阅读说明：本技术 一种用于处理铜表面的微蚀液 (Micro-etching solution for treating copper surface ) 是由 刘政 刘波 陈伟长 于 2020-12-31 设计创作，主要内容包括：本发明提供了一种用于处理铜表面的微蚀液,将经过清洁后的电路板放入所述微蚀液浸洗1～2分钟,然后将浸洗过后电路板进行印刷处理,最后将印刷好的电路板进行检测封装；所述微蚀液放入在微蚀槽内,该微蚀液包括双氧水、硫酸和水；所述双氧水的浓度为80～140g/L；硫酸的浓度为120～180g/L；所述微蚀液的添加含量为20～40wt％,余量为水。本发明的用于处理铜表面的微蚀液,容易进行稀释应用,处理方便,表面微蚀效果均一,具有多种使用方式,能够在印刷电路板制造工程中进行应用。(The invention provides a microetching solution for treating a copper surface, which is characterized in that a cleaned circuit board is placed into the microetching solution for immersion cleaning for 1-2 minutes, then the circuit board after immersion cleaning is subjected to printing treatment, and finally the printed circuit board is subjected to detection and packaging; the micro-etching solution is put into a micro-etching groove, and the micro-etching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 80-140 g/L; the concentration of the sulfuric acid is 120-180 g/L; the additive content of the microetching liquid is 20-40 wt%, and the balance is water. The micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and capable of being applied to the manufacturing engineering of printed circuit boards in various using modes.)

1. A microetching solution for treating a copper surface is characterized in that a cleaned circuit board is placed into the microetching solution for immersion cleaning for 1-2 minutes, then the circuit board after immersion cleaning is subjected to printing treatment, and finally the printed circuit board is subjected to detection packaging; the method is characterized in that: the micro-etching solution is put into a micro-etching groove, and the micro-etching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 80-140 g/L; the concentration of the sulfuric acid is 120-180 g/L; the additive content of the microetching liquid is 20-40 wt%, and the balance is water.

2. The microetching solution for treating a copper surface according to claim 1, characterized in that: the microetching solution also comprises 2-5 wt% of ethanolamine, 3-6 wt% of 1, 2-propylene glycol and 1-3 wt% of heptylamine.

3. The microetching solution for treating a copper surface according to claim 1, characterized in that: also comprises 1-3 wt% of stabilizer, 0.5-10 wt% of surfactant and 0.2-1 wt% of antibacterial agent.

4. The microetching solution for treating a copper surface according to claim 3, characterized in that: the microetching solution for treating the copper surface is applied by spraying or soaking.

5. The microetching solution for treating a copper surface according to claim 1, characterized in that: the concentration of the hydrogen peroxide is 110 g/L.

6. The microetching solution for treating a copper surface according to claim 1, characterized in that: the concentration of the sulfuric acid is 150 g/L.

7. The microetching solution for treating a copper surface according to claim 1, characterized in that: the addition content of the microetching solution is 30 wt%.

8. The microetching solution for treating a copper surface according to claim 2, characterized in that: the microetching solution also comprises 3 wt% of ethanolamine, 4 wt% of 1, 2-propylene glycol and 2 wt% of heptylamine.

9. The microetching solution for treating a copper surface according to claim 3, characterized in that: also comprises 2 wt% of stabilizing agent, 6 wt% of surfactant and 0.5 wt% of antibacterial agent.

10. The microetching solution for treating a copper surface according to claim 9, characterized in that: the stabilizer is an inorganic ammonia stabilizer, the surfactant is polyoxyethylene ether or fatty acid glyceride, and the antibacterial agent is sodium benzoate or sodium polychlorinated phenolate.

Technical Field

The invention relates to the technical field of chemical microetching liquid, in particular to microetching liquid for treating a copper surface.

Background

The existing metal surface micro-etching solution adopts a mixture of simple hydrogen peroxide, sulfuric acid and timely imidazoles, and the existing PCB circuit board industry adopts a brushing method, namely, a board to be printed with a solder mask is subjected to acid washing, the board is ground to remove oxides, and the degree of tightness of the grinding is adjusted according to the thickness of different boards, so that good quality is achieved. The method has the advantages of one-time adjustment every two hours, complex operation, poor durability and stability of the micro-etched workpiece, uneven roughness of the etched metal surface, easy scratching of a base material, and difficult removal of metal surface oxides to influence the binding force between the workpiece surface and other materials.

For example, chinese patent CN201910466360.3 discloses a microetching solution for treating copper surfaces, which is characterized by comprising the following components: 1,2, 4-triazole, 2-isopropylimidazole, 3, 5-dimethylpyrazole, 6-nitrobenzimidazole, triethylene glycol, 1, 2-propylene glycol, heptylamine, sulfuric acid, polypropylene glycol, sodium alginate and water. Specifically, the microetching liquid for treating the copper surface comprises the following components in percentage by weight: 1-4% of 1,2, 4-triazole, 3-7% of 2-isopropylimidazole, 1-4% of 3, 5-dimethylpyrazole, 0.5-1.5% of 6-nitrobenzimidazole, 7-11% of triethylene glycol, 0.5-2% of 1, 2-propylene glycol, 3-6% of heptylamine, 4-7% of sulfuric acid, 3-7% of polypropylene glycol, 13-16% of sodium alginate and the balance of water. The technical scheme is used for treating the micro-etching solution on the copper surface, but the micro-etching solution has the advantages of complex components, difficulty in dilution and application, inconvenient treatment, non-uniform surface micro-etching effect and single use form, and is difficult to apply in the manufacturing engineering of the printed circuit board.

Disclosure of Invention

In order to solve the problems that the microetching liquid in the prior art has more complex components, is not easy to dilute and apply, is inconvenient to treat, has non-uniform surface microetching effect and single use form and is difficult to apply in the manufacturing engineering of a printed circuit board, the invention provides the microetching liquid for treating the copper surface.

The technical scheme adopted by the invention is as follows: a microetching solution for treating a copper surface is characterized in that a cleaned circuit board is placed into the microetching solution for immersion cleaning for 1-2 minutes, then the circuit board after immersion cleaning is subjected to printing treatment, and finally the printed circuit board is subjected to detection packaging; the method is characterized in that: the micro-etching solution is put into a micro-etching groove, and the micro-etching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 80-140 g/L; the concentration of the sulfuric acid is 120-180 g/L; the additive content of the microetching liquid is 20-40 wt%, and the balance is water.

In some embodiments, the microetching solution further comprises 2 to 5 wt% of ethanolamine, 3 to 6 wt% of 1, 2-propanediol, and 1 to 3 wt% of heptylamine.

In some embodiments, the antibacterial agent further comprises 1-3 wt% of a stabilizer, 0.5-10 wt% of a surfactant and 0.2-1 wt% of an antibacterial agent.

In some embodiments, the microetching solution for treating copper surfaces is applied by spraying or immersion.

In some embodiments, the concentration of the hydrogen peroxide is 110 g/L.

In some embodiments, the concentration of sulfuric acid is 150 g/L.

In some embodiments, the microetching solution is added in an amount of 30 wt%.

In some embodiments, the microetching solution further comprises ethanolamine 3 wt%, 1, 2-propanediol 4 wt%, and heptylamine 2 wt%.

In some embodiments, the antibacterial agent further comprises 2 wt% of a stabilizer, 6 wt% of a surfactant and 0.5 wt% of an antibacterial agent.

In some embodiments, the stabilizer is an inorganic ammonia stabilizer, the surfactant is a polyoxyethylene ether or a fatty acid glyceride, and the antimicrobial agent is sodium benzoate or sodium polychlorinated phenolate.

Compared with the prior art, the invention has the beneficial effects that:

(1) the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and capable of being applied to the manufacturing engineering of printed circuit boards in various using modes.

(2) The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the printed circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, less pollution and convenient use, can quickly treat metal surface oxides and improve the cleanliness of the metal surface

(3) The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Detailed Description

The present invention will be described in further detail with reference to examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The invention discloses a microetching solution for treating a copper surface, which is characterized in that a cleaned circuit board is placed into the microetching solution for immersion cleaning for 1-2 minutes, then the circuit board after immersion cleaning is subjected to printing treatment, and finally the printed circuit board is subjected to detection and packaging; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 80-140 g/L; the concentration of the sulfuric acid is 120-180 g/L; the additive content of the microetching liquid is 20-40 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

Further preferably, in this embodiment of the present invention, the microetching solution further includes 2 to 5 wt% of ethanolamine, 3 to 6 wt% of 1, 2-propanediol, and 1 to 3 wt% of heptylamine. The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, little pollution and convenient use, can quickly treat metal surface oxides and improve the metal surface cleanliness.

Further preferably, in this embodiment of the present invention, the composition further comprises 1 to 3 wt% of a stabilizer, 0.5 to 10 wt% of a surfactant, and 0.2 to 1 wt% of an antibacterial agent.

The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

Specifically, in a further preferred embodiment of the present invention, the concentration of the hydrogen peroxide solution is 110 g/L.

Specifically, it is further preferable that the concentration of the sulfuric acid is 150g/L in this embodiment of the present invention.

Specifically, as a further preferable mode, in this embodiment of the present invention, the microetching solution is added in an amount of 30 wt%.

Specifically, as a further preference, in this embodiment of the present invention, the microetching solution further includes ethanolamine 3 wt%, 1, 2-propanediol 4 wt%, and heptylamine 2 wt%.

Specifically, it is further preferable that the antimicrobial agent further includes 2 wt% of a stabilizer, 6 wt% of a surfactant, and 0.5 wt% of an antimicrobial agent in this embodiment of the present invention.

Specifically, it is further preferable that in this embodiment of the present invention, the stabilizer is an inorganic ammonia stabilizer, the surfactant is polyoxyethylene ether or fatty acid glyceride, and the antifungal agent is sodium benzoate or sodium polychlorinated phenolate.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Post-application of 0.1N KMnO₄To measure

END POINT colorless → Red

Calculation of 35% H₂0₂(g/L) value of the measured amount X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 1

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 80 g/L; the concentration of the sulfuric acid is 120 g/L; the additive content of the microetching liquid is 20 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Then measured with 0.1N KMnO4

END POINT colorless → Red

Calculation of 35% H202(g/L) the value of the measured quantity X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 2

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 2 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 140 g/L; the concentration of the sulfuric acid is 180 g/L; the additive content of the microetching solution is 40 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Then measured with 0.1N KMnO4

END POINT colorless → Red

Calculation of 35% H202(g/L) the value of the measured quantity X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 3

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1.5 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 110 g/L; the concentration of the sulfuric acid is 150 g/L; the additive content of the microetching liquid is 30 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Then measured with 0.1N KMnO4

END POINT colorless → Red

Calculation of 35% H202(g/L) the value of the measured quantity X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 4

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1.5 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 110 g/L; the concentration of the sulfuric acid is 150 g/L; the additive content of the microetching liquid is 30 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

As a further preference, in this embodiment of the invention, the microetching solution further comprises 2 wt% of ethanolamine, 3 wt% of 1, 2-propanediol, and 1 wt% of heptylamine. The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, little pollution and convenient use, can quickly treat metal surface oxides and improve the metal surface cleanliness.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Then measured with 0.1N KMnO4

END POINT colorless → Red

Calculation of 35% H202(g/L) the value of the measured quantity X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 5

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1.5 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 110 g/L; the concentration of the sulfuric acid is 150 g/L; the additive content of the microetching liquid is 30 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

As a further preference, in this embodiment of the invention, the microetching solution further comprises 5 wt% of ethanolamine, 6 wt% of 1, 2-propanediol, and 3 wt% of heptylamine. The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, little pollution and convenient use, can quickly treat metal surface oxides and improve the metal surface cleanliness.

Further preferably, in this embodiment of the present invention, the composition further comprises 1 wt% of a stabilizer, 0.5 wt% of a surfactant, and 0.2 wt% of an antibacterial agent.

The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Specifically, it is further preferable that in this embodiment of the present invention, the stabilizer is an inorganic ammonia stabilizer, the surfactant is polyoxyethylene ether or fatty acid glyceride, and the antifungal agent is sodium benzoate or sodium polychlorinated phenolate.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Then measured with 0.1N KMnO4

END POINT colorless → Red

Calculation of 35% H202(g/L) the value of the measured quantity X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 6

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1.5 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 110 g/L; the concentration of the sulfuric acid is 150 g/L; the additive content of the microetching liquid is 30 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

As a further preference, in this embodiment of the invention, the microetching solution further comprises 3 wt% of ethanolamine, 4 wt% of 1, 2-propanediol, and 2 wt% of heptylamine. The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the printed circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, less pollution and convenient use, can quickly treat metal surface oxides and improve the cleanliness of the metal surface

Further preferably, in this embodiment of the present invention, the liquid composition further includes 3 wt% of a stabilizer, 10 wt% of a surfactant, and 1 wt% of an antimicrobial agent.

The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

Specifically, it is further preferable that in this embodiment of the present invention, the stabilizer is an inorganic ammonia stabilizer, the surfactant is polyoxyethylene ether or fatty acid glyceride, and the antifungal agent is sodium benzoate or sodium polychlorinated phenolate.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Post-application of 0.1N KMnO₄To measure

END POINT colorless → Red

Calculation of 35% H₂0₂(g/L) value of the measured amount X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

Example 7

A microetching liquid for treating the surface of copper is prepared through cleaning circuit board, immersing in the microetching liquid for 1.5 min, printing, and detecting; specifically, the microetching solution is placed in a microetching groove, and the microetching solution comprises hydrogen peroxide, sulfuric acid and water; the concentration of the hydrogen peroxide is 110 g/L; the concentration of the sulfuric acid is 150 g/L; the additive content of the microetching liquid is 30 wt%, and the balance is water. The microetching liquid is sulfuric acid-hydrogen peroxide series microetching liquid for copper surface treatment in the manufacturing engineering of printed circuit boards. The microetching agent has stable microetching speed, and the copper surface after microetching is uniform and glossy.

In addition, the micro-etching solution for treating the copper surface is easy to dilute and apply, convenient to treat, uniform in surface micro-etching effect, and multiple in use mode, and can be applied to the manufacturing engineering of printed circuit boards.

As a further preference, in this embodiment of the invention, the microetching solution further comprises 3 wt% of ethanolamine, 4 wt% of 1, 2-propanediol, and 2 wt% of heptylamine. The microetching solution has obvious pretreatment and surface chemical treatment effects on the printed circuit board, ensures that the copper surface of the circuit board achieves uniform roughness and cleanliness, increases the binding force between the copper surface and a pattern layer and a film, has low toxicity, little pollution and convenient use, can quickly treat metal surface oxides and improve the metal surface cleanliness.

Further preferably, in this embodiment of the present invention, the liquid composition further comprises 2 wt% of a stabilizer, 6 wt% of a surfactant, and 0.5 wt% of an antibacterial agent.

The microetching liquid product has wide application, and is mainly used for the pretreatment of oxide removal on the surface of metal and the pretreatment of metal coloring. And can also be used in the metallurgical industries of electronic circuit board copper surface super-roughening, oxidation removing treatment, mechanical processing, metal deep processing, spraying and the like.

Specifically, in this embodiment of the invention, the microetching solution for treating the copper surface is applied by spraying or immersion.

Specifically, it is further preferable that in this embodiment of the present invention, the stabilizer is an inorganic ammonia stabilizer, the surfactant is polyoxyethylene ether or fatty acid glyceride, and the antifungal agent is sodium benzoate or sodium polychlorinated phenolate.

The application method of the metal surface micro-etching solution comprises the following steps: diluting the metal surface micro-etching solution by using tap water or purified water according to the volume concentration of 10 +/-5%, then putting the workpiece into the diluted solution, soaking or spraying for 40-60 seconds at normal temperature, and then washing and drying by using tap water.

Hydrogen peroxide concentration analysis method

Putting 1ML reagent into a 250ML conical flask, adding 50ML distilled water, adding 50% sulfuric acid and 5ML

Post-application of 0.1N KMnO₄To measure

END POINT colorless → Red

Calculation of 35% H₂0₂(g/L) value of the measured amount X0.1X 48.57

Supplement amount SE-100 (reference value-analysis value) X Tank capacity/300 value

The conventional management range is 30-60 g/L.

Cu concentration analysis method

Taking 1ML reagent and putting into a 250ML conical flask

Adding pH 9.5Buff25ML, adding NH₄OH₅And ML, then dropping 2-5 drops of Pan indicator.

0.05M-EDTA to assay

END Point, dark blue → Green

Calculating Cu concentration (g/L) by measuring X0.05 Xf X63.54

In addition, Cu concentration (g/L) is measured as X0.05X f X63.54

The management range is 0-40 g/L.

Sulfuric acid concentration analysis method

1ML reagent is put into a 250ML conical flask, 50ML distilled water is added, and 3-5 drops of 0.1N NaOH are added as an M-O indicator to measure

END Point red → yellow

Calculation of the value of ML X0.1N X49

Supplement amount 98% (reference value-analysis value) ÷ 1.84XTank volume/1000 value

Value of 50% (reference value-analytical value) ÷ 1.42XTank capacity/1000.

Measuring the weight

ETCH RATE (μm) ═ ((initial-final) X10,000)/(length X width X8.92X2)

The microetching liquid has high uniformity of the treated metal surface and brings more stable adhesive force to the surface.

While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as described herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.