阅读说明：本技术 泵送线布置中的改进或与其相关的改进 (Improvements in or relating to pumping line arrangements ) 是由 A.J.西利 于 2018-07-03 设计创作，主要内容包括：在半导体制造领域中,存在确保不同的不相容过程流不以由此存在发生不同过程流之间的灾难性反应的高风险的方式而彼此混合的需要。一种泵送线布置(10)包括腔室连接线(12),所述腔室连接线(12)流体地可连接到形成半导体制造工具(15)的一部分的过程腔室(14)。所述泵送线布置(10)还包括阀模块(16),所述阀模块(16)流体地连接到所述腔室连接线(12)。所述阀模块(16)将所述腔室连接线(12)分成相应的第一和第二泵送线(18、20)。所述第一泵送线(18)旨在载送第一过程流,并且所述第二泵送线(20)旨在载送与所述第一过程流不相容的第二过程流。所述第一泵送线(18)或所述第二泵送线(20)中的至少一个包括流体地连接在其内的预减少模块(26、28),所述预减少模块(26、28)被配置成从旨在由其它泵送线(18、20)载送的过程流中去除一个或多个不相容的组分。(In the field of semiconductor manufacturing, there is a need to ensure that different incompatible process streams do not mix with each other in a manner whereby there is a high risk of catastrophic reactions between the different process streams occurring. A pump line arrangement (10) includes a chamber connection line (12), the chamber connection line (12) being fluidly connectable to a process chamber (14) forming part of a semiconductor manufacturing tool (15). The pumping line arrangement (10) further comprises a valve module (16), the valve module (16) being fluidly connected to the chamber connection line (12). The valve module (16) divides the chamber connection line (12) into respective first and second pumping lines (18, 20). The first pumping line (18) is intended to carry a first process flow and the second pumping line (20) is intended to carry a second process flow that is incompatible with the first process flow. At least one of the first pumping line (18) or the second pumping line (20) includes a pre-reduction module (26, 28) fluidly connected therein, the pre-reduction module (26, 28) configured to remove one or more incompatible components from a process stream intended to be carried by the other pumping line (18, 20).)

1. A pumping line arrangement for use in a semiconductor manufacturing assembly, comprising:

a chamber connection line fluidly connectable to a process chamber forming part of a semiconductor manufacturing tool within which at least two process steps are performed; and

a valve module fluidly connected to the chamber connection line, the valve module dividing the chamber connection line into respective first and second pumping lines, the first pumping line intended to carry a first process step exhaust gas flow and the second pumping line intended to carry a second process step exhaust gas flow incompatible with the first process step exhaust gas flow,

at least one of the first pumping line or the second pumping line includes a pre-abatement module fluidly connected therein configured to remove one or more incompatible process step exhaust gas constituents from a process step exhaust gas stream intended to be carried by the other pumping line.

2. A pumping line arrangement according to claim 1, wherein the or each pre-reduction module is fluidly connected within a corresponding pumping line immediately downstream of the valve module.

3. The pumping line arrangement of claim 1 or claim 2, wherein the first pumping line comprises a first pre-reduction module fluidly connected therein, the first pre-reduction module configured to remove one or more incompatible process step exhaust constituents from the second process stream, and wherein the second pumping line comprises a second pre-reduction module fluidly connected therein, the second pre-reduction module configured to remove one or more incompatible process step exhaust constituents from the first process stream.

4. The pumping line arrangement of claim 3, wherein the first pumping line defines a deposition pumping line intended to carry a deposition process stream, the second pumping line defines a cleaning pumping line intended to carry a cleaning process stream, and wherein the first pre-reduction module is configured to remove one or more incompatible process step exhaust components from the cleaning process stream and the second pre-reduction module is configured to remove one or more incompatible process step exhaust components from the deposition process stream.

5. The pumping line arrangement according to any of the preceding claims, wherein the first pre-reduction module comprises a fluorine removal agent.

6. The pumping line arrangement according to claim 5, wherein the fluorine removal agent is or comprises:

calcium carbonate; and/or

Silicon.

7. The pumping line arrangement according to any of the preceding claims, wherein the second pre-reduction module comprises a fluorinating agent.

8. The pumping line arrangement according to claim 7, wherein the fluorinating agent is or comprises:

a transition metal fluoride; and/or

Potassium tetrafluorocobaltate.

9. The pumping line arrangement according to claim 8, wherein the transition metal fluoride is or comprises:

cobalt (III) fluoride; and/or

Iron fluoride (iron (III) fluoride).

10. A vacuum pumping system comprising a pumping line arrangement according to any of the preceding claims, wherein the vacuum pumping system comprises a first main reduction module and a second main reduction module, and the first pumping line is fluidly connected with the first main reduction module configured to reduce the first process flow, and the second pumping line is fluidly connected with the second main reduction module configured to reduce the second process flow, each of the main reduction modules being positioned downstream of a corresponding upstream pre-reduction module.

11. The vacuum pumping system of claim 10, comprising:

the plurality of pumping line arrangements according to any of claims 1 to 9, wherein the chamber connection lines are fluidly connectable to respective process chambers forming part of one or more semiconductor manufacturing tools;

a first common pumping line fluidly connected with the first main reduction module and a first pumping line of the pumping line arrangement; and

a second common pumping line fluidly connected with the second main reduction module and a second pumping line of the pumping line arrangement.

12. A vacuum pumping system as defined in claim 11, wherein the first common pumping line is fluidly connected to a first vacuum pumping arrangement and the second common pumping line is fluidly connected to a second vacuum pumping arrangement.

13. A semiconductor manufacturing assembly comprising a semiconductor manufacturing tool comprising at least one process chamber having a pumping line arrangement according to any of the preceding claims fluidly connected thereto.