阅读说明：本技术 一种中空微针模具的制备方法 (Preparation method of hollow microneedle mould ) 是由 袭祥春 杜庆田 于 2019-11-15 设计创作，主要内容包括：本发明公开了一种中空微针模具的制备方法,包括以下步骤,将阳模的下端与基质容器的内壁连接；将熔融或溶液状态的阴模基质注入基质容器内,阴模基质的液面高度低于阳模的上端,且阳模的熔点高于阴模基质的熔点温度；待阴模基质固化后形成阴模,将阴模与阳模分离,阴模上形成两端开口的模具孔；在模具孔的内壁上涂覆导电层；在导电层的外侧覆盖金属层；去除阴模得到由导电层和金属层组成的中空微针模具。对所用阳模的尺寸精度要求低,解除对微加工技术的依赖,微针模具的内径主要通过金属层涂覆厚度来控制和调整,便于获取不同尺寸的微针；通过对模具进行再加工,改变微针模具尺寸,可以在一定尺寸范围内满足模具尺寸的多样化。(The invention discloses a preparation method of a hollow microneedle mould, which comprises the following steps of connecting the lower end of a male mould with the inner wall of a substrate container; injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate; forming a female die after the matrix of the female die is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die; coating a conductive layer on the inner wall of the die hole; covering a metal layer on the outer side of the conductive layer; and removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer. The requirement on the dimensional accuracy of the used male die is low, the dependence on a micro-machining technology is eliminated, and the inner diameter of the microneedle die is mainly controlled and adjusted through the coating thickness of the metal layer, so that microneedles with different sizes can be obtained conveniently; the size of the microneedle mould is changed by reprocessing the mould, so that the diversification of the mould size can be met within a certain size range.)

1. A method for preparing a hollow microneedle mould is characterized by comprising the following steps: comprises the following steps of (a) carrying out,

step one, connecting the lower end of a male die with the inner wall of a substrate container;

injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate;

step three, forming a female die after the female die substrate is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die;

coating a conductive layer on the inner wall of the die hole;

covering a metal layer on the outer side of the conductive layer;

and sixthly, removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer.

2. The method of claim 1, wherein the method comprises: the male die is of a prism or cylindrical structure.

3. The method of claim 2, wherein the step of preparing a hollow microneedle mold comprises: the male die is of a solid or hollow structure.

4. The method of claim 3, wherein the step of preparing a hollow microneedle mold comprises: the male die is made of metal.

5. The method of claim 1, wherein the method comprises: the female mold substrate is one of polydimethylsiloxane, polymethyl methacrylate, polyimide, polystyrene, polyvinyl alcohol and photoresist.

6. The method of claim 1, wherein the method comprises: the conducting layer is coated in a sputtering or spin coating mode.

7. The method of claim 1, wherein the method comprises: the conducting layer is one or more of nickel, copper, chromium, tungsten, platinum, gold and silver.

8. The method of claim 1, wherein the method comprises: the metal layer is covered by electroplating, electroforming or chemical plating.

9. The method of claim 1, wherein the method comprises: the removal mode of the female die is calcination or solvent dissolution.

10. The method of claim 1, wherein the method comprises: the substrate container is of an upper end opening structure.

Technical Field

The invention relates to the technical field of microneedle moulds, in particular to a preparation method of a hollow microneedle mould.

Background

In recent years, microneedles have attracted much attention as a physical permeation-promoting means for transdermal drug delivery and cosmetic skin care, or as microneedle therapy electrodes for disease treatment. The micro-needle has small size and does not touch the nerves of the dermis layer, so that the micro-needle does not cause pain; in addition, the transdermal patch has unique advantages in the aspect of transdermal absorption of the medicine, can replace a transdermal patch, realizes continuous painless administration, avoids or reduces the physiological discomfort of patients and improves the utilization effect of the medicine. The demand for microneedles is also increasing dramatically with the increasing demand for quality of life.

At present, the processing of the micro-needle is mainly divided into two types, one is a mould method, and the other is micro-processing direct forming; the micro-processing direct forming method is mainly formed by processing the surface of a substrate such as metal, polymer, glass, silicon chip and the like by adopting laser, X-ray and the like, and is limited by a micro-processing technology, so that the difficulty is high, the precision control requirement is high, and the cost is high; compared with direct micro-machining molding, the mold method can manufacture the micro-needles in batches and has relatively low cost. The existing mold method mainly comprises the steps of casting or plating a female mold on the outer side of a male mold, determining the size of an inner cavity of a microneedle mold according to the size of the male mold, wherein the determination of the size of the male mold mainly depends on a micro-machining technology, the requirements on the surface smoothness and the size precision of the male mold in machining are very high, the manufacturing difficulty is high, and the production cost is high.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a preparation method of a hollow microneedle mould, which solves the problem that the size processing of the existing mould depends on the micro-processing technology, and reduces the requirement on the manufacturing precision of a male mould and the production cost.

In order to realize the purpose, the invention provides the following technical scheme:

a preparation method of a hollow microneedle mould comprises the following steps,

step one, connecting the lower end of a male die with the inner wall of a substrate container;

injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate;

step three, forming a female die after the female die substrate is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die;

coating a conductive layer on the inner wall of the die hole;

covering a metal layer on the outer side of the conductive layer;

and sixthly, removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer.

Preferably, the male mould is of prismatic or cylindrical configuration.

Preferably, the male mould is of a solid or hollow construction.

Preferably, the male die is made of metal.

Preferably, the female mold substrate is one of polydimethylsiloxane, polymethyl methacrylate, polyimide, polystyrene, polyvinyl alcohol and photoresist.

Preferably, the conductive layer is applied by sputtering or spin coating.

Preferably, the conductive layer is one or more of nickel, copper, chromium, tungsten, platinum, gold and silver.

Preferably, the metal layer is covered by electroplating, electroforming or chemical plating.

Preferably, the removal mode of the female die is calcination or solvent dissolution.

Preferably, the substrate container is of an open-topped structure.

Compared with the prior art, the invention has the beneficial effects that:

the invention relates to a preparation method of a hollow metal microneedle mould, which is characterized in that a female mould is obtained by utilizing a male mould to perform reverse mould, and then a hollow microneedle mould is prepared on the inner wall of the female mould by plating; the micro-needle mold is characterized in that the requirement on the dimensional accuracy of a used male mold is low, the dependence on a micro-machining technology is removed, and the inner diameter of the micro-needle mold is mainly controlled and adjusted through the coating thickness of a metal layer, so that micro-needles with different sizes can be obtained conveniently; the size of the microneedle mould is changed by reprocessing the mould (thinning or thickening the metal layer), so that the diversification of the mould size can be met within a certain size range.

Drawings

FIG. 1 is a schematic view of the male mold mated with the substrate container; (ii) a

FIG. 2 is a schematic illustration of the mating of the female mold with the substrate container;

FIG. 3 is a schematic diagram of the structure of the negative mold after coating with the conductive layer;

FIG. 4 is a schematic view of the structure after the female mold is covered with a metal layer;

fig. 5 is a schematic structural view of a microneedle mold.

In the figure: 1-a substrate container; 2-a male die; 3-female die; 301-a die hole; 4-a conductive layer; 5-metal layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.