阅读说明：本技术 复合电子组件 (Composite electronic assembly ) 是由 孙受焕 于 2020-11-09 设计创作，主要内容包括：本公开提供一种复合电子组件,所述复合电子组件包括具有多层陶瓷电容器和陶瓷片的复合主体,多层陶瓷电容器包括第一陶瓷主体以及设置在第一陶瓷主体的两端上的第一外电极和第二外电极,在第一陶瓷主体中层叠有多个介电层和内电极,所述内电极设置为彼此相对并且多个介电层中的相应的一个介电层介于内电极之间；陶瓷片设置在多层陶瓷电容器下方并且包括包含陶瓷的第二陶瓷主体以及设置在第二陶瓷主体的两端上并且分别连接到第一外电极和第二外电极的第一端子电极和第二端子电极。第一陶瓷主体和第二陶瓷主体之间在厚度方向上的间隔距离G1与内电极和第一陶瓷主体的下表面之间的边缘部的长度M1的比G1/M1满足1.0至2.5。(The present disclosure provides a composite electronic component including a composite body having a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and inner electrodes are laminated, and first and second outer electrodes disposed on both ends of the first ceramic body, the inner electrodes being disposed to be opposite to each other with a corresponding one of the plurality of dielectric layers interposed therebetween; the ceramic sheet is disposed under the multilayer ceramic capacitor and includes a second ceramic body including ceramic and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to first and second external electrodes, respectively. A ratio G1/M1 of a spacing distance G1 in the thickness direction between the first ceramic body and the second ceramic body to a length M1 of an edge portion between the inner electrode and the lower surface of the first ceramic body satisfies 1.0 to 2.5.)

1. A composite electronic assembly comprising:

a composite body comprising:

a multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes are laminated, and first and second external electrodes disposed on both ends of the first ceramic body, the internal electrodes being disposed to be opposite to each other with a corresponding one of the plurality of dielectric layers interposed therebetween; and

a ceramic sheet disposed under the multilayer ceramic capacitor and including a second ceramic body including ceramic and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively,

wherein a ratio G1/M1 of a spacing distance G1 in a thickness direction between the first ceramic body and the second ceramic body to a length M1 of an edge portion between the inner electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

2. The composite electronic component of claim 1, wherein the length M1 of the edge portion between the inner electrode and the lower surface of the first ceramic body and the separation distance G1 in the thickness direction between the first ceramic body and the second ceramic body satisfy M1< G1.

3. The composite electronic component of claim 1, wherein the separation distance G1 in the thickness direction between the first and second ceramic bodies satisfies 30 μm G1 ≦ 120 μm.

4. The composite electronic component of claim 1, wherein the separation distance G1 in the thickness direction between the first and second ceramic bodies satisfies 50 μm G1 100 μm.

5. The composite electronic assembly of claim 1, wherein the internal electrodes in the first ceramic body are stacked perpendicular to a mounting surface of the composite body.

6. The composite electronic assembly of claim 1, wherein the internal electrodes are stacked perpendicular to the lower surface of the first ceramic body, and

the lower surface of the first ceramic main body faces the ceramic sheet.

7. The composite electronic component according to claim 1, wherein the multilayer ceramic capacitor and the ceramic sheet are bonded to each other by solder or a conductive adhesive applied on the upper surface of the first terminal electrode and the upper surface of the second terminal electrode.

8. The composite electronic component according to claim 1, wherein the thickness direction is a stacking direction along which the ceramic sheet and the multilayer ceramic capacitor are stacked.

9. A composite electronic assembly comprising:

a composite body comprising:

a multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes are laminated, and first and second external electrodes disposed on both ends of the first ceramic body, the internal electrodes being disposed to be opposite to each other with a corresponding one of the plurality of dielectric layers interposed therebetween; and

a ceramic sheet disposed under the multilayer ceramic capacitor and including a second ceramic body including ceramic and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively,

wherein a length M1 of an edge portion between the internal electrode and the lower surface of the first ceramic body and a separation distance G1 in the thickness direction between the first ceramic body and the second ceramic body satisfy M1< G1.

10. The composite electronic component of claim 9, wherein a ratio G1/M1 of the separation distance G1 in the thickness direction between the first ceramic body and the second ceramic body to the length M1 of the edge portion between the inner electrode and the lower surface of the first ceramic body satisfies 1.0< G1/M1 ≦ 2.5.

11. The composite electronic component of claim 9, wherein the separation distance G1 in the thickness direction between the first and second ceramic bodies satisfies 30 μ ι η ≦ G1 ≦ 120 μ ι η.

12. The composite electronic component of claim 9, wherein the separation distance G1 in the thickness direction between the first and second ceramic bodies satisfies 50 μ ι η ≦ G1 ≦ 100 μ ι η.

13. The composite electronic assembly of claim 9, wherein the internal electrodes in the first ceramic body are stacked perpendicular to a mounting surface of the composite body.

14. The composite electronic assembly of claim 9, wherein the internal electrodes are stacked perpendicular to the lower surface of the first ceramic body, and

the lower surface of the first ceramic main body faces the ceramic sheet.

15. The composite electronic component according to claim 9, wherein the multilayer ceramic capacitor and the ceramic sheet are bonded to each other by solder or a conductive adhesive applied on the upper surface of the first terminal electrode and the upper surface of the second terminal electrode.

16. The composite electronic component according to claim 9, wherein the thickness direction is a stacking direction along which the ceramic sheet and the multilayer ceramic capacitor are stacked.

Technical Field

The present disclosure relates to a composite electronic assembly.

Background

A multilayer ceramic capacitor, which is one type of electronic multilayer chip assembly, may be a chip capacitor mounted on a circuit substrate of various electronic products, such as an imaging device including a Liquid Crystal Display (LCD) and a Plasma Display Panel (PDP), a computer, a Personal Digital Assistant (PDA), a mobile phone, and the like, and may be charged or discharged.

Since a multilayer ceramic capacitor (MLCC) can be small-sized, can secure high capacitance, and can be easily mounted, such MLCC can be used as a component of various electronic devices.

The MLCC may have a structure in which a plurality of dielectric layers and internal electrodes having different polarities, which may be disposed between the dielectric layers, may be alternately stacked.

Since the dielectric layer has piezoelectricity and total distortion, when a direct current voltage or an alternating current voltage is applied to the MLCC, a piezoelectric phenomenon occurs between the inner electrodes, and thus vibration occurs.

Such vibration may be transmitted to the circuit substrate on which the MLCC is mounted through the outer electrodes of the MLCC, so that the entire circuit substrate may become an acoustic reflection surface and may generate vibration sound, which may be experienced as noise.

The vibration sound may be in audible frequencies between 20Hz and 20000Hz, and such vibration sound causing discomfort to the listener is called acoustic noise.

Such acoustic noise may be perceived by a user when the electronic device has been designed to have a slim and reduced size and has been used together with a printed circuit board in an environment where voltage is relatively high and voltage variation is relatively large.

Thus, there is a continuing need for products with reduced acoustic noise.

In order to reduce acoustic noise, studies have been made on a composite electronic component using a substrate on the lower surface of the MLCC.

However, specific studies on the size of the MLCC, the mounting method, the size of the ceramic sheet disposed in the lower portion, and the degree of removing acoustic noise according to the size of the electrode have not been properly conducted. Therefore, it is necessary to study a critical value related to the degree of influence of acoustic noise according to the distance between the MLCC and the ceramic sheet disposed on the lower surface and the length of the lower edge portion provided in the MLCC.

Disclosure of Invention

An aspect of the present disclosure is to provide a composite electronic component that may reduce acoustic noise.

According to an aspect of the present disclosure, a composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and inner electrodes are laminated, and first and second outer electrodes disposed on both ends of the first ceramic body, the plurality of dielectric layers being disposed opposite to each other with a corresponding one of the plurality of dielectric layers interposed between the inner electrodes; the ceramic sheet is disposed under the multilayer ceramic capacitor and includes a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively. A ratio (G1/M1) of a spacing distance (G1) in a thickness direction between the first ceramic body and the second ceramic body to a length (M1) of an edge portion between the inner electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

According to another aspect of the present disclosure, a composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and inner electrodes are laminated, and first and second outer electrodes disposed on both ends of the first ceramic body, the inner electrodes being disposed to be opposite to each other with a corresponding one of the plurality of dielectric layers interposed therebetween; the ceramic sheet is disposed under the multilayer ceramic capacitor and includes a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively. A length (M1) of an edge portion between the internal electrode and the lower surface of the first ceramic body and a separation distance (G1) in the thickness direction between the first ceramic body and the second ceramic body satisfy M1< G1.

Drawings

The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

fig. 1 is a perspective view illustrating a composite electronic assembly according to a first example embodiment of the present disclosure;

FIG. 2 is a sectional view taken along line I-I' in FIG. 1;

FIG. 3 is a sectional view taken along line II-II' in FIG. 1; and

fig. 4 is an exploded perspective view showing a composite electronic component divided into a multilayer ceramic capacitor and a ceramic sheet.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Therefore, the shapes and dimensions of elements in the drawings may be exaggerated for clarity of description. Further, elements having the same function will be described using the same reference numerals within the scope of the same concept shown in the drawings of each exemplary embodiment.

Values for parameters describing, for example, one-dimensional dimensions of an element (including, but not limited to, "length," "width," "thickness," "diameter," "distance," "gap," and/or "dimension"), two-dimensional dimensions of an element (including, but not limited to, "area" and/or "dimension"), three-dimensional dimensions of an element (including, but not limited to, "volume" and/or "dimension"), and properties of an element (including, but not limited to, "roughness," "density," "weight ratio," and/or "molar ratio") can be obtained by the methods and/or tools described in this disclosure. However, the present disclosure is not limited thereto. Other methods and/or tools understood by one of ordinary skill in the art may be used even if not described in this disclosure.

Composite electronic assembly

Fig. 1 is a perspective view showing a composite electronic component according to a first exemplary embodiment.

Fig. 2 is a sectional view taken along line I-I' in fig. 1.

Fig. 3 is a sectional view taken along line II-II' in fig. 1.

Referring to fig. 1, with respect to the composite electronic component in the example embodiment, "the length direction" may be defined as "L direction", "the width direction" may be defined as "W direction", and "the thickness direction" may be defined as "T direction". The "thickness direction" may be the same as a "stacking direction" along which the ceramic sheets and the multilayer ceramic capacitor are stacked.

Further, in example embodiments, the composite electronic component may have upper and lower surfaces opposite to each other and first and second side surfaces disposed in the length direction and third and fourth side surfaces disposed in the width direction, the first and second side surfaces and the third and fourth side surfaces connecting the upper and lower surfaces. The shape of the composite electronic component is not limited to any particular shape, but may have a hexahedral shape as shown in the drawings.

Further, the first and second side surfaces of the composite electronic component disposed in the length direction may be disposed in the same direction as the first and second side surfaces of the multilayer ceramic capacitor and the ceramic sheet disposed in the length direction, and the third and fourth side surfaces of the composite electronic component disposed in the width direction may be disposed in the same direction as the third and fourth side surfaces of the multilayer ceramic capacitor and the ceramic sheet disposed in the width direction.

Further, in the composite electronic component, the multilayer ceramic capacitor and the ceramic sheet may be bonded to each other. When the ceramic sheet is bonded to the lower portion of the multilayer ceramic capacitor, the upper surface of the composite electronic component may be defined as the upper surface of the multilayer ceramic capacitor, and the lower surface of the composite electronic component may be defined as the lower surface of the ceramic sheet.

Referring to fig. 1 and 2, the composite electronic component in the first exemplary embodiment may include a composite body 300, the composite body 300 including a multilayer ceramic capacitor 100 and a ceramic sheet 200, the multilayer ceramic capacitor 100 including a first ceramic body 110 and first and second external electrodes 131 and 132 disposed on both ends of the first ceramic body 110, in the first ceramic main body 110, a plurality of dielectric layers 111 and internal electrodes 121 and 122 disposed to face each other with the dielectric layers 111 interposed therebetween are laminated, a ceramic sheet 200 is disposed under the multilayer ceramic capacitor 100, and the ceramic sheet 200 includes a second ceramic body 210 including ceramic, and first and second terminal electrodes 231 and 232, the first and second terminal electrodes 231 and 232 being disposed on both ends of the second ceramic body 210 and connected to the first and second outer electrodes 131 and 132, respectively, the multilayer ceramic capacitor 100 and the ceramic sheet 200 being bonded to each other at the first and second terminal electrodes 231 and 232.

The ceramic may comprise alumina (Al)₂O₃)。

In general, in order to reduce vibration of the multilayer ceramic capacitor that may be transmitted to the printed circuit board, an intermediate medium may be interposed between the multilayer ceramic capacitor and the board.

Such an intermediate medium may be implemented by a resin used for manufacturing the substrate, and since the intermediate medium is formed using a material having elasticity, the intermediate medium may absorb vibration of the multilayer ceramic capacitor by its elasticity.

Unlike the general configuration described above, in the first exemplary embodiment, since the second ceramic main body 210 of the ceramic sheet 200 uses the ceramic material including alumina (Al)₂O₃) The ceramic of (1) is not elastically changed and is a hard material so that the printed circuit board and the multilayer ceramic capacitor 100 can be spaced apart from each other by the ceramic sheet 200, and thus, vibration transmitted from the multilayer ceramic capacitor 100 can be blocked.

In example embodiments, a ratio (G1/M1) of a spacing distance (G1) between the first and second ceramic bodies 110 and 210 in a thickness direction to a length (M1) of edge portions between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110 may satisfy 1.0 to 2.5. In other words, the ratio can satisfy 1.0. ltoreq.G 1/M1. ltoreq.2.5.

In one example, the separation distance (G1) may represent a dimension of a space between the first and second ceramic bodies 110, 210 in the thickness direction T, and may be one of an average dimension, a maximum dimension, and a dimension measured at a central portion of the composite body 300.

In one example, the separation distance (G1) may be determined by: based on an image of a cross-section cut in an L-T plane scanned by, for example, a Scanning Electron Microscope (SEM), a predetermined number (for example, 5) of points are defined to the left and a predetermined number (for example, 5) of points are defined to the right at equal intervals (optionally, or non-equal intervals) from a reference center point of a space between the first and second ceramic bodies 110 and 210, a size of the space in the thickness direction T is measured at equal intervals (optionally, or non-equal intervals), and an average value is obtained therefrom. The reference center point may have the same distance as the opposite edge in the cut section or substantially the same distance in consideration of the measurement error. In this case, the separation distance (G1) may be an average value. Alternatively, the separation distance (G1) may be determined and measured in the W-T plane. A length (M1) (or a size) of an edge portion between the internal electrode 121 or 122 and the lower surface of the first ceramic main body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

Alternatively, the separation distance (G1) may be determined by: based on an image of a cross-section cut in an L-T plane scanned by, for example, a Scanning Electron Microscope (SEM), a predetermined number (for example, 5) of points are defined to the left and a predetermined number (for example, 5) of points are defined to the right at equal intervals (optionally, non-equal intervals) from a reference center point of a space between the first and second ceramic bodies 110 and 210, the size of the space is measured at equal intervals (optionally, non-equal intervals), and thus a maximum value is obtained. In this case, the separation distance (G1) may be the maximum distance. Alternatively, the separation distance (G1) may be determined and measured in the W-T plane. A length (M1) (or a size) of an edge portion between the internal electrode 121 or 122 and the lower surface of the first ceramic main body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

Alternatively, the separation distance (G1) may be based on the size of a space at the reference center point based on an image of a cross-section cut in the L-T plane scanned by, for example, a Scanning Electron Microscope (SEM). The reference center point may have the same distance as the opposite edge in the cut section or substantially the same distance in consideration of the measurement error. Alternatively, the separation distance (G1) may be determined and measured in the W-T plane. A length (M1) (or a size) of an edge portion between the internal electrode 121 or 122 and the lower surface of the first ceramic main body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

In order to reduce acoustic noise, studies have been made on a composite electronic component using a substrate on the lower surface of a multilayer ceramic capacitor.

However, specific studies regarding the size of the multilayer ceramic capacitor, the mounting method, the size of the ceramic sheets disposed in the lower portion of the composite body, and the degree of removing acoustic noise according to the size of the electrodes have not been properly conducted. Therefore, it is necessary to study a critical value of the degree of influence of acoustic noise in relation to the distance between the multilayer ceramic capacitor and the ceramic sheet disposed on the lower surface and the length of the edge portion between the inner electrode disposed in the multilayer ceramic capacitor and the lower surface of the multilayer ceramic capacitor, and a numerical value of the critical value has been suggested in the exemplary embodiment.

In the course of having studied the exemplary embodiments, it has been found that the distance between the ceramic sheet adhered to the lower surface of the multilayer ceramic capacitor to reduce acoustic noise and the multilayer ceramic capacitor, that is, the distance between the second ceramic body of the ceramic sheet and the first ceramic body of the multilayer ceramic capacitor in the thickness direction may be correlated with acoustic noise generated by vibration of the multilayer ceramic capacitor.

The larger the distance in the thickness direction between the first ceramic main body of the multilayer ceramic capacitor and the second ceramic main body of the ceramic sheet, the more the magnitude of vibration transmitted to the multilayer ceramic capacitor of the ceramic sheet can be reduced, so that noise can be reduced, and when the distance is increased to a predetermined limit point or further, the effect of reducing noise may not be increased.

Further, since there may be a limit in design regarding the size of a product, particularly, a limit regarding the height of a product, an appropriate distance should be determined in consideration of the effect of reducing acoustic noise.

Further, in the composite electronic component in example embodiments, the internal electrodes of the multilayer ceramic capacitor may be laminated perpendicular to the mounting surface of the composite body.

In this case, regions of the lower edge portions of the multilayer ceramic capacitor (i.e., the edge portions between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110) in which the internal electrodes are not printed may serve as an intermediate medium that transfers vibrations generated from the regions where the internal electrodes are disposed to the ceramic sheets disposed below the multilayer ceramic capacitor.

The transmission mechanism of the vibration of the multilayer ceramic capacitor may be affected by the correlation between the length (M1) of the lower edge portion in the first ceramic body 110 of the multilayer ceramic capacitor 100 and the separation distance (G1) in the thickness direction between the second ceramic body 210 of the ceramic sheet 200 and the first ceramic body 110 of the multilayer ceramic capacitor 100, and thus, there may be a difference in acoustic noise.

In the first example embodiment, acoustic noise may be greatly reduced by adjusting the ratio (G1/M1) of the separation distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body to satisfy 1.0 to 2.5.

In other words, when G1 and M1 satisfy G1/M1 ≧ 1.0, acoustic noise can be reduced, and when the ratio (G1/M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body exceeds 2.5, that is, for example, when G1 and M1 satisfy G1/M1>2.5, the effect of reducing noise is insignificant.

Furthermore, as the value of G1/M1 increases, the size of the composite electronic component may also increase. Therefore, according to the first example embodiment, when the ratio (G1/M1) of the separation distance (G1) in the thickness direction between the first and second ceramic bodies 110 and 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body satisfies 1.0 to 2.5, the effect of reducing noise may be optimal.

When the length (M1) of the edge portions between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spaced distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 satisfy M1< G1, the piezoelectric phenomenon of the multilayer ceramic capacitor can be effectively prevented, thereby improving the effect of reducing acoustic noise.

According to the first example embodiment, the separation distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction may satisfy 30 μm ≦ G1 ≦ 120 μm.

By adjusting the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to satisfy 30 μm G1 120 μm, acoustic noise can be reduced.

The more the separation distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 increases, the more the acoustic noise can be reduced. However, when the separation distance (G1) is excessively increased, the size of the composite electronic component may be increased. Therefore, G1 may have an upper value due to limitations in product height.

In other words, when the separation distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction is less than 30 μm, the effect of reducing acoustic noise may be insufficient, and when the separation distance (G1) exceeds 120 μm, the size of the product may increase, which may not be preferable.

More preferably, the spacing distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction may satisfy 50 μm G1 ≦ 100 μm.

By adjusting the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to satisfy 50 μm G1 100 μm, the effect of reducing acoustic noise can be improved.

When the separation distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction is less than 50 μm, the effect of reducing acoustic noise may be insufficient, and when the separation distance (G1) exceeds 100 μm, the size of the product may increase, which may not be preferable.

In the following description, the multilayer ceramic capacitor 100 and the ceramic sheet 200 included in the composite body 300 will be described in more detail.

Referring to fig. 2, the first ceramic body 110 included in the multilayer ceramic capacitor 100 may be formed by laminating a plurality of dielectric layers 111, and a plurality of internal electrodes 121 and 122 (in turn, first and second internal electrodes) may be disposed in the first ceramic body 110 and may be spaced apart from each other with the dielectric layers 111 interposed between the internal electrodes 121 and 122.

The plurality of dielectric layers 111 included in the first ceramic body 110 may be in a sintered state, and boundaries between adjacent dielectric layers may be integrated with each other such that the boundaries may not be apparent.

The dielectric layer 111 may be formed by firing a ceramic green sheet including ceramic powder, an organic solvent, and an organic binder. The ceramic powder may have a high dielectric constant, and barium titanate (BaTiO) may be used₃) Base material, strontium titanate (SrTiO)₃) The base material and the like are ceramic powder, but not limited thereto.

The dielectric layer 111 forming the first ceramic body 110 may include a ferroelectric material, but example embodiments thereof are not limited thereto.

According to the first example embodiment, the internal electrodes may include a first internal electrode 121 exposed to a first side surface of the composite body 300 disposed in the length direction and a second internal electrode 122 exposed to a second side surface of the composite body disposed in the length direction, but example embodiments thereof are not limited thereto.

The first and second internal electrodes 121 and 122 may be formed using a conductive paste including a conductive metal.

The conductive metal may be realized by nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but the conductive metal is not limited thereto.

The first and second internal electrodes 121 and 122 may be printed on the ceramic green sheet formed as the dielectric layer 111 by a printing method such as a screen printing method or a gravure printing method using a conductive paste.

The first ceramic body 110 may be formed by alternately stacking ceramic green sheets each having an internal electrode printed thereon and firing the ceramic green sheets.

A plurality of first and second internal electrodes 121 and 122 may be vertically disposed on the upper and lower surfaces of the first ceramic body 110.

The first and second external electrodes 131 and 132 may be formed of a conductive paste containing a conductive metal, and the conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof, but example embodiments thereof are not limited thereto.

A nickel/tin (Ni/Sn) plating layer may be further disposed on the first and second external electrodes 131 and 132.

According to the first example embodiment, the ceramic sheet 200 may be bonded to the multilayer ceramic capacitor 100 and disposed under the multilayer ceramic capacitor 100.

The ceramic sheet 200 may have the following shape: first and second terminal electrodes 231 and 232 connected to the first and second external electrodes 131 and 132 are disposed on both ends of the second ceramic body 210, and the second ceramic body 210 is fabricated in a bulk form using ceramic.

Conventionally, in order to reduce vibration transmitted to a multilayer ceramic capacitor of a printed circuit board, it has been attempted to interpose an intermediate medium between the multilayer ceramic capacitor and the board.

The intermediate medium may be implemented by a resin used to manufacture the substrate, and since the intermediate medium is formed using a material having elasticity, the intermediate medium may absorb vibration of the multilayer ceramic capacitor by its elasticity.

Unlike the above-described configuration, in the first exemplary embodiment, the second ceramic main body 210 of the ceramic sheet 200 may be manufactured using only hard ceramic that does not undergo elastic change, so that the printed circuit board and the multilayer ceramic capacitor 100 may be spaced apart from each other by the ceramic sheet 200, and therefore, transmission of vibration generated from the multilayer ceramic capacitor 100 may be prevented.

According to a first example embodiment, the ceramic may comprise alumina (Al)₂O₃)。

Due to aluminum oxide (Al)₂O₃) Does not have piezoelectric properties, and thus alumina (Al)₂O₃) Can prevent the transmission of vibration generated from the multilayer ceramic capacitor 100, and thus, includes alumina (Al)₂O₃) The ceramic sheet 200 may be disposed under the multilayer ceramic capacitor 100 and may reduce acoustic noise.

The first and second terminal electrodes 231 and 232 may not be limited to any particular example. For example, the first terminal electrode 231 may have a double-layered structure including a first conductive resin layer disposed inside and a first plating layer disposed outside, and the second terminal electrode 232 may have a double-layered structure including a second conductive resin layer disposed inside and a second plating layer disposed outside.

According to the first exemplary embodiment, since the first terminal electrode 231 has the double-layered structure including the first conductive resin layer disposed inside and the first plating layer disposed outside as described above, and the second terminal electrode 232 has the double-layered structure including the second conductive resin layer disposed inside and the second plating layer disposed outside as described above, when external mechanical stress is applied, stress can be prevented from being transferred to the multilayer ceramic capacitor 100 by the conductive resin layer for the ceramic sheet 200 and the terminal electrodes 231 and 232 of the ceramic sheet 200, so that damage caused by cracks in the multilayer ceramic capacitor can be prevented.

The first and second conductive resin layers may include a conductive metal and a thermosetting resin, but example embodiments thereof are not limited thereto. For example, the first conductive resin layer and the second conductive resin layer may include silver (Ag) and epoxy.

In the multilayer ceramic capacitor according to the first example embodiment, a plurality of first and second internal electrodes 121 and 122 may be vertically disposed on the upper and lower surfaces of the first ceramic body 110.

Accordingly, when the composite body 300 is mounted on the printed circuit board, the first and second internal electrodes 121 and 122 may be stacked perpendicular to the mounting surface. In one example, an element being perpendicular to another element may mean the element being completely perpendicular to the other element. Alternatively, a component being perpendicular to another component may mean the component being substantially perpendicular to the other component, taking into account identifiable errors that may occur during manufacturing or measurement.

In general, when a voltage is applied to the multilayer ceramic capacitor, the ceramic body may expand and decrease in a length direction, a width direction, and a thickness direction by the inverse piezoelectric effect of the dielectric layer.

When the amounts of displacement of the length-width surface (L-W surface), the width-thickness surface (W-T surface), and the length-thickness surface (L-T surface) of the ceramic body are measured by a Laser Doppler Vibrometer (LDV), the amounts of displacement may occur in the order of L-W surface > W-T surface > L-T surface.

The amount of displacement of the L-T surface compared to the W-T surface may be about 42%, which may appear to be less than the amount of displacement of the W-T surface. This is because, even though the same level of stress may be generated on the L-T surface and the W-T surface, since the L-T surface may have a larger area than the area of the W-T surface, a similar level of stress may be distributed throughout a larger area, and thus relatively small deformation may occur.

Therefore, in the ordinary multilayer ceramic capacitor, the displacement amount on the L-T surface can be the smallest.

According to the first exemplary embodiment, by vertically laminating the first and second internal electrodes 121 and 122 on the upper and lower surfaces of the first ceramic body 110, the first and second internal electrodes 121 and 122 may be disposed perpendicular to the mounting surface when the composite body 300 is mounted on the printed circuit board, so that the amount of vibration of the surface contacting the ceramic sheet 200 may be reduced.

Fig. 4 is an exploded perspective view showing a composite electronic component divided into a multilayer ceramic capacitor and a ceramic sheet.

The composite body 300 may be formed by bonding the multilayer ceramic capacitor 100 to the ceramic sheet 200, and the method of forming the composite body 300 may not be limited to any particular method.

The method of forming the composite body 300 may include bonding the separately manufactured multilayer ceramic capacitor 100 to the ceramic sheet 200 using solder or a conductive adhesive 213.

The conductive adhesive 213 may be implemented by a paste including a conductive metal and an epoxy resin, but example embodiments thereof are not limited thereto.

Referring to fig. 4, when the multilayer ceramic capacitor 100 and the ceramic sheet 200 are bonded to each other using a solder or conductive adhesive 213, the solder or conductive adhesive 213 may be applied to the upper surfaces of the first and second terminal electrodes 231 and 232 and may be bonded to the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 100.

A solder or a conductive adhesive 213 may be applied to the upper surfaces of the first and second terminal electrodes 231 and 232 and may be fixed on the lower surface of the multilayer ceramic capacitor 100 together with the ceramic sheet 200. Accordingly, only the vibration of the length-width surface (L-W surface) of the first ceramic body 110 may be transmitted to the ceramic sheet 200.

Therefore, stress and vibration generated from the multilayer ceramic capacitor, which may be transmitted to the ceramic sheet, may be reduced, and thus acoustic noise may be reduced.

The composite electronic component according to the second exemplary embodiment may include a composite body 300, the composite body 300 including a multilayer ceramic capacitor 100 and a ceramic sheet 200, the multilayer ceramic capacitor 100 including a first ceramic body 110 and first and second external electrodes 131 and 132 disposed on both ends of the first ceramic body 110, in the first ceramic main body 110, a plurality of dielectric layers 111 and internal electrodes 121 and 122 disposed to face each other with the dielectric layers 111 interposed therebetween are laminated, a ceramic sheet 200 is disposed under the multilayer ceramic capacitor 100, and the ceramic sheet 200 includes a second ceramic body 210 including ceramic, and first and second terminal electrodes 231 and 232, the first and second terminal electrodes 231 and 232 being disposed on both ends of the second ceramic body 210 and connected to the first and second outer electrodes 131 and 132, respectively, the multilayer ceramic capacitor 100 and the ceramic sheet 200 being bonded to each other at the first and second terminal electrodes 231 and 232. Further, the length (M1) of the edge portions between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spaced distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 may satisfy M1< G1.

When the length (M1) of the edge portions between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spaced distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 satisfy M1< G1, the piezoelectric phenomenon of the multilayer ceramic capacitor can be effectively prevented, thereby improving the effect of reducing acoustic noise.

According to the second example embodiment, the ratio (G1/M1) of the spaced distance (G1) in the thickness direction between the first and second ceramic bodies 110 and 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body may satisfy 1.0< G1/M1 ≦ 2.5.

Since the ratio (G1/M1) of the spacing distance (G1) in the thickness direction between the first and second ceramic bodies 110 and 210 to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body satisfies 1.0< G1/M1 ≦ 2.5, the effect of reducing acoustic noise can be improved.

The description of the same features and elements of the second example embodiment as those of the first example embodiment will not be repeated.

In the following description, embodiments will be described in more detail, but embodiments of the present disclosure are not limited thereto.

Experimental examples

The composite electronic components in the examples and comparative examples were manufactured as follows.

In the embodiment and the comparative example, the ceramic sheets were disposed under the multilayer ceramic capacitor, and the composite electronic component was manufactured according to the mounting form of the internal electrodes of the multilayer ceramic capacitor, and the acoustic noise values were compared according to the separation distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction and the ratio (G1/M1) of the separation distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110.

Specifically, table 1 indicates an example in which the internal electrodes are stacked perpendicular to the mounting surface of the substrate, and compares acoustic noise values according to a spacing distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction and a ratio (G1/M1) of the spacing distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction to a length (M1) of an edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110.

In the experiment, it was determined that there is an effect of reducing the acoustic noise when the acoustic noise value is 30dBA or less, and particularly, it was determined that the effect of reducing the acoustic noise is significant when the acoustic noise value is equal to or less than 25 dBA.

[ TABLE 1 ]

*: comparative example

Referring to table 1 above, regarding samples 2, 3, 4, 9, 10, 11, 17, and 18 as examples, the spaced distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction satisfies 30 μ M ≦ G1 ≦ 120 μ M, and the ratio (G1/M1) of the spaced distance (G1) between the first and second ceramic bodies 110 and 210 in the thickness direction to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110 satisfies 1.0 to 2.5, so that the acoustic noise value is relatively low.

In particular, when the ratio (G1/M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110 satisfies G1/M1>1.0, the effect of reducing acoustic noise is improved.

With regard to samples 1, 5, 6, 7, 8, 12, 13, 14, 15, and 16 as comparative examples, the ratio (G1/M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110 did not satisfy the range of 1.0 to 2.5, so that the effect of reducing acoustic noise was relatively low.

In particular, with samples 1, 6, 7, 12, and 13 of the comparative example, the separation distance (G1) between the first ceramic body 110 and the second ceramic body 210 did not satisfy the range of 30 μm ≦ G1 ≦ 120 μm so that the acoustic noise value was high, and therefore, the comparative example was determined as samples 1, 6, 7, 12, and 13.

According to the foregoing example embodiments, stress or vibration caused by piezoelectric properties of the multilayer ceramic capacitor may be mitigated by the ceramic sheets, so that acoustic noise generated from the circuit substrate may be reduced.

Further, by optimizing the distance between the first ceramic main body of the multilayer ceramic capacitor and the second ceramic main body of the ceramic sheet disposed on the lower surface and the length of the edge portion between the inner electrode disposed in the multilayer ceramic capacitor and the lower surface of the first ceramic main body, the effect of reducing acoustic noise can be improved.

Further, since the internal electrodes of the multilayer ceramic capacitor are stacked in a direction perpendicular to the mounting surface and the surface taken in the length-width direction on which the piezoelectric displacement amount is relatively small is bonded to the ceramic sheet, stress and vibration generated from the multilayer ceramic capacitor, which may be transmitted to the ceramic sheet, may be reduced, so that acoustic noise may be reduced.

While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the invention defined by the appended claims.