阅读说明：本技术 泵送线布置中的改进或与其相关的改进 (Improvements in or relating to pumping line arrangements ) 是由 A.J.西利 于 2018-07-03 设计创作，主要内容包括：在半导体制造领域中,存在确保不同的不相容过程流不以由此存在发生不同过程流之间的灾难性反应的高风险的方式而彼此混合的需要。一种泵送线布置(10)包括腔室连接线(12),所述腔室连接线(12)流体地可连接到形成半导体制造工具(15)的一部分的过程腔室(14)。所述泵送线布置(10)还包括阀模块(16),所述阀模块(16)流体地连接到所述腔室连接线(12)。所述阀模块(16)将所述腔室连接线(12)分成相应的第一和第二泵送线(18、20)。所述第一泵送线(18)旨在载送第一过程流,并且所述第二泵送线(20)旨在载送与所述第一过程流不相容的第二过程流。所述第一泵送线(18)或所述第二泵送线(20)中的至少一个包括流体地连接在其内的预减少模块(26、28),所述预减少模块(26、28)被配置成从旨在由其它泵送线(18、20)载送的过程流中去除一个或多个不相容的组分。(In the field of semiconductor manufacturing, there is a need to ensure that different incompatible process streams do not mix with each other in a manner whereby there is a high risk of catastrophic reactions between the different process streams occurring. A pump line arrangement (10) includes a chamber connection line (12), the chamber connection line (12) being fluidly connectable to a process chamber (14) forming part of a semiconductor manufacturing tool (15). The pumping line arrangement (10) further comprises a valve module (16), the valve module (16) being fluidly connected to the chamber connection line (12). The valve module (16) divides the chamber connection line (12) into respective first and second pumping lines (18, 20). The first pumping line (18) is intended to carry a first process flow and the second pumping line (20) is intended to carry a second process flow that is incompatible with the first process flow. At least one of the first pumping line (18) or the second pumping line (20) includes a pre-reduction module (26, 28) fluidly connected therein, the pre-reduction module (26, 28) configured to remove one or more incompatible components from a process stream intended to be carried by the other pumping line (18, 20).)