阅读说明：本技术 固态硬盘结构 (Solid state disk structure ) 是由 胡泊 于 2021-08-30 设计创作，主要内容包括：本发明公开一种固态硬盘结构,包括线路板和由绝缘树脂形成的壳体,线路板固定在壳体的顶部,其底部集成有嵌入壳体内的存储器和控制器,线路板的顶部的左侧集成有天线,天线和存储器均与控制器电连接,所述壳体的外部涂有第一电磁干扰阻断层,壳体内于存储器和控制器的下方设有第二电磁干扰阻断层,线路板的顶部涂有第三电磁干扰阻断层,线路板的边缘处设有连接至第一电磁干扰阻断层处的接地过孔,壳体于底部设有与穿孔连接的接地垫。本发明有效地改善电磁干扰阻挡性能,改善无线数据传输性能和特性,提高了整个固态硬盘；同时,使整个固态硬盘的结构和工艺更简单,有效地提高效率和减少成本。(The invention discloses a solid state disk structure, which comprises a circuit board and a shell formed by insulating resin, wherein the circuit board is fixed at the top of the shell, a memory and a controller which are embedded in the shell are integrated at the bottom of the circuit board, an antenna is integrated at the left side of the top of the circuit board, the antenna and the memory are electrically connected with the controller, a first electromagnetic interference blocking layer is coated outside the shell, a second electromagnetic interference blocking layer is arranged below the memory and the controller in the shell, a third electromagnetic interference blocking layer is coated at the top of the circuit board, a grounding through hole connected to the first electromagnetic interference blocking layer is arranged at the edge of the circuit board, and a grounding pad connected with a through hole is arranged at the bottom of the shell. The invention effectively improves the electromagnetic interference blocking performance, improves the wireless data transmission performance and characteristics, and improves the whole solid state disk; meanwhile, the structure and the process of the whole solid state disk are simpler, the efficiency is effectively improved, and the cost is reduced.)

1. A solid state disk structure, its characterized in that: the electromagnetic interference shielding device comprises a circuit board and a shell formed by insulating resin, wherein the circuit board is fixed at the top of the shell, a memory and a controller embedded in the shell are integrated at the bottom of the circuit board, an antenna is integrated at the left side of the top of the circuit board, the antenna and the memory are electrically connected with the controller, a first electromagnetic interference shielding layer is coated outside the shell, a second electromagnetic interference shielding layer is arranged below the memory and the controller in the shell, a third electromagnetic interference shielding layer is coated at the top of the circuit board, a grounding via hole connected to the first electromagnetic interference shielding layer is arranged at the edge of the circuit board, a first conductive substance used for electrically connecting the first electromagnetic interference shielding layer with an earth wire of the circuit board is filled in the grounding via hole, and the shell and the circuit board are provided with through holes vertically penetrating through the shell and the circuit board, the antenna is separated from the memory and the controller by the through hole, the bottom of the shell is provided with a grounding pad connected with the through hole, and a second conductive substance used for electrically connecting the second electromagnetic interference blocking layer, the third electromagnetic interference blocking layer, the grounding pad and the circuit board to a grounding wire is filled in the through hole.

2. The solid state disk structure of claim 1, wherein: the third electromagnetic interference blocking layer is disposed to the right of the perforation at the leftmost side of the housing.

3. The solid state disk structure of claim 2, wherein: the antenna is disposed to the left of the perforation at the leftmost side of the housing.

4. The solid state disk structure of any one of claims 1 to 3, wherein: the through holes are distributed on the shell and the circuit board in a matrix manner.

5. The solid state disk structure of any one of claims 1 to 3, wherein: the memory is formed by stacking a plurality of layers of NAND flash memories up and down.

Technical Field

The invention relates to the technical field of solid state, in particular to a solid state disk structure.

Background

The conventional Solid State Drive (SSD) NAND flash memory consists of a NAND flash memory, a controller for controlling the service life and the function of the NAND flash memory, power supply elements for controlling various power supplies of the Solid State Drive, power supplies of each controller and the NAND flash memory, active elements such as a power supply resistor and a power supply coil for stabilizing the safety of digital logic functions, a Printed Circuit Board (PCB) for installing the NAND flash memory for storing user data and various patch elements, and a connector or a slot for connecting the power supply and the data of the Solid State Drive. The solid state disk is easy to have a phenomenon of thought electromagnetic interference among various components when in use. The existing solid state disk adopts a plastic cover or a metal box to block electromagnetic interference, but the whole structure and the production cost of the solid state disk are influenced.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a solid state disk structure.

The technical scheme of the invention is as follows:

a solid state disk structure comprises a circuit board and a shell formed by insulating resin, wherein the circuit board is fixed at the top of the shell, a memory and a controller embedded in the shell are integrated at the bottom of the circuit board, an antenna is integrated at the left side of the top of the circuit board, the antenna and the memory are electrically connected with the controller, a first electromagnetic interference blocking layer is coated outside the shell, a second electromagnetic interference blocking layer is arranged below the memory and the controller in the shell, a third electromagnetic interference blocking layer is coated at the top of the circuit board, a grounding via hole connected to the first electromagnetic interference blocking layer is arranged at the edge of the circuit board, a first conductive substance used for electrically connecting the first electromagnetic interference blocking layer and a grounding wire of the circuit board is filled in the grounding via hole, and the shell and the circuit board are provided with vertical through holes penetrating through the shell and the circuit board, the antenna is separated from the memory and the controller by the through hole, the bottom of the shell is provided with a grounding pad connected with the through hole, and a second conductive substance used for electrically connecting the second electromagnetic interference blocking layer, the third electromagnetic interference blocking layer, the grounding pad and a grounding wire of the circuit board is filled in the through hole.

Preferably, the third electromagnetic interference blocking layer is arranged on the right side of the perforation located on the leftmost side of the housing.

Preferably, the antenna is located to the left of the aperture at the leftmost side of the housing.

Preferably, the through holes are distributed in a matrix on the housing and the circuit board.

Preferably, the memory is formed by stacking a plurality of layers of NAND flash memories one on top of the other.

Compared with the prior art, the invention has the beneficial effects that: the electromagnetic interference blocking layers are arranged on the outer surface of the shell, the top of the circuit board and the lower part of the circuit board, and are electrically connected with the grounding pad by utilizing the grounding via hole and the through hole, so that elements such as an antenna, a controller, a memory and the like on the circuit board can be separated, the electromagnetic interference blocking performance is effectively improved, the wireless data transmission performance and the wireless data transmission performance are improved, and the whole solid state disk is improved; meanwhile, the traditional metal box and other electric resistance breaking forms are avoided, the structure and the process of the whole solid state disk are simpler, the efficiency is effectively improved, and the cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of an overall structure of a solid state disk according to the present invention;

FIG. 2 is a schematic top view of a solid state drive according to the present invention;

fig. 3 is a schematic bottom structure diagram of the solid state disk of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

Example 1

As shown in fig. 1 to 3, the solid state disk structure of the present embodiment includes a circuit board 1 and a housing 2 formed by insulating resin, the circuit board 1 is fixed on the top of the housing 2, a memory 11 and a controller 12 embedded in the housing 2 are integrated on the bottom of the circuit board 1, an antenna 13 is integrated on the left side of the top of the circuit board 1, the antenna 13 and the memory 11 are both electrically connected to the controller 12, a first electromagnetic interference blocking layer 21 is coated on the outside of the housing 2, a second electromagnetic interference blocking layer 22 is disposed below the memory 11 and the controller 12 in the housing 2, a third electromagnetic interference blocking layer 23 is coated on the top of the circuit board 1, and of course, the bottom of the circuit board 1 may also be coated with an electromagnetic interference blocking layer. Edge of circuit board 1 is equipped with and is connected to 24 holes are crossed to the ground connection of first electromagnetic interference blocking layer 21 department, ground connection via hole 24 is filled and is used for first electromagnetic interference blocking layer 21 with the first conducting material that the earth connection electricity of circuit board 1 is connected, casing 2 with be equipped with on the circuit board 1 vertical running through casing 2 and circuit board 1's perforation 25, perforation 25 will antenna 13 with memory 11 the control 12 ware separates, casing 2 be equipped with in the bottom with the ground pad 26 that perforation 25 is connected, the perforation 25 intussuseption is filled with and is used for second electromagnetic interference blocking layer 22, third electromagnetic interference blocking layer 23 ground pad 26 with the second conducting material that the earth connection electricity of circuit board 1 is connected. The first electromagnetic interference blocking layer 21, the second electromagnetic interference blocking layer 22 and the third electromagnetic interference blocking layer 23 are made of the same electromagnetic interference blocking material, and the first conductive substance 2 and the second conductive substance are made of the same conductive material. Components such as an active element and a passive element are integrated on the wiring board 1, and the electrical connection of the active element, the passive element, the antenna 13, the memory 11, the controller 12, and the like is a common circuit connection. The memory 11 and the controller 12 may be separated by a perforation 25 as necessary, and electromagnetic interference between the two may be prevented. The third emi blocking layer 23 is disposed on the right side of the through hole 25 located on the leftmost side of the housing 2, and the antenna 13 is disposed on the left side of the through hole 25 located on the leftmost side of the housing 2, so as to mainly isolate the antenna 13 from other electronic components and prevent interference. In the solid state disk structure of the embodiment, the electromagnetic interference blocking layers are arranged on the outer surface of the shell, the top of the circuit board and the lower part of the circuit board, and are electrically connected with the grounding pad by utilizing the grounding via holes and the through holes, so that the elements such as an antenna, a controller, a memory and the like on the circuit board can be separated, the electromagnetic interference blocking performance is effectively improved, the wireless data transmission performance and the wireless data transmission performance are improved, and the whole solid state disk is improved; meanwhile, the traditional metal box and other electric resistance breaking forms are avoided, the structure and the process of the whole solid state disk are simpler, the efficiency is effectively improved, and the cost is reduced.

In this embodiment, the through holes 25 are distributed in a matrix on the housing 2 and the circuit board 1, and all the electronic components except the antenna 13 are wrapped in a rectangular ring to block the electromagnetic interference with the antenna 13. The memory 12 is formed by stacking a plurality of layers of NAND flash memories up and down, the plurality of layers of NAND flash memories are electrically connected, and the space can be saved by adopting a stacking mode.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.