阅读说明：本技术 电容器装置 (Capacitor device ) 是由 佐野友久 広瀬健太郎 今井洋平 荒木清道 于 2019-07-11 设计创作，主要内容包括：一种电容器装置,能够防止滤波电容器与多个平滑电容器之间的热干扰。在电源与作为供电装置的半导体模块之间的通电电路中设置的电容器装置包括：滤波电容器,用于去除包括在从电力输入端子供给来的电流中的噪声；多个平滑电容器,用于使电压平滑；电容器壳体,用于对滤波电容器和多个平滑电容器进行容纳,在滤波电容器与多个平滑电容器中的、设置于最靠近滤波电容器的位置处的平滑电容器之间的第一间隙构造成大于多个平滑电容器中的彼此相邻的两个平滑电容器之间的第二间隙。(A capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. A capacitor device provided in a power-on circuit between a power supply and a semiconductor module as a power supply device includes: a filter capacitor for removing noise included in a current supplied from the power input terminal; a plurality of smoothing capacitors for smoothing a voltage; and a capacitor case for accommodating the smoothing capacitor and the plurality of smoothing capacitors, a first gap between the smoothing capacitor and one of the plurality of smoothing capacitors disposed at a position closest to the smoothing capacitor being configured to be larger than a second gap between two of the plurality of smoothing capacitors adjacent to each other.)

1. A capacitor device provided in a power-on circuit between a power source and a power supply device, the capacitor device comprising:

a filter capacitor for removing noise included in a current input from a power input terminal;

a plurality of smoothing capacitors for smoothing a voltage;

a capacitor case for accommodating the filter capacitor and the plurality of smoothing capacitors, wherein,

a first gap between the filter capacitor and a smoothing capacitor of the plurality of smoothing capacitors disposed at a position closest to the filter capacitor is configured to be larger than a second gap between two smoothing capacitors of the plurality of smoothing capacitors adjacent to each other.

2. The capacitor device of claim 1,

three or more smoothing capacitors are arranged with a plurality of distances as the plurality of smoothing capacitors, and a minimum value of the plurality of distances is set to a value of the second gap.

3. The capacitor device according to claim 1 or 2,

also comprises a discharge resistance substrate provided with a discharge resistance, wherein,

the discharge resistance substrate is disposed at a position outside a side wall of the capacitor case surrounding the case opening.

4. The capacitor device of claim 3,

the discharge resistance substrate is configured to extend along an opening surface of the case opening on an outer side of the side wall of the capacitor case surrounding the case opening.

5. The capacitor device according to any one of claims 1 to 4,

further comprising a voltage detection terminal for detecting voltages of the smoothing capacitor and the plurality of smoothing capacitors, wherein,

the voltage detection terminal is configured to protrude from the capacitor case.

6. The capacitor device according to any one of claims 1 to 5,

and a power supply terminal for supplying power input to the power supply input terminal to another electronic device, wherein,

the smoothing capacitor is electrically disposed on an upstream side of the plurality of smoothing capacitors with respect to a current from the power supply,

any one of the power supply input terminal and the power supply terminal is disposed at a position closer to the smoothing capacitor than the plurality of smoothing capacitors.

7. The capacitor device according to any one of claims 1 to 6,

a fixing portion for fixing the capacitor case is provided between the filter capacitor and the plurality of smoothing capacitors.

8. The capacitor device according to any one of claims 1 to 7,

further included is a bus bar for supplying electric power to the semiconductor module as the power supply device.

Technical Field

The present disclosure relates to a capacitor device.

Background

Japanese unexamined patent application publication No. 2014-45035 (hereinafter, referred to as JP2014-45035a) discloses a capacitor device that constitutes a power conversion device mounted on a vehicle such as an electric vehicle and a hybrid vehicle. The capacitor device has a capacitor case that accommodates a smoothing capacitor and a filter capacitor including a plurality of capacitor elements. In the capacitor device, a filter capacitor removes noise included in a DC current input from a power supply, and a smoothing capacitor is configured to smooth a boosted DC voltage.

As the capacitor device, a capacitor device having a filter capacitor and a plurality of smoothing capacitors according to design requirements is known. In the case of such a capacitor device, the plurality of smoothing capacitors are less likely to thermally interfere with each other because they have similar heat generation levels when energized. However, since the filter capacitor and the smoothing capacitor have different heat generation levels at the time of energization, there is a problem that the capacitor on the low temperature side may be affected by the capacitor on the high temperature side due to mutual thermal interference. In particular, in the case of a structure in which the filter capacitor and the smoothing capacitor are accommodated together in the capacitor case, as in the capacitor device disclosed in JP2014-45035a, since the distance between the capacitors is small, the problem of thermal interference is significant. Therefore, when designing such a capacitor device having a capacitor case that houses the smoothing capacitor and the plurality of smoothing capacitors, a structure for preventing thermal interference from easily occurring between the capacitors at the time of energization is required.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors.

A capacitor device according to an aspect of the present disclosure is provided in a power-on circuit between a power supply and a power supply device. The capacitor device has a filter capacitor, a plurality of smoothing capacitors, and a capacitor case. The smoothing capacitor eliminates noise included in a current input from the power supply input terminal and the smoothing capacitors smooth the voltage. The capacitor case accommodates the filter capacitor and the plurality of smoothing capacitors. A first gap between the filter capacitor and a filter capacitor, which is disposed at a position closest to the filter capacitor, among the plurality of smoothing capacitors, is configured to be larger than a second gap between two smoothing capacitors, which are adjacent to each other, among the plurality of smoothing capacitors.

In the capacitor device described above, the first gap between the filter capacitor and the plurality of smoothing capacitors is a gap having a predetermined distance between the filter capacitor and the smoothing capacitor disposed at a position closest to the filter capacitor. The first gap is set to be relatively larger than a second gap between two smoothing capacitors adjacent to each other, whereby the filter capacitor can be separated from each of the plurality of smoothing capacitors. By doing so, the smoothing capacitor and the plurality of smoothing capacitors having different heat generation levels at the time of energization are less likely to thermally interfere with each other.

As described above, according to the above aspect, it is possible to provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. Note that codes in parentheses described in the claims and the solutions to technical problems represent correspondence with specific measures described in the following embodiments, and do not limit the technical scope of the present disclosure.

Drawings

In the drawings:

fig. 1 is a diagram showing an overall configuration of a power conversion device of a first embodiment;

fig. 2 is an inverter circuit diagram of the power conversion device of fig. 1;

fig. 3 is a perspective view of the capacitor device of the first embodiment;

fig. 4 is a view when fig. 3 is viewed in the direction of arrow a in fig. 3;

fig. 5 is a view when fig. 3 is viewed in the direction of arrow B in fig. 3;

fig. 6 is a sectional view schematically showing the arrangement of a filter capacitor and a plurality of smoothing capacitors accommodated in a capacitor case of a capacitor device of the second embodiment.

Detailed Description

Embodiments related to the capacitor device will be described below with reference to the drawings.

It should be noted that, in the drawings of the present specification, without being specifically mentioned, a first direction, i.e., a stacking direction of a plurality of semiconductor modules constituting a semiconductor stacking unit is indicated by an arrow X, a second direction orthogonal to the first direction X is indicated by an arrow Y, and a third direction (also referred to as "height direction") orthogonal to the first direction X and the second direction Y is indicated by an arrow Z.

(first embodiment)

As shown in fig. 1, the power conversion device 1 according to the first embodiment houses a semiconductor lamination unit 3, a control circuit substrate 7, a reactor 8, a capacitor device 10, and a discharge resistance substrate 24 in a case 2. The housing 2 is made of a metal material having good thermal conductivity, so-called "heat dissipation".

The power conversion device 1 is mounted on, for example, an electric vehicle, a hybrid vehicle, or the like, and functions as an inverter that converts DC power supply power into AC power necessary for driving a drive motor.

The semiconductor laminated unit 3 includes: a plurality of semiconductor modules 4, each of the semiconductor modules 4 incorporating a semiconductor element 5 in a main body portion; and a cooler having a plurality of cooling tubes 6. In the semiconductor laminated unit 3, the plurality of semiconductor modules 4 and the plurality of cooling tubes 6 are alternately laminated and arranged in the first direction X. That is, each semiconductor module 4 is sandwiched between two cooling pipes 6 from both side surfaces in the first direction X. The cooling pipe 6 has a first end communicating with the cooling medium inflow pipe 6a and a second end communicating with the cooling medium outflow pipe 6 b.

The semiconductor module 4 has a plurality of control terminals 4a, positive electrode terminals 4b, negative electrode terminals 4c, and AC terminals 4 d. Each of the plurality of control terminals 4a protrudes upward from the main body portion in the third direction Z. Each of the positive electrode terminal 4b, the negative electrode terminal 4c, and the AC terminal 4d protrudes downward from the main body portion in the third direction Z.

The control circuit substrate 7 is electrically connected to the plurality of control terminals 4a of each of the plurality of semiconductor modules 4. The control circuit substrate 7 is configured to control a switching operation (on/off operation) of the semiconductor element 5 incorporated in the semiconductor module 4 to convert DC power supplied to the semiconductor module 4 into AC power. As the semiconductor element 5, an arbitrary switching element such as an IGBT (i.e., an insulated gate bipolar transistor) or a MOSFET (i.e., a metal oxide semiconductor field effect transistor) is typically used.

The reactor 8 is provided below the semiconductor laminated unit 3. The reactor 8 has a coil (also referred to as an "inductor") that generates a magnetic flux by energization from the energization portion 9 and has a function of converting electric energy into magnetic energy by using the coil.

The capacitor device 10 is provided in an energization circuit (an inverter circuit 30 described later) between a power source (a battery B described later) and the semiconductor module 4 as a power supply device. The capacitor device 10 includes a filter capacitor 11, a plurality of smoothing capacitors 12, and a capacitor case 13 that accommodates the filter capacitor 11 and the plurality of smoothing capacitors 12. The filter capacitor 11 and the smoothing capacitor 12 are composed of similar capacitor elements. The capacitor device 10 is also referred to as a "capacitor module" or "capacitor assembly".

The capacitor case 13 is a bottom box-shaped case having a case opening 14, and is configured to be fixed to the case 2 via a plurality of fixing portions 16. The fixing portion 16 is provided with a through hole 16a for inserting a shaft portion of a fastening member (not shown). Thus, the fixing portion 16 is a fixing point by fastening and fixing. The capacitors 11 and 12 are sealed with a potting resin in a state of being accommodated through the case opening 14 of the capacitor case 13.

In order to supply power to the semiconductor module 4, the capacitor device 10 includes a positive electrode bus bar 17 and a negative electrode bus bar 18, the positive electrode bus bar 17 and the negative electrode bus bar 18 extending from the capacitor case 13 in the second direction Y perpendicular to the opening surface 14a of the case opening 14 to electrically connect the capacitors 11, 12 to the semiconductor module 4. Each of the positive electrode bus bar 17 and the negative electrode bus bar 18 is configured as a plate member extending from the smoothing capacitor 12 through the case opening 14 of the capacitor case 13. The positive electrode bus bar 17 is joined to the positive electrode terminal 4b protruding from the semiconductor module 4 by welding or the like. Similarly, the negative electrode bus bar 18 is connected to the negative electrode terminal 4c protruding from the semiconductor module 4 by welding or the like.

The discharge resistance substrate 24 is provided with a discharge resistance 25, and the discharge resistance 25 is used to discharge the electric charges accumulated in the capacitor device 10. The discharge resistance substrate 24 is disposed at a position deviated from the projection surface in the second direction Y of the case opening 14 of the capacitor case 13, in other words, separated from the opening surface 14a of the case opening 14 of the capacitor case 13. The discharge resistance substrate 24 is provided at a position outside the side wall 13a of the case opening 14 surrounding the capacitor case 13. Specifically, the discharge resistance substrate 24 is provided in the substrate fixing portion 15 extending from the side wall 13a of the capacitor case 13 surrounding the case opening 14. This makes it possible to prevent thermal interference from occurring between the heat generated by the discharge resistor 25 as a heating element and the capacitors 11, 12 accommodated in the capacitor case 13.

The discharge resistance substrate 24 is configured to extend along the opening surface 14a of the case opening 14 of the capacitor case 13. At that time, the extended surface of the discharge resistance substrate 24 is parallel to the opening surface 14a of the case opening 14 and perpendicular to the side wall 13a of the capacitor case 13 surrounding the case opening 14. The opening surface 14a may also be referred to as a potting surface formed of a potting resin.

The capacitor device 10 includes a voltage detection terminal 26 for detecting the voltages of the filter capacitor 11 and the plurality of smoothing capacitors 12. The voltage detection terminal 26 protrudes in the third direction Z from the substrate fixing portion 15 provided in the capacitor case 13, and extends between the discharge resistance substrate 24 and the control circuit substrate 7. That is, the voltage detection terminal 26 is configured to protrude from the capacitor case 13 that accommodates the capacitors 11, 12. Thus, the voltage detection terminal 26 is less susceptible to electromagnetic noise from the capacitors 11 and 12.

Here, the configuration of each part of the above-described power conversion apparatus 1 and the circuit configuration will be described in more detail.

As shown in fig. 2, in the inverter circuit 30 of the power conversion device 1, the switching operation (on/off operation) of the semiconductor element 5 incorporated in each of the plurality of semiconductor modules 4 is controlled by the control circuit substrate 7, and the DC power of the battery B is converted into the AC power. The plurality of semiconductor modules 4 are divided into a semiconductor module 4A and a semiconductor module 4B.

In the present embodiment, the reactor 8, the filter capacitor 11, and the semiconductor module 4A constitute a booster 31 of the inverter circuit 30. The booster 31 has a function of boosting the voltage of the battery B. The filter capacitor 11 is a capacitor for removing noise (noise current) included in the current input from a pair of power input terminals 20 described below. The smoothing capacitor 11 is electrically disposed on the upstream side of the plurality of smoothing capacitors 12 with respect to the current from the battery B.

Meanwhile, the capacitor 12 and the semiconductor module 4B constitute a converter 32 of the inverter circuit 30. The converter 32 has a function of converting the DC power boosted in the booster 31 into three-phase (i.e., U-phase, V-phase, W-phase) AC power. The capacitor 12 is a capacitor for smoothing the voltage after boosting in the booster 31. Three-phase AC motor M for vehicle running is driven by AC power obtained by converter 32.

In addition, the discharge resistor 25 is provided in parallel with the filter capacitor 11 and the smoothing capacitor 12. Thereby, for example, when the power conversion device 1 is stopped, the internal charges of the capacitors 11, 12 are discharged through the discharge resistor 25.

Note that the number and arrangement of the respective elements constituting the inverter circuit 30 described above are not limited to those shown in fig. 2, and may be appropriately changed as needed.

As shown in fig. 3, the capacitor case 13 of the capacitor device 10 is configured such that the first direction X is a longitudinal direction. The filter capacitor 11 and the two smoothing capacitors 12 are accommodated in the capacitor case 13 in a state juxtaposed in the first direction X.

Further, the capacitor device 10 includes: a pair of power input terminals 20, the pair of power input terminals 20 being electrically connected to a battery B; and a pair of power supply terminals 21, the pair of power supply terminals 21 being used to supply power input to the pair of power input terminals 20 to another electronic device having the reactor 8.

The positive electrode-side terminal 20p, which is one of the paired power input terminals 20, is constituted by a first end portion 22a of the bent plate-shaped bus bar 22. The positive electrode-side terminal 21p, which is one of the paired power supply terminals 21, is formed of the second end 22b of the bus bar 22.

The negative electrode-side terminal 20n, which is the other of the pair of power input terminals 20, is constituted by a first end portion 23a of the bent plate-shaped bus bar 23. The negative-electrode-side terminal 21n, which is the other of the pair of power supply terminals 21, is formed by the second end 23b of the bus bar 23. In the bus bar 23, a region between the first end 23a and the second end 23b is buried in the potting resin of the capacitor case 13.

A positive electrode-side terminal 20p and a negative electrode-side terminal 20n as a pair of power input terminals 20 are electrically connected to the positive electrode side and the negative electrode side of the external battery B, respectively (see fig. 2), and are electrically connected to a positive electrode-side terminal 21p and a negative electrode-side terminal 2 n, respectively. The positive electrode-side terminal 21p and the negative electrode-side terminal 21n as the pair of power supply terminals 21 are electrically connected to the reactor 8, and are configured to be able to supply electric power input to the pair of power input terminals 20 to the reactor 8.

The paired power supply input terminals 20 and the paired power supply terminals 21 are electrically connected to each of the smoothing capacitor 11 and the plurality of smoothing capacitors 12, and are disposed at positions closer to the smoothing capacitor 11 than the plurality of smoothing capacitors 12.

Here, as described above, the smoothing capacitor 11 is electrically provided on the upstream side of the plurality of smoothing capacitors 12. Therefore, by disposing the paired power input terminals 20 and the paired power supply terminals 21 closer to the filter capacitor 11, the current-carrying path to the filter capacitor 11 can be suppressed to be short. On the other hand, if the paired power input terminals 20 and the paired power supply terminals 21 are brought close to the plurality of smoothing capacitors 12, the energization path to the smoothing capacitor 11 becomes long, and there may arise a problem that the increased portion of the energization path functions as a heater at the time of energization to increase the amount of heat generation.

As shown in fig. 4, in the capacitor case 13, one of three fixing portions 16 fixed to the case 2 is provided between the filter capacitor 11 and the plurality of (two in the present embodiment) smoothing capacitors 12. This makes it possible to transfer heat generated in the capacitors 11, 12 at the time of energization to the high thermal conductivity case 2 through the fixing portion 16 and cool the capacitor device 10.

Meanwhile, the two smoothing capacitors 12 are less likely to thermally interfere with each other because the two smoothing capacitors 12 have similar heat generation levels at the time of energization, but since the filter capacitor 11 and the smoothing capacitor 12 have different heat generation levels at the time of energization, the capacitor on the cooling temperature side may be affected by the capacitor on the high temperature side due to mutual thermal interference.

Therefore, as shown in fig. 4 and 5, the capacitor device 10 of the present embodiment is configured such that a first gap G1 (first distance) between the smoothing capacitor 12A and the smoothing capacitor 11 disposed at a position closest to the smoothing capacitor 11, among the two smoothing capacitors 12, is larger than a second gap G2 (second distance) between the two smoothing capacitors 12.

According to the capacitor device 10, the filter capacitor 11 can be separated from each of the two smoothing capacitors 12A, 12B by making the first gap G1 relatively larger than the second gap G2. Thus, thermal interference is less likely to occur between the smoothing capacitor 11 and the two smoothing capacitors 12A, 12B having different heat generation levels at the time of energization.

Therefore, according to the first embodiment, it is possible to provide the capacitor device 10 capable of preventing thermal interference between the filter capacitor 11 and the two smoothing capacitors 12A, 12B.

In addition, according to the capacitor device 10, thermal interference can be prevented in consideration of the difference in the amount of heat generation and the thermal resistance between the filter capacitor 11 and the smoothing capacitor 12. Further, the noise superposition of the filter capacitor 11 and the smoothing capacitor 12 can be prevented. Further, since the potential difference between the filter capacitor 11 and the smoothing capacitor 12 is different, the reliability of insulation is improved.

Another embodiment related to the above-described first embodiment will be described below with reference to the drawings. In another embodiment, the same elements as those of the first embodiment will be denoted by the same reference numerals, and the description of the same elements will be omitted.

(second embodiment)

The capacitor device 110 of the second embodiment differs from the capacitor device 10 of the first embodiment in the number of smoothing capacitors 12 accommodated in a capacitor case 13. The other configuration is the same as that of the first embodiment.

As shown in fig. 6, the capacitor case 13 of the capacitor device 110 accommodates three smoothing capacitors 12. Note that fig. 6 shows the capacitor case 13 in a simplified manner.

The three smoothing capacitors 12 are juxtaposed by two distances D1, D2 in the first direction X. That is, when the three smoothing capacitors 12 are the first smoothing capacitor 12A, the second smoothing capacitor 12B, and the third smoothing capacitor 12C in this order from the closest to the filter capacitor 11, the distance between the first smoothing capacitor 12A and the second smoothing capacitor 12B adjacent to each other is D1, and the distance between the second smoothing capacitor 12B and the third smoothing capacitor 12C adjacent to each other is D2.

Here, the value of the smaller of the two distances D1, D2, i.e., the minimum value Dmin, may be set to the value of the second gap G2. In the case of fig. 6, since the distance D1 is smaller than the distance D2 and is the minimum value Dmin, the distance D1 is the second gap G2.

The capacitor device 110 is configured such that a first gap G1 between the filter capacitor 11 and the smoothing capacitor 12A, which is disposed at a position closest to the filter capacitor 11, of the three smoothing capacitors 12A, 12B, 12C is larger than a second gap G2, that is, a distance D1 at which the first smoothing capacitor 12A and the second smoothing capacitor 12B are adjacent to each other.

Except for the case where there is a difference between the distance D1 and the distance D2 due to a slight tolerance or the like, when the distance D1 is equal to the distance D2, both distances D1, D2 are the minimum value Dmin and correspond to the second gap G2.

According to the capacitor device 110 of the second embodiment, it is possible to prevent thermal interference between the filter capacitor 11 and the three smoothing capacitors 12. Further, the similar operational effects to those of the first embodiment can be exerted.

The present disclosure is not limited to the above-described exemplary embodiments, and various applications and variations can be considered without departing from the object of the present disclosure. For example, the following respective modes to which the above-described embodiments are applied can also be implemented.

In the above-described embodiment, the capacitor devices 10, 110 in which one filter capacitor 11 and two or three smoothing capacitors 12 are accommodated in the capacitor case 13 are exemplified, but the numbers of the filter capacitors 11 and the smoothing capacitors 12 are not limited to these, and may be appropriately changed as needed. For example, the number of the smoothing capacitors 12 may be changed to four or more.

In the above-described embodiment, the capacitor devices 10, 110 provided in the inverter circuit 30 between the battery B and the semiconductor module 4 are exemplified, but the structure of the capacitor devices 10, 110 may be applied to the structure of the capacitor devices provided in the energization circuit between the power supply and various power supply devices.