Resin molding device, method for peeling release film, and method for producing resin molded article
阅读说明:本技术 树脂成型装置、脱模膜的剥离方法、树脂成型品的制造方法 (Resin molding device, method for peeling release film, and method for producing resin molded article ) 是由 高田直树 高桥范行 水间敬太 川本佳久 于 2019-07-24 设计创作,主要内容包括:本发明提供易于从树脂成型品剥离脱模膜的树脂成型装置。所述树脂成型装置特征在于,具备具有相向配置的一边的模具(100)和另一边的模具(200)的成型模;包围所述成型模而可将其从外部空气隔绝的外部空气隔绝部件(300);被连接到一边的模具(100)和另一边的模具(200)之一或两者,并在所述被连接的模具的模具表面上吸附脱模膜的脱模膜吸附机构(220);以及对以外部空气隔绝部件(300)包围的空间加压,并可对所述脱模膜向吸附有所述脱模膜的模具表面的方向加压的加压机构(400)。(The invention provides a resin molding device which is easy to strip a release film from a resin molding product. The resin molding device is characterized by comprising a molding die having a die (100) on one side and a die (200) on the other side which are arranged oppositely; an external air insulating member (300) surrounding the molding die and insulating the molding die from external air; a release film adsorption mechanism (220) which is connected to one or both of the mold (100) on the one side and the mold (200) on the other side and adsorbs a release film on the mold surface of the connected molds; and a pressurizing mechanism (400) for pressurizing a space surrounded by the external air insulating member (300) and pressurizing the release film in a direction of the mold surface to which the release film is adsorbed.)
1. A resin molding device is characterized by comprising:
a molding die having a die on one side and a die on the other side arranged opposite to each other;
an external air insulating member surrounding the molding die and insulating the molding die from external air;
a release film suction mechanism which is connected to one or both of the mold on the one side and the mold on the other side and sucks a release film on a mold surface of the connected molds;
and a pressurizing mechanism for pressurizing a space surrounded by the external air insulating member and pressurizing the release film in a direction of a mold surface on which the release film is adsorbed.
2. The resin molding apparatus as claimed in claim 1, wherein
The mold on one side is a mold for fixing a molding object,
the other mold is a mold in which a cavity is formed on the mold surface and the release film is adsorbed on the mold surface.
3. The resin molding apparatus as claimed in claim 2, wherein
The other side of the mould has a bottom part and a side part,
the cavity is formed by a space surrounded by the bottom surface member and the side surface member.
4. The resin molding apparatus as claimed in any one of claims 1 to 3, wherein the mold on the one side is an upper mold and the mold on the other side is a lower mold.
5. A method for peeling a release film, characterized in that the release film adhered to a molded resin and adsorbed on a mold surface of a mold is peeled from the molded resin in a state of being pressed in a direction of the mold surface.
6. The method for peeling off a release film as claimed in claim 5, wherein
The release film is a laminate of a plurality of films,
at least one of the plurality of films is peeled from the molded resin, and at least one of the plurality of films remains in close contact with the molded resin.
7. The method of releasing a release film according to claim 5 or 6, wherein the release film is at least one of a resin film, a metal foil, and a rubber sheet.
8. The method of peeling a release film according to claim 6, wherein each of the plurality of films is a metal foil.
9. A method for producing a resin molded article, comprising:
a mold release film adsorption step of adsorbing the mold release film to the mold surface of the molding die;
a resin molding step of molding a resin with the mold by the mold die in a state where the mold release film is adsorbed on the surface of the mold;
a release film peeling step of peeling the release film from the molded resin,
the release film peeling step is a step of peeling the release film from the molded resin by the release film peeling method according to any one of claims 5 to 8.
10. The method for producing a resin molded article according to claim 9, wherein
Performing the release film adsorption step, the resin molding step, and the release film peeling step using the resin molding apparatus according to any one of claims 1 to 4,
in the release film adsorption step, the release film is adsorbed to the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism,
in the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold with the release film being adsorbed,
in the release film peeling step, the space surrounded by the outside air blocking member is pressurized by the pressurizing mechanism, and the release film is peeled from the molded resin in a state where the release film is pressurized in a direction of a mold surface to which the release film is adsorbed.
Technical Field
The present invention relates to a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product.
Background
In resin molding using a mold, a mold release film may be adsorbed on a mold surface of the mold to perform resin molding (patent document 1 and the like). The release film is peeled from the resin molded product after the resin molding.
Disclosure of Invention
Problems to be solved by the invention
However, if the adhesion or adhesion between the release film and the resin after molding is too strong, the release film may be difficult to peel from the resin molded article. In such a case, there is a possibility that the release film remains in the resin molded product or the resin molded product is brought to the release film side instead. When such a problem occurs, a defective product, a stoppage of operation, deterioration of productivity, and the like may occur in the production of a resin molded product.
Accordingly, an object of the present invention is to provide a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product, which are capable of easily peeling the release film from the resin molded product.
Means for solving the problems
To achieve the object, a resin molding apparatus according to the present invention includes:
a molding die having a die on one side and a die on the other side arranged opposite to each other;
an external air insulating member surrounding the molding die and insulating the molding die from external air;
a release film suction mechanism which is connected to one or both of the mold on the one side and the mold on the other side and sucks a release film on a mold surface of the connected molds;
and a pressurizing mechanism for pressurizing a space surrounded by the external air insulating member and pressurizing the release film in a direction of a mold surface on which the release film is adsorbed.
The method for peeling off a release film according to the present invention is characterized in that the release film is adhered to a molded resin and adsorbed on a mold surface of a mold, and the release film is peeled off from the molded resin in a state of being pressed in a direction toward the mold surface.
The method for producing a resin molded article of the present invention is characterized by comprising:
a mold release film adsorption step of adsorbing the mold release film to the mold surface of the molding die;
a resin molding step of molding a resin with the mold by the mold die in a state where the mold release film is adsorbed on the surface of the mold;
a release film peeling step of peeling the release film from the molded resin,
the step of peeling the release film is a step of peeling the release film from the molded resin by the method of peeling the release film of the present invention.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product, which are capable of easily peeling a release film from a resin molded product, can be provided.
Drawings
Fig. 1 is a schematic view illustrating a structure of a resin molding apparatus according to the present invention.
FIG. 2 is a sectional view showing one step of an example of the method for producing a resin molded article according to the present invention.
Fig. 3 is a sectional view showing another step of the same method for manufacturing a resin molded article as in fig. 2.
Fig. 4 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 5 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 6 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 7 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 8 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
FIG. 9A is a photograph of a resin molded article obtained in example 2. Fig. 9(b) is a photograph of the copper laminate sheet peeled from the resin molded article of fig. 9 (a).
FIG. 10 is a photograph of a resin molded article obtained by a comparative example, and FIG. 10(a) is a drawing. Fig. 10(b), 10(c) and 10(d) are enlarged photographs of a part of the resin molded article of fig. 10 (a).
Detailed Description
The present invention will be described in further detail with reference to examples. However, the present invention is not limited to the following description.
In the resin molding apparatus of the present invention, for example, the one mold may be a mold to which a molding object is fixed, and the other mold may be a mold having a cavity formed in a mold surface and having the release film adhered to the mold surface. In this case, for example, the other mold may have a bottom member and a side member, and the cavity may be formed by a space surrounded by the bottom member and the side member.
In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold and the other mold may be a lower mold. For example, the mold on the one side may be a lower mold, and the mold on the other side may be an upper mold.
The resin molding apparatus of the present invention may be, for example, a compression molding apparatus, a transfer molding apparatus, an extrusion molding apparatus, or the like.
In the method for peeling off a release film according to the present invention, the release film may be at least one of a resin film, a metal foil, and a rubber sheet.
In the method for peeling off a release film according to the present invention, for example, the release film is a laminate of a plurality of films, and at least one of the plurality of films is peeled off from the molded resin, and at least one of the plurality of films remains in close contact with the molded resin. In this case, for example, the plurality of films may be all metal foils.
In general, a thin film is sometimes referred to as a "film" and a relatively thick film is sometimes referred to as a "sheet" to distinguish them from each other, but in the present invention, the "film" and the "sheet" are not distinguished from each other.
The method for producing a resin molded article of the present invention can be, for example,
the step of adsorbing the release film, the step of molding the resin, and the step of peeling the release film are performed using the resin molding apparatus of the present invention,
in the release film adsorption step, the release film is adsorbed to the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism,
in the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold with a release film being adsorbed,
in the release film peeling step, the space surrounded by the outside air blocking member is pressurized by the pressurizing mechanism, and the release film is peeled from the molded resin in a state where the release film is pressurized in a direction of a mold surface to which the release film is adsorbed.
The method of producing a resin molded article of the present invention is a process including the step of adsorbing the release film, the step of molding the resin, and the step of peeling the release film, as described above, but may include any other steps.
In the present invention, "resin molding" is not particularly limited, and may be, for example, a method of resin-sealing a component such as a chip, or may be a method of resin-molding only without resin-sealing. Similarly, in the present invention, the "resin molded article" is not particularly limited, and may be, for example, a resin molded article (product, semi-product, or the like) obtained by resin-sealing a component such as a chip, or may be a product, semi-product, or the like obtained by molding only a resin without resin-sealing. In the present invention, the "resin molded article" may be a resin molded article (product, semi-finished product, or the like) itself, or may be a resin molded article in the middle of a method for producing a resin molded article. For example, the "resin molded article" may be a resin molded article after the resin molding step is performed and before the mold releasing step is performed.
In the present invention, the "resin molding" may be, for example, resin molding of one or both surfaces of the object to be molded. However, the present invention is not limited to this, and for example, only resin molding may be performed without using a molding object. Further, for example, although the component such as the chip fixed to one or both surfaces of the object to be molded can be resin-sealed, only one or both surfaces of the object to be molded may be resin-molded without resin-sealing the component.
In the present invention, the "object to be molded" is, for example, a substrate.
In the present invention, the method of "resin molding" is not particularly limited as long as it is a method of resin molding using a release film, and may be compression molding, for example, but may also be transfer molding, extrusion molding, or the like.
In the present invention, "resin molding" means, for example, a state in which a resin is cured (hardened) to mold the cured resin. The hardness of the cured resin is not particularly limited, and may be, for example, a degree that the cured resin does not deform or a degree that is necessary for protecting a chip or the like sealed with the resin, and the magnitude of the hardness is not particularly limited. In the present invention, the curing (hardening) of the resin may be not limited to a state in which the resin is completely cured (hardened), but may be a state in which the resin is further curable.
In the present invention, "placing" also includes "fixing".
In general, "electronic component" refers to both a case of a chip before resin encapsulation and a case of a state in which the chip has been resin-encapsulated, but in the present invention, a case of simply referring to "electronic component" refers to an electronic component in which a chip is resin-encapsulated (electronic component as a finished product) unless otherwise specified. Specifically, the "chip" of the present invention includes, for example, chips of passive elements such as resistors, capacitors, and inductors, semiconductor chips such as diodes, transistors, Integrated Circuits (ICs), and semiconductor elements for power control, and chips such as sensors and filters. In the present invention, the resin-sealed component is not limited to a chip, and may be at least one of a chip, a lead, a bump, an electrode, a wiring pattern, and the like, or may include a component that is not chip-shaped.
The substrate (also referred to as a frame or an insert) as an object to be resin-molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a semiconductor wafer such as a silicon wafer, a ceramic substrate, a metal substrate, or the like, or may be, for example, a Circuit board (Circuit board) such as a printed Circuit board. When such a molding object is resin-molded, the resin molding may be particularly referred to as "resin sealing". In the present invention, "resin molding" includes "resin sealing", and for example, only one surface of the substrate may be resin molded, or both surfaces may be resin molded. The substrate may be, for example, a mounting substrate having a chip mounted on one or both surfaces thereof, or may be a substrate having only wiring. The method of mounting the chip is not particularly limited, but examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component having a chip encapsulated with a resin can be manufactured by resin-encapsulating one or both surfaces of a mounting substrate.
The use of the substrate to be resin-molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited. Examples of the applications of the substrate include a power control module substrate, a high-frequency module substrate for a mobile communication terminal, an engine control substrate for a transportation device or the like, a motor control substrate, a drive system control substrate, and the like. The shape of the substrate may be any shape or form as long as it can be molded, and for example, a substrate having a rectangular or circular shape in a plan view may be used.
In the present invention, the "resin molded article" is not particularly limited, and may be, for example, an electronic component in which a chip is resin-sealed by compression molding or the like. The "resin molded article" in the present invention may be an intermediate product used for manufacturing a single or a plurality of electronic components such as a semiconductor product and a circuit module, for example. In the present invention, the "resin molded article" is not limited to the electronic component in which the chip is resin-encapsulated and the intermediate product thereof, and may be other resin molded articles.
In the present invention, the resin material (resin used for resin molding) is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, the resin composition may be a composite material containing a part of a thermosetting resin or a thermoplastic resin. Examples of the form of the resin to be supplied to the resin sealing apparatus include granular resin, flowable resin, sheet resin, plate resin, and powdery resin.
In the present invention, the "fluid resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term "liquid" means a liquid that has fluidity at room temperature (room temperature) and flows by an applied force, and the magnitude of the fluidity, in other words, the degree of viscosity is not particularly limited. That is, in the present invention, the "liquid resin" refers to a resin that has fluidity at normal temperature (room temperature) and flows by an applied force. In the present invention, the "molten resin" refers to a resin that is in a liquid state by being heated and melted, and has fluidity. The form of the molten resin is not particularly limited, and may be, for example, a form that can be supplied to a cavity of a mold.
In the present invention, the molding die is not particularly limited, and may be, for example, a metal die, a ceramic die, or the like.
Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the drawings are schematically illustrated with appropriate omission, exaggeration, and the like.
[ example 1]
In the present embodiment, an example of the resin molding apparatus of the present invention, a method for peeling off a release film of the present invention using the same, and an example of a method for producing a resin molded product of the present invention are shown.
Fig. 1 schematically shows the structure of a resin molding apparatus according to the present embodiment. In this figure, the molding die and the external air insulating member are shown in a sectional view.
As shown in fig. 1, the resin molding apparatus includes a molding die, an outside
The
The
The
Through
The release
The outside
The resin molding apparatus of fig. 1 further includes a molding
The
Next, a method for producing a resin molded article and a method for peeling off a release film according to the present invention using the resin molding apparatus of fig. 1 will be described by way of example using schematic step cross-sectional views of fig. 2 to 8. In fig. 2 to 8, the same components as those in fig. 1 are denoted by the same reference numerals. However, for convenience of illustration, the shape and the like may be different from those of fig. 1. In fig. 2 to 8, for convenience of illustration, only a part of the mold (the
First, as shown in fig. 2, the
Next, as shown in fig. 3 to 4, a release film adsorption step is performed. First, as shown in fig. 3, the
Further, as shown by an
Then, as indicated by an
In this embodiment, the mold is preheated by a heater (not shown) provided inside the mold, and the resin material 20A starts to melt together with the
Next, as shown in fig. 5 to 8, a resin sealing step and a release film peeling step are performed. The step of peeling the release film is a step of peeling the release film from the molded resin by the method of peeling the release film of the present invention, as described above.
First, lower
Thereafter, as shown in fig. 6, the lower die holding member 210 (lower die 200) is further raised. Thereby, the
Further, as shown in fig. 7 to 8, the
First, as shown in fig. 7, the
After the completion of the solidification of the molten resin 20B, the valve V7 is closed, the valve V6 (see fig. 1) is opened, and as shown by an
The timing of starting the pressurization in the outside air insulation space S is not particularly limited as long as it is after the mold is closed. For example, the pressurization in the outside air insulation space S may be started simultaneously with completion of the solidification of the
Thereafter, as shown in fig. 8, the lower
At this time, the
The resin molding step and the release film peeling step are performed as described above, and the resin molded
When the release film is adsorbed to the mold surface of the mold only by adsorption by the decompression, the adsorption force is a pressure difference between the pressure in the decompressed through-
In this embodiment, the molding object is held by suction generated by pressure reduction in the mold, as well as being held by the clamp portion. When the molding object is large, the molding object is likely to be bent or wrinkled only when the end portion is clamped by the clamp portion, and therefore, suction by reduced pressure is often used. Although the suction force generated by the decompression of the molding object can be more firmly held in the molding die than in the case of merely clamping, the maximum suction force is about 1.013 × 10 in the case of the atmospheric pressure in the external air insulation space S as in the case of the release film5Pa. However, according to the present invention, the suction force of the object to be molded can be enhanced by setting the pressure (positive pressure) in the space S surrounded by the external air insulating member to a pressure higher than the atmospheric pressure, as in the case of the release film. As a result, the force for peeling the resin molded article from the release film is further increased, and therefore the resin molded article and the release film are more easily peeled. As a result, the molded object is not carried away by the lower mold during mold opening, and problems of mold release of the resin molded product, product failure, and the like can be suppressed or prevented.
In the present embodiment, as shown in fig. 1, the circuit (piping) for pressurizing the inside of the external air insulation space S also serves as a circuit (piping) 1006 for depressurizing the inside of the external air insulation space S. However, the present invention is not limited to this, and for example, a dedicated circuit (pipe) for pressurizing the inside of the outside air insulation space S may be separately provided.
The mechanism for holding (fixing) the substrate (object to be molded) on the upper mold is not particularly limited. The mechanism may be clamped, for example, only by the clamping portion, but preferably, as in the present embodiment, suction by reduced pressure is used. This increases the force for attracting the substrate, and also increases the force for peeling off the release film.
In the present embodiment, the upper mold is a mold for fixing a substrate (object to be molded), and the lower mold is a mold for sucking a release film. However, the present invention is not limited to this, and for example, the lower mold may be a mold for fixing a substrate (object to be molded) and the upper mold may be a mold for sucking a release film.
In recent years, the number of types of release films used for resin molding has increased. However, when the adhesion or adhesion between the release film and the resin is strong, there is a possibility that the release film remains in the resin molded article or the resin molded article remains on the side of the release film as described above. However, according to the present invention, such a problem of mold release can be suppressed or prevented.
Fig. 2 to 8 illustrate a case where the
[ example 2]
In recent years, a new molding technique has been required in which copper (Cu) foil or the like, which is a wiring material later, is added to the surface of a resin molded article at the same time as molding. In this case, for example, a laminate sheet, which is a laminate of a substrate and a copper foil, is used as a release film, and only the substrate is peeled off from the molded resin, and the copper foil remains in close contact with the molded resin. In this case, if the peel strength (adhesive force) between the substrate and the copper foil is larger than the suction force of the laminate to the mold surface of the mold, a problem may occur in the peeling between the substrate and the copper foil. However, even in this case, if the method of peeling off the mold release film according to the present invention is used, as described above, the suction force of the mold release film can be enhanced by pressurizing the space surrounded by the external air insulating member (inside the external air insulating space), and the force of pressing the mold release film against the mold surface side of the mold can be increased. Therefore, according to the present invention, the base material and the copper foil can be stably peeled. The base material is not particularly limited as long as it can form a laminate together with the copper foil, and for example, the base material may be a copper (Cu) foil. That is, the laminate sheet may be a laminate of a plurality of copper foils. As described above, each film in the laminate of the plurality of films is not limited to the copper foil and the like, and is arbitrary.
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