阅读说明：本技术 一种用于印刷线路板的***式油墨加工工艺 (Processing technology of seal type ink for printed circuit board ) 是由 韩少华 王健 孙彬 沈洪 李晓华 于 2019-11-20 设计创作，主要内容包括：本发明公开了一种用于印刷线路板的印章式油墨加工工艺,涉及印刷油墨技术领域,包括以下步骤：Sp1：根据印刷线路板的油墨印刷区域,对印章头进行指定区域开窗；Sp2：在印章头内部设有盛装油墨装置,并且可以利用装置中的压力系统,对每次印刷使用的油墨量得到了严格的控制。利用指定的压力,使每次印刷流出指定量的油墨；本发明通过采用印章式加工工艺,每次印刷流出的油墨是定量的,并对整个印章头进行施加均匀压力,这样就保证了油墨厚度的均匀性,印章头有储存油墨的位置,使油墨隔绝了空气,减少了油墨凝固,可以采用多个印章头同时下降,进行印刷产品,可大幅度提升生产效率,可做到多种厚度,提高弯折能力。(The invention discloses a processing technology of seal type ink for a printed circuit board, which relates to the technical field of printing ink and comprises the following steps: sp 1: windowing a designated area of the stamp head according to an ink printing area of the printed circuit board; sp 2: the ink container is arranged in the seal head, and the pressure system in the ink container can be utilized to strictly control the amount of ink used in each printing. Using a specified pressure to make ink flow out in a specified amount in each printing process; by adopting the seal type processing technology, the ink flowing out in each printing is quantitative, and uniform pressure is applied to the whole seal head, so that the uniformity of the thickness of the ink is ensured, the seal head has a position for storing the ink, the ink is isolated from air, the ink solidification is reduced, a plurality of seal heads can be simultaneously lowered to print products, the production efficiency can be greatly improved, various thicknesses can be realized, and the bending capability is improved.)

1. A stamp type ink processing technology for a printed circuit board is characterized by comprising the following steps:

sp 1: windowing a designated area of the stamp head according to an ink printing area of the printed circuit board;

sp 2: the ink container is arranged in the seal head, and the pressure system in the ink container can be utilized to strictly control the amount of ink used in each printing. Using a specified pressure to make ink flow out in a specified amount in each printing process;

sp 3: applying pressure to the whole stamp head to enable the stamp head to descend, and printing ink on a circuit board;

sp 4: heating and curing the printing ink;

sp 5: a plurality of stamp heads are used for printing simultaneously, a plurality of jointed board products are carried at one time, and the production efficiency can be improved.

2. The process of claim 1, wherein the ink has a thickness in the range of 5um to 50 um.

3. A process of manufacturing a stamp-type ink for printed circuit boards according to claim 2, wherein the thickness tolerance of the ink is ± 5 um.

4. A process of manufacturing a stamp-type ink for printed circuit boards according to claim 1, wherein the positional tolerance of the ink is within ± 50 um.

5. A process of stamping ink for printed circuit boards as claimed in claim 1 wherein the ink is of the solid or liquid ink type.

Technical Field

The invention relates to the technical field of printing ink, in particular to a processing technology of seal type ink for a printed circuit board.

Background

The modern social science and technology is changed day by day, the thought of people is changed rapidly, from the existence of no electronic product in life to the ubiquitous electronic product in life, along with the increase of the usage amount of the electronic product by people, the electronic industry is developed rapidly, the subsequent printed circuit board industry is also developed rapidly, the production with high efficiency, high quality and low cost is the target of the printed circuit board industry, the printed circuit board is an important electronic component, is a support body of the electronic component and is a carrier for the electrical connection of the electronic component. Because it is made by adopting electronic printing technique, so it is called as printed circuit board, at present, the most widely used technique is to print the ink placed on the printing screen on the circuit board by using the force of scraper, the basic operation steps are that the screen manufacturer can draw the corresponding pattern on the screen according to the provided pattern, so as to make it possible to leak the ink in the designated area; installing a printing screen on a machine table; adding the diluted, proportioned and stirred ink onto a screen plate of a machine table; and scraping the ink by a scraper to enable the ink to be printed in a specified area of the circuit board, baking after printing is finished, and solidifying the ink.

However, the current printing ink technology is influenced by the screen mesh number, the scraper hardness, the scraper angle and other factors, the thickness of the printing ink cannot be thinner, the service life of the screen is limited, a new screen needs to be maintained and purchased regularly, manpower and capital are consumed, the cost is increased, the printing ink needs to be placed on the screen and exposed in the air during printing, drying is accelerated, the condition of screen blocking is easily caused, the production efficiency is reduced, the cost is increased, the pressure and the angle of the scraper are difficult to control, the conditions of uneven color, uneven thickness and the like are often caused, overflow is easily caused at the edge of the printing ink, and the machine is lifted to finish printing.

Disclosure of Invention

The invention aims to provide a seal type ink processing technology for a printed circuit board, and aims to solve the problems that the existing printing ink technology is influenced by factors such as screen mesh number, scraper hardness, scraper angle and the like, the ink thickness cannot be thinner, the service life of a screen is limited, a new screen needs to be maintained and purchased periodically, manpower and capital are consumed, the cost is increased, the ink needs to be placed on the screen and exposed in the air during printing the ink, drying is accelerated, the condition of screen blocking is easy to generate, the production efficiency is reduced, the cost is increased, the pressure and the angle of a scraper are difficult to control, the conditions of uneven color, uneven thickness and the like are often caused, overflow is easy to generate at the edge of the ink, and printing is finished by lifting a machine table.

In order to achieve the purpose, the invention provides the following technical scheme:

a processing technology of seal type ink for a printed circuit board comprises the following steps:

sp 1: windowing a designated area of the stamp head according to an ink printing area of the printed circuit board;

sp 2: the ink container is arranged in the seal head, and the pressure system in the ink container can be utilized to strictly control the amount of ink used in each printing. Using a specified pressure to make ink flow out in a specified amount in each printing process;

sp 3: applying pressure to the whole stamp head to enable the stamp head to descend, and printing ink on a circuit board;

sp 4: heating and curing the printing ink;

sp 5: a plurality of stamp heads are used for printing simultaneously, a plurality of jointed board products are carried at one time, and the production efficiency can be improved.

As a further scheme of the invention: the thickness range of the ink is 5um-50 um.

As a further scheme of the invention: the thickness tolerance range of the ink is +/-5 um.

As a further scheme of the invention: the position tolerance range of the ink is +/-50 um.

As a further scheme of the invention: the type of ink is solid or liquid ink type.

Compared with the prior art, the invention has the beneficial effects that:

the invention adopts the seal type processing technology, the ink flowing out each time of printing is quantitative, and the uniform pressure is applied to the whole seal head, thus the uniformity of the thickness of the ink and the uniformity of the color of the ink are ensured, the seal type processing method is adopted, the seal head has the position for storing the ink, the ink is isolated from the air, the solidification of the ink is reduced, the ink windowing size of the seal head can be designed according to the sizes of different splicing plates, the processing technology is suitable for products with various widths and models, a plurality of seal heads can be simultaneously lowered for printing the products, the production efficiency can be greatly improved, the thickness of the ink can be controlled by the pressure of the pressure plug, the various thicknesses can be realized, the bending capability is improved, and the requirement of customers is met.

Drawings

FIG. 1 is a schematic illustration of a single stamp head printing in accordance with the present invention;

FIG. 2 is a schematic representation of the ink of the present invention prior to transfer;

FIG. 3 is a schematic illustration of an ink transfer process according to the present invention;

FIG. 4 is a schematic representation of the ink of the present invention after transfer;

fig. 5 is a schematic view of multiple stamp heads printing in accordance with the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 5, in an embodiment of the present invention, a process for processing a stamp-type ink for a printed circuit board includes the following steps:

sp 1: windowing a designated area of the stamp head according to an ink printing area of the printed circuit board;

sp 2: the ink container is arranged in the seal head, and the pressure system in the ink container can be utilized to strictly control the amount of ink used in each printing. Using a specified pressure to make ink flow out in a specified amount in each printing process;

sp 3: applying pressure to the whole stamp head to enable the stamp head to descend, and printing ink on a circuit board;

sp 4: heating and curing the printing ink;

sp 5: a plurality of stamp heads are used for printing simultaneously, a plurality of jointed board products are carried at one time, and the production efficiency can be improved.

The thickness range of printing ink is 5um-50um, the thickness tolerance range of printing ink is 5um, the position tolerance range of printing ink is 50um, the type of printing ink is solid-state or liquid printing ink type.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.