阅读说明：本技术 金刚石-碳化硅基板及其制备方法与应用 (Diamond-silicon carbide substrate and preparation method and application thereof ) 是由 何新波 刘鹏飞 何十三 吴茂 于 2020-12-29 设计创作，主要内容包括：本发明涉及一种三维连续结构金刚石-碳化硅基板的制备方法,包括如下步骤：将聚碳硅烷、硅粉、分散剂、粘结剂、塑化剂和溶剂混合后进行湿法球磨,制备流延浆料；将流延浆料进行流延成型,干燥,制备流延坯；在流延坯中通过化学气相渗透过程填充金刚石,制备三维连续结构金刚石-碳化硅基板。通过以聚碳硅烷为陶瓷前驱体,流延成型法制备薄板状多孔碳化硅,化学气相渗透法在多孔碳化硅上沉积致密的金刚石,达到了致密化的目的。本发明中的三维连续结构金刚石-碳化硅基板的制备方法,不仅克服了硅蒸汽渗透法导致的基体中大量硅残余与金刚石易石墨化的问题,还有利于提高复合材料热导率。(The invention relates to a preparation method of a three-dimensional continuous structure diamond-silicon carbide substrate, which comprises the following steps: mixing polycarbosilane, silicon powder, a dispersing agent, a binder, a plasticizer and a solvent, and then carrying out wet ball milling to prepare casting slurry; carrying out tape casting molding on the tape casting slurry, and drying to prepare a tape casting blank; filling diamond in the casting blank through a chemical vapor infiltration process to prepare the diamond-silicon carbide substrate with the three-dimensional continuous structure. The thin porous silicon carbide is prepared by a tape casting method by taking polycarbosilane as a ceramic precursor, and compact diamond is deposited on the porous silicon carbide by a chemical vapor infiltration method, so that the aim of densification is fulfilled. The preparation method of the diamond-silicon carbide substrate with the three-dimensional continuous structure not only solves the problem that a large amount of silicon residues and diamond in a matrix are easy to graphitize due to a silicon vapor permeation method, but also is beneficial to improving the thermal conductivity of the composite material.)

1. A method for preparing a diamond-silicon carbide substrate, comprising the steps of:

1) mixing polycarbosilane, silicon powder, a dispersing agent, a binder, a plasticizer and a solvent, and then carrying out wet ball milling to prepare casting slurry, wherein the mass ratio of the polycarbosilane to the silicon powder is 100 (0-25);

2) carrying out tape casting molding on the tape casting slurry, and drying to prepare a tape casting blank;

3) and filling diamond in the casting blank through a chemical vapor infiltration process to prepare the diamond-silicon carbide substrate.

2. The method of claim 1, wherein the polycarbosilane, the dispersant, the plasticizer and the binder are present in a mass ratio of 100 (2-10): 10-20.

3. The method of making a diamond-silicon carbide substrate according to claim 1, wherein the dispersant is selected from at least one of triethyl phosphate and castor oil; and/or

The binder is polyvinyl butyral; and/or

The plasticizer is dioctyl phthalate; and/or

The solvent is selected from at least two of isopropanol, toluene, ethanol, methyl ethyl ketone, ethyl acetate, trichloroethylene and water.

4. The method of making a diamond-silicon carbide substrate according to any one of claims 1 to 3, wherein the wet ball milling comprises the steps of:

ball-milling and dispersing the polycarbosilane, the silicon powder and the dispersing agent in the solvent for 5-7 h, then adding the binder and the plasticizer, and continuing ball-milling for 5-7 h to prepare the casting slurry;

the grinding medium used in the wet ball milling is zirconia balls, and the diameter of the grinding medium is at least one selected from 5mm, 8mm and 15 mm.

5. The method of making a diamond-silicon carbide substrate according to any of claims 1 to 3 wherein the chemical vapor infiltration process temperature is 900 ℃ to 1200 ℃ and the infiltration time is 12h to 18 h.

6. A method of making a diamond-silicon carbide substrate according to any of claims 1 to 3 further comprising a pretreatment step prior to performing step 1):

and (3) carrying out pre-heat treatment on the polycarbosilane in a vacuum environment, wherein the heat treatment temperature is 600-1000 ℃, and the time is 1-3 h.

7. The method for producing a diamond-silicon carbide substrate according to any one of claims 1 to 3, further comprising, before the step 2), subjecting the casting slurry to a defoaming treatment under a vacuum degree of-100 KPa to-87.5 KPa for a defoaming time of 30min to 50 min.

8. A method of making a diamond-silicon carbide substrate according to any of claims 1 to 3 further comprising the step of degreasing the cast blank prior to performing step 3):

degreasing the casting blank at 900-1400 ℃ for 1-3 h under the protective atmosphere, then cooling to 100 ℃ at the speed of less than or equal to 5 ℃/min, and furnace-cooling.

9. A diamond-silicon carbide substrate produced by the method of any one of claims 1 to 8.

10. Use of a diamond-silicon carbide substrate according to claim 9 in the manufacture of a substrate material for electronic packaging.

Technical Field

The invention relates to the field of ceramic materials, in particular to a diamond-silicon carbide substrate and a preparation method and application thereof.

Background

With the continuous development of the electronic industry, the integration level of electronic and semiconductor devices is higher and higher, so that the power density of the electronic devices is higher and higher, the heat productivity is rapidly increased, and the heat dissipation capability becomes a key factor for restricting the working efficiency and the service life of the devices. In the early years, people achieve better heat dissipation capacity through reasonable circuit design, but with the gradual increase of heat productivity, the heat dissipation requirement cannot be met through a circuit design method. Moreover, in addition to the role of heat dissipation in the device, the electronic package substrate also provides sufficient support for the components, and the mismatch in thermal expansion coefficient between the substrate material and the semiconductor chip will cause fatigue failure of the substrate material under the action of thermal stress.

Diamond particle reinforced metal matrix composites (diamond/aluminum, diamond/copper) are widely used in the field of electronic packaging due to their excellent properties such as low thermal expansion coefficient, high thermal conductivity, etc., but are not suitable as electronic packaging substrate materials due to their high density, high electrical conductivity, etc. The diamond-silicon carbide composite material is a ceramic matrix composite material with high thermal conductivity, low thermal expansion, low density and proper dielectric constant, and is considered as the most potential electronic packaging substrate material. The conventional diamond-silicon carbide composite is prepared by filling silicon carbide and silicon having low thermal conductivity between diamond particles by a silicon vapor infiltration method. However, silicon carbide with low thermal conductivity has an adverse effect on the thermal conductivity of the composite material, and the silicon vapor infiltration method causes problems of a large amount of silicon residue in the matrix and easy graphitization of diamond. Secondly, the size of the diamond-silicon carbide composite material prepared by the traditional method is only 10mm by 10mm, and the requirement of larger size cannot be met. In addition, the bonding strength of the diamond and silicon carbide matrix interface is also one of the important influence factors of the thermal conductivity of the composite material.

Therefore, the development of a preparation method of the diamond-silicon carbide composite material to reduce the interface thermal resistance and the influence of the low-thermal-conductivity silicon carbide on the thermal conductivity of the composite material has important significance.

Disclosure of Invention

Based on the method, the invention provides a preparation method of the diamond-silicon carbide substrate, which solves the problem that a large amount of silicon residues in a matrix and diamond are easy to graphitize caused by a silicon vapor permeation method, and effectively improves the thermal conductivity of the composite material.

The technical scheme of the invention for solving the technical problems is as follows.

A method of making a diamond-silicon carbide substrate comprising the steps of:

1) mixing polycarbosilane, silicon powder, a dispersing agent, a binder, a plasticizer and a solvent, and then carrying out wet ball milling to prepare casting slurry, wherein the mass ratio of the polycarbosilane to the silicon powder is 100 (0-25);

2) carrying out tape casting molding on the tape casting slurry, and drying to prepare a tape casting blank;

3) and filling diamond in the casting blank through a chemical vapor infiltration process to prepare the diamond-silicon carbide substrate.

In some embodiments, in the preparation method of the diamond-silicon carbide substrate, the mass ratio of the polycarbosilane to the dispersant to the plasticizer to the binder is 100 (2-10) to (10-20).

In some of the embodiments, in the method for manufacturing a diamond-silicon carbide substrate, the dispersant is selected from at least one of triethyl phosphate and castor oil; and/or

The binder is polyvinyl butyral; and/or

The plasticizer is dioctyl phthalate; and/or

The solvent is selected from at least two of isopropanol, toluene, ethanol, methyl ethyl ketone, ethyl acetate, trichloroethylene and water.

In some of the embodiments, in the method for preparing a diamond-silicon carbide substrate, the wet ball milling comprises the following steps:

ball-milling and dispersing the polycarbosilane, the silicon powder and the dispersing agent in the solvent for 5-7 h, then adding the binder and the plasticizer, and continuing ball-milling for 5-7 h to prepare the casting slurry;

the grinding medium used in the wet ball milling is zirconia balls, and the diameter of the grinding medium is at least one selected from 5mm, 8mm and 15 mm.

In some embodiments, in the preparation method of the diamond-silicon carbide substrate, the chemical vapor infiltration process temperature is 900-1200 ℃, and the infiltration time is 12-18 h.

In some embodiments, the method for preparing a diamond-silicon carbide substrate further comprises a pretreatment step before the step 1):

and (3) carrying out pre-heat treatment on the polycarbosilane in a vacuum environment, wherein the heat treatment temperature is 600-1000 ℃, and the time is 1-3 h.

In some embodiments, before the step 2), the method for preparing a diamond-silicon carbide substrate further comprises a step of subjecting the casting slurry to defoaming treatment under the condition that the vacuum degree is-100 KPa to-87.5 KPa, wherein the defoaming time is 30min to 50 min.

In some embodiments, the method for preparing a diamond-silicon carbide substrate further comprises, before performing step 3), a step of degreasing the casting blank prepared in step 2):

degreasing the casting blank prepared in the step 2) at 900-1400 ℃ for 1-3 h under the protective atmosphere, then cooling to 100 ℃ at the speed of less than or equal to 5 ℃/min, and furnace-cooling.

The invention provides a diamond-silicon carbide substrate prepared by the preparation method of the diamond-silicon carbide substrate.

The invention provides application of the diamond-silicon carbide substrate in manufacturing electronic packaging substrate materials.

Compared with the prior art, the diamond-silicon carbide substrate prepared by the preparation method of the diamond-silicon carbide substrate has the following beneficial effects:

according to the invention, polycarbosilane, silicon powder, a dispersing agent, a binder, a plasticizer and a solvent are mixed and subjected to wet ball milling to prepare casting slurry, and further, casting blank with the thickness of 0.3-0.55 mm, controllable size and the size of 25mm to 25mm can be prepared through casting molding, so that the requirement of the industry on the thickness of a heat dissipation substrate is met, and the size range is expanded. In the preparation method of the diamond-silicon carbide substrate, the thin-plate-shaped porous silicon carbide is prepared by a tape casting method by taking polycarbosilane as a ceramic precursor, and compact diamond is deposited on the porous silicon carbide by a chemical vapor infiltration method, so that the aim of densification is achieved, and the diamond skeleton with a three-dimensional continuous structure is constructed. The diamond skeleton with a three-dimensional continuous structure is used as the reinforcement, so that the interface thermal resistance between the reinforcement and the matrix is reduced, and the three-dimensional continuous diamond skeleton in the composite material can be used as a transmission channel of a thermal load, so that the thermal physical property of the composite material can be greatly improved. The preparation method of the diamond-silicon carbide substrate not only solves the problem that a large amount of silicon residues and diamond in a matrix are easy to graphitize caused by a silicon vapor permeation method, but also is beneficial to improving the thermal conductivity of the composite material.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a flow chart of one embodiment of a process for making a diamond-silicon carbide substrate.

Detailed Description

The diamond-silicon carbide substrate and the method for producing the same according to the present invention will be described in further detail with reference to specific examples. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

The weight of the related components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also represent the proportional relationship of the weight among the components, and therefore, the content of the related components is scaled up or down within the scope disclosed in the description of the embodiments of the present invention as long as it is in accordance with the description of the embodiments of the present invention. Specifically, the weight described in the description of the embodiment of the present invention may be a unit of mass known in the chemical industry field, such as μ g, mg, g, and kg.

Referring to fig. 1, a method for fabricating a diamond-silicon carbide substrate includes steps S100 to S300.

Step S100: mixing Polycarbosilane (PCS), silicon powder, a dispersing agent, a binder, a plasticizer and a solvent, and then carrying out wet ball milling to prepare casting slurry. Wherein the mass ratio of the polycarbosilane to the silicon powder is 100 (0-25).

The polycarbosilane, the silicon powder, the dispersing agent, the binder, the plasticizer and the solvent are mixed and then subjected to wet ball milling, and the casting slurry which is uniformly dispersed and stable can be obtained, so that the subsequent casting molding is facilitated.

Optionally, the mass ratio of the polycarbosilane to the silicon powder is 100 (2.5-25).

Furthermore, the mass ratio of the polycarbosilane to the silicon powder is 100 (5-10).

In some examples, before performing step S100, a preprocessing step is further included:

the polycarbosilane is pre-heat treated in a vacuum environment at the temperature of 600-1000 ℃ for 1-3 h.

The polycarbosilane can reduce the volume shrinkage in the subsequent degreasing process after being subjected to heat treatment for 1 to 3 hours in a vacuum environment at the temperature of between 600 and 1000 ℃.

Preferably, the heat treatment temperature is 800 ℃ and the time is 2 h.

In some examples, in step S100, the mass ratio of the polycarbosilane, the dispersant, the plasticizer and the binder is 100 (2-10): (10-20): (10-20).

Optionally, the mass ratio of the polycarbosilane to the dispersant to the plasticizer to the binder is 100 (5-8): 11-15.

Preferably, the mass ratio of polycarbosilane, dispersant, plasticizer and binder is 100:6.6:13: 13.

In some examples, the viscosity of the casting slurry is 8000mPaS to 8450mPaS in step S100.

The control of the viscosity of the slurry is beneficial to the subsequent tape casting process, and the viscosity of the slurry is related to the thickness of the tape casting blank in the tape casting process. In the present embodiment, the viscosity of the casting slurry can be set in accordance with the viscosity requirement of the slurry for the usual casting.

In some examples, in step S100, the dispersant is selected from at least one of triethyl phosphate and castor oil.

Preferably, the dispersant is castor oil.

The dispersant can uniformly disperse each raw material in the solvent.

In some examples, the binder is polyvinyl butyral (PVB) in step S100.

In some examples, the plasticizer is dioctyl phthalate in step S100.

The addition of the binder and plasticizer to the raw materials can increase the strength of the casting blank and improve the toughness and ductility of the casting blank to facilitate separation from the substrate material.

In some examples, in step S100, the solvent is selected from at least two of isopropanol, toluene, ethanol, methyl ethyl ketone, ethyl acetate, trichloroethylene, and water.

Optionally, the solvent is one of isopropanol/toluene, ethanol/ethyl acetate, ethanol/methyl ethyl ketone, trichloroethylene/methyl ethyl ketone, and ethanol/water. It is to be noted that, in this context, "/" indicates a mixture, such as isopropanol/toluene indicates a mixture of isopropanol and toluene.

In some examples, in step S100, the wet ball milling includes steps S110 to S120:

step S110: ball-milling and dispersing the polycarbosilane, the silicon powder and the dispersing agent in a solvent for 5-7 h.

Step S120: adding a binder and a plasticizer, and continuously performing ball milling for 5-7 h to prepare casting slurry.

It can be understood that the raw materials can be fully and uniformly mixed by adopting a step-by-step ball milling and mixing mode.

In some examples, the wet ball milling uses zirconia balls as the grinding media in steps S110 to S120, and the diameter of the zirconia balls is at least one selected from 5mm, 8mm and 15 mm. It will be appreciated that the grinding media may also be other materials commonly used in wet ball milling.

Preferably, the grinding media are selected from mixtures of zirconia balls having diameters of 5mm, 8mm and 15mm respectively.

Step S200: and carrying out tape casting molding on the tape casting slurry, and drying to prepare a tape casting blank.

In some of the examples, the thickness of the casting blank is 0.3mm to 0.55mm in step S200.

The casting blank with the thickness of 0.3 mm-0.55 mm is prepared by a casting forming mode, and the requirement (0.38 mm-0.5 mm) of the thickness of a common heat conducting substrate in the industry can be met.

Preferably, after step S100 and before step S200, step S130 is further included.

Step S130: and (4) defoaming the casting slurry.

In some examples, in step S130, the defoaming treatment is performed under a vacuum degree of-100 KPa to-87.5 KPa, and the defoaming time is 30min to 50 min.

Through defoaming treatment, bubbles in the casting slurry are discharged, the existence of large pores in a subsequent casting blank is avoided, the viscosity of the casting slurry is controlled within a certain range, and the casting slurry is beneficial to subsequent casting forming.

Further, after the step S200, a step of cutting the casting blank so that the size of the casting blank satisfies the requirement is further included.

The size of the casting blank prepared by the method can reach 25mm by 25mm, and the requirement of larger size is enlarged.

Step S300: diamond was filled in the cast ingot by a chemical vapor infiltration process (CVI process) to prepare a diamond-silicon carbide substrate.

Wherein, the diamond precursor used in the step S300 is methane gas.

In some examples, in step S300, the temperature of the chemical vapor infiltration process is 900 ℃ to 1200 ℃, and the infiltration time is 12h to 18 h.

Preferably, the temperature of the chemical vapor infiltration process is 1200 ℃ and the infiltration time is 18 h.

In some examples, the osmotic pressure is 3kPa in step S300.

In the CVI process, precursor methane gas is carried into a permeation furnace through hydrogen gas, enters pores of a casting blank, is cracked and deposited on the surface of the casting blank, and the pores in the casting blank are completely compact through continuous deposition.

Preferably, after step S200 and before step S300, step S210 is further included.

Step S210: and degreasing the casting blank.

In some examples, the degreasing process is performed in a protective atmosphere in step S210.

Optionally, the protective atmosphere is argon or nitrogen.

In some examples, the degreasing process includes steps S211 to S212 in step S210.

Step S211: and degreasing the casting blank at 900-1600 ℃ for 1-3 h under the protective atmosphere.

Preferably, the degreasing temperature is 1600 ℃.

The higher degreasing temperature can not only completely decompose and volatilize organic reagents such as dispersing agents, binders, plasticizers and the like contained in the casting blank, but also promote the PCS to be further cracked to form SiC, thereby being beneficial to improving the strength of the blank and preventing the blank from deforming in the subsequent process to influence the quality of the substrate.

Step S212: cooling to 100 ℃ at the speed of less than or equal to 5 ℃/min, and cooling along with the furnace.

The invention provides a three-dimensional continuous structure diamond-silicon carbide substrate prepared by the preparation method of the diamond-silicon carbide substrate.

The diamond-silicon carbide substrate with the density of more than 94 percent and even up to 98 percent can be prepared through the steps S100 to S300, and the diamond has a three-dimensional structure in the substrate and is well combined with the substrate.

The invention also provides application of the diamond-silicon carbide substrate in manufacturing electronic packaging substrate materials.

The diamond-silicon carbide substrate and the preparation method thereof have at least the following advantages:

according to the invention, polycarbosilane, silicon powder, a dispersing agent, a binder, a plasticizer and a solvent are mixed and subjected to wet ball milling to prepare the casting slurry. And further preparing a casting blank with controllable size and uniform porosity by casting molding, and infiltrating diamond into the casting blank by a CVI process, wherein the infiltrated diamond gradually fills the pores in the casting blank to obtain the compact diamond-silicon carbide substrate. The preparation method provided by the invention not only solves the problem that the heat conductivity is difficult to improve in the process of CVI silicon carbide in the porous diamond preform in the traditional method, but also solves the problem that diamond is easy to graphitize in the silicon gas-phase infiltration process. Compared with a silicon vapor infiltration method, the diamond-silicon carbide substrate prepared by the preparation method provided by the invention does not contain residual silicon, and the insulation property and the dielectric property of the substrate are favorably improved.

In the diamond-silicon carbide substrate prepared by the preparation method of the diamond-silicon carbide substrate provided by the invention, the diamond reinforcement exists in a continuous three-dimensional framework form, an effective heat transfer channel can be established in the composite material, and the thermal conductivity of the composite material can be greatly improved. The ceramic-based electronic packaging substrate has the characteristics of controllable size, low density, high strength and high thermal conductivity, is expected to become an ideal electronic packaging substrate, and has important significance for promoting the development of the ceramic-based electronic packaging substrate.

The preparation method of the diamond-silicon carbide substrate provided by the invention is simple in preparation process, short in production period and suitable for large-scale production.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

Hereinafter, a diamond-silicon carbide substrate and a method for producing the same according to the present invention will be exemplified, and it is understood that the diamond-silicon carbide substrate and the method for producing the same according to the present invention are not limited to the following examples.

The vacuum defoaming machine adopted in the embodiment is of the following model: DL-TP2.0L, available from Delong technologies, Zhejiang; the casting machine model adopted is as follows: DL-LYJ-QE50, available from Delong technologies, Zhejiang; the type of the adopted degreasing furnace is as follows: model TS-590L, available from Ningbos Borui Automation Equipment; the CVI furnace is adopted, the model of which is ZHC-phi 22, and is purchased from Hitachi technologies, Inc. in Hunan province.

Example 1

The preparation process of the diamond/silicon carbide substrate of the present example is specifically as follows:

1) 50g of PCS, 3.3g of dispersant (triethyl phosphate) and 21.7g of ethanol and ethyl acetate azeotropic liquid are added into a polytetrafluoroethylene ball milling tank, a zirconia ball mixture with the diameter of 5mm, 8mm and 15mm is used as a grinding medium, ball milling is carried out for 6h, then adhesive (PVB 6.5g) and plasticizer (dioctyl phthalate 6.5g) are added into the mixture, ball milling is carried out for 6h, and casting slurry with the viscosity of about 8000mPaS is obtained.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.47mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1400 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 900 ℃, the infiltration pressure is 3kPa, the infiltration time is 12h, and the furnace is cooled.

Example 2

1) Adding 50g of PCS, 2.5g of silicon powder, a dispersing agent (3.3 g of triethyl phosphate) and 21.7g of ethanol and ethyl acetate azeotropic liquid into a polytetrafluoroethylene ball milling tank, ball milling for 6h by taking a zirconia ball mixture with the diameter of 5mm, 8mm and 15mm as a grinding medium, adding 6.5g of adhesive (PVB) and 6.5g of plasticizer (dioctyl phthalate), and continuing ball milling for 6h to obtain casting slurry with the viscosity of about 8160 mPaS.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.51mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1400 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 900 ℃, the infiltration pressure is 3kPa, the infiltration time is 12h, and the furnace is cooled.

Example 3

1) 50g of PCS, 5g of silicon powder, 3.3g of dispersant (triethyl phosphate) and 21.7g of ethanol and ethyl acetate azeotropic liquid are added into a polytetrafluoroethylene ball milling tank, zirconia ball mixture with the diameter of 5mm, 8mm and 15mm is used as a grinding medium, the mixture is ball milled for 6h, then 6.5g of adhesive (PVB) and 6.5g of plasticizer (dioctyl phthalate) are added into the mixture, the ball milling is continued for 6h, and casting slurry with the viscosity of about 8210mPas is obtained.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.47mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1400 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 1200 ℃, the infiltration pressure is 3kPa, the infiltration time is 12h, and the furnace cooling is carried out.

Example 4

1) 50g of PCS, 5g of silicon powder, 3.3g of dispersant (triethyl phosphate) and 21.7g of ethanol and ethyl acetate azeotropic liquid are added into a polytetrafluoroethylene ball milling tank, zirconia ball mixture with the diameter of 5mm, 8mm and 15mm is used as a grinding medium, the mixture is ball milled for 6h, then 6.5g of adhesive (PVB) and 6.5g of plasticizer (dioctyl phthalate) are added into the mixture, the ball milling is continued for 6h, and casting slurry with the viscosity of about 8210mPas is obtained.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.51mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1400 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 1200 ℃, the infiltration pressure is 3kPa, the infiltration time is 15h, and the furnace is cooled.

Example 5

1) Adding 50g of PCS, 5g of silicon powder, 3.3g of dispersant (castor oil) and 21.7g of ethanol and ethyl acetate azeotropic liquid into a polytetrafluoroethylene ball milling tank, ball milling for 6h by taking a zirconia ball mixture with the diameter of 5mm, 8mm and 15mm as a grinding medium, adding 6.5g of adhesive (PVB) and 6.5g of plasticizer (dioctyl phthalate), and continuing ball milling for 6h to obtain casting slurry with the viscosity of about 8340 mPas.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.53mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1400 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 1200 ℃, the infiltration pressure is 3kPa, the infiltration time is 18h, and the furnace cooling is carried out.

Example 6

1) Adding 50g of PCS, 5g of silicon powder, 3.3g of dispersant (castor oil) and 21.7g of ethanol and ethyl acetate azeotropic liquid into a polytetrafluoroethylene ball milling tank, ball milling for 6h by taking a zirconia ball mixture with the diameter of 5mm, 8mm and 15mm as a grinding medium, adding 6.5g of adhesive (PVB) and 6.5g of plasticizer (dioctyl phthalate), and continuing ball milling for 6h to obtain casting slurry with the viscosity of about 8340 mPas.

2) And (2) carrying out vacuum defoaming on the casting slurry prepared in the step 1) for 30min under a negative pressure environment of-87.5 KPa, and filtering.

3) And (3) carrying out tape casting molding on the tape casting slurry treated in the step 2) by using a tape casting machine, controlling the height of a scraper to be 1.3mm, controlling the tape casting speed to be 0.02m/min, drying in a first drying area, a second drying area and a third drying area at the temperature of 40 ℃, 55 ℃ and 70 ℃ respectively to obtain tape casting blanks with the thickness of 0.53mm, and cutting.

4) And (3) degreasing the casting blank in an argon environment, wherein the degreasing temperature is set to 1600 ℃, and the heat preservation time is 120 min. After the heat preservation is finished, the temperature is reduced to 100 ℃ at the speed of 2 ℃/min and then the furnace is cooled.

5) And placing the degreased casting blank in a CVI furnace, and performing chemical vapor infiltration by taking methane gas as a precursor and hydrogen gas as carrier gas to densify. The infiltration temperature is 1200 ℃, the infiltration pressure is 3kPa, the infiltration time is 18h, and the furnace cooling is carried out.

Example 7

The method is basically the same as example 6, except that the added components and the weight are different, and specifically the following components are added:

40g of PCS, 5g of silicon powder, 3.3g of dispersant (castor oil), and 21.7g of trichloroethylene and methyl ethyl ketone azeotropic liquid are added into a polytetrafluoroethylene ball mill pot, and zirconia balls with the diameters of 5mm, 8mm and 15mm are used. The media was ball milled for 6h, then binder (PVB 6.5g), plasticizer (dioctyl phthalate 6.5g) were added to it and ball milling was continued for 6h to obtain a casting slurry with a viscosity of about 8450 mPaS.

Example 8

Essentially the same as in example 6, except that the infiltration temperature during CVI was 800 ℃.

Example 9

Essentially the same as in example 6, except that the infiltration temperature during CVI was 1300 ℃.

Example 10

The same as example 6, except that the permeation time during CVI was 10 h.

Comparative example 1

In one disclosed technique a uniform porous diamond preform is prepared by tape casting and densified by a CVI process. The method comprises the following specific steps:

1) mixing 50 parts of diamond, 3 parts of triethyl phosphate, 34 parts of ethanol and ethyl acetate azeotropic liquid, carrying out ball milling for 8 hours, adding 6 parts of polyvinyl butyral and 6 parts of dioctyl phthalate, and carrying out ball milling for 15 hours to obtain casting slurry.

2) And (3) carrying out vacuum defoaming on the casting slurry subjected to ball milling for 25min, carrying out casting molding on the defoamed slurry, naturally drying in air, and then demoulding to obtain the diamond preform with a set thickness.

3) And carrying out chemical vapor infiltration on the diamond preform prepared by casting molding to obtain the diamond-silicon carbide substrate, wherein the treatment temperature is 1000 ℃.

4) And (3) polishing the surface of the diamond-silicon carbide substrate after permeation, then superposing the diamond-silicon carbide substrate layer by layer, and performing hot-pressing sintering to obtain a substrate material with the thickness of 3mm, wherein the sintering temperature is 1450 ℃, and the sintering heat preservation time is 2 h.

The data for each example are shown in table 1.

TABLE 1

The density, thermal conductivity and thermal expansion coefficient of examples 1 to 10 and comparative example 1 were measured, respectively, and the results are shown in table 2.

Density: and testing by adopting an Archimedes drainage method.

Density: and testing by adopting an Archimedes drainage method.

Thermal conductivity: the test is carried out by a laser method (a relaxation-resistant laser thermal conductivity tester LFA 467).

Coefficient of thermal expansion: the test is carried out by adopting a differential method (Hunan instrument PCY-II vacuum thermal expansion coefficient tester).

TABLE 2

It can be seen from the above examples that, wet ball milling is performed on PCS and silicon powder to obtain casting slurry, casting is further performed to prepare a casting blank with controllable size and uniform porosity, and densification is performed through a CVI process to obtain a dense diamond-silicon carbide substrate with a three-dimensional continuous structure. Within a certain range, the density of the prepared diamond/silicon carbide substrate can be improved by increasing the infiltration temperature; within a certain range, the density of the prepared diamond/silicon carbide substrate can be improved by increasing the penetration time.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.