without coating during the coating process, so as to meet the coating requirement.

Another advantage of the present invention is to provide a coating method and a protective layer thereof, which do not require a shielding removal process, do not introduce residual glue or damage to the substrate, reduce the cost, improve the yield of the coating, shorten the coating time, and can be quickly and efficiently implemented by cleaning even though the shielding removal process is performed.

Another advantage of the present invention is to provide a coating method and a protective layer thereof, wherein the protective layer includes at least one anti-deposition layer, wherein the anti-deposition layer is made of a material that can prevent deposition of film-forming chemical molecules during a coating process, and the anti-deposition layer does not need to be removed from the surface of the substrate after coating.

It is another advantage of the present invention to provide a plating method and a protective layer thereof, wherein in some embodiments, the deposition prevention layer does not affect the electrical connection performance of the plating-free member.

Another advantage of the present invention is to provide a coating method and a protective layer thereof, which are not limited by the shape and size of the product to be coated or the arrangement of parts without coating on the surface thereof, and have wide applicability.

Another advantage of the present invention is to provide a coating method and a protective layer thereof that does not require cleaning or maintenance to save labor costs.

Another advantage of the present invention is to provide a coating method and a protective layer thereof, which is simple, easy to automate, and low in cost.

According to one aspect of the present invention, the present invention further provides a coating method comprising:

A. forming at least one anti-deposition layer on the surface of at least one part of the base material without coating; and

B. and carrying out film coating treatment on the base material through film coating equipment, wherein the anti-deposition layer prevents film-forming chemical molecules in the film coating process from depositing on the surface of the anti-deposition layer to form a film.

In some embodiments, wherein step a precedes step B.

In some embodiments, step a includes: and coating the anti-deposition layer on the surface of the component without film coating.

In some embodiments, the non-plating-required component is a circuit interface element, wherein the anti-deposition layer allows conductive connection between the circuit interface element and other circuit interfaces.

In some embodiments, wherein said step B comprises: b1, placing the substrate in a coating cavity of the coating equipment; b2, performing negative pressure generation operation on the film coating cavity; and B3, preparing a film layer on the surface of the base material in a chemical vapor deposition mode, wherein the film layer is not formed on the surface of the anti-deposition layer in a deposition mode.

In some embodiments, the surface of the substrate treated in step B has the film layer and the deposition prevention layer, wherein the film layer is adjacent to the deposition prevention layer.

In some embodiments, wherein the material of the anti-settling layer comprises squalene.

According to another aspect of the present invention, there is further provided a coating method, comprising:

a. placing a base material in a coating cavity of coating equipment, wherein at least one anti-deposition layer is arranged on the surface of at least one part of the base material, which does not need coating;

b. performing negative pressure generation operation on the coating cavity; and

c. preparing a film layer on the surface of the substrate in a chemical vapor deposition mode, wherein the anti-deposition layer prevents film-forming chemical molecules in a coating process from depositing to form a film on the surface of the anti-deposition layer, and the film layer is not deposited on the surface of the anti-deposition layer.

According to another aspect of the present invention, there is further provided a protective layer prepared on a surface of a substrate, comprising:

at least one anti-deposition layer, wherein the anti-deposition layer is made of a material which can prevent film-forming chemical molecules in a film-coating process from depositing a film on the surface of the anti-deposition layer; and

at least one film layer, wherein the film layer is prepared on the surface of the base material through film coating equipment, and the film layer is adjacent to the anti-deposition layer.

In some embodiments, wherein the substrate is a circuit board, wherein the non-plating requiring component is on the circuit board selected from the group consisting of: one or a combination of a circuit interface element, an antenna elastic sheet, an inductor, a camera module and an acoustic device.

According to another aspect of the present invention, there is further provided a circuit board, wherein the circuit board includes a main board and at least one component without requiring coating disposed on the main board, the circuit board further includes a protective layer, wherein the protective layer includes at least one deposition-preventing layer and at least one film layer, wherein the deposition-preventing layer is formed on a surface of the component without requiring coating, and the film layer is formed on a surface of the main board.

In some embodiments, the anti-deposition layer is coated on the surface of the component without coating before the film layer is prepared.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

FIG. 1 is a method flow diagram of a method of coating in accordance with a preferred embodiment of the present invention.

Fig. 2 is a flowchart of a method for preparing a film according to a specific example of the coating method according to the above preferred embodiment of the present invention.

Fig. 3 is a schematic view illustrating the deposition preventing layer and the film layer formed on the surface of the substrate by the coating method according to the above preferred embodiment of the present invention.

Fig. 4 is a method flowchart of the plating method according to a modified embodiment of the above preferred embodiment of the present invention.

Fig. 5 is a schematic block diagram of a protective layer prepared on the surface of a substrate according to the above preferred embodiment of the present invention.

Fig. 6 is a schematic plan view of the circuit board according to the above preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Exemplary coating method

Fig. 1 shows a flow chart of a method of the coating method of the present invention, and as shown in fig. 1, the coating method includes:

s10, forming at least one anti-deposition layer 10 on the surface of the substrate 800, which is not required to be coated with the film 810; and

s20, performing film coating treatment on the base material 800 through a film coating device, wherein the deposition-preventing layer 10 prevents film-forming chemical molecules in the film coating process from depositing on the surface of the deposition-preventing layer to form a film.

In the present embodiment, the step S10 precedes the step S20. In other words, before the substrate 800 is subjected to the plating process by the plating equipment, the deposition preventing layer 10 needs to be formed on the surface of the deposition unnecessary part 810 of the substrate 800, so that the deposition unnecessary part 810 is shielded by the deposition preventing layer 10. The deposition-preventing layer 10 is made of a material that can prevent the deposition of film-forming chemical molecules on the surface thereof during a coating process. Then, during the coating process, the deposition prevention layer 10 can prevent deposition of film-forming chemical molecules on the surface thereof to form a film, and the portion of the surface of the substrate 800 where the deposition prevention layer 10 is not formed can be deposited by the film-forming chemical molecules to form a film layer. The material of the anti-settling layer 10 may be terpenoids, for example, squalene (2,6,10,15,19, 23-hexamethyl-2, 6,10,14,18, 22-tetracosane) can be specifically mentioned.

Further, in the step S10, the deposition preventing layer 10 is coated on the surface of the component without film plating. In other words, the deposition preventing layer 10 is adhered to the surface of the no-plating part 810 by its own adhesiveness, so as to be fixed and not to be easily detached or dropped off. In the coating process, an automatic device can be used to coat the anti-deposition layer 10 on the surface of the component 810 without coating, so as to improve the precision, reduce the labor cost and save the coating time.

In a specific example of this embodiment, the substrate 800 is a circuit board, such as a PCB, wherein the component 810 without film plating of the substrate 800 may be a circuit interface component on the surface of the circuit board, such as an adapter, a circuit port, a USB interface, or the like, or the component 810 without film plating is a component or a part on the surface of the circuit board, such as an antenna dome, an inductor, a camera module, an acoustic device (which may be determined according to requirements), or the like, which needs to be shielded. Preferably, the deposition prevention layer 10 does not affect the electrical connection performance of the non-plating required part 810 (e.g., the circuit interface element) of the substrate 800. More preferably, the anti-settling layer 10 has conductivity. Alternatively, the deposition prevention layer 10 is a non-insulating material. It is understood that the substrate 800 may be other types of products to be coated, such as a mobile phone, an electronic device, a keyboard or a part thereof, and the like, without limitation. Alternatively, the anti-deposition layer 10 may not have electrical conductivity, wherein the thickness of the anti-deposition layer 10 can be preset, wherein the anti-deposition layer 10 can be electrically broken down to conduct electricity, that is, the circuit interface component can electrically break down the anti-deposition layer 10 to complete the electrical conductivity when electrically connecting other circuit interfaces. In other words, the anti-settling layer 10 allows for conductive connection between the circuit interface element and other circuit interfaces.

The anti-deposition layer 10 can be directly coated on the surface of the component 810 without film plating formed on the base material 800, so that the anti-deposition layer is not limited by the shape and size of the base material 800 or the arrangement of the component 810 without film plating on the surface of the base material 800, and the applicability is wide. In other words, the anti-deposition layer 10 can be coated and formed into a layered structure matching the shape and size of the non-plating parts such as the circuit interface component according to the requirement. Alternatively, before the deposition prevention layer 10 is formed, the raw material for forming the deposition prevention layer 10 is an amorphous viscous material, and after the raw material is coated on the surface of the deposition-unnecessary part 810, the raw material is cured and formed into the deposition prevention layer 10.

Further, the anti-deposition layer 10 has a predetermined thickness to meet different coating requirements.

It is worth mentioning that when the deposition prevention layer 10 is applied to the circuit interface element, the deposition prevention layer 10 does not need to be removed from the surface of the circuit interface element of the substrate 800. That is, the coating method of the present application does not require a process of deblocking. In other words, in the step S20, the substrate 800 after being coated by the coating apparatus is coated without the step of removing the deposition preventing layer 10, and the coating is completed. Compared with the traditional coating method adopting glue or adhesive tape for shielding, the coating method does not need to remove the anti-deposition layer 10 on the surface of the coating component 810, and the anti-deposition layer 10 can not influence the electric connection performance of the coating component 810, so that the coating method can not introduce residual glue or damage the substrate, reduce the cost, improve the coating yield, shorten the coating time and be beneficial to realizing automation. Moreover, compared with a coating method adopting a coating clamp, the coating method does not need post-cleaning, maintenance or the like.

Further, the coating method further comprises the following steps: and S30, removing the anti-deposition layer 10 on the surface of the base material 800. That is, after the coating is finished, the deposition preventing layer 10 on the surface of the component 810 without coating of the substrate 800 may be removed by a cleaning device or manually, that is, the surface of the substrate 800 may be subjected to a shielding removing process to remove the deposition preventing layer 10 on the surface of the component 810 without coating of the substrate 800. Since the deposition preventing layer 10 is different from a conventional glue or tape, the cleaning device or manual cleaning can remove the deposition preventing layer 10 more efficiently and quickly without adhesive residue or damage to electronic components. In other words, when the anti-deposition layer 10 is coated on the antenna spring, the inductor, the camera module, the acoustic device, and other components on the surface of the substrate 800, after the coating is finished, the anti-deposition layer 10 can be removed to ensure the performance of the antenna spring, the inductor, the camera module, and the acoustic device.

Preferably, as shown in fig. 2, the step S20 includes:

s21, placing the substrate 800 in a film coating cavity of the film coating equipment;

s22, performing negative pressure generation operation on the film coating cavity; and

s23, preparing a film layer 20 on the surface of the substrate 800 by chemical vapor deposition, wherein the film layer 20 is not formed on the surface of the deposition-preventing layer 10 by deposition.

In step S21, the substrate 800 is the substrate 800 processed in step S10. In other words, after the deposition preventing layer 10 is formed on the surface of the deposition-unnecessary part 810 of the substrate 800, the substrate 800 is placed in the coating chamber to prepare the film layer 20.

It is understood that the coating apparatus is, for example, a vacuum coating apparatus, wherein the coating apparatus provides the coating chamber with a higher vacuum degree, that is, the coating chamber is not an absolute vacuum, for example, the vacuum degree of the coating chamber is approximately 0.1 to 20Pa, wherein the substrate 800 is placed in the coating chamber to complete coating, optionally, the coating type of the coating apparatus may be vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, P L D laser sputtering deposition, physical vapor deposition, or plasma chemical vapor deposition, and the like, and the working principle thereof is not described herein in detail, optionally, the film 20 includes a film, a thin film, or a nano film layer that is coated on the surface of the substrate 800 where the deposition-resistant film 10 is not formed, optionally, the film 20 may be implemented as a silicone nano film-resistant layer, a silicone hard nano film-resistant layer, a composite structure high-insulating nano film-resistant layer, a modulated structure nano film, a plasma polymerized film, a gradient structure liquid-resistant film, a gradient structure liquid-resistant film, a cross-linked film, a water-resistant nano film, a color difference-resistant nano-acrylic acid-based film, or a nano-acrylic acid-based on which the substrate 800 has a nano film with a high resistance to improve the nano film-resistant nano-coating-film.

In the step S22, the negative pressure generating operation is performed on the coating chamber by vacuum pumping, for example, the coating chamber is vacuum pumped by a vacuum pump or the like.

In the step S23, a reaction raw material or an auxiliary raw material required by the film to be prepared is introduced into the coating chamber, a radio frequency and/or high voltage pulse power supply is used to generate plasma to activate a chemical vapor deposition reaction, so as to form a film-forming chemical molecule in a vapor phase state in the coating chamber, and then the film-forming chemical molecule in the vapor phase state is deposited on the surface of the substrate 800 on which the deposition-preventing film 10 is not formed within a preset coating time, so as to form the film 20. Since the deposition-preventing layer 10 prevents the deposition of the film-forming chemical molecules on the surface thereof, the film layer 20 is not deposited on the surface of the deposition-preventing layer 10. Further, the surface of the base material 800 processed in the step S20 has the film layer 20 and the deposition prevention layer 10, and the deposition prevention layer 10 is adjacent to the film layer 20 but not laminated on the surface of the base material 800.

For example, the parameters of the coating device in the coating process are as follows: air intake amount: he: 10-200sccm, perfluorooctyl ethyl acrylate: 10-300 sccm; before coating, the vacuum degree of the coating cavity is as follows: less than 10 Pa; the vacuum degree of the coating cavity during coating is as follows: 0.1-20 Pa; generating a voltage using a radio frequency and/or pulsed power supply, outputting the voltage: 10-300V, duty ratio: 5-100%, frequency: 20-360 KHz; coating time: 0.1 to 5hrs, which is only an example and not a limitation to the present invention.

Further, as shown in fig. 3, the film-coating-free member 810 includes a first member 811 and a second member 812, wherein the first member 811 does not overlap with the second member 812 in position, and the step S10 includes:

s11, forming a first anti-deposition layer 11 on the surface of the first component 811 of the base material 800; and

s12, forming a second anti-settling layer 12 on the surface of the second part 812 of the substrate 800.

Preferably, the first anti-deposition layer 11 and the second anti-deposition layer 12 have the same thickness. The first anti-deposition layer 11 and the second anti-deposition layer 12 are made of materials capable of preventing film-forming chemical molecules in a film-coating process from depositing a film on the surfaces of the first anti-deposition layer and the second anti-deposition layer.

It is understood that the first component 811 and the second component 812 may be circuit interface elements or components to be shielded, etc. located at different positions on the surface of the substrate 800.

Optionally, the thicknesses of the first deposition prevention layer 11 and the second deposition prevention layer 12 may not be equal to each other, so as to respectively meet the coating requirements of the first component 811 and the second component 812.

In a modified embodiment of the preferred embodiment, as shown in fig. 4, the plating method includes:

a. placing a substrate 800 in a coating cavity of a coating device, wherein at least one anti-deposition layer 10 is arranged on the surface of at least one component 810 of the substrate 800, which is not required to be coated, and the anti-deposition layer 10 is made of a material capable of preventing film-forming chemical molecules in a coating process from depositing a film on the surface of the anti-deposition layer;

b. performing negative pressure generation operation on the coating cavity; and

c. preparing the film layer 20 on the surface of the substrate 800 by chemical vapor deposition, wherein the film layer 20 is not deposited on the surface of the deposition-preventing layer 10.

Further, the plating-free member 810 includes a first member 811 and a second member 812, wherein the deposition prevention layer 10 includes a first deposition prevention layer 11 and a second deposition prevention layer 12, wherein the first deposition prevention layer 11 is formed on a surface of the first member 811, and wherein the second deposition prevention layer 12 is formed on a surface of the second member 812. Further, the first anti-deposition layer 11 and the second anti-deposition layer 12 have the same thickness.

The coating method further comprises the following steps: the deposition preventing layer 10 is removed. That is, after the film layer 20 is prepared in the step c, the deposition preventing layer 10 may be removed by a cleaning device or manually, so as to ensure the performance of the non-film-plating parts, such as the circuit interface element, the antenna dome, the inductor, the camera module, or the acoustic device.

Optionally, the coating apparatus is, for example, a vacuum coating apparatus, wherein the coating apparatus provides the coating chamber with a higher vacuum degree, that is, the coating chamber is not an absolute vacuum, for example, the vacuum degree of the coating chamber is approximately 0.1 to 20Pa, wherein the substrate 800 is placed in the coating chamber to complete coating, and optionally, the coating type of the coating apparatus may be vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, P L D laser sputtering deposition, physical vapor deposition, or plasma chemical vapor deposition, and the like, and the working principle thereof is not described herein again.

Exemplary overcoat layer

Fig. 5 is a schematic plan view of a protective layer 100 prepared on the surface of a substrate 800 according to a preferred embodiment of the present application. As shown in fig. 5, the protective layer 100 includes: at least one anti-deposition layer 10 and at least one film layer 20, wherein the anti-deposition layer 10 is made of a material capable of preventing film-forming chemical molecules in a film-coating process from depositing a film on the surface of the anti-deposition layer, the film layer 20 is prepared on the surface of the substrate 800 by a film-coating device, and the film layer 20 is adjacent to the anti-deposition layer 10.

Further, the substrate 800 has at least one deposition-preventing layer 810, wherein the deposition-preventing layer 10 is formed on the surface of the deposition-preventing layer 810. Preferably, the deposition prevention layer 10 is applied to the surface of the deposition-unnecessary part 810 of the substrate 800.

The substrate 800 is a circuit board, the non-plating component 810 is a circuit interface element on the circuit board, and the deposition-preventing layer 10 covers the surface of the circuit interface element, and in order to ensure the electrical connection performance of the non-plating component 810, the deposition-preventing layer 10 has conductivity, or the deposition-preventing layer 10 is a non-insulating material.

Preferably, the method for preparing the film layer on the surface of the substrate by the coating equipment comprises the following steps: placing the substrate 800 in a coating chamber of the coating device; performing negative pressure generation operation on the coating cavity; and preparing the film layer 20 on the surface of the substrate 800 by chemical vapor deposition, wherein the film layer 20 is not deposited on the surface of the deposition-preventing layer 10.

In a specific example, the film layer is selected from: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof electric breakdown-resistant film layer, a low-adhesion corrosion-resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion ageing-resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.

Further, the deposition prevention layer 10 includes a first deposition prevention layer 11 and a second deposition prevention layer 12, wherein the plating-free member 810 includes a first member 811 and a second member 812, wherein the first deposition prevention layer 11 is formed on a surface of the first member 811, and wherein the second deposition prevention layer 12 is formed on a surface of the second member 812. Preferably, the thickness of the first anti-deposition layer 11 is equal to the thickness of the second anti-deposition layer 12.

Exemplary Circuit Board

Fig. 6 is a schematic structural diagram of a circuit board according to a preferred embodiment of the present application, and as shown in fig. 6, the circuit board includes: a main board 820 and at least one component without film coating 810 disposed on the main board 820, wherein the circuit board further includes a protective layer 100, wherein the protective layer 100 includes at least one deposition-preventing layer 10 and at least one film layer 20, wherein the deposition-preventing layer 10 is formed on the surface of the component without film coating 810, and the film layer 20 is formed on the surface of the main board 820.

In a specific example, the film 20 is prepared by a coating apparatus, wherein the method for preparing the film 20 by the coating apparatus comprises: b1, placing the circuit board in a film coating cavity of the film coating equipment; b2, performing negative pressure generation operation on the film coating cavity; and B3, preparing the film layer 20 on the surface of the circuit board by means of chemical vapor deposition, wherein the film layer 20 is not formed on the surface of the deposition-preventing layer 10 by deposition.

In a specific example, the anti-deposition layer is coated on the surface of the component without coating before the film layer is prepared.

In a specific example, the deposition prevention layer 10 includes a first deposition prevention layer 11 and a second deposition prevention layer 12, wherein the plating-free component includes a first component 811 and a second component 812, wherein the first deposition prevention layer 11 is formed on a surface of the first component 811, and wherein the second deposition prevention layer 12 is formed on a surface of the second component 812.

In a specific example, wherein the film layer 20 is selected from: the coating comprises one or more of an organic silicon nano protective film layer, an organic silicon hard nano protective film layer, a composite structure high-insulation hard nano protective film layer, a high-insulation nano protective film layer with a modulation structure, a plasma polymerization film layer, a gradient increasing structure liquid-proof film layer, a gradient decreasing structure liquid-proof film layer, a film layer with controllable crosslinking degree, a waterproof electric breakdown-resistant film layer, a low-adhesion corrosion-resistant film layer, a liquid-proof film layer with a multilayer structure, a polyurethane nano film layer, an acrylamide nano film layer, an anti-static liquid-proof nano film layer, an epoxy nano film layer, a high-transparency low-color-difference nano film layer, a high-adhesion ageing-resistant nano film layer, a silicon-containing copolymer nano film layer and a polyimide nano film layer.

In a specific example, the no-plating part 810 is a circuit interface element on the circuit board.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.