阅读说明：本技术 一种化学镀镍镀液 (A kind of chemical nickel-plating plating solution ) 是由 丁先峰 魏振峰 钟文波 于 2019-09-27 设计创作，主要内容包括：本发明提供一种化学镀镍镀液,包括开缸液,所述开缸液包括100ml/L的开缸剂、50ml/L的硫酸镍溶液、5ml/L的连四硫酸钾溶液；所述开缸剂包括0.28g/L的次磷酸钠、0.03g/L的苹果酸、0.08g/L的琥珀酸、0.08g/L的乳酸、0.10g/L的氨水以及余量的去离子水；所述硫酸镍溶液的浓度为450g/L；次亚磷酸钠溶液的浓度为500g/L；连四硫酸钾溶液的浓度为1g/L。本发明的化学镍药液稳定性良好；镀液沉积速率稳定；适用用于化学镍金制程对镍腐蚀的改善；有效的降低镍腐蚀不良,满足业界对产品可靠性的品质要求。(The present invention provides a kind of chemical nickel-plating plating solution, including opens cylinder liquid, described to open the tetrathionic acid potassium solution that cylinder liquid includes the open cylinder agent of 100ml/L, the nickel sulfate solution of 50ml/L, 5ml/L；The open cylinder agent includes the deionized water of the sodium hypophosphite of 0.28g/L, the malic acid of 0.03g/L, the succinic acid of 0.08g/L, the lactic acid of 0.08g/L, the ammonium hydroxide of 0.10g/L and surplus；The concentration of the nickel sulfate solution is 450g/L；The concentration of ortho phosphorous acid sodium solution is 500g/L；The concentration of tetrathionic acid potassium solution is 1g/L.Chemical nickel liquid medicine stability of the invention is good；Plating solution deposition rate is stablized；It is applicable in the improvement corroded for chemical nickel gold processing procedure to nickel；It is bad to effectively reduce nickel corrosion, meets industry to the quality requirements of product reliability.)

1. a kind of chemical nickel-plating plating solution, including open cylinder liquid, which is characterized in that it is described open open cylinder agent that cylinder liquid includes 100ml/L, The tetrathionic acid potassium solution of the nickel sulfate solution of 50ml/L, 5ml/L；

The open cylinder agent includes the sodium hypophosphite of 0.28g/L, the malic acid of 0.03g/L, the succinic acid of 0.08g/L, 0.08g/L The deionized water of lactic acid, the ammonium hydroxide of 0.10g/L and surplus；

The concentration of the nickel sulfate solution is 450g/L；The concentration of ortho phosphorous acid sodium solution is 500g/L；Tetrathionic acid potassium solution Concentration be 1g/L.

2. chemical nickel-plating plating solution according to claim 1, which is characterized in that the chemical nickel-plating plating solution further includes adding Liquid, the liquid of adding includes nickel sulfate solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution, and nickel sulfate Solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution are the ratio addition of 1:1:1:0.5 by volume；Institute The concentration for stating nickel sulfate solution is 450g/L.

3. chemical nickel-plating plating solution according to claim 2, which is characterized in that the pH adjusting agent includes the hydrogen of 0.18g/L Sodium oxide molybdena, the malic acid of 0.03g/L, the succinic acid of 0.06g/L, the lactic acid of 0.04g/L and surplus deionized water.

4. chemical nickel-plating plating solution according to claim 1, which is characterized in that the working ph values of the chemical nickel-plating plating solution are 4.2~4.5.

Technical field

The present invention relates to chemical plating nickel technology fields, specifically, refer to a kind of chemical nickel-plating plating solution.

Background technique

Chemical nickel plating with its simple process, be not necessarily to additional power source, good evenness；In high molecular material and inorganic non-gold Belong to and being deposited on a variety of nonmetal basal bodies such as material；The excellent performances such as corrosion resistance, wear-resisting property and binding force of cladding material be strong etc. are special Point is rapidly developed and is widely applied.The plating solution composition of chemical nickel plating is particularly significant, and the ingredient of common chemical nickel-plating liquid has Metal salt, reducing agent, complexing agent, buffer, stabilizer, pH adjusting agent etc..

The nickel layer lattice compactness that existing chemical nickel-plating plating solution plates out is insufficient, and phosphorus content only has 7% or so, is easy to produce The abnormal problem of nickel corrosion.

Summary of the invention

In view of this, may make nickel layer to crystallize the technical problem to be solved in the present invention is to provide a kind of chemical nickel-plating plating solution It is finer and close, while improving nickel etching problem.

In order to solve the above technical problems, the present invention is achieved by following technical solution:

A kind of chemical nickel-plating plating solution, including open cylinder liquid and add liquid, wherein

The cylinder liquid of opening includes that the open cylinder agent of 100ml/L, the nickel sulfate solution of 50ml/L, the potassium tetrathionate of 5ml/L are molten Liquid；

The liquid of adding includes nickel sulfate solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution, and sulphur Sour nickel solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution are that the ratio of 1:1:1:0.5 adds by volume Add；

The open cylinder agent include the sodium hypophosphite of 0.28g/L, the malic acid of 0.03g/L, 0.08g/L succinic acid, The deionized water of the lactic acid of 0.08g/L, the ammonium hydroxide of 0.10g/L and surplus；

The concentration of the nickel sulfate solution is 450g/L；The concentration of ortho phosphorous acid sodium solution is 500g/L；Potassium tetrathionate The concentration of solution is 1g/L；

The pH adjusting agent include the sodium hydroxide of 0.18g/L, the malic acid of 0.03g/L, 0.06g/L succinic acid, The lactic acid of 0.04g/L and the deionized water of surplus.

Preferably, the working ph values of the chemical nickel-plating plating solution are 4.2~4.5.

Malic acid is helpful for nickel coating compact crystallization, and the proportional quantity of malic acid and both lactic acid in the present invention can Plate out compactness more preferably nickel coating.

The advantageous effects of the above technical solutions of the present invention are as follows:

1, chemical nickel liquid medicine stability is good；

2, plating solution deposition rate is stablized；

3, it is applicable in the improvement corroded for chemical nickel gold processing procedure to nickel；

4, it is bad to effectively reduce nickel corrosion, meets industry to the quality requirements of product reliability；

5, nickel corrosion bring quality is reduced to withhold.

Detailed description of the invention

Fig. 1 for nickel plating bath institute plated product of the invention electron microscope picture.

Specific embodiment

To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with specific implementation Example is described in detail.

A kind of chemical nickel-plating plating solution, including build the bath stage open cylinder liquid and production operation maintenance in play supplementary function Add liquid.

Open the tetrathionic acid potassium solution that cylinder liquid includes the open cylinder agent of 100ml/L, the nickel sulfate solution of 50ml/L, 5ml/L；

The liquid of adding includes nickel sulfate solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution, and sulphur Sour nickel solution, ortho phosphorous acid sodium solution, pH adjusting agent and tetrathionic acid potassium solution are that the ratio of 1:1:1:0.5 adds by volume Add；

The open cylinder agent include the sodium hypophosphite of 0.28g/L, the malic acid of 0.03g/L, 0.08g/L succinic acid, The deionized water of the lactic acid of 0.08g/L, the ammonium hydroxide of 0.10g/L and surplus；

The concentration of the nickel sulfate solution is 450g/L；The concentration of ortho phosphorous acid sodium solution is 500g/L；Potassium tetrathionate The concentration of solution is 1g/L；

The pH adjusting agent include the sodium hydroxide of 0.18g/L, the malic acid of 0.03g/L, 0.06g/L succinic acid, The lactic acid of 0.04g/L and the deionized water of surplus.

Manufacturing parameter:

Temperature	78-82℃
		Ni2+	4.3-5.0g/L
PH value	4.2-4.5
		Bath load	0.2-0.8dm2/L

The picture of the product that nickel plating obtains under an electron microscope is as shown in Figure 1.It can be seen that product nickel layer lattice compactness.

The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art For, without departing from the principles of the present invention, several improvements and modifications can also be made, these improvements and modifications It should be regarded as protection scope of the present invention.