阅读说明：本技术 化学气相沉积设备 (Chemical vapor deposition apparatus ) 是由 丁欣 于 2018-09-11 设计创作，主要内容包括：本发明提供一种化学气相沉积设备。该设备包括反应腔,反应腔内包括多个用于承载衬底的基座,多个基座为圆盘形,工艺气体通过管路进入反应腔,多个基座中的每个基座彼此之间并列排布,各个基座的圆心在同一直线上；各个基座承载衬底的上表面彼此相互平行或在同一平面上；各个基座的转动轴线在同一平面上,各个基座相对于彼此独立地旋转；以及工艺气体沿各个基座的上表面,垂直于各个基座的各个圆心的连线方向流动。(The invention provides a chemical vapor deposition device. The equipment comprises a reaction cavity, wherein the reaction cavity comprises a plurality of bases for bearing substrates, the plurality of bases are disc-shaped, process gas enters the reaction cavity through a pipeline, the bases in the plurality of bases are arranged in parallel, and the circle centers of the bases are on the same straight line; the upper surfaces of the base bearing substrates are parallel to each other or on the same plane; the rotation axes of the bases are on the same plane, and the bases rotate independently relative to each other; and the process gas flows along the upper surface of each base and in a direction perpendicular to the connecting line of the circle centers of each base.)

1. A chemical vapor deposition device comprises a reaction chamber, wherein the reaction chamber comprises a plurality of bases for bearing substrates, the plurality of bases are disc-shaped, process gas enters the reaction chamber through a pipeline, and the chemical vapor deposition device is characterized in that,

each base in the plurality of bases is arranged in parallel, and the circle centers of the bases are on the same straight line;

the upper surfaces of the susceptors, which bear the substrates, are parallel to each other or on the same plane;

the rotation axes of the bases are on the same plane, and the bases rotate independently relative to each other; and the process gas flows along the upper surface of each susceptor in a direction perpendicular to a line connecting the centers of the circles of each susceptor.

2. The chemical vapor deposition apparatus according to claim 1, further comprising an inner box between the reaction chamber and the susceptor, the inner box having a shape including a rectangular parallelepiped; and

the reaction gas flows along the upper surface of the susceptor and in a direction relatively parallel to the upper surface and a short side of a rectangle in a cross section of the inner case.

3. The chemical vapor deposition apparatus of claim 1, wherein adjacent susceptors rotate in opposite directions to each other.

4. The chemical vapor deposition apparatus of claim 1, further comprising a mass flow meter that is common to the plurality of susceptors, the mass flow meter distributing the process gas to each of the susceptors; and

a regulating valve is provided on the line through which the process gas flows from the mass flow meter to the pedestal.

5. The chemical vapor deposition apparatus according to claim 1, further comprising a transfer chamber and a mechanical transfer arm, wherein the transfer chamber is polygonal, at least one side of the transfer chamber is provided with a transfer station for the substrate, and the other sides are provided with the reaction chamber; and

the mechanical transfer arm is positioned in the transfer chamber and transfers the substrate to the plurality of susceptors of the reaction chamber.

6. The chemical vapor deposition apparatus of claim 5, wherein the mechanical transfer arm is further configured to move along a line parallel to the center of each of the plurality of susceptors in the reaction chamber.

7. The chemical vapor deposition apparatus of claim 1, wherein a susceptor extension is filled between each of the susceptors, the material of the susceptor extension is the same as that of the susceptor, and the upper surface of the susceptor extension is coplanar with that of the susceptor.

8. The chemical vapor deposition apparatus of claim 7, wherein the upper surface of the susceptor extension portion comprises one or more of a shield, a protrusion, a recess, a guide fin, an anchor point.

9. The chemical vapor deposition apparatus of claim 7, wherein the upper surface of the susceptor extension portion and the upper surface of the susceptor have a height difference, and the height difference is adjustable manually or automatically by a mechanical structure.

10. The chemical vapor deposition apparatus of claim 2, wherein the inner box is made of a non-metallic high temperature and corrosion resistant material.

11. The chemical vapor deposition apparatus of claim 2, wherein a heat generating body is disposed between the reaction chamber and the inner box, the heat generating body comprising an infrared lamp source, a resistive heater, the resistive heater comprising a metal or graphite resistive heater.

12. The chemical vapor deposition apparatus of claim 11, wherein the metal resistive heater or the graphite resistive heater is driven by rf exciting the metal or the graphite with an induction coil to generate heat.

13. The chemical vapor deposition apparatus of claim 11, wherein the resistive heater is in the form of a spiral.

14. The chemical vapor deposition apparatus of claim 11, wherein the resistive heater further comprises at least one of:

a ring heater centered at the center of the circle of the base;

an arc-shaped heater taking the circle center of the base as a center;

the point-like heaters are distributed on a plurality of rings taking the circle center of the base as the center, or are distributed in a honeycomb manner by taking the circle center of the base as the center;

the wire heaters are vertically or parallelly distributed on the circle center connecting line of the base, or are distributed along the radial direction of the base.

15. The chemical vapor deposition apparatus according to claim 11, wherein a heat insulating material is provided between the exothermic body and the reaction chamber, the heat insulating material being a high emissivity material or a high reflectivity material.

Technical Field

The invention relates to the field of chemical vapor deposition, in particular to chemical vapor deposition equipment.

Background

Chemical Vapor Deposition (CVD) is a widely used thin film growth technique in the fields of semiconductors and flat panel displays. Vapor deposition techniques have a relatively low growth rate. Meanwhile, a large amount of non-metallic graphite, quartz, ceramic and other materials are used for manufacturing parts of the metal reaction cavity due to high reaction temperature. Limited by the processing techniques of such materials, the cost of such reaction chamber components is very high, resulting in high cost of film formation.

Disclosure of Invention

In order to solve the above problems, the present invention provides a novel chemical vapor deposition reaction apparatus with high sheet (substrate) throughput, high throughput, and high film formation uniformity.

According to one aspect of the invention, the chemical vapor deposition equipment comprises a reaction cavity, wherein the reaction cavity comprises a plurality of bases for bearing substrates, the plurality of bases are disc-shaped, process gas enters the reaction cavity through a pipeline, the bases are arranged in parallel, and the circle centers of the bases are on the same straight line;

the upper surfaces of the bearing substrates of the susceptors are parallel to each other or on the same plane;

the rotation axes of the bases are on the same plane, and the bases rotate independently relative to each other; and

the process gas flows along the upper surface of each susceptor in a direction perpendicular to a line connecting the centers of the respective susceptors.

Further, an inner box is arranged between the reaction cavity and the base, and the shape of the inner box comprises a cuboid; and a reaction gas flowing along the upper surface of the susceptor in a direction relatively parallel to the upper surface and a shorter side of the rectangle sectioned by the cross section of the inner case.

Further, the adjacent susceptors rotate in opposite directions to each other.

Further, the chemical vapor deposition apparatus further includes a mass flow meter using a common mass flow meter for the plurality of susceptors, the mass flow meter distributing the process gas to each of the susceptors; and arranging a regulating valve on a pipeline for the process gas to flow from the mass flow meter to the base.

Furthermore, the chemical vapor deposition equipment also comprises a transmission cavity and a mechanical transmission arm, wherein the transmission cavity is polygonal, at least one side of the transmission cavity is provided with a transfer station of the substrate, and the rest sides are provided with reaction cavities; and a mechanical transfer arm positioned in the transfer chamber for transferring the substrate to the plurality of susceptors of the reaction chamber.

Further, the mechanical transfer arm is configured to move along a line parallel to the respective centers of the circles of the respective susceptors in the reaction chamber.

Furthermore, base extension parts are filled among the bases, the material of the base extension parts is the same as that of the bases, and the upper surfaces of the base extension parts and the upper surfaces of the bases are in the same plane.

Further, the upper surface of the base extension includes one or more of a shield, a protrusion, a recess, a guide fin, and an anchor point.

Further, the upper surface of the base extension part and the upper surface of the base have a height difference, and the height difference can be manually or automatically adjusted through a mechanical structure

Further, the inner box is made of a non-metal high-temperature-resistant and corrosion-resistant material.

Furthermore, a heating body is arranged between the reaction cavity and the inner box, the heating body comprises an infrared lamp source and a resistance type heater, and the resistance type heater comprises a metal or graphite resistance type heater.

Furthermore, the driving mode of the metal resistance type heater or the graphite resistance type heater also comprises the step of exciting metal or graphite by radio frequency of the induction coil so that the metal resistance type heater or the graphite resistance type heater generates heat.

Further, the resistive heater is spiral-shaped.

Further, the resistive heater further comprises at least one of:

a ring heater centered at the center of the base;

an arc heater using the center of the circle of the base as the center;

the point heaters are distributed on a plurality of rings taking the circle center of the base as the center or distributed in a honeycomb manner by taking the circle center of the base as the center;

and the wire heaters are vertically or parallelly distributed on the connection line of the circle centers of the bases, or the wire heaters are distributed along the radial direction of the bases.

Further, a heat insulating material is provided between the heating element and the reaction chamber.

Compared with the prior art, the implementation mode of the invention has the main differences and the effects that:

the chemical vapor deposition apparatus of the embodiment of the invention arranges two to more disk susceptors at low cost, and the disk susceptors can share a gas flow controller or fewer heaters through pipelines. The cost of the reaction cavity and other equipment matched with the reaction cavity can be greatly reduced while more disc bases are subjected to film formation; thereby reducing the manufacturing cost of the whole set of equipment. Meanwhile, the consumption of reaction gas, heating energy and the like is reduced, so that the consumption of film-forming consumables is reduced. And the film forming uniformity same as that of a single-piece disc base can be achieved while realizing the low-cost proposal.

Drawings

FIG. 1 shows a top view of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 2 is a schematic connection diagram of a mass flow meter of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 3 is a schematic vertical sectional view showing a shape and arrangement of a heat generating body of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 4 is a schematic top view showing a shape and arrangement of a heat generating body of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 5 is a schematic top view of another heater of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 6 is a schematic vertical sectional view showing the shape and arrangement of another heater of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 7 is a schematic top view of another heater of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 8 is a schematic view showing a configuration of an arc-shaped heat generating body of the chemical vapor deposition apparatus according to the embodiment of the present invention.

FIG. 9 shows a schematic view of a complete disk spiral heater of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 10 shows a sectioned schematic view of a complete disk spiral heater of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 11 is a schematic view illustrating a chemical vapor deposition apparatus according to an embodiment of the present invention in which an insulated container is provided between a heat source and a reaction chamber.

FIG. 12 is a schematic view illustrating a thermal insulation layer disposed between a heat source and a reaction chamber in a chemical vapor deposition apparatus according to an embodiment of the present invention.

Fig. 13 is a schematic view showing an in-line configuration of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 14 is a schematic view showing another line configuration of a chemical vapor deposition apparatus according to an embodiment of the present invention.

FIG. 15 shows a simplified three-dimensional schematic view of a chemical vapor deposition apparatus according to an embodiment of the invention.

FIG. 16 shows a schematic view of a chemical vapor deposition system according to an embodiment of the invention.

Detailed Description

In order to make the purpose and technical solution of the embodiments of the present invention clearer, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.

In the present invention, the reaction chamber includes a metallic vacuum, low pressure, normal pressure or high pressure vessel, and also includes the above-mentioned vessels and nozzles for producing a material suitable for thermal chemical vapor deposition, graphite susceptor, quartz or ceramic parts, heating devices, and the like. In a broader sense, the reaction chamber may also include piping, valves, mass flow meters, electrical circuits, etc. for supplying the reaction gas, and the present invention is not limited thereto.

In the present invention, the susceptor is typically made of a high temperature resistant material such as metal, ceramic, quartz, high purity graphite, or carbide coated graphite, and the like. The susceptor may comprise a rotatable disk carrying a silicon wafer or other substrate, or may comprise a rotatable disk carrying a silicon wafer or other substrate and other non-rotatable portions outside the disk.

Fig. 1 shows a top view of a chemical vapor deposition apparatus according to an embodiment, in which 101 is a substrate to be processed, 102 is a disk susceptor, 103 is a susceptor extension, 104 is an inner box, and 105 is a reaction chamber.

According to embodiments of the present invention, a plurality of disc bases 102 may be juxtaposed. The disk base 102 accommodates a substrate 101 having a diameter of 100mm, 150mm, 200mm, 300mm, 450mm, or the like. In some cases, the substrate 101 may also be a square (rectangular or square) piece. The substrate 101 material may be metal, glass, quartz, silicon, germanium, sapphire, aluminum nitride, gallium arsenide, silicon carbide, graphene, or the like.

As an example, the disk base 102 typically has a diameter 1.1 to 1.5 times the diameter of the substrate 101. Typically smaller substrates 101 may also be placed on a larger puck base 102. For example, the 150mm substrate 101 may be placed on a 200mm compliant base, or the 200mm substrate 101 may be placed on a 300mm base, with a recess of suitable shape being cut into the larger base.

According to the embodiment of the invention, the centers of the disk bases 102 are on the same straight line, and the upper surfaces of the disk bases 102 (or the substrates 101 placed on the surfaces of the bases) are on the same plane; or the surfaces on the disk bases 102 (or of the substrate 101) are parallel to each other, and the rotation axes of the disk bases 102 are on the same plane. The individual disk bases 102 rotate at their respective centers. The reaction gas or the process gas flows along the surface of the disk susceptor 102 (or the substrate 101) in a vertical direction along a line connecting the centers of the circles of the disk susceptor 102.

As another example, when the number of the disk bases 102 is greater than three, the center of one of the three or more disk bases 102 is allowed to be slightly deviated from the line connecting the centers of the other disk bases 102. Since a slight deviation does not have a large influence on the process performance, i.e., the uniformity of film formation. Deposited films include silicon, germanium, sapphire, silicon oxide, silicon nitride, aluminum nitride, gallium arsenide, silicon carbide, graphene, and the like.

As shown in fig. 1, adjacent disk bases 102 may rotate in the same direction or in opposite directions. The rotational speed is in the range of 0-60 RPM. Preferably in opposite directions, when adjacent disk bases 102 are rotated in opposite directions, for example, a disk base 102 rotating clockwise is adjacent to a base rotating counterclockwise, and vice versa a disk base 102 rotating counterclockwise is adjacent to a base rotating clockwise. The linear velocities of the adjacent edge portions of the adjacent disk bases 102 at this time are directed in parallel in the same direction, so that disturbance of the reaction gas can be minimized and a good laminar flow can be maintained.

Further, in the extended plane of the upper surface of these disk bases 102, a gap not covered by the disk bases 102 is provided. To maintain a uniform temperature distribution, the voids may be covered with a planar member formed of the same or similar material as the disk base 102. We refer to the part covering these voids as the base extension 103. The upper surfaces of these component(s) are coplanar with the upper surface of the small disk susceptor 102 (substrate 101) or have at most a slight height difference during processing in the reaction chamber 105. Because a small height difference does not have a great influence on the process performance, namely the uniformity of film formation, and the gas flow rate of the reaction chamber 105 can be controlled by adjusting the height difference, the method is a possible process adjusting means and can realize manual or automatic adjustment through a mechanical structure. Not shown in fig. 1, but the surface of the susceptor extension 103 may be provided with masks, protrusions, depressions, guide fins, positioning points (blocks), etc. designed based on process requirements, which may serve to adjust the distribution of gas, temperature, etc. in the reaction chamber 105 to help improve film formation uniformity.

Next, fig. 2 shows a schematic connection diagram of the mass flow meter, wherein 301 is a gas source (gas cylinder, gas holder, etc.) for providing process gas, 302 is a mass flow meter for controlling the flow rate of gas, and 303 is a throttle valve. As shown in fig. 2, a common mass flow meter 302 may be used for a plurality of disk susceptors 102 or for several disk susceptors 102 in a plurality of disk susceptors 102, and the gas flowing out of the same mass flow meter 302 is uniformly distributed to each disk susceptors 102 through the upper surface thereof by a gas pipe to perform a process, so as to ensure uniformity of film formation. Since the influence of the gas piping flowing into the respective disk bases 102 after the mass flow meter 302 may slightly differ on the gas flow rate, etc., regulating valves, for example, a throttle valve 303 may be provided on the respective piping before entering the respective disk bases 102 after the mass flow meter 302, the throttle valve 303 may be a manual needle valve or an actuated throttle valve, and the throttle valve 303 is used to compensate for a deviation generated on the piping after the flow meter to compensate for the uniformity of the final film formation. Alternatively, more throttle valves may be additionally designed in the cross-section of each disk base 102 to divide the process gas flow through a single disk base 102 (substrate 101) into more zones to be independently controlled.

According to embodiments of the present invention, the disk base 102 or the like may be disposed within a metal, such as a sealed container made of stainless steel or aluminum. In some cases, the inside of the metal-made closed container is also referred to as a reaction chamber 105. The short side of the inner wall of the reaction chamber 105 is 125mm-810mm, the long side is about integral multiple of the length of the short side, and the multiple is the number of the disc bases 102. The reaction chamber 105 is isolated from the outside by a flange, a valve at the flange, etc., cooling water, etc. are introduced into the reaction chamber 105 through a pipe, a process gas is introduced into the reaction chamber 105 through a nozzle, a power source is introduced into the reaction chamber through an electrode, a driving shaft of the disk base 102, etc., to provide a process environment or conditions required for chemical vapor deposition. In this reaction chamber 105, a rectangular parallelepiped or a similar rectangular parallelepiped is designed, for example, an inner box 104 having a basic shape of opening, step, and arch-shaped upper surface for resisting gas pressure or connecting other shape components. The inner case 104 may internally house the disk base 102 and the base extension 103. Similarly, the inner box 104 is isolated from the outside by a flange, a valve at the flange, etc., cooling water, etc., are supplied to the inner box 104 through a pipe, process gas is supplied through a nozzle, and power is supplied to the inner box 104 through an electrode and a driving shaft of the disk base 102, etc.

In the inner cassette 104, the reaction gas flows in a direction parallel to the plane of the surface of the disk base 102 (substrate 101) and the short side of the rectangle in the cross section of the inner cassette, or in a direction perpendicular to the line connecting the centers of the circles of the disk bases 102 along the surface of the disk base 102 (substrate 101).

Since the inner box 104 is exposed to high temperatures and potentially corrosive process gases, the inner box 104 is typically fabricated from non-metallic, high temperature and corrosion resistant materials such as quartz, glass, ceramic, graphite, coated graphite, and the like.

A heating element (heat source) is disposed between the reaction chamber 105 and the inner box 104 for heating the substrate 101 to a desired reaction/process temperature, wherein the process temperature range of the substrate 101 is 100-2800 ℃. The heating body can be an infrared lamp source, a metal or graphite or a coating graphite resistance type heater. The graphite or coating graphite or metal resistance type heating can be directly connected with a power supply, and the graphite or metal can be excited by using induction coil radio frequency and the like to generate heat. The heat-generating body may directly or indirectly heat the substrate 101. Such as infrared radiation, may be directed through the inner box 104, which is made of quartz, to directly heat the disk base 102 and the substrate 101. When the material of the inner box 104 exhibits strong infrared radiation absorption properties, the ceramic or graphite-coated inner box 104 is heated in an indirect manner, and after the inner box 104 absorbs the heat radiated by the resistive heater, heat is radiated again toward the disk base 102 to heat the disk base 102 and the substrate 101.

Referring to fig. 3 to 10, the shape and arrangement of the heat generating body (heat source) in the embodiment of the present invention are described.

In one example, the top line heat source is combined with the bottom arc heat source, the shape and arrangement of the heating element (heat source) are as shown in fig. 3 and 4, the heating element 201 is a line heater perpendicular to or parallel to the line connecting the centers of the circles of the disk bases 102, i.e., an elongated heat source, and 203 is a point heat source or a smaller line or plane heat source. The heating element 202 is a ring-shaped heater centered at the center of the disk base 102, or a segment of an arc-shaped heater (heat source) or a complete disk-shaped heater, for example, a heater including a spiral line, on the ring.

In the above-described exemplary variation, the top linear heat source is combined with the bottom radial linear heat source, and the shape and arrangement of the heat generating bodies (heat sources) are as shown in fig. 5, wherein the heat generating bodies 204 are linear heaters, i.e., short strip-shaped heat sources, radial to the disk base 102.

In another example, the top line heat source and the bottom line heat source are perpendicular to each other, and the shape and arrangement of the heat generating body (heat source) are as shown in fig. 6 and 7, in which the heat generating body 205 is a line heater (i.e., an elongated heat source) perpendicular to the line connecting the centers of the circles of the disk bases.

According to the embodiment of the present invention, the heat-generating body 202 may be any one or a combination of plural kinds of ring heaters as shown in fig. 8 to 10. The heat generating body may be an arc on a circle centered on the center of the disk base 102 as shown in fig. 8.

As another example, as shown in fig. 9, the heating element has a spiral shape, and the spiral forms a circular ring or a complete circle, and the center of the circular ring or the circle is the same as the center of the disc base 102. Further, as shown in fig. 10, 201-1 is the outermost toroid-shaped spiral resistance heater, 202-2 is the inner smaller toroid-shaped spiral heater, and 202-3 is the center smaller disc-shaped spiral heater, such that 202-1, 202-2, 202-3 divides the complete disc-shaped heater into two toroids and a central small disc-shaped heater, wherein each heater is independently controlled to achieve zonal control of the temperature of the disc substrate.

Wherein the spiral resistance heater has a great effect on higher temperature processes. Because of the high temperature process, it is common practice to use graphite or graphite coated materials for making resistive heaters. Since graphite heaters are typically cut directly from a large block of graphite material, and graphite lacks flexibility, it is difficult to form a structure similar to a spring to absorb the stress caused by thermal expansion during temperature rise. The graphite can be cut by a simple machine tool to form a spiral line structure. The spiral line structure can be simply analogized to a circumference with gradually enlarged radius from the center; compared with a true circle, the helical structure can obtain 10 times or even more of the circumference length; and stress can be uniformly released to each length of the spiral line when thermal expansion occurs, thereby minimizing stress per unit length. Thereby improving the service life of the heater, improving the stability of the equipment and reducing the cost.

In addition, the heating element may be a point heat source or a smaller line or plane heat source distributed on a plurality of rings with the center of the circle of the disc base 102 as the center, or the heating element may be a point heat source distributed in a honeycomb manner with the center of the circle of the disc base 102 as the center, which is not limited by this method.

Further, the heating elements may be connected in series or in parallel as necessary. After the plurality of heaters are connected in series and in parallel, the heaters are separately and independently controlled with other heaters connected in series and in parallel, so that the temperature on the disc base 102 is controlled in a partitioning manner, and better film forming uniformity is realized.

Specifically, a single wire heater parallel to the connection line of the centers of the circular bases 102 can heat two bases at the same time, and the same power supply, for example, a thyristor or an IGBT power module is used for control, so that the manufacturing cost of the heater can be reduced. For a line heater perpendicular to the connection line of the circle centers of the disc bases 102 and other centrosymmetric heating elements (heat sources), the line heater and other centrosymmetric heating elements can be connected in series or in parallel with the heating elements of the corresponding part of the other disc base 102 and controlled by the same heating power supply, so that the manufacturing cost of the heating power supply can be effectively reduced, and meanwhile, good film forming uniformity can still be obtained.

The arrangement of the above-mentioned heaters, in several combinations, is described as follows:

a wire heater (i.e., a long strip of heat source) is used. Wherein, a line heater parallel to the connecting line of the circle centers of the disc bases 102 is arranged above the disc, and a line heater vertical to the connecting line of the circle centers of the disc bases 102 is arranged below the disc. Or on the contrary, a line heater perpendicular to the line connecting the centers of the circle of the disc base 102 is arranged above the disc, and a line heater parallel to the line connecting the centers of the circle of the disc base 102 is arranged below the disc. Point heaters (point-like heat sources) or ring heaters are arranged at other positions to supplement and regulate line heaters (i.e. long heat sources). Or a line heater parallel to the line connecting the centers of the circle of the disc bases 102 is arranged above the disc, and a point heater (point-shaped heat source) or a ring-shaped heat source is arranged below the disc. Or interchanged.

The heat of the heater may be directed through an inner box 104, such as a quartz inner box, to heat the disk base 102 and the substrate 101; it is also possible to indirectly heat the inner casing 104, for example, an inner casing of coated graphite material, and then indirectly heat the disk base 102 and the substrate 101 by radiation from the inner casing 104. When the reaction gas flows across the heated substrate surface, the reaction gas can form a film on the substrate surface, i.e. chemical vapor deposition occurs.

It can be understood that the temperature of the substrate can be detected by temperature measuring devices such as infrared sensors or thermocouples, and the power of different heating bodies/heat sources can be controlled according to the process requirements, i.e. the temperature of the substrate is uniform by zone control.

According to an embodiment of the present invention, as shown in fig. 11 and 12, a high reflectivity (reflectivity) or high emissivity (emissivity) material 208, such as an oxide, nitride or carbide material of sintering or other forming process, such as a gold-plated plate, can be disposed between the heater and the reaction chamber 105, and these materials can block heat radiation, reduce energy consumption, and reduce the temperature of the surface of the metal reaction chamber 105 for protection. Wherein figure 11 is a fully wrapped, hermetically sealed reflector box 208. Fig. 12 shows two sheets 208 disposed only on the top and bottom two large surface area sides. The material with high reflective index can be a single sheet, such as a thin sheet before the reaction chamber 105, or a plurality of thin sheets can be combined to cover different planes or areas; or may be a complete closed container similar to the inner box 104 or the reaction chamber 105, or a material with high reflective index may be attached to the inner surface of the reaction chamber 105 (metal container) or the outer surface of the inner box 104 by spraying, depositing, attaching, or the like.

Fig. 13 and 14 show configurations of the pipeline of the present invention, according to an embodiment of the present invention. In fig. 12 and 13, 401 is a mechanical transfer arm for transferring a substrate, 402 is a cassette for storing a substrate, and 403 is a guide rail for linear movement of the mechanical transfer arm.

As an example, polygonal transfer chambers may be provided, the polygons being 3, 4, 5, 6, 7 or at most 8-sided. The reaction chambers 105 of the aforementioned plurality of disk susceptors 102 are provided on each of the remaining sides of the polygon, except for one or both sides of the polygon as transfer stations for transferring the substrates 101 outward from the system. The mechanical transfer arm 401 is located at the center point of the polygon, the mechanical transfer arm 401 can rotate 360 degrees around the center of the polygon, and the mechanical transfer arm 401 can simultaneously move back and forth in the radial direction. The mechanical transfer arm 401 extends in the radial direction to go deep into the disk base 102 on each side of the polygon to transfer the substrate 101, and then rotates to a position (side) on the polygon where the reaction chamber 105 of the disk base 102 is not disposed to transfer the substrate 101 out of the system, or conversely, from the outside to the disk base 102 in the reaction chamber 105 through the polygonal transfer chamber.

As shown in fig. 13, the transfer chamber has a quadrilateral shape, a mechanical transfer arm 401 is provided at the center thereof, three sides thereof are provided with the reaction chamber 105 having the double disk base 102, and the fourth side is provided with the cassette 402 for transferring the substrate 101 stored in the cassette 402 by the mechanical transfer arm 401 into the reaction chamber 105 or from the reaction chamber 105 to the cassette 402.

As shown in fig. 14, the centers of the plurality of disk bases 102 are located on the same straight line as described above. A robot transfer arm 401 is disposed at one side of the disk bases 102, the base of the robot transfer arm 401 being movable along a line parallel to the center of the disk bases 102, and an arm on the base of the robot transfer arm being movable along a line parallel to the center of the disk bases 102 to place the substrate 101 on the disk base 102 or to transfer the substrate 101 out of the reaction chamber 105 before moving to each disk base 102. Cassette 402 may also be located on the other side of mechanical transfer arm 401 relative to disk base 102, or may be located on both ends of mechanical transfer arm 401.

A chemical vapor deposition process system including a chemical vapor deposition apparatus according to an embodiment of the present invention will be briefly described with reference to fig. 15 and 16. FIG. 15 is a three-dimensional model created when designing an embodiment of the present invention. The output from the three-dimensional model to FIG. 15 is simplified, and only the reaction chamber 105, the substrate 101, the disk base 102, the base extension 103, and the rotation mechanism of the disk base are output.

FIG. 16 shows a schematic connection diagram of a chemical vapor deposition process system. 501, a control unit of the device comprises an industrial personal computer, a single chip microcomputer, a programmable PLC, an Ethernet controller, an image man-machine interface and the like, and controls other units such as a reaction cavity and the like; 502 is a gas module, including a gas holder, a mass flow meter, various gas circuit valves, a gas distributor, etc.; 503 is a mechanical control unit for rotating and lifting the base; 504 is a substrate handling system, such as a robot, cassette control system, etc.; 505 is a heater power supply silicon controlled rectifier or IGBT or other power module, a temperature measurement sensor, a temperature control algorithm unit and the like; and 506 is other auxiliary units such as safety interlocks, control mechanisms for pumps (under reduced pressure process), heat sinks, etc.

In summary, the present invention can arrange two or more disk susceptors at low cost, and the gas flow controller or less heaters can be shared between the disk susceptors through a pipeline. The film forming device can form films on a plurality of disc bases and simultaneously greatly reduce the cost of a reaction cavity, a gas control loop, a heater power supply, a substrate conveying system and the like which are matched with the reaction cavity; thereby reducing the manufacturing cost of the whole set of system equipment. Meanwhile, the consumption of reaction gas, heating energy and the like is reduced, so that the consumption of film-forming consumables is reduced. And the film forming uniformity same as that of a single-piece disc base can be achieved while realizing the low-cost proposal.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be interpreted as reflecting an intention that: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.

Those skilled in the art will appreciate that the modules in the device in an embodiment may be adaptively changed and disposed in one or more devices different from the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed first terminal device. In the unit claims enumerating several terminal devices, several of these terminal devices may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope being indicated by the following claims, along with the full scope of equivalents to which such claims are entitled. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.