阅读说明：本技术 树脂模塑装置 (Resin molding apparatus ) 是由 藤沢雅彦 斎藤裕史 于 2021-04-21 设计创作，主要内容包括：本发明提供一种树脂模塑装置,所述树脂模塑装置可防止搬送时工件发生弯曲,防止发生所述弯曲导致的成形不良。本发明的树脂模塑装置(1)包括：模塑模具(12),对在载体(Wa)的内侧搭载了电子零件(Wb)的工件(W)进行树脂模塑；及装载机(4),搬送工件(W)；且装载机(4)包括：卡盘(32),与工件(W)的下表面的外缘部接触分离；移动装置(34),使卡盘(32)移动；及框体(22),与工件(W)的上表面的外缘部接触分离；以至少在搬送时可由卡盘(32)与框体(22)夹持工件(W)的方式构成。(The invention provides a resin molding device which can prevent a workpiece from bending during conveying and prevent poor forming caused by the bending. The resin molding apparatus (1) of the present invention comprises: a molding die (12) for resin-molding a workpiece (W) having an electronic component (Wb) mounted on the inner side of a carrier (Wa); and a loader (4) for conveying the workpiece (W); and the loader (4) comprises: a chuck (32) which is in contact with and separated from the outer edge of the lower surface of the workpiece (W); a moving device (34) for moving the chuck (32); and a frame (22) that is in contact with and separated from the outer edge of the upper surface of the workpiece (W); the work (W) can be held by the chuck (32) and the frame (22) at least during conveyance.)

1. A resin molding apparatus, comprising:

a molding die for resin molding a workpiece having electronic components mounted on the inner side of a carrier; and

a loader that conveys the workpiece; and is

The loader includes: a chuck that is brought into contact with and separated from an outer edge portion of a lower surface of the workpiece; a moving device for moving the chuck; and a frame body which is in contact with and separated from an outer edge portion of an upper surface of the workpiece; the chuck and the frame can hold the workpiece at least during conveyance.

2. The resin molding apparatus according to claim 1, wherein:

further comprises a control part for controlling the movement of the frame body,

the control unit controls a pressing force when the frame abuts against the workpiece.

3. The resin molding apparatus according to claim 1, wherein:

the chuck is configured to abut against and support the outer edge portion of the workpiece at a plurality of points spaced apart from each other.

4. The resin molding apparatus according to claim 3, wherein:

the structure of the chuck is as follows: the chuck jaws are integrally formed at a rear end side of the chuck jaws, and the chuck jaws are integrally movable in and out of a plane projected from the workpiece.

5. The resin molding apparatus according to any one of claims 1 to 4, wherein:

the structure of the mobile device is as follows: the chuck is configured to perform horizontal movement, rotational movement, or a combined movement of the horizontal movement and the rotational movement so as to be able to obtain a position that enters the plane of planar projection of the workpiece and approaches the workpiece with a predetermined gap so as not to contact the lateral outer peripheral portion of the workpiece, and a position that is separated from the position within the plane of planar projection of the workpiece.

6. The resin molding apparatus according to any one of claims 1 to 4, wherein:

further comprising a preheating stage for preheating the workpiece,

the preheating stage has a retreat groove for retreating the chuck in a state where the lower surface of the workpiece is in contact with the chuck.

7. The resin molding apparatus according to any one of claims 1 to 4, wherein:

the chuck is provided in an annular arrangement in a plan view.

8. The resin molding apparatus according to any one of claims 1 to 4, wherein:

the chuck and the frame are provided in a plurality of combinations corresponding to a plurality of kinds of the work pieces having different outer diameters,

the loader is configured to be attachable to and detachable from the respective combinations and to be operable.

Technical Field

The present invention relates to a resin molding apparatus for molding a workpiece with resin.

Background

In the manufacture of semiconductor devices and the like, resin molding apparatuses are widely used, and workpieces having electronic components mounted on carriers are molded with a molding resin and processed into molded articles. As examples of such a resin molding apparatus, a compression molding apparatus or a transfer molding apparatus are known.

As an example of the conventional technology, patent document 1 (japanese patent laid-open publication No. 2018-125356) discloses a transfer molding apparatus for resin-molding a workpiece (lead frame). In the resin molding apparatus, since the work is large or thin, the amount of bending becomes large due to its own weight. As a result, the following problems occur: when the workpiece is held by the chuck jaws and conveyed, the workpiece is likely to be separated from the chuck jaws and fall off. In order to solve such a problem, the resin molding apparatus described in patent document 1 is provided with a conveying device including a holding claw and an outer rotary holding part, and capable of reliably holding and conveying a workpiece.

Documents of the prior art

Patent document

Patent document 1 Japanese patent laid-open No. 2018-125356

Disclosure of Invention

Problems to be solved by the invention

In recent years, as a carrier constituting a work, there has been an increase in the number of cases of using a carrier thinner and larger than before in order to improve productivity or molding quality. Therefore, the workpiece is likely to be curved (sometimes referred to as a "smile curve") when the workpiece is conveyed while holding the outer periphery, and the curvature may cause a problem.

For example, when a workpiece is conveyed in a bent state and a molding resin is mounted on the workpiece, the resin is biased, which results in a molding failure. Further, when the workpiece in a curved state is placed on the preheating table and preheated, the workpiece is unevenly heated, which causes poor molding of the molding resin or increases the heating time.

Means for solving the problems

The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin molding apparatus capable of preventing a workpiece from being bent during conveyance and preventing a molding failure due to the bending.

The present invention solves the above problems by the following solution means described as an embodiment.

The resin molding apparatus of the present invention is characterized by comprising: a molding die for resin molding a workpiece having electronic components mounted on the inner side of a carrier; and a loader that conveys the workpiece; and the loader comprises: a chuck that is brought into contact with and separated from an outer edge portion of a lower surface of the workpiece; a moving device for moving the chuck; and a frame body which is in contact with and separated from an outer edge portion of an upper surface of the workpiece; the chuck and the frame can hold the workpiece at least during conveyance.

Thus, when the workpiece is conveyed by the loader, the outer edge portion of the workpiece can be clamped by the frame and the chuck for conveyance. Therefore, even when a workpiece that is thinner and larger than before is used, the workpiece can be prevented from being bent because the outer edge portion is sandwiched and conveyed.

Preferably, the work pressing device further includes a control unit that controls movement of the housing, and the control unit controls a pressing force when the housing is in contact with the workpiece. This prevents the workpiece from being damaged (cut), and also prevents the workpiece from falling off, and the workpiece can be conveyed while being prevented from being bent.

Preferably, the chuck is configured to abut against and support the outer edge portion of the workpiece at a plurality of points spaced apart from each other. This prevents the workpiece from being bent between the support points.

Preferably, the chuck has a structure that: the chuck jaws are integrally formed at a rear end side of the chuck jaws, and the chuck jaws are integrally movable in and out of a plane projected from the workpiece. Thus, the mechanism for moving the chuck jaws can be simply configured.

Further, it is preferable that the moving device has a structure in which: the chuck is configured to perform horizontal movement, rotational movement, or a combination thereof so as to be able to obtain a position that enters the plane of planar projection of the workpiece and approaches the workpiece with a predetermined gap so as not to contact the lateral outer peripheral portion of the workpiece, and a position that is separated from the position within the plane of planar projection of the workpiece. Thus, the workpiece placed on the transfer position or the pre-heater can be held by the loader by the structure in which the chuck is movable. Further, the position where the workpiece is held by the loader can be corrected by a structure in which the chuck approaches so as not to abut against the lateral outer peripheral portion of the workpiece.

Preferably, the apparatus further includes a preheating stage for preheating the workpiece, and the preheating stage includes a retreat groove for retreating the chuck in a state where a lower surface of the workpiece is in contact with the chuck. Thus, the work can be placed in contact with the preheating stage and the molding die.

Preferably, the chuck is provided in an annular arrangement in a plan view. Thus, the chuck and the frame can reliably clamp the entire periphery of the outer edge of the workpiece.

Preferably, the chuck and the frame are provided in a plurality of combinations corresponding to a plurality of kinds of the works having different outer diameters, and the loader is configured to be attachable to and detachable from the respective combinations. Thus, resin molding can be performed by replacing a plurality of kinds of workpieces W having different outer diameter dimensions with corresponding combinations.

For example, the carrier is formed in a shape having a thickness of 0.2mm to 3mm and a maximum width of 400mm to 700 mm. The invention exerts particularly remarkable effects on workpieces comprising carriers that are thinner and larger than previously described.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, the workpiece can be prevented from being bent during conveyance. Therefore, the occurrence of forming defects due to bending of the workpiece can be prevented.

Drawings

Fig. 1 is an apparatus configuration diagram showing an example of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic view (front cross-sectional view) showing an example of a loader and a preheater of the resin molding apparatus of fig. 1.

Fig. 3 is a sectional view taken along line III-III of fig. 2.

Fig. 4 is a schematic view (bottom view) showing an example of a housing of the resin molding apparatus of fig. 1.

Description of the symbols

1: resin molding apparatus

2: workpiece conveying part

2 a: conveying part body

3: rail part

4: loading machine

4 a: video camera

5: support plate

6: dispenser

7: resin supply table

8: cleaning device

9: preheating part

10: pre-heater

10 a: preheating table

10 b: x-direction reference module

10 c: y-direction reference module

10 d: escape groove

11: pressing part

12: molding die

13: film conveying mechanism

14: cooling table

22: frame body

22 a: abutting part

24: first moving device

24A: guide post

24B: cylinder

32: chuck with a locking mechanism

32 a: chuck jaw

34: second moving device

A: workpiece supply unit

B: resin supply unit

C: workpiece transfer unit

D: pressing unit

E: cooling unit

F: release film

F1: winding-out roller

F2: winding roller

P: receiving position

Q: transfer position

R: molding resin

U: edge

W: workpiece

Wa: carrier

Wb: electronic component

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic diagram showing a configuration example of a resin molding apparatus 1 according to an embodiment of the present invention. In all the drawings for describing the embodiments, the same reference numerals are given to members having the same functions, and the repetitive description thereof may be omitted.

The resin molding apparatus 1 of the present embodiment is an apparatus for resin molding a workpiece W using a mold die 12 including an upper die and a lower die. Hereinafter, a case of a compression molding apparatus having a cavity in the upper mold will be described as an example of the resin molding apparatus 1.

First, as an example of the workpiece W to be molded, a workpiece is used in which an electronic component Wb such as a semiconductor chip is held on a carrier Wa such as a carrier. As a main example, a rectangular carrier having longitudinal and lateral sides of about 500mm to 600mm is used as the carrier Wa. The carrier Wa is made of an appropriate material such as metal (copper alloy, stainless steel alloy, etc.) or glass, and is made thin enough to bend under its own weight. The work W is configured by attaching a plurality of electronic components Wb to such a carrier Wa using an adhesive in a matrix (here, the matrix is not limited to a state in which the electronic components are regularly arranged, and refers to a structure in which a plurality of electronic components are arranged in a wide range in a column direction or a row direction). The work W is not limited to the above-described material or structure. For example, the carrier Wa may also be circular. The carrier Wa may have a maximum width (side or diameter) of about 400 to 700mm and a thickness of about 0.2 to 3 mm. In the present embodiment, carrier boards and semiconductor chips are exemplified as the carrier Wa and the electronic component Wb, but various configurations other than these may be adopted.

On the other hand, the molding resin R is, for example, a thermosetting resin (for example, an epoxy resin containing a filler), and may be in the form of granules, powder, liquid, gel, or sheet, or in some cases, may be in the form of a solid represented by small pieces.

Next, an outline of the resin molding apparatus 1 of the present embodiment will be described. As shown in fig. 1, the resin molding apparatus 1 is formed by serially connecting a work supply unit a, a resin supply unit B, a work transfer unit C, a press unit D, and a cooling unit E, respectively. The workpiece W is conveyed by the workpiece conveying unit 2, the loader 4, and the like (described in detail later). Each unit may be configured to surround the transfer robot at the center. Hereinafter, a case of a rectangular workpiece W will be described as an example.

The workpiece supply unit a is provided with a receiving position P (first position) which is a position to receive the workpiece W from the previous step. The workpiece transfer unit C is provided with a transfer position Q (second position) which is a position for transferring the workpiece W to the loader 4. Here, the workpiece conveying section 2 is configured to reciprocate the conveying section main body 2a between the receiving position P and the conveying position Q along the rail portion 3 provided between the workpiece supply unit a, the resin supply unit B, and the workpiece conveying unit C (see a solid arrow H in fig. 1). For example, the conveying unit main body 2a is coupled to a drive belt (not shown) and reciprocates. The conveying unit body 2a is provided with a holder plate 5, and the holder plate 5 has a rectangular plate surface (may be in a lattice shape or the like) having a larger outer shape and a larger thickness (for example, about 10 mm) than the work W. With the structure of the workpiece conveying unit 2, the workpiece W is conveyed in a state of being positioned and placed on the stand plate 5. Therefore, even when a workpiece W thinner and larger than before is used, the workpiece W can be prevented from being bent because the workpiece W is conveyed while being placed on the stand plate 5.

Then, the resin supply unit B is provided with a dispenser 6 and a resin supply table 7 to supply the molding resin R (for example, a granular resin). The workpiece W is transferred from the conveying unit main body 2a to the resin supply table 7 by a pick-and-place mechanism (not shown) movable in the Y-Z direction while being placed on the rack plate 5. In the state of being placed on the resin supply table 7, the molding resin R is supplied from the dispenser 6 onto the workpiece W. Here, the dispenser 6 is disposed in such a manner as to be scannable along the X-Y direction on the workpiece W. An electronic balance (not shown) is provided on the resin supply table 7, and the molding resin R supplied to the workpiece W is measured to an appropriate amount.

Then, a conveying position Q is provided in the work conveying unit C, and the conveying position Q is a position at which the work W in the state of being supplied with the molding resin R is conveyed from the rack plate 5 to the loader 4. The loader 4 is provided with a mechanism (described in detail later) for holding the workpiece W. With the configuration of the loader 4, the workpiece W is held at the transfer position Q and is conveyed to the preheating section 9 of the press unit D without being supported on the inner side of the lower surface of the workpiece W. The movement ranges of the loader 4 in the X-Y direction are indicated by broken line arrows G1 and G2 in fig. 1.

Further, the workpiece transfer unit C is provided with a cleaning device 8 for removing dust such as resin powder and foreign matter adhering to a predetermined surface of the workpiece W. The cleaning device 8 of the present embodiment has a structure in which: when the workpiece W held by the loader 4 is conveyed from the conveying position Q to the press unit D (preheating section 9), the lower surface thereof (here, the non-mounting surface of the electronic component Wb) is cleaned. As a modified example, as shown by the broken line in fig. 1, the cleaning device 8 may be provided at a plurality of positions.

Then, the press unit D is provided with a preheating section 9 and a pressing section 11. The preheating unit 9 is provided with a preheater 10. The preheater 10 preheats (preheats) the workpiece W to which the molding resin R is supplied to a predetermined temperature (about 100 ℃ as an example) while being placed on the preheating stage 10 a. The workpiece W preheated to a predetermined temperature by the preheating unit 9 (preheater 10) is held by the loader 4 and carried into the pressing unit 11 (molding die 12).

The preheating unit 9 is provided with a pair of X-direction reference blocks 10b and Y-direction reference blocks 10c to correct a positional deviation in the rotational direction of the workpiece W. Thus, the workpiece W is pressed against the pair of X-direction reference blocks 10b and the Y-direction reference blocks 10c by a pusher or the like, not shown, on the preheating table 10a, whereby the positional deviation of the workpiece W in the rotational direction can be corrected.

Here, the loader 4 is provided with a camera 4a for reading the coordinates of the corner of the workpiece W. This makes it possible to correct the position where the workpiece W is held by the loader 4. The reason why the correction is made is that: since the workpiece W is stretched when the workpiece W is preheated to a predetermined temperature on the preheating table 10a, the position where the loader 4 holds the workpiece W must be corrected before the workpiece W is carried into the molding die 12.

As a specific correction method, the amount of deviation between the workpiece center position and the stage center position is detected from the amount of positional deviation between the outer shape position of the workpiece W and the alignment mark. For example, coordinates of a corner portion of the workpiece W are read by a camera 4a provided in the loader 4, an offset amount from the alignment mark in the X-Y direction is calculated, the center position of the loader 4 is aligned with the center position of the workpiece W, and the workpiece W is held. In the present embodiment, one camera 4a is provided in the loader 4, but the present invention is not limited to this, and a plurality of cameras 4a may be provided to read the coordinates of the workpiece W.

On the other hand, a molding die 12 including an upper die and a lower die is provided in the pressing portion 11. In the present embodiment, a placement portion for a workpiece W is provided on the lower die, and a cavity is provided on the upper die. After the workpiece W with the molding resin R mounted thereon is carried into the molding die 12 configured as described above, the mold is closed and heated to, for example, about 130 to 150 ℃. In this case, the lower mold is a movable mold, and the upper mold is a fixed mold, but the present invention is not limited thereto, and the lower mold may be a fixed mold, the upper mold may be a movable mold, or both of them may be movable molds. The mold 12 is opened and closed by a known mold opening and closing mechanism (not shown). As an example of the mold opening and closing mechanism, there is known a mechanism including a pair of platens, a plurality of coupling mechanisms (tie rods or column portions) for bridging the pair of platens, a drive source (for example, an electric motor) for moving (raising and lowering) the platens, and a drive transmission mechanism (for example, a crank link) (both not shown).

Further, a film transfer mechanism 13 is provided in the press section 11 to supply (transfer) the release film F to the molding die 12 (here, the upper die). The film transfer mechanism 13 is provided, and the release film F is sucked and held on the upper mold clamping surface including the cavity. As the release film F, a film material connected in a long strip shape excellent in heat resistance, peeling easiness, flexibility and stretchability is used, and for example, Polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene copolymer (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, or the like is suitably used. The release film F is fed (conveyed) from a take-up roll F1, and is wound up to a take-up roll F2 via an upper mold nip surface. Further, a short strip film cut to a size corresponding to the required size of the workpiece W may be used instead of the long strip film.

Then, the cooling unit E is provided with a cooling stage 14 for cooling the workpiece W taken out of the mold 12. As an operation example, in a state where the resin molding operation is completed and the mold 12 is opened, the loader 4 enters the mold 12, holds the workpiece W, and takes out the workpiece W. The workpiece W is transported from the press unit D to the cooling unit E while being held by the loader 4, and is transported to the cooling stage 14 to be cooled. Then, the cooled workpiece W is conveyed to the subsequent step (e.g., dicing step).

Next, a structure of the loader 4 characteristic to the present embodiment will be described in detail.

As shown in fig. 2, the loader 4 includes: a frame 22 that is in contact with and separated from an outer edge portion of an upper surface of the workpiece W (here, a mounting surface of the electronic component Wb); and a first moving device 24 for moving the frame 22 up and down. In addition, the method comprises the following steps: a chuck 32 which is brought into contact with and separated from an outer edge portion of a lower surface of the workpiece W (here, a non-mounting surface of the electronic component Wb); and a second moving device 34 for moving the chuck 32. A plurality of chuck jaws 32a that contact the lower surface of the workpiece W are provided at the front end of the chuck 32. The frame 22 and the chuck 32 are configured to hold the workpiece W from the vertical direction (Z-axis direction). That is, the frame 22 and the chuck 32 are arranged to overlap each other in a plan view. Further, a control unit (not shown) for controlling the movement of the loader 4, the first moving device 24, and the second moving device 34 is provided at a predetermined position of the resin molding apparatus 1.

The first moving device 24 of the present embodiment includes: a guide post 24A for guiding the frame 22 to move up and down (movement in the Z-axis direction); and a cylinder 24B as a driving mechanism for driving the same to move up and down (in the Z-axis direction). Here, the cylinder 24B is connected to an electro-pneumatic regulator (not shown) controlled by a control unit to operate. Further, the frame 22 may be moved up and down by a combination of a servo motor, a linear guide, and the like. This enables variable control of the operation (pressing force, pressing speed, etc.) of the cylinder 24B.

The frame 22 of the present embodiment includes an abutting portion 22a provided around the entire outer edge of the workpiece W. As shown in fig. 2 to 4, the contact portion 22a is formed in a continuous ring shape (corresponding to a square ring shape of the rectangular workpiece W) in a plan view (a bottom view). However, the contact portion 22a is not limited to the above-described configuration, and may be formed discontinuously (intermittently) (not shown). In fig. 2, the back chuck jaws 32a are not shown for ease of understanding of the structure.

The frame 22 is preferably in a ring shape continuous over the entire circumference from the viewpoint of preventing the mold resin R from scattering, but may have any intermittent structure in consideration of engagement with the chuck 32 (particularly, the chuck claws 32 a). Specifically, the rectangular workpiece W may have a structure in which each side is continuous and the corner is interrupted. The rectangular workpiece W may be interrupted at a predetermined position such as the center of each side. However, in such a case, by avoiding the position of the chuck claws 32a from overlapping with the position of the interruption, the carrier Wa can be clamped without deforming it. Further, by providing the frame body 22 intermittently, the structure can be made inexpensive by arbitrarily combining the corner members and the side members.

In addition, when the carrier Wa is circular, the inner circumference of the frame 22 must also be circular, but in this case, the carrier Wa may be in the form of a ring having a continuous entire circumference, or may be interrupted in the middle. In this case, the small portions may be combined and configured by a structure in which the portions are interrupted at regular intervals.

Preferably, at least the contact portion 22a of the frame 22 is formed of an electrostatic Discharge (ESD) material having a heat resistance of about 250 ℃. The ESD material releases, prevents, or alleviates a charged state caused by peeling electrification or frictional electrification of another member (for example, the carrier Wa) in contact with the frame 22. This prevents the frame 22 from being electrostatically charged, and prevents the mold resin R placed on the workpiece W from adhering to the frame 22. Therefore, the frame 22 may be formed using an ESD material on the inner peripheral surface and the lower surface. Further, for the purpose of holding and protecting the carrier Wa described below, an elastic body such as rubber may be used for the abutment portion 22 a.

According to the above configuration, when the workpiece W is conveyed from the conveying position Q onto the preheater 10 and when the workpiece W is conveyed from the preheater 10 into the mold 12, the outer edge portion of the workpiece W can be held between the frame 22 and the chuck 32 and conveyed. Therefore, even when a workpiece W that is thinner and larger than before is used, the workpiece W can be prevented from being bent due to its own weight or the weight of the molding resin R because the workpiece W is conveyed while being sandwiched by the outer edge portions. As a result, the occurrence of molding defects due to the bias of the molding resin R caused by the occurrence of warpage can be prevented. For example, in the case where only the outer edge portion of the outer periphery of the workpiece W is supported by the chuck jaws 32a of the chuck 32, a force is applied by its own weight or the like so that the center of the workpiece W (carrier Wa) is bent downward by being drawn inward, as shown by a chain line in fig. 2. However, when the loader 4 receives the workpiece W, the outer edge portion of the carrier Wa placed flat is sandwiched between the chuck 32 and the frame 22, and thus the workpiece W can be prevented from being bent even if a force that pulls the carrier Wa inward is applied by the weight of the workpiece W or the weight of the molding resin R. Further, by controlling the first moving device 24, the abutting portion 22a of the frame 22 is controlled to be pressed against the carrier Wa with a pressing force in a range in which the carrier Wa is not damaged (cut or crushed), and the carrier Wa can be protected and the workpiece W can be prevented from being bent. As described above, by controlling the pressing force of the frame 22, the workpiece W can be conveyed while being prevented from being bent while preventing the workpiece W from being damaged (cut).

Here, the control unit performs the following control. Specifically, control is performed to bring the workpiece W, to which the molding resin R is supplied, into the following state: while the loader 4 is moved from the conveyance position Q onto the preheating stage 10a, the frame 22 is brought into contact with the upper surface of the workpiece W.

According to the above configuration, since the abutting portion 22a of the frame 22 is formed in a continuous annular shape in a plan view (bottom view), when the work W in a state where the molding resin R is supplied from the dispenser 6 to the upper surface (here, the mounting surface of the electronic component Wb) is transported by using the loader 4, an effect of preventing gas from passing over the moving work W can be obtained. This prevents the molding resin R from flying and scattering, and thus prevents the generation of particles (dust) floating in the resin molding apparatus 1. Therefore, the occurrence of poor molding due to the particles can be prevented.

The control unit performs the following control. Specifically, the pressing force and pressing speed when the frame 22 is in contact with the workpiece W may be controlled on the preliminary heating stage 10a (any control may be performed).

Then, the chuck 32 of the present embodiment includes the following structure: the support member is disposed in a ring shape in plan view, and is supported by being abutted against the outer edge of the workpiece W at a plurality of points spaced at regular intervals in a direction along the side of the workpiece W. Specifically, eight-point supported (eight) chuck jaws 32a are provided at equal intervals on each side, corresponding to the rectangular workpiece W. For example, in the case where two points are supported by the minimum number of sides when the workpiece is stably held by two sides, that is, each side, it is considered that the distance between the points supported in the workpiece as large as more than 400mm on each side exceeds 100mm, and it is considered that the workpiece W is bent between the points supported. In the structure of the present invention, if such bending of the work W occurs, there may be a problem that the carrier Wa is separated from the frame 22 and the molding resin R on the work W falls out from the gap.

In contrast, according to the above-described structure, as shown in fig. 3, such a gap can be prevented from being generated by supporting each side with the eight-point chuck jaws 32 a. However, the present invention may be applied to a case where each side is not supported by the eight-point chuck jaws 32 a. As a minimum limit for preventing the carrier Wa from separating from the housing 22, it is necessary to provide chuck claws 32a having two points at both ends of one side and one point in the middle, in total, three or more points. The number of the chuck claws 32a can be arbitrarily set according to the length of one side of the carrier Wa, the material thereof, the thickness thereof, the weight of the electronic components or the like on the carrier Wa or the molding resin R, the arrangement of these, the force with which the abutting portion 22a is pressed against the carrier Wa, the area in which the carrier Wa is sandwiched by the chuck claws 32a and the frame body 22, and the like. With this structure, the workpiece W can be prevented from being bent between the adjacent chuck jaws 32 a. In the configuration of fig. 3, for example, the width dimension of the chuck claws 32a in a plan view is set to about 20 mm.

Further, the chuck 32 of the present embodiment is configured such that a plurality of chuck claws 32a provided on one side (for example, side U in fig. 3) are integrally formed on the rear end side (the side opposite to the side facing the workpiece W). This allows the chuck claws 32a to integrally advance and retract with respect to the plane of planar projection of the workpiece W. Therefore, a mechanism (second moving device 34 described below) for moving the chuck jaws 32a can be simply configured. Further, the chuck claws 32a may be positioned at the same height to clamp uniformly.

Here, the second moving device 34 of the present embodiment is configured so that the chuck 32 (here, the chuck claws 32a) can obtain a position close to the workpiece W with a predetermined gap (L in fig. 2 is about 1.7 mm) so as to enter the plane of projection of the workpiece W and not to abut the lateral outer peripheral portion of the workpiece W, and a position apart from the workpiece W. Specifically, the chuck jaws 32a are configured to be horizontally moved (moved in the X-Y direction) by a driving mechanism (not shown) (for example, an air cylinder). However, the present invention is not limited to the above configuration, and a configuration including a rotation shaft (not shown) for rotating the chuck jaws 32a, a configuration in which horizontal movement and rotational movement are combined and moved, or the like is also conceivable.

As described above, the workpiece W placed on the transfer position Q and the preheater 10 can be held by the loader 4 by the movable structure of the chuck 32 (the chuck jaws 32 a). Further, by the configuration in which the chucks 32 (chuck claws 32a) are brought close so as not to abut against the lateral outer peripheral portion of the workpiece W, the position at which the workpiece W is held by the loader 4 can be corrected.

As described above, when the workpiece W is conveyed from the conveying position Q onto the preheater 10 and when the workpiece W is conveyed from the preheater 10 into the mold 12 (here, onto the lower mold), the outer edge portion of the workpiece W is held between the frame 22 and the chuck 32 and conveyed. Therefore, a retreat groove 10d is provided at a corresponding position (a position directly below the chuck claw 32a in a plan view) of the preheating stage 10a and the mold 12 (lower mold), and the retreat groove 10d advances and retreats the chuck 32 (the chuck claw 32a) in a state where the lower surface of the workpiece W (here, the non-mounting surface of the electronic component Wb) is in contact with a predetermined mounting surface. Although not shown, a retraction groove 10d for retracting the chuck 32 (chuck claws 32a) may be provided in the lower mold. Thus, the workpiece W can be placed in contact with the preheating stage 10a and the mold 12 (lower mold).

As described above, the outer diameter of the work W to be resin-molded is not limited to one. Therefore, the frame 22 and the chuck 32 are prepared in a plurality of combinations corresponding to a plurality of kinds of works W having different outer diameter dimensions. Further, the loader 4 is configured to be attachable and detachable and operable in various combinations. Thus, a plurality of kinds of works W having different outer diameter dimensions can be resin-molded by one resin molding apparatus of the present embodiment.

As described above, according to the resin molding apparatus of the present invention, the warpage of the workpiece can be corrected at the time of preheating or the like. Therefore, the productivity can be improved and the occurrence of molding failure can be prevented.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention. In particular, although the case where a plurality of semiconductor chips are mounted in a matrix on a rectangular carrier has been described as an example of the work, the work is not limited to this. For example, resin molding can be similarly performed using a work such as another member instead of the carrier as the mounted member, or using another element instead of the semiconductor chip as the mounted member. Further, the larger the work, the more likely the bending occurs, but the work is not necessarily as large as 500mm on one side, and the structure of the present invention can be applied to a work smaller than the work in an extremely thin substrate.

Further, the resin molding apparatus of the compression molding system in which the upper mold has the cavity is described as an example, but the present invention is also applicable to a structure in which only the lower mold has the cavity, a transfer molding system, or the like.