阅读说明：本技术 一种用于5g高速电路板的沉锡装置 (Tin deposition device for 5G high-speed circuit board ) 是由 方丽霞 于 2021-05-15 设计创作，主要内容包括：本发明公开了一种用于5G高速电路板的沉锡装置,包括支撑结构,其用于连接各个内部结构,所述支撑结构还包括：箱体、支撑柱、凹槽、滑槽、沉锡液、连接盒、伺服电机,固定结构,其用于对电路板进行固定,所述固定结构还包括：电动推杆、横杆、转轴、上固定辊、轮轴、下固定辊、橡胶垫、电路板、空腔、蜗轮、蜗杆、转动轴,沉锡结构,其用于对电路板进行沉锡,所述沉锡结构还包括：顶板、上喷头、直杆、下喷头、液体管道、涡轮叶片、回流管道。优点在于：首先利用固定结构对电路板进行固定,通过电动推杆控制上固定辊的移动,从而有效的对不同尺寸电路板进行固定,同时利用橡胶垫对电路板进行缓冲,防止电路板因摩擦而损坏。(The invention discloses a tin immersion device for a 5G high-speed circuit board, which comprises a support structure and a tin immersion device, wherein the support structure is used for connecting each internal structure, and the support structure also comprises: box, support column, recess, spout, heavy tin liquid, connecting box, servo motor, fixed knot construct, it is used for fixing the circuit board, fixed knot constructs still includes: electric putter, horizontal pole, pivot, go up fixed roll, shaft, lower fixed roll, rubber pad, circuit board, cavity, worm wheel, worm, axis of rotation sink the tin structure, and it is used for sinking the tin to the circuit board, sink the tin structure and still include: the spray nozzle comprises a top plate, an upper spray nozzle, a straight rod, a lower spray nozzle, a liquid pipeline, a turbine blade and a backflow pipeline. Has the advantages that: at first, utilize fixed knot to construct and fix the circuit board, through the removal of electric putter control upper fixed roller to effectual not unidimensional circuit board is fixed, utilizes the rubber pad to cushion the circuit board simultaneously, prevents that the circuit board from damaging because of the friction.)

1. A heavy tin device that is used for 5G high speed circuit board, characterized by includes:

a support structure for connecting the respective internal structures, the support structure further comprising: box (1), support column (11), recess (12), spout (13), heavy tin liquid (14), connecting box (15), servo motor (16), wherein, support column (11) are fixed to be set up subaerial, box (1) welded fastening is on support column (11) top, bilateral symmetry sets up fluted (12) on box (1), spout (13) have been seted up to bilateral symmetry on box (1) inner wall, heavy tin liquid (14) set up inside box (1), box (1) outside welded fastening has connecting box (15), servo motor (16) are in connecting box (15) outside through bolt fixed connection, fixed knot constructs, and it is used for fixing the circuit board, fixed knot constructs still includes: the device comprises an electric push rod (2), a cross rod (21), a rotating shaft (22), an upper fixing roller (23), a wheel axle (24), a lower fixing roller (25), a rubber pad (26), a circuit board (27), a cavity (28), a worm wheel (29), a worm (210) and a rotating shaft (211), wherein the bottom end of the electric push rod (2) is fixedly connected to the inner wall of a sliding groove (13) through a bolt, the cavity (28) is formed in a box body (1), the cross rod (21) is fixedly connected to the bottom of the extending end of the electric push rod (2), the rotating shaft (22) is rotatably connected with the cross rod (21), the upper fixing roller (23) is coaxially welded and fixed on the rotating shaft (22), the wheel axle (24) is rotatably connected in the box body (1), the lower fixing roller (25) is coaxially welded and fixed on the wheel axle (24), and the rubber pad (26) is fixedly connected to the surfaces of the upper fixing roller (23) and the lower fixing roller (25) through gluing, the circuit board (27) is arranged between the upper fixing roller (23) and the lower fixing roller (25), the worm wheel (29) is coaxially welded and fixed on a section of the wheel shaft (24) located in the cavity (28), the worm (210) is meshed with the worm wheel (29), the rotating shaft (211) is coaxially welded and fixed on the worm (210), and the tin immersion structure is used for performing tin immersion on the circuit board and further comprises: roof (3), go up shower nozzle (31), straight-bar (32), lower shower nozzle (33), liquid pipeline (34), turbine blade (35), backflow pipeline (36), wherein, roof (3) welded fastening is inside box (1), it sets up in roof (3) bottom to go up shower nozzle (31), straight-bar (32) welded fastening is on box (1) inner wall, shower nozzle (33) set up in straight-bar (32) top down, liquid pipeline (34) are connected with roof (3), turbine blade (35) welded fastening is located one section of connecting box (15) inside in axis of rotation (211), backflow pipeline (36) are connected in connecting box (15) below.

2. The tin immersion device for 5G high-speed circuit boards as claimed in claim 1, wherein the groove (12) communicates the outside with the inside of the box body (1), and the liquid level of the tin immersion liquid (14) is lower than the height of the groove (12).

3. The tin deposition device for the 5G high-speed circuit board is characterized in that the connecting box (15) is of a cylindrical structure, the servo motor (16) is a motor with the rated power of 0.25kW and the model Y30M1-2, the servo motor (16) is communicated with an external circuit through a lead, a gas absorber (4) is arranged on the inner wall of the top of the box body (1), and the gas absorber (4) is communicated with the external circuit through a lead.

4. The tin immersion device for 5G high-speed circuit boards as claimed in claim 1, wherein the electric push rod (2) is connected with an external circuit through a lead, the cross rod (21) slides in the sliding groove (13), and the axle (24) penetrates through the box body and rotates in the cavity (28).

5. The tin immersion device for the 5G high-speed circuit board is characterized in that the circuit board (27) corresponds to the groove (12) in position, the worm wheel (29) rotates in the cavity (28), the rotating shaft (211) penetrates through the box body (1) and the connecting box (15), and the rotating shaft (211) is coaxially welded and fixed with the output end of the servo motor (16).

6. The tin immersion device for the 5G high-speed circuit board according to claim 1, wherein the straight rod (32) is arranged between the lower fixing rollers (25), the liquid pipeline (34) is respectively communicated with the upper spray head (31) and the lower spray head (33), the liquid pipeline (34) penetrates through the box body (1), the other end of the liquid pipeline (34) is connected above the connecting box (15), and the liquid pipeline (34) is communicated with the inside of the connecting box (15).

7. The tin immersion device for 5G high-speed circuit boards as claimed in claim 1, wherein the return pipe (36) is communicated with the connection box (15), and the other end of the return pipe (36) is communicated with the inside of the box body (1).

Technical Field

The invention relates to the technical field of circuit board production, in particular to a tin deposition device for a 5G high-speed circuit board.

Background

The tin deposition can be used for chemical tin plating on the surfaces of copper alloys such as red copper, brass, beryllium copper and the like, and the tin plating is bright silvery white, so that the weldability and the decorativeness of copper can be improved, the conductivity is not influenced, and the tin deposition can be used for the aspects of electronic industry, furniture appliances, food packaging and the like. Oxidation resistance, increases the beauty of copper workpieces, has no toxicity or heavy metal, and does not rust after a salt spray test for more than 45 hours. Does not need electroplating equipment, only needs soaking, and is convenient and simple.

Traditional tin equipment that sinks can't adjust the distance between two fixed rollers, when the circuit board thickness is great, need dismantle the fixed roller, the change corresponds radial fixed roller, it is hard to waste time, a large amount of fixed rollers need be bought simultaneously, the cost of production has been increased, and, after tin liquid that sinks used a period, tin liquid inside can produce more bubble, can lead to the fact the influence to sinking the tin quality, make tin that sinks inadequately, it can produce more harmful gas to sink the tin in-process simultaneously, if gaseous a large amount of discharges, not only can lead to the fact the influence to people's health, can the polluted environment simultaneously also.

Disclosure of Invention

The invention aims to solve the problems in the prior art, and provides a tin deposition device for a 5G high-speed circuit board.

In order to achieve the purpose, the invention adopts the following technical scheme:

a kind of tin deposition apparatus used for 5G high-speed circuit board, including:

a support structure for connecting the respective internal structures, the support structure further comprising: box, support column, recess, spout, heavy tin liquid, connecting box, servo motor, wherein, the support column is fixed to be set up subaerial, box welded fastening is on the support column top, bilateral symmetry sets up flutedly on the box, bilateral symmetry has seted up the spout on the box inner wall, heavy tin liquid sets up inside the box, box outside welded fastening has the connecting box, servo motor passes through bolt fixed connection in the connecting box outside.

A fixing structure for fixing the circuit board, the fixing structure further comprising: an electric push rod, a cross rod, a rotating shaft, an upper fixed roller, a wheel shaft, a lower fixed roller, a rubber pad, a circuit board, a cavity, a worm wheel, a worm and a rotating shaft, wherein the bottom end of the electric push rod is fixedly connected on the inner wall of the sliding chute through a bolt, a cavity is arranged in the box body, the cross bar is fixedly connected with the bottom of the extension end of the electric push rod, the rotating shaft is rotatably connected with the cross bar, the upper fixed roller is coaxially welded and fixed on the rotating shaft, the wheel shaft is rotatably connected in the box body, the lower fixed roller is coaxially welded and fixed on the wheel shaft, the rubber pad is fixedly connected on the surfaces of the upper fixed roller and the lower fixed roller in a gluing way, the circuit board is arranged between the upper fixing roller and the lower fixing roller, the worm wheel is coaxially welded and fixed on a section of the wheel shaft in the cavity, the worm and the worm wheel are meshed with each other, and the rotating shaft is coaxially welded and fixed on the worm.

The heavy tin structure, it is used for sinking the tin to the circuit board, it still includes to sink the tin structure: the improved structure of the turbine blade comprises a top plate, an upper spray head, a straight rod, a lower spray head, a liquid pipeline, turbine blades and a backflow pipeline, wherein the top plate is welded and fixed inside a box body, the upper spray head is arranged at the bottom of the top plate, the straight rod is welded and fixed on the inner wall of the box body, the lower spray head is arranged above the straight rod, the liquid pipeline is connected with the top plate, the turbine blades are welded and fixed on one section of a rotating shaft located inside a connecting box, and the backflow pipeline is connected below the connecting box.

In the tin deposition device for the 5G high-speed circuit board, the groove communicates the outside with the inside of the box body, and the liquid level of the tin deposition liquid is lower than the height of the groove.

In the tin deposition device for the 5G high-speed circuit board, the connecting box is of a cylindrical structure, the servo motor is a motor with rated power of 0.25kW and model Y30M1-2, the servo motor is communicated with an external circuit through a lead, and a gas absorber is arranged on the inner wall of the top of the box body and is communicated with the external circuit through a lead.

In the tin immersion device for the 5G high-speed circuit board, the electric push rod is communicated with an external circuit through a lead, the cross rod slides in the sliding groove, and the wheel shaft penetrates through the box body and rotates in the cavity.

In the tin immersion device for the 5G high-speed circuit board, the tin immersion device for the G high-speed circuit board is characterized in that the circuit board corresponds to the groove in position, the worm wheel rotates in the cavity, the rotating shaft penetrates through the box body and the connecting box, and the rotating shaft is coaxially welded and fixed with the output end of the servo motor.

In the tin immersion device for the 5G high-speed circuit board, the straight rod is arranged between the lower fixing rollers, the liquid pipeline is respectively communicated with the upper spray head and the lower spray head, the liquid pipeline penetrates through the box body, the other end of the liquid pipeline is connected above the connecting box, and the liquid pipeline is communicated with the inside of the connecting box.

In the tin immersion device for the 5G high-speed circuit board, the backflow pipeline is communicated with the connecting box, and the other end of the backflow pipeline is communicated with the interior of the box body.

Compared with the prior art, the invention has the advantages that:

1. according to the tin deposition device for the 5G high-speed circuit board, the circuit board is fixed by the fixing structure, the electric push rod controls the upper fixing roller to move, so that the circuit boards with different sizes are effectively fixed, and meanwhile, the circuit board is buffered by the rubber pad, and the circuit board is prevented from being damaged due to friction.

2. According to the tin deposition device for the 5G high-speed circuit board, disclosed by the invention, the servo motor is used for driving the turbine blade to rotate, so that the tin deposition liquid is pumped into the connecting box and then is sent into the spray head through the liquid pipeline, the cyclic utilization is realized, meanwhile, the turbine blade rotates at a high speed, bubbles in the tin deposition liquid are scattered, and the quality problem caused by the bubbles is prevented.

3. According to the tin deposition device for the 5G high-speed circuit board, harmful gas generated in the tin deposition process is absorbed through the gas absorber, so that the influence on the health of people due to the fact that a large amount of gas is discharged is prevented, and the environment is effectively protected.

Drawings

FIG. 1 is a schematic structural diagram of a tin deposition apparatus for a 5G high-speed circuit board according to the present invention;

FIG. 2 is a front sectional view of a tin deposition apparatus for a 5G high-speed circuit board according to the present invention;

fig. 3 is a side cross-sectional view of a tin deposition device for a 5G high-speed circuit board according to the present invention.

In the figure: the device comprises a box body 1, support columns 11, grooves 12, sliding chutes 13, solder deposition liquid 14, a connecting box 15, a servo motor 16, an electric push rod 2, a transverse rod 21, a rotating shaft 22, an upper fixed roller 23, a wheel shaft 24, a lower fixed roller 25, a rubber pad 26, a circuit board 27, a cavity 28, a worm gear 29, a worm 210, a rotating shaft 211, a top plate 3, an upper spray head 31, a straight rod 32, a lower spray head 33, a liquid pipeline 34, turbine blades 35, a return pipeline 36 and a gas absorber 4.

Detailed Description

The following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

Referring to fig. 1-3, a tin immersion device for a 5G high-speed circuit board comprises:

a support structure for connecting the respective internal structures, the support structure further comprising: box 1, support column 11, recess 12, spout 13, heavy tin liquid 14, connecting box 15, servo motor 16, wherein, support column 11 is fixed to be set up subaerial, 1 welded fastening of box is on 11 tops of support column, recess 12 has been seted up to bilateral symmetry on the box 1, spout 13 has been seted up to bilateral symmetry on the 1 inner wall of box, heavy tin liquid 14 sets up inside box 1, 1 outside welded fastening of box has connecting box 15, servo motor 16 passes through bolt fixed connection in the 15 outsides of connecting box.

Fixed knot constructs, and it is used for fixing the circuit board, and fixed knot constructs still includes: the device comprises an electric push rod 2, a cross rod 21, a rotating shaft 22, an upper fixing roller 23, a wheel shaft 24, a lower fixing roller 25, a rubber pad 26, a circuit board 27, a cavity 28, a worm wheel 29, a worm 210 and a rotating shaft 211, wherein the bottom end of the electric push rod 2 is fixedly connected to the inner wall of a sliding groove 13 through a bolt, the cavity 28 is formed in a box body 1, the cross rod 21 is fixedly connected to the bottom of the extending end of the electric push rod 2, the rotating shaft 22 is rotatably connected with the cross rod 21, the upper fixing roller 23 is coaxially welded and fixed on the rotating shaft 22, the wheel shaft 24 is rotatably connected in the box body 1, the lower fixing roller 25 is coaxially welded and fixed on the wheel shaft 24, the rubber pad 26 is fixedly connected to the surfaces of the upper fixing roller 23 and the lower fixing roller 25 in a gluing mode, the circuit board 27 is arranged between the upper fixing roller 23 and the lower fixing roller 25, the worm wheel 29 is coaxially welded and fixed on a section of the wheel shaft 24, which is positioned in the cavity 28, and the worm 210 is meshed with the worm wheel 29, rotation axis 211 coaxial weld fixation is on worm 210, start electric putter 2, make electric putter 2's extension end remove, thereby drive horizontal pole 21 and remove, make horizontal pole 21 slide in spout 13, then drive pivot 22 and reciprocate, make and go up fixed roll 23 and reciprocate, thereby adjusted the distance between fixed roll 23 and the lower fixed roll 25, the removal of fixed roll 21 in the control of electric putter 2, thereby effectual not unidimensional circuit board 2 fixes, utilize rubber pad 26 to cushion circuit board 2 simultaneously, prevent that circuit board 2 from damaging because of the friction.

The servomotor 16 is actuated to rotate the rotating shaft 211, which rotates the worm 210, and the worm gear 29, which rotates the wheel shaft 24, and simultaneously rotates the lower fixed roller 25, which advances the circuit board 27.

Sink the tin structure, it is used for sinking the tin to the circuit board, and sink the tin structure and still include: the tin deposition device comprises a top plate 3, an upper spray head 31, a straight rod 32, a lower spray head 33, a liquid pipeline 34, turbine blades 35 and a return pipeline 36, wherein the top plate 3 is fixedly welded inside a box body 1, the upper spray head 31 is arranged at the bottom of the top plate 3, the straight rod 32 is fixedly welded on the inner wall of the box body 1, the lower spray head 33 is arranged above the straight rod 32, the liquid pipeline 34 is connected with the top plate 3, the turbine blades 35 are fixedly welded on one section of a rotating shaft 211 positioned inside a connecting box 15, the return pipeline 36 is connected below the connecting box 15, the rotating shaft 211 is driven to rotate by a servo motor 16, the turbine blades 35 are rotated, so that tin deposition liquid 14 is sucked into the connecting box 15 and then respectively sent into the upper spray head 31 and the lower spray head 33 through the liquid pipeline 34 and then evenly sprayed on a circuit board 27 to deposit tin, the sprayed tin deposition liquid 14 is left in the box body 1 to be recycled, and the turbine blades 35 rotate at a high speed simultaneously, the bubbles in the tin deposition liquid 14 are scattered, and quality problems caused by the bubbles are prevented.

The recess 12 with external and 1 inside intercommunication of box, the liquid level height of heavy tin liquid 14 is less than the height of recess 12, connecting box 15 is the cylinder structure, servo motor 16 is rated power 0.25kW, the motor of model Y30M1-2, servo motor 16 passes through wire and external circuit intercommunication, be provided with gas absorber 4 on the inner wall of box 1 top, gas absorber 4 passes through wire and external circuit intercommunication, absorb the harmful gas that heavy tin in-process produced through gas absorber 4, prevent gaseous a large amount of discharges, cause the influence to people's health, the effectual environment that has protected.

Electric putter 2 passes through the wire and communicates with external circuit, and horizontal pole 21 slides in spout 13 is inside, and shaft 24 runs through the box and rotates in cavity 28, and circuit board 27 position corresponds with recess 12, and worm wheel 29 rotates in cavity 28 is inside, and axis of rotation 211 runs through box 1 and junction box 15, and axis of rotation 211 and the coaxial welded fastening of servo motor 16 output.

The straight rod 32 is arranged between the lower fixing rollers 25, the liquid pipeline 34 is respectively communicated with the upper spray head 31 and the lower spray head 33, the liquid pipeline 34 penetrates through the box body 1, the other end of the liquid pipeline 34 is connected above the connecting box 15, the liquid pipeline 34 is communicated with the inside of the connecting box 15, the backflow pipeline 36 is communicated with the connecting box 15, and the other end of the backflow pipeline 36 is communicated with the inside of the box body 1.

In the invention, firstly, the device is connected with a production line, then the electric push rod 2 is started according to the thickness of the circuit board 27, the extension end of the electric push rod 2 moves, so as to drive the cross rod 21 to move, so that the cross rod 21 slides in the chute 13, and then the rotating shaft 22 is driven to move up and down, so that the upper fixing roller 23 moves up and down, so as to adjust the distance between the upper fixing roller 23 and the lower fixing roller 25, the movement of the upper fixing roller 21 is controlled through the electric push rod 2, so as to effectively fix the circuit boards 2 with different sizes, meanwhile, the circuit boards 2 are buffered by using the rubber pad 26, so as to prevent the circuit boards 2 from being damaged due to friction, then the servo motor 16 is started, so that the rotating shaft 211 rotates, so as to drive the worm 210 to rotate, and the worm wheel 29 is meshed to rotate, so that the wheel shaft 24 rotates, and meanwhile, the lower fixing roller 25 is driven to rotate, so as to drive the circuit board 27 to advance, simultaneously because axis of rotation 211 is rotatory, make turbine blade 35 rotatory, thereby in connecting box 15 with heavy tin liquid 14 suction, then send into respectively through liquid pipeline 34 in last shower nozzle 31 and the lower shower nozzle 33, then evenly spray on circuit board 27, sink tin to it, spun heavy tin liquid 14 stays in box 1, carry out the cycle and use, simultaneously turbine blade 35 is high-speed rotatory, break up the inside bubble of heavy tin liquid 14, the quality problem because of the bubble causes has been prevented, absorb the harmful gas that heavy tin in-process produced through gas absorber 4, prevent that gaseous a large amount of discharges, cause the influence to people's health, the effectual environment that has protected.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.