阅读说明：本技术 基板材料的蚀刻装置 (The Etaching device of baseplate material ) 是由 山崎祐二 于 2019-03-28 设计创作，主要内容包括：本发明提出一种基板材料的蚀刻装置,其中,第1,提高蚀刻因子、蚀刻率,第2,维持蚀刻均匀性,第3,与它们同时地确保运送稳定性。关于蚀刻装置(11),从喷雾喷嘴(4)将蚀刻液B喷射于运送的基板材料A而进行蚀刻,具有坝辊(10)、(12)、阻液棒(13)、联结夹具(14)。而且,通过设定喷雾喷嘴(4)与基板材料A间的上下间隔距离E,提高蚀刻因子、蚀刻率。而且,尽管进行此设定,但还是通过设定喷雾喷嘴(4)的左右节距间隔F、倾斜喷射角度α,通过配设上下坝辊(10)、(12)、阻液棒(13),维持蚀刻均匀性。而且,尽管配设坝辊(10)、(12),但还是通过配设联结夹具(14),从而确保基板材料A的运送稳定性。(The present invention proposes a kind of Etaching device of baseplate material, wherein the 1st, raising etching factor, rate of etch, and the 2nd, maintenance etch uniformity, the 3rd, simultaneously ensure to transport stability with them.About Etaching device (11), etching solution B is sprayed into the baseplate material A in transport from spray nozzle (4) and is etched, there are dam roller (10), (12), blocking solution stick (13), be coupled fixture (14).Moreover, improving etching factor, rate of etch by the spacing distance E up and down between setting spray nozzle (4) and baseplate material A.And, although carrying out this setting, but etch uniformity is maintained by the way that upper and lower dam roller (10), (12), blocking solution stick (13) are arranged by the left and right pitch interval F of setting spray nozzle (4), inclination spray angle α.Moreover, although dam roller (10), (12) are arranged, but it is coupled fixture (14) by being arranged, so that it is guaranteed that the transport stability of baseplate material A.)

1. a kind of Etaching device of baseplate material, which is characterized in that

The Etaching device of the baseplate material is: using in the manufacturing process of electronic circuit board, and by from spraying spray Mouth sprays etching solution in the baseplate material two sides transported by conveyer, thus the Etaching device being etched,

The Etaching device of the baseplate material have upper and lower dam roller, the blocking solution stick of upside, downside connection fixture,

About the conveyer, which is clamped by upper and lower wheel subgroup and transported, about the spray nozzle, in institute It is opposed to setting position in each spraying area on the baseplate material transported, configuration is multiple in top to bottom, left and right, front and rear, and direction Left direction or right direction are obliquely tilted and are arranged,

It about the dam roller, is made of straight roll, is configured in couples by the spraying area and front and back, and be contacted with and transported The baseplate material and be arranged, the etching solution that thus control is ejected the upper surface of the baseplate material, lower surface forwards, backwards The case where flowing,

About the blocking solution stick, the case where control etching solution is crossed the dam roller and flowed out forwards, backwards,

It is multiple in left and right, front and back arranging about the connection fixture, thus the lower surface of the baseplate material transported is supported Connect holding.

2. the Etaching device of baseplate material according to claim 1, which is characterized in that

Spacing distance up and down between the spray nozzle and the baseplate material is set as 30mm or more~80mm hereinafter, thus making The etching solution is obtained to spray with the spray hits power of thump in the baseplate material.

3. the Etaching device of baseplate material according to claim 2, which is characterized in that

About the spray nozzle, spraying pressure is 0.1MPa or more~0.3MPa hereinafter, mutual left and right pitch interval is 30mm or more~60mm is hereinafter, inclination spray angle is set as 10 degree or more~30 degree or less.

4. the Etaching device of baseplate material according to claim 3, which is characterized in that

About the connection fixture, substantially stringer board shape is presented, is crossed between the dam roller and the axis of the wheel before and after it, in front and back It is from contacts-side-down in the baseplate material transported near the dam roller that the upper end-face edge of substantially linear is presented on direction Lower surface.

5. the Etaching device of baseplate material according to claim 4, which is characterized in that

By setting the above-mentioned spacing distance up and down between the spray nozzle and the baseplate material, to improve etching factor and erosion Quarter rate,

Above-mentioned spacing distance up and down is set to even now, but between the above-mentioned left and right pitch by setting the spray nozzle Every, above-mentioned inclination spray angle and by the way that the dam roller, the blocking solution stick is arranged, so that etch uniformity is maintained,

The upper and lower dam roller is arranged to even now, but by the way that the connection fixture is arranged, so that it is guaranteed that the baseplate material Transport stability.

6. the Etaching device of baseplate material according to claim 5, which is characterized in that

The dam roller is driven and is arranged opposed up and down, thus clamps the baseplate material and is transported, thus into one Step ensures the transport stability of the baseplate material.

Technical field

The present invention relates to the Etaching devices of baseplate material.That is, being related to used in the manufacturing process of electronic circuit board The Etaching device of baseplate material.

Background technique

" technical background "

It is miniaturization, very thin about printed circuit board, the other electronic circuit board used in the electronic device The progress of change, flexibility etc. is significant, and densification, the miniaturization for being formed by electronic circuit are also significant.

The representative manufacturing process of such electronic circuit board is as described below.Firstly, by copper-clad laminated board shape At baseplate material on be coated with or paste photonasty resist (anti-etching dose).

Then, the negative film of alignment circuit is exposed, using developing procedure by addition to the resist of circuitry forming part with Outer resist dissolves removal.Then, the copper other than the copper foil of circuitry forming part that will be exposed using etching work procedure Foil melts removal, and the resist of circuitry forming part is then dissolved removal using stripping process.

The copper foil of the remaining circuitry forming part on baseplate material outer surface is utilized to form electronic circuit, manufacture as a result, Electronic circuit board.

" Etaching device 1 of general example "

(2) of Fig. 6 illustrate, and Etaching device 1 is general used in the manufacturing process of such electronic circuit board Example.

In the Etaching device 1, by the transport of wheel 3 by conveyer (conveyer) 2, and will from spray nozzle 4 Etching solution B is sprayed in workpiece, that is, baseplate material A upper and lower surface, to be etched.

In figure, 5 be chamber, and 6 be liquid bath, and 7 be atomizing pump, and 8 be injection spray pipe (spray tube).C indicates carriage direction (front and back To), D indicates up and down direction.

" Etaching device 9 of previous example "

So, (2) of Fig. 3, Fig. 4, Fig. 5 illustrate the previous example of Etaching device 9.At 9 aspect of the Etaching device, also with it is upper The Etaching device 1 for the general example stated is equally, from multiple spray nozzles 4 is configured in top to bottom, left and right, front and rear, by spraying Area Z sprays etching solution B in the two sides for the baseplate material A for carrying out horizontal transport by the wheel 3 of conveyer 2, to be lost It carves.

Moreover, the E of spacing distance up and down of spray nozzle 4 and baseplate material A are 90mm or more according to above-mentioned general example, Mutual left and right pitch interval F is 70mm or more, and injection pressure is set as upside 0.18MPa, downside 0.16MPa.Downside Spray nozzle 4 does not tilt, and is arranged perpendicular to baseplate material A.

However, different from general example above-mentioned, in upside, spray nozzle 4 is, compared to vertical in the Etaching device 9 The spray angle α obliquely tilted for straight alternately towards left and right directions G (referring to (2) figure of Fig. 5).

In addition, the dam roller (dam roll) 10 of straight roll (straight roll) system passes through spray nozzle 4 in upside Spraying area Z and front and back configures in couples, and be contacted with the transported upper surface baseplate material A and be arranged.

Summary of the invention

The project solved is wanted in invention

However, for the Etaching device 9 of such previous example, someone indicates following the 1st, the 2nd, the 3rd project.

" the 1st: the raising of etching factor, rate of etch "

1st, the requirement that etching factor improves, rate of etch improves becomes strong.

That is, as previously mentioned, densification, the progress of miniaturization are aobvious in terms of electronic circuit board and its electronic circuit It writes, people expect further improvement, a greater degree of improvement of rate of etch of etching factor strongly.

Their further progresss are described in detail.About the pattern for being formed by electronic circuit, section is shown in (2) figure of Fig. 7 It is the ideal example of rectangle.(3) it is shown in figure comprising the good example with the approximate section of rectangle.In contrast, it is shown in (4) figure The poor example of the trapezoidal shape of high-dipping is presented in section.In figure, L is circuit width (bottom width), and T is that (top is wide for top surface width Degree), S is space between circuit, and H is circuit height (depth).

Moreover, about Etaching device 9, in the past, in order to cope in the circuit K for promoting densification, miniaturization, thus it is strong Ground, which expects, realizes the higher etching of precision, that is, being formed such as is approximate rectangular by section retrofit shown in (3) figure of Fig. 7 Circuit K pattern.The demand for more improving etching factor (Etch Factor) becomes strong.

In addition, improving in this wise, the speed of etching, the demand of raising rate of etch (Etch Rate) is also strong to a greater degree.

" the 2nd: the maintenance of etch uniformity "

2nd, the maintenance of etch uniformity becomes project.

So, by making etching solution B using spray hits power (the etching solution B sprayed from spray nozzle 4 of more thump Hit, intensity of injection when baseplate material A), to realize that above-mentioned etching factor improves, rate of etch improves.Moreover, passing through So that the E of spacing distance up and down between spray nozzle 4 and baseplate material A more becomes closely, to realize the spray hits power of thump.

That is, in the Etaching device 9 of previous example, by making spray nozzle 4 closer to baseplate material A, that is, pass through It is set in previous example shortlyer, the spacing distance E up and down that is 90mm or more in general example, so that strong spray hits power can be realized And etching factor, rate of etch improve.

But when making that spacing distance E becomes close up and down, then it is aggrieved and deteriorate to generate etch uniformity (Uniformity) Such problems.

This problem further progress is described in detail.About the etching solution B ejected, in the state of normal, in substrate material Expect the upper surface of A, the outer surface of lower surface is flowed on G in left and right directions, baseplate material A is etched, is then flowed from the left and right sides Under, discharge, be thus successively updated to fresh liquid.

When in contrast, so that spray nozzle 4 approaches and reinforces spray hits power more, then become easy in institute's shape At circuit K depth and width on generate deviation, become easy damage etch uniformity.

That is, about the upper surface of baseplate material A, the outer surface of lower surface, cause to be etched because of following situations Excessively insufficient, Chi Su, the situation are as follows: whether a. is in the underface of spray nozzle 4, thus in the spray hits of etching solution B Difference is generated in terms of power, b. hinders the flowing of etching solution B, updates, and c. etching solution B disperses or on front-rear direction C Liquid accumulation, delay etc. occur for flowing, d..

At previous 9 aspect of Etaching device, the strategy for maintaining etch uniformity is also sought, that is, dam roller is set in upside 10 so that the spray nozzle 4 of upside tilt etc., control etching solution B the flowing of the upper surface baseplate material A strategy, But as insufficient for the countermeasure of strong spray hits power.

For example, there are following worries: under the action of strong spray hits power, so that etching solution B is from baseplate material A It rebounds, disperses in front-rear direction C.In addition, since the etching solution B that ejects occurs that nature is fallen, being self-possessed falls, thus etching In terms of the lower surface of the uniformity baseplate material A that there is no problem, it is also possible to generate and ask in the case where strong spray hits power Topic.

Someone indicates, with etching factor, the raising of rate of etch, causes etch uniformity undermined, becomes big Project.

" the 3rd: transporting ensuring for stability "

3rd, transporting stability ensures to become project.

About electronic circuit board and baseplate material A, the progress of lightweight, very thinization, flexibility etc. is significant.Moreover, In Etaching device 9, baseplate material A is clamped by 3 groups of upper and lower wheel of conveyer 2 and is transported.

In contrast, as described above, the strategy of the etch uniformity as the maintenance upper surface baseplate material A, is provided with dam Roller 10, but respective degrees and alternatively, the use of the wheel 3 of upside is controlled, make its lack, delete.This is Due to substituting wheel 3 provided with dam roller 10.

In addition, the strategy as the etch uniformity for maintaining the lower surface baseplate material A, also studied, in major part New setting dam roller substitutes wheel 3, but respective degrees and alternatively, the use of the wheel 3 of downside will be controlled, It is set to lack, cut down.

In this respect, the worry for transporting lightweight, the significant baseplate material A of very thinization can not be stablized by generating, and be also noted Baseplate material A's in transit falls equal danger.

Therefore, although improving etching factor above-mentioned, rate of etch, and etch uniformity is maintained, but required The transport stability for ensuring baseplate material A, becomes big project.

" about the present invention "

The Etaching device of baseplate material of the invention is, in view of such actual situation, in order to solve the above-mentioned prior art Project and complete.

Moreover, it is an object of the invention to propose a kind of Etaching device of baseplate material, wherein the 1st, improve etching because Son, rate of etch, the 2nd, maintenance etch uniformity, the 3rd, simultaneously ensure to transport stability with them.

Solution for solving the problem

" about each technical solution "

If recorded in art solutions, the technical mechanism of the invention for solving such project is as described below.

Technical solution 1 is as described below.

The Etaching device of baseplate material about technical solution 1, which is characterized in that in the manufacturing process of electronic circuit board Middle use, by spraying from spray nozzle by etching solution in the baseplate material two sides transported by conveyer, to be etched.And And with upper and lower dam roller, the blocking solution stick of upside, downside connection fixture.

About the conveyer, which is clamped by upper and lower wheel subgroup and transported.

About the spray nozzle, be opposed to setting position in each spraying area on the baseplate material transported, up and down, Left and right, front and back configuration are multiple, and obliquely tilt and be arranged towards left direction or right direction.

It about the dam roller, is made of, is configured in couples by the spraying area and front and back, and be contacted with and transported straight roll The baseplate material that send and be arranged, the etching solution that thus limit injection goes out the upper surface of the baseplate material, following table forward After the case where flowing.

About the blocking solution stick, the case where etching solution is crossed the dam roller and flowed out forwards, backwards is limited.

About the connection fixture, be arranged in left and right, front and back it is multiple, thus by the lower surface of the baseplate material transported into Row, which abuts, to be kept.

Technical solution 2 is as described below.

In terms of the Etaching device of the baseplate material of technical solution 2, which is characterized in that in the technical program 1, by the spray Spacing distance up and down between atomizing nozzle and the baseplate material is set as 30mm or more~80mm hereinafter, so that the etching solution It is sprayed with the spray hits power of thump in the baseplate material.

Technical solution 3 is as described below.

In terms of the Etaching device of the baseplate material of technical solution 3, which is characterized in that in the technical program 2, about this Spray nozzle, injection pressure be 0.1MPa or more~0.3MPa hereinafter, mutual left and right pitch interval be 30mm or more~ 60mm is hereinafter, inclination spray angle is set as 10 degree or more~30 degree or less.

Technical solution 4 is as described below.

In terms of the Etaching device of the baseplate material of technical solution 4, which is characterized in that in the technical program 3, about this It is coupled fixture, substantially stringer board shape is presented, is crossed between the dam roller and the axis of the wheel before and after it, presents in the longitudinal direction The upper end-face edge of substantially linear is from contacts-side-down in the lower surface of the baseplate material transported near the dam roller.

Technical solution 5 is as described below.

In terms of the Etaching device of the baseplate material of technical solution 5, which is characterized in that in the technical program 4, by setting Above-mentioned spacing distance up and down between the fixed spray nozzle and the baseplate material, to improve etching factor and rate of etch.

Above-mentioned spacing distance up and down is set to even now, but passes through the above-mentioned left and right pitch of the setting spray nozzle Interval, above-mentioned inclination spray angle and by be arranged the dam roller, the blocking solution stick, to maintain etch uniformity.

The upper and lower dam roller is arranged to even now, but by the way that the connection fixture is arranged, so that it is guaranteed that the substrate material The transport stability of material.

Technical solution 6 is as described below.

In terms of the Etaching device of the baseplate material of technical solution 6, which is characterized in that in the technical program 5, the dam roller It is driven and is arranged opposed up and down, thus the baseplate material is clamped and is transported, thereby further ensures that the base The transport stability of plate material.

" about effect etc. "

The present invention includes such mechanism, thus becomes as described below.

(1) it in terms of Etaching device, sprays from spray nozzle by etching solution in the two of the baseplate material transported by conveyer Face, to be etched.

(2) and in the present invention, the spacing distance up and down between spray nozzle and baseplate material is set as 30mm~80mm.

(3) due to approaching the two in this wise, thus etching solution is sprayed with strong spray hits power in baseplate material, Improve etching factor, rate of etch.

(4) the injection pressure of spray nozzle is 0.1Mpa~0.3Mpa, in the state of not improving its ability, is realized in this way Strong spray hits power.

(5) however, the present invention combines use: the intensive left and right pitch interval of upper and lower dam roller, blocking solution stick, spray nozzle 10 degree~30 degree of the inclination spray angle etc. of 30mm~60mm and spray nozzle.

(6) therefore, it although etching solution is sprayed with strong spray hits power, but can prevent: towards the dispersing of front and back, flow Out, the generation of difference, liquid accumulation, delay etc. is impacted.About etching solution, as desired like that in left and right flowing thus by substrate Then material etches are flowed down from two sides, are discharged, are updated.

The excessive insufficient, Chi Su for avoiding etching as a result, without deviation forms circuit, maintains etch uniformity.

(7) however, in the present invention, provided with many dam rollers, respective degrees and alternatively, by the wheel of conveyer Using being controlled, it is made to lack, cut down.

(8) therefore in the present invention, it is coupled fixture to protect the baseplate material transported near dam roller from downside It holds and supports.

In addition, the baseplate material that upper and lower dam roller is transported by clamping, to support to transport.Although reducing wheel as a result, Subnumber, but ensure to transport stability.

(9) it about Etaching device of the invention, as described above, although improving etching factor, rate of etch, but ties up Hold etch uniformity.Moreover, although maintaining etch uniformity, but ensure to transport stability.

(10) therefore, the Etaching device of baseplate material of the invention plays following effect.

The effect of invention

" the 1st effect "

1st, improve etching factor, rate of etch.

About Etaching device of the invention, the spacing distance up and down between spray nozzle and baseplate material is closer set, Etching solution is sprayed with the spray hits power of thump in baseplate material.

Therefore, it improves etching factor and also improves rate of etch, can really and quickly respond in promoting densification, micro- The circuit substrate of refinement.

" the 2nd effect "

2nd, maintain etch uniformity.

About Etaching device of the invention, dam roller is also arranged in downside, blocking solution stick is arranged in upside, about spraying by spraying up and down Mouth densely sets left and right pitch interval, and tilts and be arranged.

The excessive insufficient, Chi Su for avoiding etching as a result, without deviation forms circuit.As described above, in order to improve etching The factor, rate of etch, thus make spray nozzle close to baseplate material, although improving spray hits power, but maintain etching Uniformity.

" the 3rd effect "

3rd, simultaneously ensure to transport stability with them.

About Etaching device of the invention, it is equipped with connection fixture, baseplate material is kept from downside and supports to transport It send.In addition, baseplate material is clamped and supports to transport by upper and lower dam roller.

Therefore, in order to maintain etch uniformity, thus dam roller is arranged in the up-down direction as described above, although respective degrees Ground is controlled the use of wheel, but transport stability is made not change and be ensured.

In this wise, the effect that the present invention is played, for example, such project existing in the prior art is all solved, Enhance significantly.

Detailed description of the invention

Fig. 1: being the side of major part for illustrating the specific embodiment of the Etaching device of baseplate material of the invention Explanatory diagram.

Fig. 2: for illustrating the specific embodiment, (1) figure is the plane explanatory diagram of major part, and (2) figure is main portion The bottom surface explanatory diagram divided.

Fig. 3: being the side illustration figure of major part for illustrating previous example.

Fig. 4: for illustrating previous example, (1) figure is the plane explanatory diagram of major part, and (2) figure is the bottom surface of major part Explanatory diagram.

Fig. 5: (1) figure is the positive explanatory diagram of major part for illustrating the specific embodiment.(2) figure is for illustrating Previous example is the positive explanatory diagram of major part.

Fig. 6: (1) figure is the side view for being coupled fixture for illustrating the specific embodiment.(2) figure is Etaching device The side view of general example.

Fig. 7: for illustrating electronic circuit board.And (1) figure is plane explanatory diagram.(2) figure, (3) figure, (4) figure are electricity The cross section explanatory diagram being exaggerated on road, (2) illustrate ideal example, and (3) illustrate good example, and (4) illustrate the example gone on business.

Fig. 8: being the cross-section photograph of circuit for illustrating electronic circuit board.And (1) figure is for illustrating the specific implementation Mode, (2) figure is for illustrating previous example.

Fig. 9: being the curve graph of rate of etch for illustrating the specific embodiment.

Specific embodiment

Hereinafter, referring to attached drawing and the present invention will be described in detail.

" the content of present invention "

Firstly, the content of present invention is as described below.

About the Etaching device 11 of baseplate material A of the invention, used in the manufacturing process of electronic circuit board J, from Spray nozzle 4 sprays etching solution B to be etched in the two sides of the baseplate material A transported by conveyer 2.And have up and down Dam roller 10,12, the blocking solution stick 13 of upside, downside connection fixture 14.

Moreover, firstly, by the spacing distance E up and down between setting spray nozzle 4 and baseplate material A, to improve etching The factor, rate of etch.

Moreover, even now set spacing distance E up and down, but by between the left and right pitch of setting spray nozzle 4 Every F, inclination spray angle α, and by the way that upper and lower dam roller 10,12, blocking solution stick 13 is arranged, to maintain etch uniformity.

Moreover, even now upper and lower dam roller 10,12 is arranged, but be coupled fixture 14 by being arranged, so that it is guaranteed that The transport stability of baseplate material A.

In this wise, although the present invention improves rate of etch, etching factor, but etch uniformity is maintained.Moreover, although Etch uniformity is maintained, but ensures to transport stability.

The content of present invention is as described above.Hereinafter, the Etaching device 11 to such baseplate material A of the invention is further It is described in detail.

" about electronic circuit board J "

Etaching device 11 of the invention is used in the manufacturing process of electronic circuit board J.Therefore firstly, joining in advance Electronic circuit board J is generally illustrated according to Fig. 7.

About the electronic circuit boards J such as printed circuit board, the progress of miniaturization, very thinization, flexibility etc. is significant, Densification, the miniaturization of the electronic circuit K of formation is also significant.

Moreover, the baseplate material A used in its manufacturing process, comprising being obtained and sticking copper foil in insulating substrate Copper-clad laminated board.Moreover, the base of 500mm × 400mm size, 600mm × 500mm size, thickness 0.06mm × 1.6mm or so Plate material is representative.

About being formed by electronic circuit K, circuit width (bottom width) L space S between 5 μm~40 μm or so, circuit Become more for 5 μm~40 μm or so, the electronic circuit that circuit height (depth) H is 12 μm~35 μm or so.

About electronic circuit board J, it is included the outer two sides substrate for forming electronic circuit K, is divided into the rigidity of hard The flexible model of model and film-form, but further also there is the electronic circuit board of multilayer model, various other models. About the present invention, other than the printed circuit board since the past, it is also widely applicable for the electronics of such various models Circuit K.

Manufacturing method about such electronic circuit board J, it is known that subtractive process (subtractive method) (reference Background technique column above-mentioned), semi-additive process (semiadditive method), various other manufacturing methods, the present invention is suitable for Such each manufacturing method.For example, be also used in half-etching (half etching), soft etching (soft etching), quickly It etches in (quick etching) etc..

Electronic circuit board J is as described above.

" Etaching device 11 "

Hereinafter, illustrating Etaching device 11 of the invention.Firstly, referring to Fig.1, (1) figure of Fig. 2, Fig. 5 etc., to Etaching device 11 progress are generally described.

About Etaching device 11, using by being sprayed from upper and lower in the manufacturing process of above-mentioned electronic circuit board J Nozzle 4 sprays etching solution B in the upper and lower surface for the baseplate material A for carrying out horizontal transport by conveyer 2, to be etched place Reason.

Etching solution B includes copper chloride, and iron chloride, other corrosive liquids melt the foil section exposed in baseplate material A Solution removal.About the etching solution B after etching process, as also illustrated that in (2) figure of Fig. 6, flowed towards the liquid bath 6 of chamber 5 Under, recycle, store, then via atomizing pump 7, filter, injection spray pipe 8 etc., towards spray nozzle 4 carry out circulation supply and again It uses.

Conveyer 2 clamps baseplate material A by 3 groups of upper and lower wheel, transports in carriage direction (front-rear direction) C.About Wheel 3, including, for example, the driven ring wheel of diameter 32mm, in front and rear, left and right, up and down be arranged it is multiple.

Many wheels 3 are only disposed in upside, In in accordingly setting position up and down on the spraying area Z of downside Downside is only disposed under the spraying area Z of upside.Each wheel 3 is respectively arranged in wheel shaft 15.

Each wheel shaft 15 is alternatively arranged in carriage direction C with equal pitch.Needless to say, be arranged dam roller 10,12 position, Do not arrange.Dam roller 10,12 is arranged position and has contained the arrangement of wheel shaft 15 and the arranging of wheel 3.That is, this is because matching If dam roller 10,12 substitutes wheel shaft 15, wheel 3.

Moreover, each wheel shaft of (width direction) G in left and right directions is arranged in such as 15 wheels 3 respectively with equal pitch interval 15, but being disposed in the wheel 3 near the spraying area Z of downside becomes less several.

That is, in downside, the baseplate material A's that is transported in order to prevent is fallen, thus for upside, in spraying area Wheel shaft 15 and wheel 3 is closer arranged in Z, but in order to avoid the obstruction of the injection as etching solution B, thus reduce wheel 3 numerical value and become few number.

Each wheel shaft 15 is erected between the stand frame (not shown) being provided with to left and right in chamber 5.It is explained, is transporting In the case where after sending direction (front-rear direction) C to observe, each wheel 3 positioned at front and back is with the position of a part stacked (overlap) Relationship is arranged.

The general remark of Etaching device 11 is as described above.

" about spray nozzle 4 "

Firstly, referring to Fig.1, (1) figure of Fig. 2, Fig. 5 etc. is illustrated the spray nozzle 4 of Etaching device 11 of the invention.

About spray nozzle 4, be opposed to setting position in each spraying area Z on the baseplate material A transported, up and down, Left and right, front and back configuration are multiple, and obliquely tilt and be arranged towards left direction or right direction.

Moreover, by the E of spacing distance up and down between spray nozzle 4 and baseplate material A be set as 30mm or more~80mm with Under, so that etching solution B is sprayed with the spray hits power of thump in baseplate material A.

In addition, injection pressure is set as 0.1MPa or more~0.3MPa hereinafter, mutual left and right pitch interval F is set For 30mm or more~60mm hereinafter, inclination spray angle α is set as 10 degree or more~30 degree or less.

Such 4 further progress of spray nozzle is described in detail.About spray nozzle 4, in above-below direction D, left and right directions G, Front-rear direction C is arranged multiple.The spray nozzle 4 of illustrated example includes long nozzle.

Moreover, firstly, in the case where carriage direction (front-rear direction) C observation, spray nozzle 4 positioned at front and back it is mutual it Between be, by accordingly in the way of setting position, in the way of not forming column, not constituting (width direction) G in left and right directions On the positional relationship that deviates from a little.That is, be between the spray nozzle 4 of front and back, according on carriage direction (front-rear direction) C not The mode for lining up each 1 column is arranged with deviateing on G in left and right directions.

Position about baseplate material A by the spray hits power of the etching solution B ejected as a result, according to not in phase It is configured with the mode being stacked on track.

Moreover, spray nozzle 4 includes following each setting.

Firstly, about upper and lower spray nozzle 4 and by the baseplate material A in route (pass line) in upper and lower Spacing distance E up and down on D is respectively set as closer approaching.Etching solution B is sprayed as a result, with the spray hits power of thump It penetrates in baseplate material A (referring to Fig.1, (1) figure of Fig. 5).

Upper and lower spacing distance E is set as 30mm~80mm.In the case where 30mm, spray nozzle 4 becomes to get too close to The spray hits power difference, impact difference, strong and weak significant difference of baseplate material A, erosion are applied in baseplate material A, etching solution B Carve that liquid B rebounding on baseplate material A, dispersing also expands.

When in contrast, more than 80mm then too far, become impact deficiency, spray hits power deficiency, undercut on the whole.

Then, the injection pressure of upper and lower spray nozzle 4 is set as 0.1MPa~0.3MPa respectively.

Excessively weak in the case where less than 0.1MPa, the impact of etching solution B towards baseplate material A become insufficient, spray hits power Become insufficient, etching becomes insufficient.It is then too strong when in contrast, more than 0.3MPa, it is impact difference, spray hits power difference, strong Weakly heterogeneous is significantly changed, etching solution B rebounding on baseplate material A, expansion of dispersing.

Therefore for example, the injection pressure of the spray nozzle 4 of upside is set as 0.18MPa, the injection of the spray nozzle 4 of downside Pressure is set as 0.16MPa.

About upper and lower spray nozzle 4, be respectively facing carriage direction C it is successively arranged in rows obtained from respectively in column, it is left The left and right pitch interval F of right direction G is set as 30mm~60mm.

In the case where 30mm, the becoming difficult of arranging of spray nozzle 4.It is then mutual when in contrast, more than 60mm Interval it is excessively broad, according to far and near poor, impact difference, the spray hits power difference, power of etching solution B with spray nozzle 4 Significant difference.

About upper and lower spray nozzle 4, it is respectively facing left and right directions G and alternately, obliquely tilts arranging (referring to Fig. 2, figure 5 (1) figure).

That is, about each spray nozzle 4 for being provided in column towards carriage direction C, in each column in its each column, according to It is secondary, alternately towards the right direction or left direction of left and right directions G.Moreover, about toward right direction column with toward left To column, the column provided with identical quantity.

Such spray nozzle 4 is arranged by inclination, to promote to spray in the etching solution B direction left and right of baseplate material A The flowing of direction G.The update of promotion etching solution B is sought as a result, is eliminated liquid and is accumulated, eliminates and be detained.

Therefore inclination spray angle α is set as 10 degree~30 degree.Less than 10 degree, etching solution B can not be promoted Flowing, in contrast, when more than 30 degree, then the impact difference of etching solution B, spray hits power difference, strong and weak significant difference.

Spray nozzle 4 is as described above.

" about dam roller 10,12 "

In the following, referring to Fig.1, Fig. 2 is illustrated the dam roller 10,12 of Etaching device 11 of the invention.

About upper and lower dam roller 10,12, includes straight roll, configured in couples by the front and back spraying area Z, and be contacted with The baseplate material A that is transported and be arranged.The upper surface and the lower surface of the etching solution B that limit injection goes out as a result, in baseplate material A The case where flowing forwards, backwards.

In addition, dam roller 10,12 is driven, and is arranged opposed up and down, thus baseplate material A is clamped and is transported It send.

Such upper and lower dam roller 10,12 further progresss are described in detail.In the Etaching device 11, about with conveyer 2 Front and rear wheels 3 between centered on and formed each spraying area Z, i.e., each jet space of etching solution B, before and after it respectively at Dam roller 10,12 is arranged over the ground.

The column of each spray nozzle 4 corresponding to upside are separately equipped with the pairs of dam roller 10 in front and back, the spray corresponding to downside The column of atomizing nozzle 4 are separately equipped with the pairs of dam roller 12 in front and back.

The upper and lower dam roller 10,12 is for example made of the straight roll of diameter 16mm.And make axis toward left and right directions G And be arranged, driving is assigned, baseplate material A is contacted and rotates.

Moreover, multiple dam roller 10,12 prevents the etching solution B sprayed from spray nozzle 4 along the upper table of baseplate material A Face, lower surface are the case where front-rear direction C flows.That is, by make etching solution B only in left and right directions G flowing in the way of into Thus the update for promoting etching solution B is sought in row control, eliminate liquid and accumulate, eliminate and be detained.

In addition, upper and lower dam roller 10,12 is separately equipped in position opposite to each other up and down, will be transported as a result, by conveyer 2 Baseplate material A is clamped and is transported.The transport of the baseplate material A carried out about the wheel 3 using conveyer 2, by this The complementary support of the dam roller 10,12 of sample, can more stably transport.

Dam roller 10,12 is as described above.

" about blocking solution stick 13 "

In the following, referring to Fig.1, (1) figure of Fig. 2 is illustrated the blocking solution stick 13 of Etaching device 11 of the invention.For pipe The case where etching solution B processed crosses the dam roller 10 of upside and flows out forwards, backwards, thus multiple blocking solution sticks 13 are arranged in upside.

That is, blocking solution stick 13 is, fixed frame is carried out between the stand frame (not shown) of left and right, in left and right directions on G and is set, thus For each dam roller 10, there are the intervals of pettiness, and are arranged in higher position.

Therefore, each blocking solution stick 13 limits following situation: etching solution B is sprayed with the spray hits power of thump in substrate material Expect A, to rebound, disperse, overflow, thus crosses each dam roller 10 and flowed out in front-rear direction D.Merely with dam roller 10 to more The etching solution B that high position control has been overflowed.

About blocking solution stick 13, control is carried out in the way of etching solution B in left and right directions G flowing.That is, supplement is based on dam roller Effect above-mentioned obtained from 10, that is, promote to update, eliminate liquid and accumulate, eliminate and be detained.

Blocking solution stick 13 is as described above.

" about fixture 14 is coupled "

In the following, referring to Fig.1, (1) figure of (2) figure of Fig. 2, Fig. 6 etc., to the connection fixture 14 of Etaching device 11 of the invention It is illustrated.

Multiple connection fixtures 14 are arranged in the left and right of downside, front and back, thus by the lower surface of the baseplate material A transported into Row, which abuts, to be kept.

That is, being coupled fixture 14 is presented substantially stringer board shape, it is crossed between the dam roller 12 of downside and the wheel shaft 15 before and after it, In The upper end-face edge that substantially linear is presented in front-rear direction C is, from contacts-side-down in the substrate transported near the dam roller 12 The lower surface of materials A.

Such 14 further progress of connection fixture is described in detail.Stringer board shape is presented in the connection fixture 14 of illustrated example, and has Have 3 stop holes 16.Moreover, the stop hole 16 in center is embedded in the groove for being locked to and being formed in 12 periphery of dam roller, the card of front and back Only hole 16 is externally embedded to the wheel shaft 15 for being locked to 12 front and back of dam roller.

It is coupled fixture 14 as a result, to be crossed between each dam roller 12 of downside and the wheel shaft 15 before and after it.Moreover, upper end-face edge Substantially linear is presented in front-rear direction C, carries out abutting guarantor from downside by the lower surface baseplate material A being carried through in upside It holds.

About such connection fixture 14, it is directed to each dam roller 12 of downside respectively, is matched in left and right directions on G with equal pitch If.As a result, by carrying out abutting holding from downside, to support the transport of baseplate material A.

It is explained, about fixture 14 is coupled, also it is contemplated that the connection fixture of various compositions other than illustrated example. Such as be also possible to following composition: comprising 2 stop holes 16, a stop hole 16 is embedded in the groove for being locked to dam roller 12, separately One stop hole 16, which is externally embedded to, is locked to wheel shaft 15.

" effect etc. "

The Etaching device 11 of baseplate material A of the invention is constituted as explained above.Therefore become as following Like that.

(1) Etaching device 11 uses in the manufacturing process of electronic circuit board J.Moreover, being directed to by the 3 of conveyer 2 Workpiece that group wheel transports, i.e., the upper and lower surface of baseplate material A, from multiple spraying sprays has been arranged in top to bottom, left and right, front and rear Mouth 4 sprays etching solution B, so that the upper and lower surface of baseplate material A is etched (referring to Fig.1 etc.).

(2) so, about electronic circuit board J and electronic circuit K, densification, the progress of miniaturization are significant, by This, the requirement that etching factor improves, rate of etch improves more becomes strong.

In order to cope in such demand, in the Etaching device 11, use long nozzle as spray nozzle 4, and will Spray nozzle 4 and by the E of spacing distance up and down between the baseplate material A in route (pass line) be set as 30mm~ 80mm (referring to Fig.1, (1) figure of Fig. 5).It in contrast, is usually 90mm or more (reference in terms of the Etaching device of previous example 9 (2) figure of Fig. 3, Fig. 5).

(3) in this wise, so that closer approaching between spray nozzle 4 and baseplate material A, thus etching solution B is with thump Spray hits power spray in baseplate material A, thus by copper foil melt remove.

Accordingly, with respect to implement it is with high accuracy etching, by section retrofit be it is approximate rectangular obtained from circuit K, formed Pattern (referring to (3) figure of Fig. 7), improves etching factor.Further also shorten etch required for the time, improve etching speed with And rate of etch.

(4) moreover, this is the ability in the injection pressure, atomizing pump 7 (referring to (2) figure of Fig. 6) that do not improve spray nozzle 4 In the state of realize.The injection pressure (atomisation pressure) of spray nozzle 4 is as in the past 0.1MPa~0.3MPa or so.

(5) in addition, based on spacing distance E up and down close in this way, so that etching solution B is sprayed with strong spray hits power in base Plate material A, but maintain etch uniformity.

When being described in detail to them, then firstly, in the Etaching device 11, using following each structure.

Not only in upside but also in downside, it is all equipped with dam roller 10,12 (referring to Fig.1, Fig. 2).In contrast, in previous example Etaching device 9 in, (referring to Fig. 3, Fig. 4) only is arranged in upside.

Blocking solution stick 13 (referring to Fig.1, (1) figure of Fig. 2) is equipped in upside.

The left and right pitch interval F of upper and lower spray nozzle 4 is densely set as 30mm~60mm (referring to Fig. 2).With this phase It is right, in the Etaching device 9 of previous example, it is set as 70mm or more (referring to Fig. 4).

Upper and lower spray nozzle 4 is, to be set as 10 degree~30 degree of inclination spray angle α, has carried out inclination and (ginseng is arranged According to (1) figure of Fig. 5).In contrast, it in the Etaching device of previous example 9, is only arranged in incline upward (referring to (2) of Fig. 5 Figure).

(6) about this Etaching device 11, by combining using such dam roller 10,12, blocking solution stick 13, spray nozzle 4 Left and right pitch interval F and spray angle α, to maintain etch uniformity.

That is, although etching solution B is sprayed with strong spray hits power, upper surface, lower surface in baseplate material A, Or it will not disperse in front and back, flow, flow out, also eliminating impact difference, liquid does not occur and accumulates, be detained yet.As it is expected, So that G flows etching solution B in left and right directions, it etched baseplate material A, then flow down, be discharged from the left and right sides, be successively updated to Fresh liquid.

Although enhancing impact force, but the generation of excessive insufficient, the slow speed of etching is prevented, not had in depth and width Form circuit K with having deviation.In this wise, etch uniformity will not reduce, and not change in the past, unceasingly maintain.

(7) however, baseplate material A is clamped by 3 groups of wheels of conveyer 2 and transported.In contrast, in the present invention In, it is provided with many dam rollers 10,12 up and down to substitute wheel 3.

That is, about conveyer 2, respective degrees, the use cutting down and control wheel 3, many wheels 3 are to set The position for having set dam roller 10,12, partially lacked (by (2) figure of (2) figure of Fig. 1, Fig. 2 and Fig. 3, Fig. 4 of previous example into Row relatively compares).

Therefore, go down in this way, produce uneasiness in terms of the stable transport of baseplate material A.The lightweight of baseplate material A, Very thinization, flexibility are significant, especially the increase for lacking, cutting down of the wheel 3 of downside, so that the clamping of baseplate material A, holding Ability dies down and deficiency, for example, the danger etc. that baseplate material A in transit is fallen occurs.

(8) so, therefore, in the Etaching device 11, multiple connection fixtures 14 are arranged in left and right, the front and back of downside, Abutting holding (referring to Fig.1, Fig. 2 is carried out from downside by the baseplate material A that is transported near dam roller 10,12 by conveyer 2 (2) (1) figure etc. of figure, Fig. 6).

It is coupled the function that fixture 14 plays the transport for supporting the wheel 3 of conveyer 2 to baseplate material A.

In addition to this, although it is complementary, upper and lower each dam roller 10,12 also baseplate material A is clamped and It transports.About dam roller 10,12, as previously mentioned, playing the function of supporting etch uniformity, and also plays in this wise and support conveying Function of the machine 2 to the transport of baseplate material A.

In the Etaching device 11, using such connection fixture 14 and dam roller 10,12, although wheel 3 is reduced, but Enhance the holding of baseplate material A, holding capability, also without baseplate material A danger fallen etc., transport stability do not change and Ensured.

(9) as described above, Etaching device 11 of the invention is by setting spacing distance E up and down, thus improve etching because Son, rate of etch.

Moreover, although setting as carrying out, but by setting left and right pitch interval F, inclination spray angle α, leading to Arranging upper and lower dam roller 10,12, blocking solution stick 13 etc. are crossed, to maintain etch uniformity.

Moreover, although reducing 3 quantity of wheel, but utilize and be coupled fixture 14, upper and lower dam roller 10,12, to will not drop Low transport stability, ensures as in the past.

Effect of the invention etc. is as described above.