阅读说明：本技术 散热组件、散热结构以及散热方法、电子设备和装置 (Heat dissipation assembly, heat dissipation structure, heat dissipation method, electronic equipment and device ) 是由 孙权 于 2020-06-04 设计创作，主要内容包括：本发明公开了一种散热组件、散热结构以及散热方法、电子设备和装置。其中,散热组件包括：声波振荡器,用于发出声波；振荡膜,设置于声波振荡器所发出声波的传输路径上；声波振荡器发出的声波带动振荡膜振动,以使振荡膜附近的空气流动。在本发明实施例中,利用声波振荡器带动振荡膜发生振动以使电子设备内部目标对象表面的空气流动加快,从而将目标对象表面的热量快速带走,达到降低目标对象表面温度的效果。此外,由于整体结构简单,占用空间小,因此,可根据电子设备内部结构和目标对象的位置进行灵活布局,且其功耗低、对电子设备干扰小。(The invention discloses a heat dissipation assembly, a heat dissipation structure, a heat dissipation method, electronic equipment and a device. Wherein, radiator unit includes: an acoustic wave oscillator for emitting an acoustic wave; an oscillation film provided on a transmission path of a sound wave emitted from the sound wave oscillator; the sound wave emitted by the sound wave oscillator drives the oscillating membrane to vibrate, so that air near the oscillating membrane flows. In the embodiment of the invention, the sound wave oscillator is utilized to drive the oscillation film to vibrate so as to accelerate the air flow on the surface of the target object in the electronic equipment, thereby quickly taking away the heat on the surface of the target object and achieving the effect of reducing the surface temperature of the target object. In addition, the whole structure is simple, the occupied space is small, flexible layout can be performed according to the internal structure of the electronic equipment and the position of the target object, the power consumption is low, and the interference to the electronic equipment is small.)

1. A heat sink assembly, comprising:

an acoustic wave oscillator for emitting an acoustic wave;

an oscillation film provided on a transmission path of the acoustic wave emitted from the acoustic wave oscillator;

the sound wave emitted by the sound wave oscillator drives the oscillating membrane to vibrate, so that air near the oscillating membrane flows.

2. The heat dissipation assembly of claim 1, wherein:

the sound wave oscillator comprises a transduction component for converting electric energy into mechanical energy and a vibration generating surface for generating sound waves, and the oscillating membrane is arranged in front of the vibration generating surface.

3. The heat removal assembly of claim 1, comprising a plurality of said acoustic wave oscillators, the plurality of acoustic wave oscillators comprising an array of acoustic wave oscillators.

4. The heat dissipating assembly of claim 3, wherein the number of the oscillating film is one, and the oscillating film is disposed on a transmission path of the acoustic wave emitted from the acoustic wave oscillator array.

5. The heat dissipating assembly of any one of claims 1 to 4, wherein:

the sound wave emitted by the sound wave oscillator is ultrasonic wave.

6. The heat dissipation assembly of any of claims 1-4, further comprising:

the cavity comprises an air outlet end;

the acoustic wave oscillator and the diaphragm are disposed within the cavity.

7. The heat dissipating assembly of claim 6, wherein one side of the oscillating membrane faces the air outlet end and the other side of the oscillating membrane faces the acoustic wave oscillator.

8. A heat dissipation structure, comprising:

the heat dissipation assembly of any one of claims 1 to 7;

and the heat dissipation assembly is arranged in the air duct.

9. The heat dissipating structure of claim 8, wherein the air duct comprises a first air inlet and at least one first air outlet, and the heat dissipating assembly is disposed at the first air inlet.

10. The heat dissipation structure of claim 9, further comprising an adjustment mechanism coupled to the heat dissipation assembly, the adjustment mechanism configured to adjust an orientation or position of the heat dissipation assembly.

11. The heat dissipating structure of claim 10, wherein the adjustment mechanism comprises a rotating component, the rotating component is connected to the heat dissipating component, and the rotating component rotates the heat dissipating component.

12. An electronic device, comprising:

the heat dissipating assembly of any of claims 1 to 7 or the heat dissipating structure of any of claims 8 to 11.

13. An electronic device, comprising:

a housing;

an electronic device disposed within the housing, the electronic device generating heat in an operating state;

the heat dissipating assembly of any of claims 1 to 7, disposed within the housing for moving air within the housing to dissipate heat from the electronic device.

14. An electronic device in accordance with claim 13, wherein said heat dissipation assembly is disposed proximate said electronic device.

15. The electronic device of claim 13, wherein the housing includes a second air inlet and at least one second air outlet, the heat dissipation assembly is disposed at the second air inlet, the heat dissipation assembly forms an air flow duct between the second air inlet and the second air outlet, and the air flow duct covers the electronic device.

16. The electronic device of claim 15, comprising two or more electronic devices, wherein the two or more electronic devices are disposed on the air flow duct.

17. The electronic device according to claim 13, comprising two or more electronic components, wherein the two or more electronic components are respectively disposed at different positions in the housing;

the electronic equipment further comprises an adjusting mechanism connected with the heat dissipation assembly, and the adjusting mechanism is used for controlling the direction or the position of the heat dissipation assembly.

18. The electronic device of claim 17, further comprising two or more first air ducts respectively corresponding to the electronic devices, wherein the adjusting mechanism controls a direction or a position of the heat dissipation assembly to interface with the first air ducts.

19. The electronic device according to any of claims 13 to 18, wherein the electronic device is a mobile terminal.

20. A heat dissipating device, applied to an electronic device, wherein the heat dissipating assembly according to any one of claims 1 to 7 or the heat dissipating structure according to any one of claims 8 to 11 is disposed in the electronic device; wherein, heat abstractor includes:

a detection section for detecting a temperature value of the target object;

and the control part is electrically connected with the heat dissipation assembly and the detection part respectively.

21. The heat dissipating device of claim 20,

and in response to the temperature value of the target object exceeding a preset temperature value, the control component controls the heat dissipation assembly to dissipate heat of the target object.

22. A heat dissipation method, which is applied to a heat dissipation device, wherein the heat dissipation device is provided with the heat dissipation assembly, the detection component and the control component as claimed in any one of claims 1 to 7, and the control component is electrically connected with the heat dissipation assembly and the detection component respectively; the heat dissipation method comprises the following steps:

acquiring a temperature value of a target object;

and when the temperature value of the target object exceeds a preset temperature value, controlling the heat dissipation assembly to dissipate heat of the target object.

23. The method for dissipating heat according to claim 22, wherein an adjusting member connected to the heat dissipating assembly is further provided in the heat dissipating device; wherein, when the temperature value of target object surpassed preset temperature value, control radiator unit dispels the heat to the target object and include:

and when the temperature value of the target object exceeds a preset temperature value, controlling the adjusting part to adjust the direction or the position of the heat dissipation assembly so as to dissipate heat of the target object.

24. An electronic device, comprising: memory, processor and computer program stored on the memory and executable on the processor, characterized in that the processor implements the heat dissipation method according to any one of claims 22 to 23 when executing the computer program.

25. A computer-readable storage medium storing computer-executable instructions for performing the method of dissipating heat of any of claims 22 to 23.

Technical Field

Embodiments of the present invention relate to, but not limited to, the field of heat dissipation technologies, and in particular, to a heat dissipation assembly, a heat dissipation structure, an electronic device, a heat dissipation apparatus, a heat dissipation method, an electronic apparatus, and a computer-readable storage medium.

Background

Its structure of the higher electronic product of integrated level is comparatively inseparable, and inside device piles up closely, and the source that generates heat such as chip device along with inside continuously generates heat, because the inside air of electronic product can not automatic flow, can make the temperature of device position constantly rise. In the related art, the heat dissipation of the electronic product is conducted away by adopting the technical means of a heat dissipation film, heat dissipation glue, a heat dissipation frame, a fan, a water cooling pipe and the like, but the thickness of the whole product is increased, the heat conduction effect is gradually reduced along with the lapse of time, and the heat dissipation effect is poor.

Disclosure of Invention

The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

In a first aspect, an embodiment of the present invention provides a heat dissipation assembly, a heat dissipation structure, an electronic device, a heat dissipation apparatus, a heat dissipation method, an electronic device, and a computer-readable storage medium, in which an acoustic wave oscillator is used to drive an oscillation film to vibrate so as to accelerate air flow on a surface of a target object inside the electronic device, thereby quickly taking away heat from the surface of the target object, and achieving an effect of reducing a surface temperature of the target object.

In a second aspect, an embodiment of the present invention provides a heat dissipation assembly, including:

an acoustic wave oscillator for emitting an acoustic wave;

an oscillation film provided on a transmission path of the acoustic wave emitted from the acoustic wave oscillator;

the sound wave emitted by the sound wave oscillator drives the oscillating membrane to vibrate, so that air near the oscillating membrane flows.

In a third aspect, an embodiment of the present invention provides a heat dissipation structure, including:

the heat dissipating assembly of the second aspect above;

and the heat dissipation assembly is arranged in the air duct.

In a fourth aspect, an embodiment of the present invention further provides an electronic device, including:

the heat dissipating component according to the second aspect above and the heat dissipating structure according to the third aspect above.

In a fifth aspect, an embodiment of the present invention further provides an electronic device, including:

a housing;

an electronic device disposed within the housing, the electronic device generating heat in an operating state;

the heat dissipation assembly of the second aspect is disposed in the housing, and is configured to enable air in the housing to flow so as to dissipate heat of the electronic device.

In a sixth aspect, an embodiment of the present invention further provides a heat dissipation apparatus, which is applied to an electronic device, and the electronic device is provided with the heat dissipation assembly according to the second aspect or the heat dissipation structure according to the third aspect; wherein, heat abstractor includes:

a detection section for detecting a temperature value of the target object;

and the control part is electrically connected with the heat dissipation assembly and the detection part respectively.

In a seventh aspect, an embodiment of the present invention further provides a heat dissipation method applied to a heat dissipation apparatus, where the heat dissipation apparatus is provided with the heat dissipation assembly, the detection component, and the control component as described in the second aspect, and the control component is electrically connected to the heat dissipation assembly and the detection component, respectively; the heat dissipation method comprises the following steps:

acquiring a temperature value of a target object;

and when the temperature value of the target object exceeds a preset temperature value, controlling the heat dissipation assembly to dissipate heat of the target object.

In an eighth aspect, an embodiment of the present invention further provides an electronic apparatus, including: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the heat dissipation method as described in the seventh aspect above when executing the computer program.

In a ninth aspect, an embodiment of the present invention further provides a computer-readable storage medium, which stores computer-executable instructions for executing the heat dissipation method according to the seventh aspect.

The embodiment of the invention comprises the following steps: the sound wave oscillator is used for emitting sound waves, the oscillating membrane is arranged on a transmission path of the sound waves emitted by the sound wave oscillator, and the sound waves emitted by the sound wave oscillator drive the oscillating membrane to vibrate so as to enable air near the oscillating membrane to flow. According to the scheme provided by the embodiment of the invention, the sound wave oscillator is utilized to drive the oscillation film to vibrate so as to accelerate the air flow on the surface of the target object in the electronic equipment, thereby quickly taking away the heat on the surface of the target object and achieving the effect of reducing the surface temperature of the target object. In addition, the whole structure is simple, the occupied space is small, flexible layout can be performed according to the internal structure of the electronic equipment and the position of the target object, the power consumption is low, and the interference to the electronic equipment is small.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.

FIG. 1A is a schematic view of a heat dissipation assembly provided in accordance with an embodiment of the present invention;

FIG. 1B is a schematic view of a heat sink assembly according to another embodiment of the present invention;

fig. 2A is a schematic diagram of a heat dissipation structure according to an embodiment of the present invention;

fig. 2B is a schematic diagram of a heat dissipation structure according to another embodiment of the invention;

FIG. 3A is a schematic diagram of an electronic device provided by one embodiment of the invention;

FIG. 3B is a schematic diagram of an electronic device provided by another embodiment of the invention;

FIG. 3C is a schematic diagram of an electronic device provided by another embodiment of the invention;

FIG. 3D is a schematic diagram of an electronic device provided by another embodiment of the invention;

FIG. 4 is a schematic view of a heat dissipation device provided by an embodiment of the present invention;

FIG. 5A is a flow chart of a method for dissipating heat according to an embodiment of the present invention;

fig. 5B is a flowchart of a heat dissipation method according to another embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It should be noted that although functional blocks are partitioned in a schematic diagram of an apparatus and a logical order is shown in a flowchart, in some cases, the steps shown or described may be performed in a different order than the partitioning of blocks in the apparatus or the order in the flowchart.

The invention provides a heat dissipation assembly, a heat dissipation structure, an electronic device, a heat dissipation method, an electronic device and a computer readable storage medium. According to the scheme provided by the embodiment of the invention, the sound wave oscillator is utilized to drive the oscillation film to vibrate so as to accelerate the air flow on the surface of the target object in the electronic equipment, thereby quickly taking away the heat on the surface of the target object and achieving the effect of reducing the surface temperature of the target object. In addition, the whole structure is simple, the occupied space is small, flexible layout can be performed according to the internal structure of the electronic equipment and the position of the target object, the power consumption is low, and the interference to the electronic equipment is small.

The embodiments of the present invention will be further explained with reference to the drawings.

As shown in fig. 1A, fig. 1A is a schematic view of a heat dissipation assembly 100 according to an embodiment of the present invention. In the example of fig. 1, the heat dissipation assembly 100 includes a sound wave oscillator 110 and an oscillating membrane 120, wherein the sound wave oscillator 110 is used for emitting sound waves, the oscillating membrane 120 is disposed on a transmission path of the sound waves emitted by the sound wave oscillator 110, and the sound waves emitted by the sound wave oscillator 110 drive the oscillating membrane 120 to vibrate, so that air near the oscillating membrane 120 flows. The heat dissipation assembly 100 has a simple structure, a small size, and a small occupied space, and thus can be flexibly arranged inside the electronic device 300 to dissipate heat at a location of a target object. The target object is a heat generating device such as a chip. In addition, the power consumption of the acoustic wave oscillator 110 is low when the acoustic wave oscillator 110 operates, and the oscillation film 120 is driven to vibrate by the acoustic wave emitted by the acoustic wave oscillator 110, so that no electromagnetic radiation exists, and the interference to the electronic device 300 is small.

In an embodiment, the diaphragm 120 and the acoustic wave oscillator 110 are spaced apart by a gap to facilitate a space having a larger amplitude when the diaphragm 120 oscillates, and the embodiment is not particularly limited.

It should be noted that the sound wave emitted by the sound wave oscillator 110 includes, but is not limited to, an ultrasonic wave and an infrasonic wave, and the present embodiment is not particularly limited.

In one embodiment, the sound wave oscillator 110 is utilized to drive the oscillating membrane 120 to vibrate so as to accelerate the air flow on the surface of the target object inside the electronic device 300, thereby rapidly removing the heat on the surface of the target object, and achieving the effect of reducing the temperature on the surface of the target object.

In one embodiment, the acoustic wave oscillator 110 includes a transduction component for converting electrical energy into mechanical energy and a vibration plane for emitting an acoustic wave, and the oscillation membrane 120 is disposed in front of the vibration plane. Specifically, the acoustic wave oscillator 110 includes a transducer component and a vibration generating surface, the transducer component converts electrical energy into mechanical energy after being powered on to drive the vibration generating surface to generate acoustic waves, and since the vibrating membrane 120 is disposed in front of the vibration generating surface, the acoustic waves generated by the acoustic wave oscillator 110 can drive the vibrating membrane 120 to vibrate, so that air near the vibrating membrane flows. Compared with the prior art, the mode that the vibration film is driven to vibrate by the magnetic field generated by the electromagnetic coil when the electromagnetic coil is electrified is utilized, the power consumption of the heat dissipation assembly 100 in the embodiment is low when the heat dissipation assembly works, the vibration film 120 is driven to vibrate by the sound wave emitted by the sound wave oscillator 110, and no electromagnetic radiation exists, so that the interference to the electronic device 300 is small.

In one embodiment, a plurality of acoustic wave oscillators 110 are included, the plurality of acoustic wave oscillators 110 making up an array of acoustic wave oscillators. In this embodiment, the plurality of acoustic wave oscillators 110 may form an acoustic wave oscillator array in a side-by-side manner, and the acoustic waves emitted by the acoustic wave oscillators 110 drive the respective corresponding oscillation membranes 120 to vibrate, so as to further accelerate the air flow near the oscillation membranes 120.

In one embodiment, the number of the oscillation film 120 is one, and the oscillation film 120 is disposed on a transmission path of the acoustic wave emitted from the acoustic wave oscillator array. In the present embodiment, the acoustic wave oscillator array corresponds to one oscillating film 120, and the acoustic wave emitted by the acoustic wave oscillator array drives the oscillating film 120 to vibrate, so that the air flow near the oscillating film 120 is accelerated due to the aggravation of the vibration of the oscillating film 120.

In one embodiment, the acoustic wave emitted by the acoustic wave oscillator 110 is an ultrasonic wave. The ultrasonic wave is a sound wave with the frequency higher than 20000 Hz, and the directivity is good, the reflecting capacity is strong, and more concentrated sound energy is easy to obtain. Since the lower frequency limit of the ultrasonic wave exceeds the upper hearing limit of a human, no noise is generated to the human.

In an embodiment, as shown in fig. 1B, the heat dissipation assembly 100 further includes a cavity 130, which includes an air outlet end 131; the acoustic wave oscillator 110 and the oscillating film 120 are disposed in the cavity 130. When the sound wave emitted by the sound wave oscillator 110 drives the oscillation film 120 to vibrate, the flowing air is concentrated and accelerated to flow out from the air outlet end 131, so that the flowing air is accelerated to quickly take away the heat on the surface of the target object, and the effect of reducing the surface temperature of the target object is achieved.

In one embodiment, one side of the oscillating membrane 120 faces the air outlet 131, and the other side of the oscillating membrane 120 faces the acoustic wave oscillator 110. That is, the oscillating film 120 is directly opposite to the air outlet end 131, and the air outlet end 131 is located on the transmission path of the sound wave emitted by the sound wave oscillator 110, and the sound wave emitted by the sound wave oscillator 110 drives the oscillating film 120 to vibrate, so that the flowing air is concentrated and accelerated to flow out from the air outlet end 131, the flowing air is accelerated to take away the heat on the surface of the target object quickly, and the effect of reducing the surface temperature of the target object is achieved.

Various embodiments will be described below with respect to the specific structure of the heat dissipation structure 200.

As shown in fig. 2A, fig. 2A is a schematic view of a heat dissipation structure 200 according to an embodiment of the present invention.

The heat dissipation structure 200 includes a heat dissipation assembly 100 and an air duct 210, and the heat dissipation assembly 100 is disposed in the air duct 210.

In one embodiment, the air duct 210 is designed as a dedicated heat dissipation channel for a target object requiring heat dissipation, so as to control the flow path and flow amount of air, thereby achieving targeted heat dissipation. The heat dissipation assembly 100 is disposed in the air duct 210, and when the sound wave generated by the sound wave oscillator 110 drives the oscillation film 120 to vibrate, the air flows in the air duct 210, and the heat on the surface of the target object is quickly taken away by the flowing air, so as to reduce the surface temperature of the target object.

In one embodiment, as shown in fig. 2B, the air duct 210 includes a first air inlet 211 and at least one first air outlet 212, and the heat dissipation assembly 100 is disposed at the first air inlet 211. In this embodiment, the air duct 210 may be designed with a first air outlet 212 or a plurality of first air outlets 212 according to heat dissipation requirements, and the heat dissipation assembly 100 may be disposed at the first air inlet 211. It should be noted that the path along which the air duct 210 goes may have a single target object that needs to dissipate heat, or may have a plurality of target objects that need to dissipate heat.

In one embodiment, the heat dissipation structure 200 further includes an adjusting mechanism, which is connected to the heat dissipation assembly 100 and is used to adjust the direction or position of the heat dissipation assembly 100. For a plurality of target objects which need to be cooled and are located in different directions, the direction or the position of the cooling assembly 100 is adjusted by the adjusting mechanism, so that the cooling assembly 100 can sequentially cool the target objects in different directions according to the control requirement, and the cooling is more reasonable.

In one embodiment, the adjusting mechanism includes a rotating component, the rotating component is connected to the heat dissipating component 100, and the rotating component drives the heat dissipating component 100 to rotate. For a plurality of target objects needing heat dissipation in different directions, each target object is designed with a corresponding air channel 210, and the rotating component drives the heat dissipation component 100 to rotate, so that the heat dissipation component 100 can be butted to the corresponding air channel 210, and the target objects in different directions are dissipated.

In addition, an embodiment of the present invention also provides an electronic device including the heat dissipation assembly 100 or the heat dissipation structure 200.

In an embodiment, the sound wave oscillator 110 is utilized to vibrate air, the oscillation film 120 in front of the sound wave oscillator 110 is driven, the oscillation film 120 regularly vibrates, the air on two sides of the oscillation film 120 is compressed in a direction perpendicular to the oscillation film 120, the air inside the electronic device 300 transversely fluctuates, the air inside the electronic device 300 is compressed to cause accelerated air flow, the accelerated air flow inside the electronic device 300 takes away heat on the surface of a target object, and therefore the effect of cooling the electronic device 300 is achieved.

As shown in fig. 3A, fig. 3A is a schematic structural diagram of an electronic device 300 according to an embodiment of the present invention.

The electronic device 300 includes a housing 310 and a heat dissipation assembly 100; the electronic device 314 is disposed in the housing 310, and the electronic device 314 generates heat in an operating state; the heat dissipation assembly 100 is disposed in the housing 310 for flowing air in the housing 310 to dissipate heat of the electronic device 314.

In an embodiment, the sound wave emitted from the sound wave oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane 120 flows, and the flowing air can rapidly take away the heat on the surface of the electronic device 314, thereby achieving the effect of reducing the temperature on the surface of the electronic device 314.

It should be noted that the electronic device 300 includes, but is not limited to, a mobile phone, a customer premises equipment CPE, a notebook computer, a tablet computer, an intelligent wearable device, an intelligent appliance, and an on-vehicle system, which are electronic consumer products with a high integration level.

Various embodiments of the specific structure of the electronic device 300 will be described below.

In one embodiment, the heat dissipation assembly 100 is disposed near the electronic device 314, so that the sound wave emitted from the sound wave oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air flow of the electronic device 314 near the oscillating membrane 120 is accelerated, and the flowing air can rapidly take away the heat on the surface of the electronic device 314, thereby achieving the effect of reducing the temperature on the surface of the electronic device 314.

In one embodiment, as shown in fig. 3B, the housing 310 includes a second air inlet 311 and at least one second air outlet 312, the heat dissipation assembly 100 is disposed at the second air inlet 311, the heat dissipation assembly 100 forms an air flow duct 313 between the second air inlet 311 and the second air outlet 312, and the air flow duct 313 covers the electronic device 314. In this embodiment, the heat dissipation assembly 100 is disposed at the second air inlet 311, and when the sound wave generated by the sound wave oscillator 110 drives the oscillating film 120 to vibrate, and the air flows in the air flowing air channel 313 formed between the second air inlet 311 and the second air outlet 312, the heat on the surface of the electronic device 314 is quickly taken away by the flowing air and transferred out of the housing 310, so as to achieve the effect of reducing the temperature on the surface of the electronic device 314.

In an embodiment, the electronic device 314 includes two or more electronic devices 314, the two or more electronic devices 314 are distributed on the air flowing air channel 313, when the sound wave generated by the sound wave oscillator 110 drives the oscillating film 120 to vibrate, and the air flows in the air flowing air channel 313 formed between the second air inlet 311 and the second air outlet 312, the flowing air quickly takes away heat on the surfaces of the electronic devices 314, so as to achieve an effect of reducing the surface temperature of the electronic devices 314.

In one embodiment, as shown in fig. 3C, two or more electronic devices 314 are included, and the two or more electronic devices 314 are respectively disposed at different positions in the housing 310; the electronic device 300 further includes an adjustment mechanism 315 coupled to the heat dissipation assembly 100, wherein the adjustment mechanism 315 is used to control the orientation or position of the heat dissipation assembly 100. In this embodiment, since the plurality of electronic devices 314 are located at different positions in the housing 310, the direction or position of the heat dissipation assembly 100 is adjusted by using the adjustment mechanism 315, so that the heat dissipation assembly 100 can sequentially dissipate heat of the electronic devices 314 at different positions according to the control requirement, and the heat dissipation is more reasonable.

In an embodiment, as shown in fig. 3D, the electronic device further includes two or more first air channels 320 respectively corresponding to the electronic devices 314, and the adjusting mechanism 315 controls the direction or the position of the heat dissipation assembly 100 to interface with the first air channels 320. For the electronic devices 314 in different directions, each electronic device 314 is designed with a corresponding first air duct 320, and the adjusting mechanism 315 drives the heat dissipation assembly 100 to rotate, so that the heat dissipation assembly 100 can be butted to the corresponding first air duct 320, thereby dissipating heat of target objects in different directions.

In one embodiment, the electronic device 300 is a mobile terminal including, but not limited to, a cell phone.

As shown in fig. 4, fig. 4 is a schematic view of a heat dissipation device 400 according to an embodiment of the present invention.

The heat dissipation device 400 is applied to an electronic apparatus, and the heat dissipation assembly 100 or the heat dissipation structure 200 is disposed in the electronic apparatus. The heat sink 400 includes a detection part 410 and a control part 420, wherein the detection part 410 is used for detecting a temperature value of a target object, and the control part 420 is electrically connected to the heat sink assembly 100 and the detection part 410, respectively.

In an embodiment, the heat sink 400 detects a temperature value of an electronic device inside the electronic device through the detecting component 410, and the control component 420 controls the heat sink assembly 100 to be turned on or off according to the detected temperature value of the electronic device. After the heat dissipation assembly 100 is started, the sound wave emitted by the sound wave oscillator 110 drives the oscillation film 120 to vibrate, so that the air near the oscillation film 120 flows, and the flowing air can quickly take away the heat on the surface of the electronic device, thereby achieving the effect of reducing the surface temperature of the electronic device. The detecting component 410 may be a temperature sensor, and the controlling component 420 may be a single chip or a Field Programmable Gate Array (PFGA) chip, which is not limited in this embodiment.

In an embodiment, in response to the temperature value of the target object exceeding the preset temperature value, the control component 420 controls the heat dissipation assembly 100 to dissipate heat of the target object. The preset temperature value is a default or settable safety range temperature value. If the temperature value of the electronic device detected by the detecting component 410 exceeds the preset temperature value, the control component 420 controls the heat dissipation assembly 100 to start, and the sound wave emitted by the sound wave oscillator 110 drives the oscillation film 120 to vibrate, so that the air near the oscillation film 120 flows, and the flowing air can quickly take away the heat on the surface of the electronic device, thereby achieving the effect of reducing the surface temperature of the electronic device. When the detection component 410 detects that the temperature value of the electronic device is reduced below the preset temperature value, the control component 420 closes the heat dissipation component 100, the sound wave oscillator 110 stops working, the oscillation membrane 120 stops oscillating, and the whole process realizes real-time dynamic adjustment of the temperature of the electronic device inside the electronic device.

As shown in fig. 5A, fig. 5A is a flowchart of a heat dissipation method according to an embodiment of the present invention.

The heat dissipation method is applied to the heat dissipation device, the heat dissipation assembly, the detection component and the control component are arranged in the heat dissipation device, and the control component is electrically connected with the heat dissipation assembly and the detection component respectively.

The heat dissipation method includes but is not limited to the following steps:

step S510: acquiring a temperature value of a target object;

step S520: and when the temperature value of the target object exceeds a preset temperature value, controlling the heat dissipation assembly to dissipate heat of the target object.

In an embodiment, the control component obtains the temperature value of the target object through the detection component, and when the temperature value of the target object exceeds a preset temperature value, the control component controls the heat dissipation assembly to dissipate heat of the target object. The preset temperature value is a default or settable safety range temperature value. If the temperature value that detection part detected electron device surpassed preset temperature value, control unit can control radiator unit and start, and the sound wave that sound wave oscillator sent drives the vibration membrane vibration to make near the air flow of vibration membrane, the air that flows can take away the heat on electron device surface fast, reaches the effect that reduces electron device surface temperature. When the detection part detects that the temperature value of the electronic device is reduced to be lower than the preset temperature value, the control part controls the radiating assembly to enter a standby state, the sound wave oscillator stops working, the oscillation membrane also stops oscillating, and the whole process realizes real-time dynamic adjustment of the temperature of the electronic device in the electronic equipment.

In addition, as shown in fig. 5B, another embodiment of the present application further provides a heat dissipation method, where the heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is further provided with an adjusting component connected to the heat dissipation assembly. The present embodiment is another embodiment of the refinement flow of step S520 in the above embodiments, and the step S520 includes but is not limited to:

and step S521, when the temperature value of the target object exceeds a preset temperature value, controlling the adjusting component to adjust the direction or the position of the radiating component so as to radiate the target object.

It should be noted that step S521 in this embodiment is a further limitation to step S520 in the above embodiment. In step S521 in this embodiment, when a plurality of electronic devices located at different positions exist in the electronic device, the direction or the position of the heat dissipation assembly is adjusted by using the adjustment component, so that the heat dissipation assembly can sequentially dissipate heat of the electronic devices at different positions according to the control requirement, and the heat dissipation is more reasonable.

In one embodiment, the adjusting mechanism is a rotating component, the rotating component is connected with the heat dissipation component, and the rotating component drives the heat dissipation component to rotate. For a plurality of target objects needing heat dissipation in different directions, each target object is designed with a corresponding air channel, and the rotating component drives the heat dissipation component to rotate, so that the heat dissipation component can be in butt joint with the corresponding air channels, and the target objects in different directions are subjected to heat dissipation.

Further, an embodiment of the present invention also provides an electronic apparatus including: a memory, a processor, and a computer program stored on the memory and executable on the processor.

The processor and memory may be connected by a bus or other means.

The memory, which is a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. Further, the memory may include high speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory located remotely from the processor, and these remote memories may be connected to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The non-transitory software programs and instructions required to implement the heat dissipation method applied to the electronic device in the above-described embodiment, or the non-transitory software programs and instructions required to implement the heat dissipation method applied to the server in the above-described embodiment, are stored in the memory, and when being executed by the processor, the heat dissipation method applied to the electronic device in the above-described embodiment is performed, for example, the method steps S510 to S520 in fig. 5A and the method steps S510 to S521 in fig. 5B described above are performed.

Furthermore, an embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium stores computer-executable instructions, which are executed by a processor or a controller, for example, by a processor in the above-mentioned embodiment of the electronic device, and can cause the processor to perform the heat dissipation method in the above-mentioned embodiment, for example, perform the above-mentioned method steps S510 to S520 in fig. 5A and the method steps S510 to S521 in fig. 5B.

One of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.

While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.