阅读说明：本技术 一种印刷电路板脱焊分离方法 (Printed circuit board desoldering separation method ) 是由 成丁 于 2019-11-15 设计创作，主要内容包括：本发明公开了一种印刷电路板脱焊分离方法,具体步骤包括：首先对废弃印刷电路板清洗干净,去除表面杂质,对电路板进行高压除尘处理后烘干；再将烘干的印刷电路板加热使焊锡融化,使用金属钩将大电子元器件取下；将电路板保持电子元器件所在一面朝向上方,呈水平悬置于酸性溶液中；再往酸性溶液中加入氧化剂；待印刷电路板表面的完全溶解后,取出电路板和容器底部的电子元器件冲洗干净,进行分类回收。本发明脱焊时间短,拆解后的副产品进行资源再利用,实现废弃印刷电路板上电子元件和基板的无损脱焊分离,脱焊操作高效、安全、可靠、节能、环保。(The invention discloses a printed circuit board desoldering separation method, which comprises the following specific steps: firstly, cleaning a waste printed circuit board, removing surface impurities, carrying out high-pressure dust removal treatment on the circuit board, and then drying the circuit board; heating the dried printed circuit board to melt the soldering tin, and taking down the large electronic component by using a metal hook; the surface of the circuit board, on which the electronic components are positioned, faces upwards and is horizontally suspended in the acid solution; adding an oxidant into the acidic solution; and after the surface of the printed circuit board is completely dissolved, taking out the circuit board and the electronic components at the bottom of the container, washing the circuit board and the electronic components clean, and classifying and recycling the circuit board and the electronic components. The invention has short desoldering time, the disassembled by-product can be recycled, the nondestructive desoldering separation of the electronic element and the substrate on the waste printed circuit board can be realized, and the desoldering operation is efficient, safe, reliable, energy-saving and environment-friendly.)

1. A printed circuit board desoldering separation method is characterized by comprising the following specific steps:

step 1, cleaning a waste printed circuit board, removing surface impurities, performing high-pressure dust removal treatment on the circuit board, and drying;

step 2, heating the printed circuit board dried in the step 1 to melt the soldering tin, and taking down the large electronic component by using a metal hook;

step 3, enabling the surface of the circuit board processed in the step 2, where the electronic components are located, to face upwards and horizontally suspending the circuit board in an acid solution;

step 4, adding an oxidant into the acidic solution obtained in the step 3;

and 5, after the surface of the printed circuit board in the step 4 is completely dissolved, taking out the circuit board and the electronic components at the bottom of the container, washing the circuit board and the electronic components clean, and classifying and recycling the circuit board and the electronic components.

2. The desoldering separation method of a printed circuit board as claimed in claim 1, wherein the temperature range of the heating wire is 250-300 ℃ when heating in step 2.

3. The method for separating printed circuit boards by desoldering according to claim 1, wherein the acidic solution in step 3 is an acidic HBF4 solution with a concentration of 20-40%.

4. The desoldering separation method of the printed circuit board as claimed in claim 1, wherein the oxidizing agent in step 4 is hydrogen peroxide solution with a concentration of 10% -30%.

5. The desoldering separation method of the printed circuit board as recited in claim 1, wherein the reaction temperature of the step 4 is 20 ℃ to 50 ℃ and the reaction time is 2h to 3 h.

6. The method of claim 1, wherein a high pressure steam cleaner is used in step 1.

Technical Field

The invention belongs to the technical field of electronic product treatment and recovery, and relates to a printed circuit board desoldering separation method.

Background

With the increasing speed of the electronic and electric products, the amount of electronic waste containing printed circuit boards is increasing. The nondestructive disassembly of the elements and the substrate on the waste printed circuit board is always difficult for recovering the printed circuit board. The physical recovery of printed circuit boards requires that electronic components are desoldered first. The desoldering process has two key steps: selection of a heating method of the desoldering and study on the detaching force of the desoldering. At present, the common heating methods for melting soldering tin in the process of removing printed circuit board components mainly include air heating, infrared heating, laser heating, liquid heating and the like. However, due to the difference of the packaging technologies of the components, the disassembly force for disassembling the components is different, and the defects of large damage degree of the electronic components and high separation rate of the electronic components exist.

Disclosure of Invention

The invention aims to provide a printed circuit board desoldering separation method, which solves the problems of high damage degree of electronic components and low separation rate of electronic components in the method for disassembling the printed circuit board in the prior art.

The technical scheme adopted by the invention is that the printed circuit board desoldering separation method is characterized by comprising the following specific steps of:

step 1, cleaning a waste printed circuit board, removing surface impurities, performing high-pressure dust removal treatment on the circuit board, and drying;

step 2, heating the printed circuit board dried in the step 1 to melt the soldering tin, and taking down the large electronic component by using a metal hook;

step 3, enabling the surface of the circuit board processed in the step 2, where the electronic components are located, to face upwards and horizontally suspending the circuit board in an acid solution;

step 4, adding an oxidant into the acidic solution obtained in the step 3;

and 5, after the surface of the printed circuit board in the step 4 is completely dissolved, taking out the circuit board and the electronic components at the bottom of the container, washing the circuit board and the electronic components clean, and classifying and recycling the circuit board and the electronic components.

The present invention is also characterized in that,

when heating in the step 2, the temperature range of the electric heating wire is 250-300 ℃;

the acidic solution in the step 3 is an acidic HBF4 solution with the concentration of 20-40%;

in the step 4, the oxidant is hydrogen peroxide solution with the concentration of 10-30%.

The reaction temperature of the step 4 is 20-50 ℃, and the reaction time is 2-3 h;

and (3) selecting a high-pressure steam cleaning machine in the step 1.

The invention has the beneficial effects that the printed circuit board desoldering separation method comprises the steps of firstly cleaning the waste printed circuit board, and drying the circuit board after high-pressure dust removal treatment; heating the dried printed circuit board to melt the soldering tin, and taking down the large electronic component by using a metal hook; the surface of the circuit board, on which the electronic components are positioned, faces upwards and is horizontally suspended in the acid solution; adding an oxidant into the acidic solution; and after the surface of the printed circuit board is completely dissolved, taking out the circuit board and the electronic components at the bottom of the container, washing the circuit board and the electronic components clean, and classifying and recycling the circuit board and the electronic components. The method has the advantages of short desoldering time, environmental protection, high safety and less pollution; the method effectively solves the problems of high energy consumption, high temperature, low treatment capacity, high pollution and high risk caused by the conventional disassembling method of the printed circuit board, realizes the nondestructive desoldering separation of the electronic element and the substrate on the waste printed circuit board, has high efficiency, safety, reliability, energy conservation, environmental protection and low element damage rate.

Detailed Description

The invention relates to a printed circuit board desoldering separation method, which comprises the following specific steps:

step 1, cleaning a waste printed circuit board, removing surface impurities, performing high-pressure dust removal treatment on the circuit board, and drying;

step 2, heating the printed circuit board dried in the step 1 to melt the soldering tin, taking down the large electronic component by using a metal hook, wherein the temperature range of the electric heating wire is 250-300 ℃ during heating;

step 3, enabling the surface of the circuit board processed in the step 2, where the electronic components are located, to face upwards and horizontally suspending the circuit board in an acid solution; the acidic solution in the step 3 is an acidic HBF4 solution with the concentration of 20-40%;

step 4, adding an oxidant into the acidic solution obtained in the step 3, wherein the reaction temperature is 20-50 ℃, and the reaction time is 2-3 hours; in the step 4, the oxidant is hydrogen peroxide solution with the concentration of 10-30%.

And 5, after the surface of the printed circuit board in the step 4 is completely dissolved, taking out the circuit board and the electronic components at the bottom of the container, washing the circuit board and the electronic components clean, and classifying and recycling the circuit board and the electronic components.

The high-pressure steam cleaning machine is selected in the step 1, high-pressure steam dust removal is carried out on the circuit board, the later-stage processing work can be better facilitated, meanwhile, dust can be collected and processed, and the cleaning machine is convenient and environment-friendly.

The present invention will be described in detail with reference to the following embodiments.