阅读说明：本技术 一种特殊阻焊制作方法 (Special solder mask manufacturing method ) 是由 杨和斌 金功成 李强 华允均 于 2021-09-26 设计创作，主要内容包括：本发明公开了一种特殊阻焊制作方法。本发明中,第一次丝印制作要求：43T网板、湿膜厚度控制15-25um,丝印后平放静止30±15min在烤板,烤板要求72℃/5min。第二次喷涂制作要求：油墨粘度流量计32±1S,湿膜厚度控制60-70um,预烤隧道炉参数73℃/45min第一次制作使用网印制作第二次制作使用喷涂制作,减少生产周期时间,加快了生产速度,从而为生产者带来了更多的经济效益,同时也可以减少导致异物报废,节约了生产过程中的原料损耗,降低了生产成本。(The invention discloses a special solder resist manufacturing method. In the invention, the first silk-screen printing manufacture requirement is as follows: the thickness of the 43T screen plate and the wet film is controlled to be 15-25um, the screen printing is carried out, the screen printing is horizontally placed and kept still for 30 +/-15 min, and the baking is carried out on the board at a speed of 72 ℃/5 min. The second spraying manufacture requirement is as follows: the printing ink viscosity flow meter is 32 +/-1S, the wet film thickness is controlled to be 60-70um, the prebaking tunnel furnace parameter is 73 ℃/45min, the screen printing manufacturing is used for the first manufacturing, the spraying manufacturing is used for the second manufacturing, the production cycle time is reduced, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrapping can be reduced, the raw material loss in the production process is saved, and the production cost is reduced.)

1. A special solder mask manufacturing method is characterized by comprising the following steps: the special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, the ink is solidified by a certain heating treatment method,

and S5, after the solidification is finished in the step S5, the silicon plate is taken down and can be stored.

2. A special solder mask manufacturing method according to claim 1, characterized in that: in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; and paying attention to abnormal conditions such as pressing plates, sticking plates, fragments and the like, and processing in time.

3. A special solder mask manufacturing method according to claim 1, characterized in that: in the step S2, the thickness of the wet film is controlled to be 15-25um, and the wet film is kept flat and still for 15-45 min after silk-screen printing.

4. A special solder mask manufacturing method according to claim 1, characterized in that: in the step S3, the temperature of the baking plate is required to be 72 ℃/5 min.

5. A special solder mask manufacturing method according to claim 1, characterized in that: in the step S3, whether printing is deviated, virtual printing, pulp leakage, net blocking and the like is observed in the process, and adjustment is performed according to the situation; and paying attention to abnormal conditions such as pressing plates, sticking plates, fragments and the like, and processing in time.

6. A special solder mask manufacturing method according to claim 1, characterized in that: in the step S4, the ink viscosity flow meter 34-36S, the wet film thickness is controlled to be 40-55um, and the pre-baking tunnel furnace parameter is 75 ℃/45 min.

Technical Field

The invention belongs to the technical field of solder mask silk printing, and particularly relates to a special solder mask manufacturing method.

Background

The printed circuit board is basically composed of a welding pad, a through hole, a solder mask layer, a silk-screen printing layer, a copper wire, various elements and the like. In order to increase the thickness of the copper sheet, the solder mask is usually scribed to remove green oil, and then tin is added to increase the thickness of the copper wire.

The existing solder mask silk-screen technology is mainly divided into three types, namely, the traditional silk-screen process, the spraying process and the coating process; traditional screen printing: its advantages are high uniformity of ink, low cost and switching between different inks. The defect of high scrap rate and more abnormal variation; the spraying process comprises the following steps: its advantages are high productivity, high detergency to small holes, short production period and low variability. The defects are that the thick copper plate has uneven printing ink, the thin plate has color difference, and the dense holes are provided with spacing oil and inconvenient printing ink switching. For products with outer copper thickness more than or equal to 2 oz: the original process is manufactured by screen printing twice or spraying twice, the production cycle of the screen printing twice is long, and foreign matters are highly scrapped. The ink produced by two times of spraying is uneven, so that the ink height of the bonding pad is higher than the quality requirement.

Disclosure of Invention

The invention aims to: in order to solve the problems proposed above, a special solder resist manufacturing method is provided.

The technical scheme adopted by the invention is as follows: a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, the ink is solidified by a certain heating treatment method,

s5, after the silicon plate is solidified in the step S5, the silicon plate is taken down and can be stored

In a preferred embodiment, in step S2, whether the printing is shifted or not is detected by a vernier caliper, and the adjustment is performed; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; and paying attention to abnormal conditions such as pressing plates, sticking plates, fragments and the like, and processing in time.

In a preferred embodiment, in step S2, the wet film thickness is controlled to 15-25um, and the screen is laid flat and kept still for 15-45 min.

In a preferred embodiment, in the step S3, the baking plate temperature is required to be 72 ℃/5 min.

In a preferred embodiment, in step S3, whether the printing is shifted, the ghost printing, the missing pulp, the blocking net, etc. is observed during the process, and the adjustment is performed as appropriate; and paying attention to abnormal conditions such as pressing plates, sticking plates, fragments and the like, and processing in time.

In a preferred embodiment, in step S4, the ink viscosity flow meter 34 to 36S, the wet film thickness is controlled to 40-55um, and the pre-baking tunnel oven parameters are 75 ℃/45 min.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

according to the invention, the first manufacturing is performed by using the screen printing, the second manufacturing is performed by using the spraying, so that the production cycle time is reduced, the production speed is increased, more economic benefits are brought to producers, foreign matter scrapping can be reduced, the raw material loss in the production process is saved, and the production cost is reduced.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print; in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time; in step S2, the thickness of the wet film is controlled to be 25um, and the wet film is kept flat and still for 15-45 min after silk-screen printing;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer; in step S3, the temperature of the baking plate is required to be 72 ℃/5 min; in step S3, observing whether the printing is deviated, the printing is virtual, the pulp is leaked, the screen is blocked and the like in the process, and adjusting according to the situation; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, and the ink is solidified by a certain heating treatment method; in step S4, ink viscosity flow meter 34-36S, wet film thickness control 40-55um, pre-baking tunnel furnace parameter 75 deg.C/45 min;

and S5, after the silicon plate is cured in the step S5, the silicon plate is taken down and can be stored, the first manufacturing is performed by screen printing, the second manufacturing is performed by spraying, the production cycle time is shortened, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrap can be reduced, raw material loss in the production process is saved, and the production cost is reduced.

Example two:

a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print; in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time; in step S2, the thickness of the wet film is controlled to be 15um, and the wet film is kept flat and still for 15-45 min after silk-screen printing;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer; in step S3, the temperature of the baking plate is required to be 72 ℃/5 min; in step S3, observing whether the printing is deviated, the printing is virtual, the pulp is leaked, the screen is blocked and the like in the process, and adjusting according to the situation; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, and the ink is solidified by a certain heating treatment method; in step S4, ink viscosity flow meter 34-36S, wet film thickness control 40-55um, pre-baking tunnel furnace parameter 75 deg.C/45 min;

and S5, after the silicon plate is cured in the step S5, the silicon plate is taken down and can be stored, the first manufacturing is performed by screen printing, the second manufacturing is performed by spraying, the production cycle time is shortened, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrap can be reduced, raw material loss in the production process is saved, and the production cost is reduced.

Example three:

a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print; in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time; in step S2, the thickness of the wet film is controlled to be 18um, and the wet film is kept flat and still for 15-45 min after silk-screen printing;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer; in step S3, the temperature of the baking plate is required to be 72 ℃/5 min; in step S3, observing whether the printing is deviated, the printing is virtual, the pulp is leaked, the screen is blocked and the like in the process, and adjusting according to the situation; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, and the ink is solidified by a certain heating treatment method; in step S4, ink viscosity flow meter 34-36S, wet film thickness control 40-55um, pre-baking tunnel furnace parameter 75 deg.C/45 min;

and S5, after the silicon plate is cured in the step S5, the silicon plate is taken down and can be stored, the first manufacturing is performed by screen printing, the second manufacturing is performed by spraying, the production cycle time is shortened, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrap can be reduced, raw material loss in the production process is saved, and the production cost is reduced.

Example four:

a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print; in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time; in step S2, the thickness of the wet film is controlled to be 18um, and the wet film is kept flat and still for 15-45 min after silk-screen printing;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer; in step S3, the temperature of the baking plate is required to be 72 ℃/5 min; in step S3, observing whether the printing is deviated, the printing is virtual, the pulp is leaked, the screen is blocked and the like in the process, and adjusting according to the situation; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, and the ink is solidified by a certain heating treatment method; in step S4, ink viscosity flow meter 34-36S, wet film thickness control 40-55um, pre-baking tunnel furnace parameter 75 deg.C/45 min;

and S5, after the silicon plate is cured in the step S5, the silicon plate is taken down and can be stored, the first manufacturing is performed by screen printing, the second manufacturing is performed by spraying, the production cycle time is shortened, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrap can be reduced, raw material loss in the production process is saved, and the production cost is reduced.

Example five:

a special solder mask manufacturing method comprises the following steps:

s1, taking out the corresponding 43T screen, fixing the screen on a screen fixing frame, installing a screen printer, pressing an F4 key to lock the screen, installing a scraping bar and an ink return knife, and calling in the corresponding process file;

s2, putting the silicon wafer plated with the film with one surface facing downwards into a loading box of a printing machine; the machine automatically runs to print; in step S2, a vernier caliper is used to detect whether the printing is shifted and adjust the printing; observing whether phenomena such as pulp leakage, virtual printing, net blockage and the like exist, and processing according to conditions; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time; in step S2, the thickness of the wet film is controlled to be 20um, and the wet film is kept flat and still for 15-45 min after silk-screen printing;

s3, placing the silicon wafer prepared in the step S2 into an oven, and drying and baking the silicon wafer; in step S3, the temperature of the baking plate is required to be 72 ℃/5 min; in step S3, observing whether the printing is deviated, the printing is virtual, the pulp is leaked, the screen is blocked and the like in the process, and adjusting according to the situation; paying attention to the abnormal conditions of the pressing plate, the sticking plate, the fragments and the like, and processing in time;

s4, after the silicon chip in the step S3 is cooled, the diluted paint is evenly sprayed on the surface of the product by a spray gun, and the ink is solidified by a certain heating treatment method; in step S4, ink viscosity flow meter 34-36S, wet film thickness control 40-55um, pre-baking tunnel furnace parameter 75 deg.C/45 min;

and S5, after the silicon plate is cured in the step S5, the silicon plate is taken down and can be stored, the first manufacturing is performed by screen printing, the second manufacturing is performed by spraying, the production cycle time is shortened, the production speed is accelerated, more economic benefits are brought to producers, foreign matter scrap can be reduced, raw material loss in the production process is saved, and the production cost is reduced.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.