阅读说明：本技术 一种待电镀基板、背板和显示面板 (To-be-electroplated substrate, backboard and display panel ) 是由 狄沐昕 李海旭 曹占锋 刘英伟 王珂 梁志伟 于 2019-11-15 设计创作，主要内容包括：本发明涉及显示技术领域，尤其涉及一种待电镀基板、背板和显示面板。用于解决相关技术中由于驱动电路分布不均，而使得在通过电镀形成该驱动电路时，由于驱动电路的种子层分布不均匀所导致的电场分布不均，从而使得最终所获得的驱动电路厚度均一性较差的问题。本发明实施例提供一种待电镀基板，划分出待镀膜区和设置于所述待镀膜区相对两侧的第一夹持区和第二夹持区；待电镀基板包括基底，以及沿远离基底的方向依次层叠设置的第一导电图案、第一绝缘层和第二导电图案；其中，第一导电图案覆盖待镀膜区的部分和第二导电图案覆盖所述待镀膜区的部分之间图案互补；第一绝缘层在对应第一夹持区的位置镂空。(The invention relates to the technical field of display, in particular to a substrate to be electroplated, a backboard and a display panel. The method is used for solving the problem that the thickness uniformity of the finally obtained drive circuit is poor due to the fact that the electric field distribution is uneven caused by uneven distribution of a seed layer of the drive circuit when the drive circuit is formed through electroplating due to uneven distribution of the drive circuit in the related technology. The embodiment of the invention provides a substrate to be electroplated, which is divided into a film-to-be-electroplated area, a first clamping area and a second clamping area, wherein the first clamping area and the second clamping area are arranged on two opposite sides of the film-to-be-electroplated area; the substrate to be electroplated comprises a base, a first conductive pattern, a first insulating layer and a second conductive pattern, wherein the first conductive pattern, the first insulating layer and the second conductive pattern are sequentially stacked along the direction far away from the base; the pattern complementation is realized between the part of the first conductive pattern covering the area to be coated and the part of the second conductive pattern covering the area to be coated; the first insulating layer is hollowed at a position corresponding to the first clamping area.)

1. A substrate to be electroplated is characterized in that the substrate to be electroplated is divided into a film-to-be-plated area, a first clamping area and a second clamping area, wherein the first clamping area and the second clamping area are arranged on two opposite sides of the film-to-be-plated area;

the substrate to be electroplated comprises a base, and a first conductive pattern, a first insulating layer and a second conductive pattern which are sequentially stacked along the direction far away from the base; wherein the first conductive pattern comprises a part covering the region to be plated and a part covering the first clamping region, and the second conductive pattern comprises a part covering the region to be plated and a part covering the second clamping region; the part of the first conductive pattern, which covers the to-be-coated area, and the part of the first conductive pattern, which covers the first clamping area, are connected into an integral structure, the part of the second conductive pattern, which covers the to-be-coated area, and the part of the second conductive pattern, which covers the second clamping area, are connected into an integral structure, and the parts of the first conductive pattern, which covers the to-be-coated area, and the parts of the second conductive pattern, which covers the to-be-coated area, are complementary in pattern;

the first insulating layer is hollowed at a position corresponding to the first clamping area;

treat the electroplating base plate still including set up in treat the first electroplating barricade of coating area, first electroplating barricade encircles second conductive pattern covers treat coating area part's side a week sets up, just first electroplating barricade highly be greater than the thickness of second conductive pattern, the material of first electroplating barricade is insulating material.

2. A substrate to be electroplated according to claim 1,

the first electroplating retaining wall and the second conductive pattern are in pattern complementation with each other in a part covering the area to be plated.

3. A substrate to be electroplated according to claim 1 or 2,

the first electroplating retaining wall is made of photoresist.

4. A substrate to be electroplated according to claim 1 or 2,

the substrate to be electroplated further comprises a third conductive pattern, a second insulating layer, a fourth conductive pattern and a third insulating layer, wherein the third conductive pattern is arranged on one side, close to the base, of the first conductive pattern, the third conductive pattern is closer to the base relative to the fourth conductive pattern, the second insulating layer is arranged between the third conductive pattern and the fourth conductive pattern, and the third insulating layer is arranged between the first conductive pattern and the third conductive pattern;

the substrate to be electroplated further divides a third clamping area and a fourth clamping area which are arranged on two opposite sides of the film-to-be-plated area, and the third clamping area and the fourth clamping area are respectively adjacent to the first clamping area and the second clamping area;

wherein the third conductive pattern comprises a portion covering the region to be plated and a portion covering the third clamping area, and the fourth conductive pattern comprises a portion covering the region to be plated and a portion covering the fourth clamping area; the part of the third conductive pattern, which covers the to-be-coated area, and the part of the third conductive pattern, which covers the third clamping area, are connected into an integral structure, the part of the fourth conductive pattern, which covers the to-be-coated area, and the part of the fourth conductive pattern, which covers the fourth clamping area, are connected into an integral structure, and the parts of the third conductive pattern, which covers the to-be-coated area, and the parts of the fourth conductive pattern, which covers the to-be-coated area, are complementary in pattern;

the second insulating layer is hollowed at a position corresponding to the third clamping area.

5. A substrate to be electroplated according to claim 4,

the part of the fourth conductive pattern, which covers the to-be-coated area, is of a double-layer structure, and the fourth conductive pattern sequentially comprises a first conductive sub-layer and a second conductive sub-layer along the direction far away from the substrate, wherein the first conductive sub-layer is made of a material different from that of the second conductive sub-layer.

6. A substrate to be electroplated according to claim 4,

treat that the electroplating base plate still including set up in treat the second electroplating barricade of coating area, the second electroplating barricade encircles fourth conductive pattern covers treat that coating area part's side a week sets up, just the height that the barricade was electroplated to the second is more than or equal to the thickness of fourth conductive pattern, the material of second electroplating barricade is insulating material.

7. A substrate to be electroplated according to claim 6,

and the patterns of the second electroplating retaining wall and the part of the fourth conductive pattern covering the to-be-plated film region are complementary.

8. A substrate to be electroplated according to claim 4,

the film-to-be-plated region comprises a plurality of first regions which are arranged in a matrix form, the row direction of the first regions is the distance direction from a second clamping region to a first clamping region, and the column direction of the first regions is the distance direction from a fourth clamping region to a third clamping region;

the part of the second conductive pattern covering the second clamping area comprises a first electrode;

the part of the second conductive pattern, which covers the to-be-coated area, comprises a plurality of first electrode wires extending from the first electrodes, the plurality of first electrode wires are divided into a plurality of groups along the column direction of the first area, each group of first electrode wires comprises a plurality of first electrode wires which are arranged in parallel and at intervals, and each first electrode wire in each group of first electrode wires is connected with one first area in the same row of the first area in a one-to-one correspondence manner;

the part of the fourth conductive pattern covering the fourth clamping area comprises a second electrode;

the part of the fourth conductive pattern covering the to-be-coated area comprises a plurality of second electrode wires extending from the second electrodes, the second electrode wires are divided into a plurality of groups along the row direction of the first area, each group of second electrode wires comprises a plurality of second electrode wires which are arranged in parallel and at intervals, and each second electrode wire in each group of second electrode wires is connected with one first area in the same row of the first area in a one-to-one correspondence manner.

9. A substrate to be electroplated according to claim 8,

the first electrode wires and the second electrode wires are of L-shaped structures, each group of the first electrode wires is arranged on one side of a row direction of the corresponding first area, the tail end of each first electrode wire in each group of the first electrode wires is connected with one first area in the corresponding row in a one-to-one correspondence mode, each group of the second electrode wires is arranged on one side of the row direction of one row of the corresponding first area in a one-to-one correspondence mode, and the tail end of each second electrode wire in each group of the second electrode wires is connected with one first area in the corresponding row in a one-to-one correspondence mode.

10. A backplane comprising a substrate to be plated according to any one of claims 1 to 9, and a driving circuit;

the driving circuit comprises a fifth conductive pattern which is arranged on the substrate to be electroplated and covers the surface of the second conductive pattern, and the fifth conductive pattern is formed by electroplating by taking the second conductive pattern as a seed layer.

11. The backplane according to claim 10, wherein in a case where the substrate to be electroplated further comprises a third conductive pattern and a fourth conductive pattern, and the fourth conductive pattern comprises a first conductive sublayer and a second conductive sublayer, the driving circuit further comprises the second conductive sublayer.

12. A display panel comprising the backplane of any of claims 10-11 and a plurality of micro-leds disposed on the backplane and electrically connected to a driving circuit in the backplane.

Technical Field

The invention relates to the technical field of display, in particular to a substrate to be electroplated, a backboard and a display panel.

Background

The size of the light emitting diode adopted by the micro light emitting diode display device is in a micron grade, and the micro light emitting diode display device has the characteristics of independent control and independent light emitting control of pictures, high luminance, low power consumption, ultrahigh resolution, high chroma and the like. Becomes one of the hot spots for the development of the future display technology.

Disclosure of Invention

The invention mainly aims to provide a substrate to be electroplated, a back plate and a display panel. The method is used for solving the problem that the thickness uniformity of the finally obtained drive circuit is poor due to the fact that the electric field distribution is uneven caused by uneven distribution of a seed layer of the drive circuit when the drive circuit is formed through electroplating due to uneven distribution of the drive circuit in the related technology.

In order to achieve the purpose, the invention adopts the following technical scheme:

on one hand, the embodiment of the invention provides a substrate to be electroplated, wherein the substrate to be electroplated is divided into a film-to-be-plated area, and a first clamping area and a second clamping area which are arranged on two opposite sides of the film-to-be-plated area; the substrate to be electroplated comprises a base, and a first conductive pattern, a first insulating layer and a second conductive pattern which are sequentially stacked along the direction far away from the base; wherein the first conductive pattern comprises a part covering the region to be plated and a part covering the first clamping region, and the second conductive pattern comprises a part covering the region to be plated and a part covering the second clamping region; the part of the first conductive pattern, which covers the to-be-coated area, and the part of the first conductive pattern, which covers the first clamping area, are connected into an integral structure, the part of the second conductive pattern, which covers the to-be-coated area, and the part of the second conductive pattern, which covers the second clamping area, are connected into an integral structure, and the parts of the first conductive pattern, which covers the to-be-coated area, and the parts of the second conductive pattern, which covers the to-be-coated area, are complementary in pattern; the first insulating layer is hollowed at a position corresponding to the first clamping area; treat the electroplating base plate still including set up in treat the first electroplating barricade of coating area, first electroplating barricade encircles second conductive pattern covers treat coating area part's side a week sets up, just first electroplating barricade highly be greater than the thickness of second conductive pattern, the material of first electroplating barricade is insulating material.

Optionally, the first electroplating retaining wall and the second conductive pattern cover a part of the region to be plated, and the patterns of the first electroplating retaining wall and the part of the second conductive pattern cover the region to be plated are complementary.

Optionally, the first electroplating retaining wall is made of photoresist.

Optionally, the substrate to be electroplated further includes a third conductive pattern, a second insulating layer, a fourth conductive pattern, and a third insulating layer disposed on a side of the first conductive pattern close to the base, where the third conductive pattern is closer to the base than the fourth conductive pattern, the second insulating layer is disposed between the third conductive pattern and the fourth conductive pattern, and the third insulating layer is disposed between the first conductive pattern and the third conductive pattern; the substrate to be electroplated further divides a third clamping area and a fourth clamping area which are arranged on two opposite sides of the film-to-be-plated area, and the third clamping area and the fourth clamping area are respectively adjacent to the first clamping area and the second clamping area; wherein the third conductive pattern comprises a portion covering the region to be plated and a portion covering the third clamping area, and the fourth conductive pattern comprises a portion covering the region to be plated and a portion covering the fourth clamping area; the part of the third conductive pattern, which covers the to-be-coated area, and the part of the third conductive pattern, which covers the third clamping area, are connected into an integral structure, the part of the fourth conductive pattern, which covers the to-be-coated area, and the part of the fourth conductive pattern, which covers the fourth clamping area, are connected into an integral structure, and the parts of the third conductive pattern, which covers the to-be-coated area, and the parts of the fourth conductive pattern, which covers the to-be-coated area, are complementary in pattern; the second insulating layer is hollowed at a position corresponding to the third clamping area.

Optionally, a portion of the fourth conductive pattern, which covers the region to be plated, is a double-layer structure, and sequentially includes a first conductive sub-layer and a second conductive sub-layer along a direction away from the substrate, where a material of the first conductive sub-layer is different from a material of the second conductive sub-layer.

Optionally, the substrate to be electroplated further comprises a second electroplating retaining wall arranged on the region to be plated, the second electroplating retaining wall surrounds the fourth conductive pattern to cover the side surface of the region to be plated for a circle, the height of the second electroplating retaining wall is greater than or equal to the thickness of the fourth conductive pattern, and the second electroplating retaining wall is made of an insulating material.

Optionally, the second electroplating retaining wall and the fourth conductive pattern cover a part of the to-be-plated region, and the patterns of the second electroplating retaining wall and the fourth conductive pattern are complementary.

Optionally, the to-be-plated film region includes a plurality of first regions arranged in a matrix form, a row direction of the plurality of first regions is a distance direction from the second clamping region to the first clamping region, and a column direction of the plurality of first regions is a distance direction from the fourth clamping region to the third clamping region; the part of the second conductive pattern covering the second clamping area comprises a first electrode; the part of the second conductive pattern, which covers the to-be-coated area, comprises a plurality of first electrode wires extending from the first electrodes, the plurality of first electrode wires are divided into a plurality of groups along the column direction of the first area, each group of first electrode wires comprises a plurality of first electrode wires which are arranged in parallel and at intervals, and each first electrode wire in each group of first electrode wires is connected with one first area in the same row of the first area in a one-to-one correspondence manner; the part of the fourth conductive pattern covering the fourth clamping area comprises a second electrode; the part of the fourth conductive pattern covering the to-be-coated area comprises a plurality of second electrode wires extending from the second electrodes, the second electrode wires are divided into a plurality of groups along the row direction of the first area, each group of second electrode wires comprises a plurality of second electrode wires which are arranged in parallel and at intervals, and each second electrode wire in each group of second electrode wires is connected with one first area in the same row of the first area in a one-to-one correspondence manner.

Optionally, the first electrode traces and the second electrode traces are both L-shaped structures, each group of the first electrode traces is disposed on one side of a row of the first regions in a one-to-one correspondence manner, a tail end of each first electrode trace in each group of the first electrode traces is connected to one first region in a corresponding row in a one-to-one correspondence manner, each group of the second electrode traces is disposed on one side of a row of the first regions in a one-to-one correspondence manner, and a tail end of each second electrode trace in each group of the second electrode traces is connected to one first region in a corresponding row in a one-to-one correspondence manner.

On the other hand, the embodiment of the invention provides a backplane, which comprises the substrate to be electroplated and a driving circuit; the driving circuit comprises a fifth conductive pattern which is arranged on the substrate to be electroplated and covers the surface of the second conductive pattern, and the fifth conductive pattern is formed by electroplating by taking the second conductive pattern as a seed layer.

Optionally, in a case that the substrate to be electroplated further includes a third conductive pattern and a fourth conductive pattern, and the fourth conductive pattern includes a first conductive sub-layer and a second conductive sub-layer, the driving circuit further includes the second conductive sub-layer.

On the other hand, an embodiment of the invention provides a display panel, which includes the backplane as described above, and a plurality of micro light emitting diodes disposed on the backplane and electrically connected to a driving circuit in the backplane.

The embodiment of the invention provides a substrate to be electroplated, a back plate and a display panel. Because the first conductive pattern and the second conductive pattern form the whole metal in the to-be-plated area, when the second conductive pattern is used as a seed layer and the fifth conductive pattern is formed by electroplating, the part of the first conductive pattern covering the first clamping area and the part of the second conductive pattern covering the second clamping area are electrified by clamping the clamping piece of the electroplating clamp in the first clamping area and the second clamping area, and the electric potentials of the first conductive pattern and the second conductive pattern are controlled, so that the uniform distribution of an electric field can be ensured in the electroplating process, and the problem that the thickness uniformity of the finally obtained driving circuit is poor due to the fact that the electric field is not uniformly distributed due to the fact that the seed layer of the driving circuit is not uniformly distributed when the driving circuit is formed by electroplating in the related technology is solved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic top view of a micro led display device according to an embodiment of the present invention;

fig. 2 is a schematic top view of a back plate according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional structural diagram of a back plate according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of electroplating using the substrate to be electroplated as a cathode according to an embodiment of the present invention;

FIG. 5 is a schematic top view of another back plate according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of another back plate according to an embodiment of the present invention;

FIG. 7 is a schematic flow chart illustrating a method for manufacturing a substrate to be electroplated according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram illustrating a first conductive pattern formed on a substrate according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of forming a first insulating layer based on fig. 8 according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of forming a second conductive pattern based on fig. 9 according to an embodiment of the present invention;

fig. 11 is a schematic structural view of a first electroplated barrier formed based on fig. 10 according to an embodiment of the present invention;

fig. 12 is a schematic structural diagram of forming a third conductive pattern on a substrate according to an embodiment of the present invention;

fig. 13 is a schematic structural diagram of forming a second insulating layer based on fig. 12 according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram of forming a first conductive sub-layer based on fig. 13 according to an embodiment of the present invention;

fig. 15 is a schematic structural view of forming a second electroplated barrier wall based on fig. 14 according to an embodiment of the present invention;

fig. 16 is a schematic structural diagram of forming a second conductive sublayer based on fig. 15 according to an embodiment of the present invention;

fig. 17 is a schematic structural diagram of forming a third insulating layer based on fig. 16 according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

An embodiment of the present invention provides a micro led display device, as shown in fig. 1, including a display panel 100. The display panel 100 includes a back plate 1 and a plurality of micro light emitting diodes 2 disposed on the back plate 1.

As shown in fig. 2 and 3, the backplate 1 includes a substrate 11 to be plated, and a driving circuit 12 disposed on the substrate 11 to be plated.

As shown in fig. 2 and fig. 3, the substrate 11 to be electroplated is divided into a film-to-be-plated area a, and a first clamping area S1 and a second clamping area S2 disposed at two opposite sides of the film-to-be-plated area a. The substrate to be plated 11 includes a base 111, a first conductive pattern 112, a first insulating layer 113, and a second conductive pattern 114, which are sequentially stacked in a direction away from the base 111. The first conductive pattern 112 includes a portion covering the to-be-plated film region a and a portion covering the first clamping region S1, the second conductive pattern 114 includes a portion covering the to-be-plated film region a and a portion covering the second clamping region S2, the portion of the first conductive pattern 112 covering the to-be-plated film region a and the portion covering the first clamping region S1 are connected into a whole, the portion of the second conductive pattern 114 covering the to-be-plated film region a and the portion covering the second clamping region S2 are connected into a whole, and the portion of the first conductive pattern 112 covering the to-be-plated film region a and the portion of the second conductive pattern 114 covering the to-be-plated film region a are complementary in pattern. The first insulating layer 113 is hollowed out at a position corresponding to the first clamping area S1. As shown in fig. 2 and fig. 3, the substrate 11 to be plated further includes a first plating retaining wall M1 disposed on the region a to be plated, the first plating retaining wall M1 is disposed around the second conductive pattern 114 covering the side of the region a to be plated, the height h1 of the first plating retaining wall M1 is greater than the thickness d1 of the second conductive pattern 114, and the first plating retaining wall M1 is made of an insulating material.

The pattern complementation between the part of the first conductive pattern 112 covering the area a to be plated and the part of the second conductive pattern 114 covering the area a to be plated means that, in the area a to be plated, along the thickness direction of the substrate 111, the first conductive pattern 112 and the second conductive pattern 114 are not overlapped with each other, and both are filled in the area a to be plated together, that is, the first conductive pattern 112 and the second conductive pattern 114 form a whole metal in the area a to be plated.

As shown in fig. 3, the driving circuit 12 includes a fifth conductive pattern 115 disposed on the substrate 11 to be plated and covering the surface of the second conductive pattern 114. The fifth conductive pattern 115 is formed by electroplating using the second conductive pattern 114 as a seed layer.

Based on the above structure, in the substrate to be plated 11 provided in the embodiment of the invention, since the first conductive pattern 112 and the second conductive pattern 114 form the whole metal in the region a to be plated, when the fifth conductive pattern 115 is formed by electroplating using the second conductive pattern 114 as a seed layer, by clamping the clamping members of the plating jig between the first clamping region S1 and the second clamping region S2, and energizing the portion of the first conductive pattern 112 covering the first clamping region S1 and the portion of the second conductive pattern 114 covering the second clamping region S2, and by controlling the potentials of the first conductive pattern 112 and the second conductive pattern 114, the uniform electric field distribution can be ensured during the electroplating process, and the problem of the uneven electric field distribution caused by the uneven distribution of the seed layer of the driving circuit 12 due to the uneven distribution of the driving circuit 12 in the related art can be solved, so that the thickness uniformity of the finally obtained driving circuit is poor.

Optionally, the fifth conductive pattern 115 is made of copper. That is, in the case of electroplating, as shown in fig. 4, the fifth conductive pattern may be formed by electroplating using metallic copper as an anode and electrically connected to a positive electrode of a power supply, and the substrate to be electroplated 11 as a cathode and electrically connected to a negative electrode of the power supply.

The specific shape of the pattern of the first plating retaining wall M1 is not limited, as long as the first plating retaining wall M1 surrounds the periphery of the side of the second conductive pattern 114 covering the portion to be plated a.

For convenience of manufacture, optionally, as shown in fig. 2, the first electroplated retaining wall M1 is complementary to the second conductive pattern 114 covering the portion to be plated.

Thus, the second conductive pattern 114 is exposed by etching during the manufacturing process.

The material of the first plating retaining wall M1 is not particularly limited.

For example, the material of the first plating retaining wall M1 may be photoresist or OC glue.

In an alternative embodiment of the present invention, for convenience of manufacturing, the first plating retaining wall M1 may be made of photoresist.

In the embodiment of the invention, after the electroplating is completed, the first electroplated retaining wall M1 can be removed by the stripping liquid.

The specific structure of the fifth conductive pattern 115 is not limited, and the fifth conductive pattern 115 may have any shape with uneven distribution.

For example, the fifth conductive pattern 115 may be a source-drain metal layer of an active driving circuit, or may be a cathode or anode lead of a passive driving circuit.

In another embodiment of the present invention, as shown in fig. 5 and 6, the substrate to be electroplated 11 further includes a third conductive pattern 116, a second insulating layer 117, a fourth conductive pattern 118 and a third insulating layer 119 disposed on a side of the first conductive pattern 112 close to the base 111, wherein the third conductive pattern 116 is closer to the base 111 than the fourth conductive pattern 118, the second insulating layer 117 is disposed between the third conductive pattern 116 and the fourth conductive pattern 118, and the third insulating layer 119 is disposed between the first conductive pattern 112 and the third conductive pattern 116. The substrate 11 to be electroplated further defines a third clamping area S3 and a fourth clamping area S4 disposed on two opposite sides of the region to be electroplated, and the third clamping area S3 and the fourth clamping area S4 are respectively adjacent to the first clamping area S1 and the second clamping area S2. Wherein the third conductive pattern 116 includes a portion covering the to-be-plated area a and a portion covering the third clamping area S3, and the fourth conductive pattern 118 includes a portion covering the to-be-plated area a and a portion covering the fourth clamping area S4; the part of the third conductive pattern 116 covering the area to be coated and the part of the third conductive pattern 116 covering the third clamping area S3 are connected into a whole, the part of the fourth conductive pattern 118 covering the area to be coated a and the part of the fourth clamping area S4 are connected into a whole, and the part of the third conductive pattern 116 covering the area to be coated and the part of the fourth conductive pattern 118 covering the area to be coated are complementary in pattern. The second insulating layer 117 is hollowed out at a position corresponding to the third clamping area S1.

That is, in embodiments of the present invention, the backplane may be a passive-driven backplane. At this time, the portion of the fourth conductive pattern 118 covering the region a to be plated is a double-layer structure, and sequentially includes a first conductive sublayer 1181 and a second conductive sublayer 1182 along a direction away from the substrate 111, where the first conductive sublayer 1181 is made of a different material from the second conductive sublayer 1182. That is, the second conductive sublayer 1182 is formed by electroplating using the first conductive sublayer 1181 as a seed layer.

In this case, the driving circuit 12 further includes the second conductive sublayer 1181. That is, at this time, the second conductive sublayer 1181 may be an anode lead for electrical connection with the anode of the micro light emitting diode 2, and the fifth conductive pattern 115 is a cathode lead for electrical connection with the cathode of the micro light emitting diode 2. Alternatively, the second conductive sublayer 1182 is a cathode lead for electrically connecting with a cathode of the micro light emitting diode 2, and the fifth conductive pattern 115 is an anode lead for electrically connecting with an anode of the micro light emitting diode 2.

In the embodiment of the present invention, similar to the second conductive pattern 114, since the portion of the third conductive pattern 116 covering the region a to be plated and the portion of the fourth conductive pattern 118 covering the region a to be plated are complementary in pattern, when the second conductive sub-layer 1182 is formed by electroplating using the first conductive sub-layer 1181 as a seed layer, the third conductive pattern 116 and the first conductive sub-layer 1181 form a metal on the whole surface in the region a to be plated, and therefore, by controlling the same potential of the third conductive pattern 116 and the first conductive sub-layer 1181, the uniform distribution of the electric field can be ensured during the electroplating process, and the problem of the uneven distribution of the electric field caused by the uneven distribution of the anode lead or the cathode lead in the related art when the anode lead or the cathode lead is formed by electroplating due to the uneven distribution of the seed layer of the anode lead or the cathode lead (here, the first conductive sub-layer 1181) is solved, so that the finally obtained anode lead or cathode lead has a problem of poor thickness uniformity.

In another embodiment of the present invention, as shown in fig. 5, the substrate 11 to be electroplated further includes a second electroplating retaining wall M2 disposed on a side of the second insulating layer 117 away from the substrate, the second electroplating retaining wall M2 is disposed around a periphery of a portion of the fourth conductive pattern 118 covering the side of the region to be plated, a height h2 of the second electroplating retaining wall M2 is greater than or equal to a thickness d2 of the fourth conductive pattern 118, and the second electroplating retaining wall M2 is made of an insulating material.

The specific shape of the pattern of the second plating retaining wall M2 is not limited, as long as the second plating retaining wall M2 surrounds the periphery of the side of the fourth conductive pattern 118 covering the portion to be plated a.

For convenience of manufacture, optionally, as shown in fig. 5, the second electroplated retaining wall M2 is complementary to the pattern of the portion of the fourth conductive pattern 118 covering the region to be plated a.

At this time, since the second conductive sublayer 1182 is formed by electroplating using the first conductive sublayer 1181 as a seed layer, the first conductive sublayer 1181 only needs to be exposed by etching in the manufacturing process.

The material of the second plating retaining wall M2 is not particularly limited.

For example, the material of the second plating retaining wall M2 may be photoresist or OC glue.

In an optional embodiment of the present invention, for convenience of manufacturing, the second plating retaining wall M2 may be made of photoresist.

In the embodiment of the invention, after the electroplating is completed, the second electroplating retaining wall M2 can be removed by the stripping liquid, so as to obtain the structure of the substrate to be electroplated 11 without the second electroplating retaining wall M2.

The specific distribution of the passively driven anode lead and the passively driven cathode lead is not limited, as long as the plurality of micro light emitting diodes 2 can be passively driven.

In an embodiment of the invention, as shown in fig. 5, the to-be-plated film region a includes a plurality of first regions P arranged in a matrix form, a row direction of the plurality of first regions P is a distance direction from the second clamping region S2 to the first clamping region S1, and a column direction of the plurality of first regions P is a distance direction from the fourth clamping region S4 to the third clamping region S3; the portion of the second conductive pattern 114 covering the second clamping area S2 includes a first electrode F1; the part of the second conductive pattern 114 covering the region a to be plated includes a plurality of first electrode traces F1 extending from the first electrode F1, the plurality of first electrode traces F1 are divided into a plurality of groups along the column direction of the first region P, each group of first electrode traces F1 includes a plurality of first electrode traces F1 arranged in parallel and at intervals, each first electrode trace F1 in each group of first electrode traces F1 is connected to one first region P in the same row of first region P in a one-to-one correspondence; the portion of the fourth conductive pattern 118 covering the fourth clamping area S4 includes a second electrode F2; the portion of the fourth conductive pattern 118 covering the region a to be plated includes a plurality of second electrode traces F2 extending from the second electrode F2, the plurality of second electrode traces F2 are divided into a plurality of groups along the row direction of the first region P, each group of the second electrode traces F2 includes a plurality of second electrode traces F2 arranged in parallel and at intervals, and each second electrode trace F2 in each group of the second electrode traces F2 is connected to one first region P in the same row of the first region P in a one-to-one correspondence.

Based on this, in an alternative embodiment of the present invention, as shown in fig. 5, the first electrode traces f1 and the second electrode traces f2 are both L-shaped structures, each group of the first electrode traces f1 is disposed on one side of a row of the first regions P in the column direction in a one-to-one correspondence, the end of each first electrode trace f1 in each group of the first electrode traces f1 is connected to one first region P in a corresponding row in a one-to-one correspondence, each group of the second electrode traces f2 is disposed on one side of a row of the first regions P in the row direction in a one-to-one correspondence, and the end of each second electrode trace f2 in each group of the second electrode traces f2 is connected to one first region P in a corresponding row in a one-to-one correspondence.

That is, the first electrode trace f1 and the second electrode trace f1 are distributed at different positions of the substrate 111 with different densities, which is an example of the case where some positions are distributed more intensively and other positions are distributed more sparsely.

An embodiment of the present invention provides a method for preparing a substrate to be electroplated, referring to fig. 7, including:

s11, forming a first conductive pattern 112 (as shown in fig. 8), a first insulating layer 113 (as shown in fig. 9) and a second conductive pattern 114 (as shown in fig. 10) on the substrate 111 in sequence along a direction away from the substrate 111; wherein the first conductive pattern 112 includes a portion covering the to-be-plated area a and a portion covering the first clamping area S1, and the second conductive pattern 114 includes a portion covering the to-be-plated area a and a portion covering the second clamping area S2; the part of the first conductive pattern 112 covering the area to be coated A and the part covering the first clamping area S1 are connected into a whole structure, the part of the second conductive pattern 114 covering the area to be coated A and the part covering the second clamping area S2 are connected into a whole structure, and the part of the first conductive pattern 112 covering the area to be coated A and the part of the second conductive pattern 114 covering the area to be coated A are complementary in pattern; the first insulating layer 113 is hollowed out at a position corresponding to the first clamping area S1.

The preparation method also comprises the following steps: s12, forming a first plating retaining wall M1 on a side of the first insulating layer 113 away from the substrate 111 to obtain the structure shown in fig. 11, where the first plating retaining wall M1 surrounds the second conductive pattern 114 and covers a periphery of the portion to be plated a, the height h1 of the first plating retaining wall M1 is greater than the thickness d1 of the second conductive pattern 114, and the first plating retaining wall M1 is made of an insulating material.

The beneficial technical effects of the preparation method of the substrate to be electroplated provided by the embodiment of the invention are the same as those of the substrate to be electroplated provided by the embodiment of the invention, and are not repeated herein.

The first conductive pattern 112, the second conductive pattern 114 and the first plating retaining wall M1 can be formed by a photolithography process.

Alternatively, the material of the first conductive pattern 112 and the second conductive pattern 114 are both a metal material, and the material of the first plating retaining wall M1 may be an organic material. Such as photoresist materials, resin materials, etc.

In another embodiment of the present invention, as shown in fig. 5 and fig. 6, in a case that the substrate to be electroplated 11 further includes a third conductive pattern 116, a second insulating layer 117, a fourth conductive pattern 118 and a third insulating layer 119 disposed on one side of the first conductive pattern 112 close to the base 111, and the fourth conductive pattern 118 includes a first conductive sublayer 1181 and a second conductive sublayer 1182, the substrate to be electroplated 11 further defines a third clamping area S3 and a fourth clamping area S4 disposed on two opposite sides of the region a to be electroplated; before forming the first conductive pattern 112 and the second conductive pattern 114 on the substrate 111, the preparation method further includes:

forming a third conductive pattern 116 (as shown in fig. 12), a second insulating layer 117 (as shown in fig. 13) and a first conductive sublayer 1181 (as shown in fig. 14) on the substrate 111 in sequence in a direction away from the substrate 111; wherein the third conductive pattern 116 includes a portion covering the to-be-plated area a and a portion covering the third clamping area S3, and the first conductive sublayer 1181 includes a portion covering the to-be-plated area a and a portion covering the fourth clamping area S4; the part of the third conductive pattern 116 covering the area a to be plated and the part covering the third clamping area S3 are connected into a whole, the part of the fourth conductive pattern 118 covering the area a to be plated and the part covering the fourth clamping area S4 are connected into a whole, and the part of the third conductive pattern 116 covering the area a to be plated and the part of the fourth conductive pattern 118 covering the area a to be plated are complementary in pattern; the second insulating layer 117 is hollowed out at a position corresponding to the third clamping area S3.

A second plating bank M2 is formed on the side of the second insulating layer 117 away from the substrate 111, resulting in the structure shown in fig. 15. The second plating retaining wall M2 is disposed around the first conductive sublayer 1181 covering the side of the portion to be plated a, the height h2 of the second plating retaining wall M2 is greater than the thickness d2 of the first conductive sublayer 1181, and the second plating retaining wall M2 is made of an insulating material.

The second conductive sub-layer 1182 is formed by electroplating using the first conductive sub-layer 1181 as a seed layer. A structure as shown in fig. 16 is obtained.

In practical applications, it should be noted that, in the electroplating fixture, the clamping members in the electroplating fixture may be clamped between the third clamping area S3 and the fourth clamping area S4 of the substrate 11 to be electroplated, where the third conductive pattern 116, the second insulating layer 117, and the first conductive sublayer 1181 are formed, and the substrate 11 to be electroplated is placed in the electrolyte as a cathode, and the second conductive sublayer 1182 is formed on the surface of the portion of the first conductive sublayer 1181 covering the region a to be electroplated by electrifying the portion of the third conductive pattern 116 covering the third clamping area S3 and the portion of the first conductive sublayer 1181 covering the fourth clamping area S4, i.e., by using an electrolytic reaction.

The negative electrode lead of the power supply may be electrically connected to the third conductive pattern 116 and the first conductive sublayer 1181 through the holder, and the part of the third conductive pattern 116 covering the third holding region S3 and the part of the first conductive sublayer 1181 covering the fourth holding region S4 may be electrified, or the holder (when the holder is made of a conductive material) may be directly electrified to achieve the electrical connection.

The third insulating layer 119 is formed on the second conductive sublayer 1182 on the side away from the substrate 111, resulting in the structure shown in fig. 17.

In the embodiment of the present invention, by utilizing the complementary relationship between the third conductive pattern 116 and the first conductive sublayer 1181 in the to-be-plated region a, when the second conductive sublayer 1182 is formed by electroplating, since the third conductive pattern 116 and the first conductive sublayer 1181 form a metal on the whole surface of the to-be-plated region a, by clamping the clamping members of the electroplating jig between the third clamping region S3 and the fourth clamping region S4, the portion of the third conductive pattern 116 covering the third clamping region S3 and the portion of the first conductive sublayer 1181 covering the fourth clamping region S4 are electrified, and by controlling the potentials of the third conductive pattern 116 and the first conductive sublayer 1181, the uniform distribution of the electric field can be ensured during the electroplating process, and the problem that the uneven distribution of the anode lead or the cathode lead to be formed in the related art is solved, the uneven distribution of the electric field caused by the uneven distribution of the seed layer (here, the first conductive sub-layer 1181) of the anode lead or the cathode lead causes a problem that the thickness uniformity of the finally obtained anode lead or cathode lead is poor.

The third conductive pattern 116, the first conductive sub-layer 1181 and the second electroplated retaining wall M2 may be formed by a photolithography process.

Optionally, the material of the third conductive pattern 116 and the first conductive sub-layer 1181 may be a metal material, and the material of the second plating retaining wall M2 may be an organic material. Such as photoresist materials, resin materials, etc.

In an alternative embodiment of the present invention, the material of the second conductive sub-layer 1182 is copper. That is, in the embodiment of the present invention, the metal copper may be used as an anode to be electrically connected to a positive electrode of a power supply, and the substrate to be plated 11 on which the third conductive pattern 116, the second insulating layer 117, and the first conductive sub-layer 1181 are formed may be used as a cathode to be electrically connected to a negative electrode of the power supply, that is, the second conductive sub-layer 1182 may be formed by electroplating.

The scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present invention, and the present invention is intended to be covered thereby. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.